JPS6058626A - Lead frame transfer apparatus - Google Patents
Lead frame transfer apparatusInfo
- Publication number
- JPS6058626A JPS6058626A JP16791383A JP16791383A JPS6058626A JP S6058626 A JPS6058626 A JP S6058626A JP 16791383 A JP16791383 A JP 16791383A JP 16791383 A JP16791383 A JP 16791383A JP S6058626 A JPS6058626 A JP S6058626A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- guide
- guide pin
- pin
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000000630 rising effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- 239000002184 metal Substances 0.000 description 10
- 238000005452 bending Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Reciprocating Conveyors (AREA)
Abstract
Description
【発明の詳細な説明】
技術分野
本発明は半導体装置の製造に用いられるリードフレーム
の送り機構に関する。DETAILED DESCRIPTION OF THE INVENTION TECHNICAL FIELD The present invention relates to a lead frame feeding mechanism used in the manufacture of semiconductor devices.
背景技術
金属平板をプレス成形したリードフレームを用いた半導
体装置は、リードフレームのペレリト載置部に半導体ペ
レットを載置固定するマウント工程、ベレ、ソト上の電
極とリードフレームのリード部とを金属細線にて接続す
るワイヤポンディング工程、ベレツトを含む主要部分を
樹脂材にて被覆し樹脂外装する樹脂モールド工程、リー
ドフレームの不要部分を切断し個々の半導体装置に分離
する工程等を経て製造される。BACKGROUND TECHNOLOGY A semiconductor device using a lead frame formed by press-forming a flat metal plate is manufactured by a mounting process in which a semiconductor pellet is placed and fixed on a pellet mounting part of the lead frame, and the electrodes on the top and bottom and the lead part of the lead frame are connected with metal. The lead frame is manufactured through a wire bonding process where connections are made using thin wires, a resin molding process where the main parts including the beret are coated with a resin material, and a process where unnecessary parts of the lead frame are cut off and separated into individual semiconductor devices. Ru.
ここでリードフレームは撓み易く、各工程間での保管や
移動時には複数枚マガジンに収納され保護される。特に
ワイヤボンディング工程後のリードフレームは、ベレッ
トとリード部とが金属細線で接続されているため撓みに
より金属細線が引っ張られ、金属細線のループが変形し
て不所望部分に近接したり接触して耐電圧低下や短絡等
の不良を発生したりさらには金属細線が切断して断線不
良を発生することがあり、取り扱いに注意を要する。Here, the lead frame is easily bent, and when stored or moved between processes, a plurality of lead frames are stored in a magazine and protected. In particular, in the lead frame after the wire bonding process, since the bullet and the lead part are connected by a thin metal wire, the thin metal wire is stretched due to bending, and the loop of the thin metal wire is deformed and may come close to or come into contact with an undesired part. It may cause defects such as a drop in withstand voltage or short circuit, or even breakage due to the thin metal wire being cut, so care must be taken when handling it.
一方、マウンタ工程やワイヤボンディング工程ではリー
ドフレームは送り機構により一定ピッチずつ前進送りさ
れる。On the other hand, in a mounting process or a wire bonding process, the lead frame is fed forward by a constant pitch by a feeding mechanism.
この送り機構の一例を第１図及び第２図に示す。An example of this feeding mechanism is shown in FIGS. 1 and 2.
図において１はリードフレームで、長手方向に沿って一
定ピッチでガイド穴１ａが穿設されている。In the figure, reference numeral 1 denotes a lead frame, in which guide holes 1a are bored at a constant pitch along the longitudinal direction.
２はリードフレーム１を載置し短辺方向の動きを規制し
た状態でリードフレーム１をガイドするガイドレールで
、ガイド穴１ａの移動経路に沿って長穴２ａが形成され
ている。８はガイトレーｌし２の長穴２ａを通りリード
フレーム１のガイド穴１ａに係合するガイドピンで、昇
降移動装置（図示せず）に連結されて上昇−前進一降下
一後退を繰返し、上昇−前進動によりガイドピン８をガ
イド穴１ａに係合してリードフレーム１を一定ピッチ前
進させる。A guide rail 2 guides the lead frame 1 on which the lead frame 1 is placed and restricts movement in the short side direction, and has an elongated hole 2a formed along the movement path of the guide hole 1a. Reference numeral 8 denotes a guide pin that passes through the elongated hole 2a of the guide tray 2 and engages with the guide hole 1a of the lead frame 1.The guide pin 8 is connected to an elevating movement device (not shown) and repeats ascending, advancing, descending, and retreating to ascend. - The guide pin 8 is engaged with the guide hole 1a by the forward motion, and the lead frame 1 is advanced by a constant pitch.
