JPS6054798B2 - Printed board manufacturing method - Google Patents
Printed board manufacturing methodInfo
- Publication number
- JPS6054798B2 JPS6054798B2 JP15642077A JP15642077A JPS6054798B2 JP S6054798 B2 JPS6054798 B2 JP S6054798B2 JP 15642077 A JP15642077 A JP 15642077A JP 15642077 A JP15642077 A JP 15642077A JP S6054798 B2 JPS6054798 B2 JP S6054798B2
- Authority
- JP
- Japan
- Prior art keywords
- resist
- substrate
- printed board
- etching
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】
本発明は基板端面にめつきを附着させないプリント板の
製造方法に関し、殊に金属芯入りプリント板の製造方法
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a printed circuit board in which no plating is attached to the end surface of the substrate, and particularly to a method of manufacturing a printed circuit board with a metal core.
一般にプリント板にプリント配線を形成する方法を大別
すれば、１）、アディティブ法と２）、サブトラクテイ
ブ法の二法に分れる。In general, methods for forming printed wiring on a printed board can be roughly divided into two methods: 1) additive method and 2) subtractive method.
１）の方法は通常のガラスエポキシ系の基板上又は金属
芯入り樹脂被覆基板等の上に導体パターンを形成する場
合の如く、必要とする導体パターンを銅めつき又は銅め
つきとエッチングを組合せた方法で形成する方法であり
、２）の方法は多層プリント板におけるが如く基板とし
て銅張積層板を使用し、その銅板部に必要なパターンを
残すようなエッチング加工によりパターンを形成する方
法である。Method 1) involves forming the required conductor pattern by copper plating or a combination of copper plating and etching, as in the case of forming a conductor pattern on a normal glass epoxy substrate or a resin-coated substrate with a metal core. Method 2) uses a copper-clad laminate as a substrate, similar to a multilayer printed board, and forms a pattern by etching to leave the required pattern on the copper plate. be.
これらの諸法の内、本発明に関係のある基板端面のめつ
き附着が問題となるのはめつき工程を含む１）のアディ
ティブ法に限られる。ところでこのアディティブ法はさ
らに大別して、銅めつきだけでパターンを形成するフル
アディティブ法と、銅めつきとエッチングを両用するセ
ミアディティブ法の二法に分けることができる。セミア
ディティブ法はさらに二つの場合に分け、厚付け全面銅
めつきを初期に行つて二度目のめつきを行わないパネル
めつき法と、薄付け全面銅めつきより始めパターン現像
後さらに銅めつきを行うパターンめつき法の二法となる
が、本発明が適用できるのは前者のパネルめつき法の場
合に限られる。Among these methods, only the additive method 1), which involves a plating step, is relevant to the present invention and poses a problem of plating adhesion to the end face of the substrate. By the way, this additive method can be further divided into two methods: a fully additive method in which a pattern is formed only by copper plating, and a semi-additive method in which a pattern is formed using both copper plating and etching. The semi-additive method is further divided into two types: a panel plating method in which thick, full-surface copper plating is performed initially and no second plating is performed, and a panel plating method, in which thick, full-surface copper plating is performed initially, and second plating is not performed. There are two pattern plating methods for plating, but the present invention is applicable only to the former panel plating method.
ところでプリント基板端面にめつきが付着する問題は、
これらの二法において従来製造上の重要な問題であつた
。By the way, the problem of plating on the edge of a printed circuit board is
This has traditionally been an important manufacturing problem in these two methods.