この装置ではリードフレームｌはガイドレール２によっ
て支持されているためリードフレームの撓みや捩れがな
く、ガイトレー／Ｖ ２の前後端にマガジンを配置する
ようにすれば作業中全く人手に触れることがなく、金属
細線の変形や断線が防止される。In this device, the lead frame l is supported by the guide rail 2, so there is no bending or twisting of the lead frame, and by placing the magazine at the front and rear ends of the guide tray/V2, there is no need to touch it during work. , deformation and breakage of the thin metal wire are prevented.
ところで、工程の全自動化のために、樹脂モールド工程
においてもリードフレームを自動供給することが考えら
れているが、この工程に第１図装置を直ちに適用するこ
とはできない。その理由は樹脂モールド工程ではリード
フレームは金型のキャビティ内に複数のリードフレーム
を位置決めして装着するための治具が下方に配置される
ため、ガイドピンをガイドレールの下方に配置でＡない
からである。Incidentally, in order to fully automate the process, it has been considered to automatically supply lead frames even in the resin molding process, but the apparatus shown in FIG. 1 cannot be immediately applied to this process. The reason for this is that in the resin molding process, a jig for positioning and mounting multiple lead frames in the mold cavity is placed below, so the guide pins cannot be placed below the guide rail. It is from.
そのため第３図及び第４図に示すようにガイドピンｌを
ガイドレール２の上方に配置すれば整列治具に妨げられ
ることなく、リードフレーム１の送りが可能である。Therefore, if the guide pin l is arranged above the guide rail 2 as shown in FIGS. 3 and 4, it is possible to feed the lead frame 1 without being hindered by the alignment jig.
しかしながら、この場合次のような問題があった。即ち
、ガイドピン８を降下させリードフレーム１のガイド穴
１ａに挿入した後、前進させガイドピン８をガイド穴ｌ
ａから抜いて後退させる際に、ガイドピン３とガイド穴
１ａとの間の摩擦によってリードフレーム１が持ち上げ
られ、リードフレーム１を撓ませたり、捩り、金属細線
の変形や断線を発生することがあった。However, in this case, there were the following problems. That is, the guide pin 8 is lowered and inserted into the guide hole 1a of the lead frame 1, and then moved forward to insert the guide pin 8 into the guide hole l.
When pulling out from a and moving it back, the lead frame 1 may be lifted due to friction between the guide pin 3 and the guide hole 1a, causing the lead frame 1 to be bent or twisted, and the thin metal wire to be deformed or broken. there were.
この点に関し、第１図装置ではガイ゛ドピン８をガイド
穴１ａから抜く際にガイドレール２がリードフレームｌ
のストッパの作用をするため何ら問題がなかった。Regarding this point, in the device shown in FIG. 1, when the guide pin 8 is pulled out from the guide hole 1a, the guide rail 2
There was no problem because it acted as a stopper.
そのためガイドピン３の上昇時にリードフレーム１を押
圧するスト、ソバを設ければよいが、ガイドピン３と同
じ面に配置しなければならず、機構が複雑になり好まし
くなかった。For this reason, it would be possible to provide a stop or a stopper to press the lead frame 1 when the guide pin 3 is raised, but it would be necessary to arrange it on the same surface as the guide pin 3, which would complicate the mechanism, which was undesirable.
発明の開示
本発明は上記問題点に鑑み提案されたもので、構造が簡
単でガイドピンをスムーズに抜き取ることのできる送り
装置を提供する。DISCLOSURE OF THE INVENTION The present invention was proposed in view of the above-mentioned problems, and provides a feeding device that has a simple structure and can smoothly pull out a guide pin.
本発明はリードフレーム搬送路に沿って一定区間往復動
する移動装置に、ガイドピンを搬送路上方で上下動させ
リードフレームのガイド穴に係合させる昇降装置を固定
したものにおいて、上記ガイドピンをガイド穴に保合し
てリードフレームを一定ピッチ前進させ、ガイドピンを
上昇させてガイド穴から抜き取る際に移動装置を微小距
離後退させガイドピン前端と対向するガイド穴内周面と
を離隔させてガイドピンを上昇させ移動装置を後退勤さ
せるようにしたことを特徴とする。The present invention is a moving device that reciprocates over a certain distance along a lead frame conveyance path, and a lifting device that moves a guide pin up and down above the conveyance path and engages with a guide hole of the lead frame is fixed to the moving device. The lead frame is moved forward at a fixed pitch while being engaged with the guide hole, and when the guide pin is raised and removed from the guide hole, the moving device is moved back a minute distance to separate the front end of the guide pin from the inner peripheral surface of the opposing guide hole. It is characterized in that the pin is raised and the moving device is moved backward.
本発明によれば構造が簡単で、リードフレームのガイド
穴にガイドピンを係合して前進させてガイド穴からガイ
ドピンを抜き取る際に、リードフレームの撓みや捩れが
なく、リードフレーム上に接続された金属細線のｌレー
プ変形や断線を防止できる。According to the present invention, the structure is simple, and when the guide pin is engaged with the guide hole of the lead frame and moved forward to remove the guide pin from the guide hole, there is no bending or twisting of the lead frame, and the connection is made on the lead frame. It is possible to prevent deformation and breakage of thin metal wires.
発明を実施するだめの最良の形態
以下に本発明を第５図及び第６図に示す装置から説明す
る。図において４はリードフレーム１を支持しガイドす
るガイドレールで図示しないが後方にリードフレーム１
を整列して複数収納したマガジンが、前方には金型のキ
ャビティにリードフレーム１を位置決めした状態で供給
する治具がそれぞれ配置されている。５はガイドレール
４に沿って配置したネジ軸で、ナツト６が螺着されてい
る。またこのナツト６は２本のガイトロ、ドア、７が貫
通し傾きが防止されている。ネジ軸５には回転装置（図
示せず）が連結され回転することによりナツト６を移動
させる。このネジ軸５とナツト６とで移動装置を形成し
ている。８はナツト６からガイドレール４上に延びるア
ーム、９はアーム８に支持され連結体ｉｏを上下動させ
るシリンダ（昇降装置）で、連結体１ｏの両端部はガイ
ドロッド１１．１１により傾きが防止されている。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be explained below starting from the apparatus shown in FIGS. 5 and 6. In the figure, reference numeral 4 denotes a guide rail that supports and guides the lead frame 1. Although not shown, the lead frame 1 is placed behind the guide rail.
A magazine storing a plurality of arranged lead frames 1 is arranged in front of each magazine, and a jig for supplying the lead frame 1 in a positioned state to the cavity of the mold is arranged in front of each magazine. 5 is a screw shaft arranged along the guide rail 4, and a nut 6 is screwed onto it. Further, this nut 6 is penetrated by two guide rods, a door, and 7 to prevent it from tilting. A rotating device (not shown) is connected to the screw shaft 5 and rotates to move the nut 6. This screw shaft 5 and nut 6 form a moving device. 8 is an arm extending from the nut 6 onto the guide rail 4; 9 is a cylinder (elevating device) that is supported by the arm 8 and moves the connecting body io up and down; both ends of the connecting body 1o are prevented from tilting by guide rods 11 and 11. has been done.
１２は連結体１０の下面より下方に延びるガイドピンで
、リードフレーム１のガイド穴１ａの移動軌跡上に一定
ピンチで突出している。またガイドピンの先端はテーパ
状に形成され挿入を容易にしている。Reference numeral 12 denotes a guide pin extending downward from the lower surface of the connecting body 10, and protrudes with a constant pinch on the movement locus of the guide hole 1a of the lead frame 1. Further, the tip of the guide pin is tapered to facilitate insertion.