特に電話交換機等に多用される金属芯入リプリント板に
おいては、該プリント板が通常のプリント板とは相違し
て、先に外形加工を行つた後にめつき処理を行うもので
あるだけに、この問題は従来最も厄介な問題の一つであ
つた。それはプリント板の端面に付着しためつき金属は
架装置のシェルフの溝を該プリント板が摺動する時に剥
げ落ちることがあり、また剥げ落ちなくても湿気で発生
した錆が落ちてプリント板上に附着したりして有害な作
用を起すからであつた。このような障害を防ぐために上
述したパネルめつき法においては、従来、めつき工程で
端面にめつきが付着している場合にはエッチング工程に
先立ち、該端面上のエッチングレジストをナイフで掻き
取る等して端面のめつき付着をなくすように努めてきた
。ところがこのような従来の作業は極めて時間が掛り能
率が悪く、自動化が困難である等の欠点があつた。本発
明はこのような従来の製造方法の欠点を排．除すること
を目的としている。In particular, reprinted boards with metal cores, which are often used in telephone exchanges, etc., differ from ordinary printed boards in that they are first processed into external shapes and then plated. This problem has traditionally been one of the most vexing. The metal that adheres to the edge of the printed board may peel off when the printed board slides through the grooves of the rack shelf, and even if it does not fall off, the rust generated by moisture may fall off and form on the printed board. This is because it can cause harmful effects when attached to other substances. In order to prevent such problems, in the panel plating method described above, conventionally, if plating adheres to the end face during the plating process, the etching resist on the end face is scraped off with a knife before the etching process. Efforts have been made to eliminate plating on the end surfaces. However, such conventional work is extremely time consuming, inefficient, and difficult to automate. The present invention eliminates these drawbacks of conventional manufacturing methods. The purpose is to eliminate
而して本発明によれば、外形加工済み基板の両表面と端
面を含む全面に銅めつきを施した後に行う基板表面の銅
層面を選択的にエッチングするための前処理工程が基板
をエッチングレジスト液に浸漬して基板のスル．ーホー
ルを当該レジストで似つて充填する工程と、その結果と
して基板の端面に塗布された当該エッチングレジストを
除去する工程を含んで成るプリント板の製造方法におい
て、前記レジスト液として第１の溶剤剥離型エッチング
レジスト液を−用い、該スルーホールを除く基板表面全
域の該第１レジストのみを研磨除去してから該第１レジ
ストを剥離する溶剤では剥離されない第２の溶剤剥離型
エッチングレジストで基板表面に所定のレジストパター
ンを形成し、次いで結果として基板端面に塗布されて残
留している該第１レジストを溶剤で除去することを特徴
とするプリント板の製造方法が提案される。さらにまた
上記提案の実施態様の第１案として上記提案中の該第１
レジストとして有機溶剤剥離型レジストを用い、該第２
レジストとしてアルカリ剥離型レジストを用いる当該プ
リント板の製造方法が提案され、また同第２案として同
じ上記提案中の該第１レジストとしてアルカリ剥離型レ
ジストを用い、該第２レジストとして有機溶剤剥離型レ
ジストを用いる当該プリント板の製造方法が提案される
。According to the present invention, the pretreatment step for selectively etching the copper layer on the surface of the substrate, which is performed after copper plating is applied to the entire surface of the contoured substrate including both surfaces and end surfaces, includes etching the substrate. The substrate is immersed in resist solution. - A method for producing a printed board, comprising the steps of filling the holes with the resist, and removing the etching resist applied to the end surface of the substrate, wherein the resist solution is a first solvent-stripping type. Using an etching resist solution, polish and remove only the first resist on the entire surface of the substrate except for the through holes, and then remove the first resist. A method for manufacturing a printed circuit board is proposed, which comprises forming a predetermined resist pattern, and then removing the first resist coated and remaining on the end surface of the substrate using a solvent. Furthermore, as the first embodiment of the above proposal, the first embodiment of the above proposal
An organic solvent stripping type resist is used as the resist, and the second
A method for manufacturing the printed board using an alkali-peelable resist as the resist has been proposed, and a method for producing the printed board using an alkali-peelable resist as the first resist and an organic solvent-peelable resist as the second resist has been proposed as the second method. A method of manufacturing the printed board using a resist is proposed.
以下本発明を図面を参照しながら説明する。The present invention will be explained below with reference to the drawings.
第１図Ａ及びＢは夫々従来のパネルめつき法による金属
芯入リプリント板のパターン形成のための製造工程図及
びその各工程におけるプリント板の状態を示す図である
。この従来の製造工程を工程順に本図により説明すれば
、ａ先づ絶縁基板１の外形とスルーホール元穴の機械加
工（金属芯入リプリント板の場合は金属板の外形穴加工
後に絶縁樹脂コーティング）と、めつきの付きを良くす
るための表面粗化を行い、ｂ次いで基板１の全面に無電
解で０．５μ位の薄層の銅めつきを行つて全面を導電状
態にした後、電解めつきて約５０〜７０μの銅めつき層
２を厚付けする。FIGS. 1A and 1B are diagrams showing a manufacturing process for forming a pattern on a metal-core reprint board by a conventional panel plating method, and the state of the printed board in each process. To explain this conventional manufacturing process in the order of steps using this diagram, a. First, machining the outer shape of the insulating substrate 1 and the original hole of the through hole (in the case of a reprinted board with a metal core, after machining the outer hole of the metal plate, the insulating resin coating is applied. ), the surface is roughened to improve the adhesion of plating, and then a thin layer of copper of about 0.5 μm is electrolessly plated on the entire surface of the substrate 1 to make the entire surface conductive. The copper plating layer 2 is plated to a thickness of about 50 to 70 μm.