以下、この動作を第７図乃至第１０図より説明する。先
ず第７図に示すようにマガジン（図示せず）からガイド
レール４上に押し出されたリードフレーム１′のガイド
穴１ａ′にガイドピン１２を降下させ、係合させる。そ
して第８図に示すように移動装置を動作させリードフレ
ーム１′を一定ピッチ前進させる。この時ガイドピン１
２はその進行方向外周面とガイド穴１ ａｌ内周面とが
接触している。次に第９図に示すようにガイドピン１２
とガイド穴１ ａＪの接触面が屋隔するようにネジ軸５
を逆転させ、第１０図に示すようにガイドピン１２をガ
イド穴１ ａｌから抜き、さらにネジ軸５を逆転させて
ガイドピン５を始めの位置に戻す。この位置にはマガジ
ンから次のリードフレームが押し出ガイドピン１２を上
昇させる前のネジ軸５の逆転量はネジ軸５とナンド６間
で生ずるバックラッシュ量より大きく、ガイドピン１２
とガイド穴１ ａ Ｌの間の隙間余裕を越えない範囲で
設定でき、ガイドピン１２とガイド穴１ ａｌがわずか
でも離れればガイドピン１２を上昇させつつネジ軸５を
逆転できる。This operation will be explained below with reference to FIGS. 7 to 10. First, as shown in FIG. 7, the guide pin 12 is lowered and engaged with the guide hole 1a' of the lead frame 1' pushed out from the magazine (not shown) onto the guide rail 4. Then, as shown in FIG. 8, the moving device is operated to move the lead frame 1' forward at a constant pitch. At this time, guide pin 1
2, its outer circumferential surface in the advancing direction is in contact with the inner circumferential surface of the guide hole 1 al. Next, as shown in FIG.
Insert the screw shaft 5 so that the contact surfaces of guide hole 1 and aJ are spaced apart.
is reversed and the guide pin 12 is removed from the guide hole 1al as shown in FIG. 10, and the screw shaft 5 is further reversed to return the guide pin 5 to its initial position. At this position, the amount of reversal of the screw shaft 5 before the next lead frame pushes out from the magazine and raises the guide pin 12 is greater than the amount of backlash that occurs between the screw shaft 5 and the NAND 6, and the guide pin 12
The screw shaft 5 can be reversed while raising the guide pin 12 if the guide pin 12 and the guide hole 1 a L are even slightly apart from each other.
ガイドピン１２は先端部がテーパ状になっているため、
ガイド穴１ ａＪ内周面間にテーパ部が来るとリードフ
レーム１′とガイドピン１２とは無接触状態となるから
、リードフレーム１′とガイドピンン１２の間の非導通
を検出しネジ軸を高速逆転させるようにしてもよい。Since the guide pin 12 has a tapered tip,
When the tapered part comes between the inner peripheral surfaces of guide hole 1 aJ, lead frame 1' and guide pin 12 will be in a non-contact state, so non-continuity between lead frame 1' and guide pin 12 will be detected and the screw shaft will be rotated at high speed. It may also be reversed.
このようにしてガイドレール４上を間歇送りされたリー
ドフレーム１′は前方に配置されたリードフレーム配列
治具上に順次供給される。The lead frames 1' that have been intermittently fed on the guide rails 4 in this manner are sequentially supplied onto a lead frame arrangement jig disposed in front.
以上のように、本発明によればリードフレームのガイド
穴に上方よりガイドピンを係合して前進させ、ガイドピ
ンをガイド穴から抜いてガイドピンを後退させ再度他の
リードフレームのガイド穴にガイドピンを係合して前進
させる動作を繰返し、リードフレームを間歇送りする装
置において、ガイドピンをガイド穴から抜き取る際に、
リードフレームの浮き上りがなく、そのためリードフレ
ームの撓みや戻れかなく、リードフレーム上に接続され
た金属細線のループの変形や断線が防止でき、リードフ
レーム浮き上り防止用のスト、ツバが不要で構造が簡単
となる。As described above, according to the present invention, the guide pin is engaged with the guide hole of the lead frame from above and moved forward, the guide pin is pulled out from the guide hole, the guide pin is retreated, and the guide pin is inserted into the guide hole of another lead frame again. In a device that intermittently feeds a lead frame by repeatedly engaging and advancing a guide pin, when removing the guide pin from the guide hole,
There is no lifting of the lead frame, which prevents the lead frame from bending or returning, which prevents deformation or breakage of the thin metal wire loop connected to the lead frame, and eliminates the need for a strut or collar to prevent the lead frame from lifting. The structure becomes simple.