ｃ次いでスルーホール内面レジスト層３の塗布を行うた
めレジスト液中への浸漬等により端面４のレジスト層４
″とを含めての全面へのレジストインク層の塗布を行い
、両表面だけの塗布インク層をロールブラシ等で研磨し
て除去する。c Next, in order to apply the resist layer 3 on the inner surface of the through hole, the resist layer 4 on the end surface 4 is coated by immersion in a resist solution, etc.
A resist ink layer is applied to the entire surface including ``, and the ink layer applied only to both surfaces is removed by polishing with a roll brush or the like.
ｄ次いで端面４のレジストインク層４″だけをナイフ等
で掻き取り除去する。d Then, only the resist ink layer 4'' on the end surface 4 is scraped off with a knife or the like.
ｅ次いでパターン形成のためのエッチングレジスト５を
ホトレジストに対する露光現像又はレジストインクによ
るスクリーン印刷により形成し、ｆ エッチングを行つ
てパターン部以外の端面上を含む銅層を除去してパター
ン銅面６を形成し、ｇ両表面上及びスルーホール内面の
エッチングレジスト５及び３を化学的に剥離してパター
ンを完成していた。e Next, an etching resist 5 for pattern formation is formed by exposure and development of the photoresist or screen printing with resist ink, and f etching is performed to remove the copper layer including the end face other than the pattern portion to form a patterned copper surface 6. Then, the etching resists 5 and 3 on both surfaces of G and on the inner surface of the through hole were chemically peeled off to complete the pattern.
ところが上記の従来方法による時は、ｄのスルーホール
内レジストを簡単に浸漬法で行つた結果として塗布され
た端面４だけのレジストインク４″を除去するのに時間
が掛り、またこの作業が自動化の障害となつていたので
、本発明に係る実施例においては、第２図Ａ及びＢの工
程図及び基板の状態図に示すように作業工程を改変して
いる。即ちａ及びｂは従来通りとし、Ｃ″においてはレ
ジスト液中に浸漬して端面と穴埋めの同時塗布に使用す
るレジストインクとして有機溶剤剥離型のレジストイン
クを使用して全面の塗布と表面だけのレジストの研磨除
去を行い、次に従来のｅの工程をｄの工程に先行させる
形でｅ″としてアルカリ溶剤剥離型レジストインクでパ
ターンのスクリーン印刷７を両表面に施し、次いでｄ″
従来のｄの工程に代えて、スルーホール内充填をレジス
ト液中浸漬により簡単に行つた結果として端面４に付着
しているレジスト４″を有機溶剤で剥離する工程を行い
、次のｆのエッチング工程を従来通り行つてパターン銅
面６の形成と、端面上銅めつき層８の除去とを同時に行
い、最後に残留エッチングレジスト７のアルカリ溶剤に
よる除去と有機溶剤によるスルーホール内レジストイン
ク３の除去とによる仕上げを行つてパターンの形成を完
成している。本発明に係る上記の方法によれば、スルー
ホール内充填をレジスト液中への基板浸漬により簡単に
行つたため同時に塗布されている端面からのエッチング
レジスト４″の除去は有機溶剤による溶解によりパター
ンのレジストを害することなく簡単に行うことができる
ので、従来のような入手による掻取り作業を要せす、従
つて作業の自動化を可能とすることもできる。However, when using the above conventional method, it takes time to remove the resist ink 4'' applied only to the end surface 4 as a result of simply applying the dipping method to the resist in the through hole d, and this work cannot be automated. Therefore, in the embodiment according to the present invention, the working process is modified as shown in the process diagram and the state diagram of the substrate in FIGS. 2A and B. That is, a and b are the same as before. In C'', an organic solvent stripping type resist ink is used as a resist ink that is immersed in a resist solution and used for simultaneous coating of end faces and hole filling, and the resist is coated on the entire surface and the resist is polished off only on the surface. Next, the conventional process e is preceded by the process d, and a pattern 7 is screen printed on both surfaces using alkaline solvent stripping resist ink as e'', and then d''
Instead of the conventional step d, a step of peeling off the resist 4'' adhering to the end surface 4 as a result of simply filling the through hole by immersion in a resist solution with an organic solvent is performed, and the next step f is etching. The process is carried out as usual to simultaneously form the patterned copper surface 6 and remove the copper plating layer 8 on the end surface.Finally, the remaining etching resist 7 is removed with an alkaline solvent and the resist ink 3 in the through holes is removed with an organic solvent. The formation of the pattern is completed by finishing by removing the resist.According to the above method according to the present invention, filling of the through holes is easily performed by dipping the substrate in the resist solution, so that the resist solution is coated at the same time. Removal of the etching resist 4'' from the end face can be easily performed by dissolving it with an organic solvent without damaging the pattern resist, which eliminates the need for the conventional scraping operation and therefore requires automation of the operation. It can also be made possible.