第１図はリードフレームの送り装置の一例を示す側断面
図、第２図は第１図Ａ−Ａ面図、第３図は本発明の前提
となるリードフレーム送り装置の一例を示す側断面図、
第４図は第３図Ｂ−Ｂ面図、第５図は本発明による装置
の一例を示す側断面図、第６図は第５図Ｃ−Ｃ面図、第
７図乃至第１Ｏ図は第５図装置の動作を説明する要部側
断面図を示す。
１′・・・・・・・・・・・・・・・ リードフレーム
、１ ａＬ・・・・・・・・・ ガイド穴、５．６・・
・・・・ 移動装置、
９・・・・・・・・・・・・・・・昇降機構、１２・・
・・・・・・・ ガイドピン。
第５図
藪 藪FIG. 1 is a side sectional view showing an example of a lead frame feeding device, FIG. 2 is a side view taken along line A-A in FIG. 1, and FIG. 3 is a side sectional view showing an example of a lead frame feeding device which is the premise of the present invention. figure,
4 is a view taken along the line B-B in FIG. 3, FIG. 5 is a side sectional view showing an example of the device according to the present invention, FIG. FIG. 5 shows a side sectional view of a main part explaining the operation of the device. 1'・・・・・・・・・・・・ Lead frame, 1 aL・・・・・・ Guide hole, 5.6...
...Moving device, 9... Lifting mechanism, 12...
······· guide pin. Figure 5 Thicket Thicket
Claims (1)
ガイドピンを搬送路上方で上下動させリードフレームの
ガイド穴に係合させる昇降装置を固定したものにおいて
、上記ガイドピンをガイド穴に係合してリードフレーム
を一定ピッチ前進すせ、ガイドピンを上昇させてガイド
穴から抜き取る際に移動装置を微小距離後退させガイド
ピン前端と対向するガイド穴内周面とを離隔させてガイ
ドピン左上昇させ移動装置を後退勤させるようにしたこ
とを特徴とするリードフレームの送り装置。A transfer device that reciprocates along the lead frame transport path,
In a fixed lifting device that moves the guide pin up and down on the conveyance path and engages with the guide hole of the lead frame, the guide pin is engaged with the guide hole and the lead frame is advanced by a certain pitch, and the guide pin is moved up and down. When the moving device is raised and extracted from the guide hole, the moving device is moved back a minute distance to separate the front end of the guide pin from the inner peripheral surface of the opposing guide hole, and the guide pin is raised to the left and the moving device is moved backward. Lead frame feeding device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16791383A JPS6058626A (en) | 1983-09-12 | 1983-09-12 | Lead frame transfer apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16791383A JPS6058626A (en) | 1983-09-12 | 1983-09-12 | Lead frame transfer apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6058626A true JPS6058626A (en) | 1985-04-04 |
| JPH035660B2 JPH035660B2 (en) | 1991-01-28 |
Family
ID=15858368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16791383A Granted JPS6058626A (en) | 1983-09-12 | 1983-09-12 | Lead frame transfer apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6058626A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6263210U (en) * | 1985-10-08 | 1987-04-20 | ||
| JPS63184345A (en) * | 1987-01-27 | 1988-07-29 | Toshiba Corp | Method for transferring semiconductor knockdown |
| JPH04148750A (en) * | 1990-10-12 | 1992-05-21 | Rohm Co Ltd | Intermittent transfer device for rectangular lead frame for manufacturing semiconductor parts |
| JPH06263225A (en) * | 1993-03-15 | 1994-09-20 | Ishikawa Kikai:Kk | Intermittent feeding device |
-
1983
- 1983-09-12 JP JP16791383A patent/JPS6058626A/en active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6263210U (en) * | 1985-10-08 | 1987-04-20 | ||
| JPH052490Y2 (en) * | 1985-10-08 | 1993-01-21 | ||
| JPS63184345A (en) * | 1987-01-27 | 1988-07-29 | Toshiba Corp | Method for transferring semiconductor knockdown |
| JPH04148750A (en) * | 1990-10-12 | 1992-05-21 | Rohm Co Ltd | Intermittent transfer device for rectangular lead frame for manufacturing semiconductor parts |
| JPH06263225A (en) * | 1993-03-15 | 1994-09-20 | Ishikawa Kikai:Kk | Intermittent feeding device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH035660B2 (en) | 1991-01-28 |
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