なお上記の本発明によるプリント板の製造方法において
は、有機溶剤とアルカリ溶剤を相互に入替え、また同時
に有機溶剤剥離型レジストインクとアルカリ溶剤剥離型
レジストインクとを相互に入替えた方法により行つても
全く同様の効果が得られる。In addition, in the method for manufacturing a printed board according to the present invention described above, the organic solvent and the alkaline solvent may be mutually replaced, and at the same time, the organic solvent strippable resist ink and the alkaline solvent strippable resist ink may be mutually replaced. Exactly the same effect can be obtained.
また有機溶剤剥離型レジストインクの代りに有機溶剤剥
離型ドライフィルム状ホトレジストを使用することも可
能である。It is also possible to use an organic solvent peelable dry film photoresist instead of the organic solvent peelable resist ink.
上述したように本発明に係る端面の処理工程を含むプリ
ント板の製造方法は、プリント板殊に金属芯入リプリン
ト板のパネルめつき法による製造時の基板端面へのめつ
き付着を容易且つ確実に防止することができるので、プ
リント板の製造工程”における時間短縮、工数削減を実
現させ、また該工程の自動化に大きく寄与することがて
きる。As described above, the printed board manufacturing method including the edge treatment step according to the present invention makes it possible to easily and reliably attach plating to the board end surface when manufacturing printed boards, especially reprinted boards with a metal core, by the panel plating method. Therefore, it is possible to shorten the time and reduce the number of man-hours in the printed board manufacturing process, and greatly contribute to the automation of this process.
第１図Ａ及びＢは夫々従来のパネルめつき法による金属
芯入リプリント板のパターン形成のための製造工程図及
びその各工程におけるプリント板の状態を示す図、第２
図Ａ及びＢは本発明による第１図Ａ及びＢに夫々対応す
る実施例図である。
１・・・・・・外形加工ずみ基板、２・・・・・・全面
銅めつき層、３・・・・・・スルーホール、４・・・・
・・端面、６・・・・・・パＬターン銅面、７・・・・
・ルジスト印刷パターン。Figures 1A and 1B are manufacturing process diagrams for forming patterns on metal-core reprinted boards using conventional panel plating methods, and diagrams showing the state of the printed boards in each process.
Figures A and B are embodiment views corresponding to Figures 1A and B, respectively, according to the present invention. 1... Exterior processed board, 2... Entire copper plating layer, 3... Through hole, 4...
...End face, 6...Pattern L pattern copper surface, 7...
- Rugist printing pattern.
Claims (1)
つきを施した後に行う基板表面の銅層面を選択的にエッ
チングするための前処理工程が基板をエッチングレジス
ト液に浸漬して基板のスルーホールを当該レジストで似
つて充填する工程と、その結果として基板の端面に塗布
された当該エッチングレジストを除去する工程を含んで
成るプリント板の製造方法において、前記レジスト液と
して第１の溶剤剥離型エッチングレジスト液を用い、該
スルーホールを除く基板表面全域の該第１レジストのみ
を研磨除去してから該第１レジストを剥離する溶剤では
剥離されない第２の溶剤剥離型エッチングレジストで基
板表面に所定のレジストパターンを形成し、次いで結果
として基板端面に塗布されて残留している該第１レジス
トを溶剤で除去することを特徴とするプリント板の製造
方法。 ２ 該第１レジストとして有機溶剤剥離型レジストを用
い、該第２レジストとしてアルカリ剥離型レジストを用
いることを特徴とする特許請求の範囲第１項記載のプリ
ント板の製造方法。 ３ 該第１レジストとしてアルカリ剥離型レジストを用
い、該第２レジストとして有機溶剤剥離型レジストを用
いることを特徴とする特許請求の範囲第１項記載のプリ
ント板の製造方法。[Scope of Claims] 1. A pretreatment step for selectively etching the copper layer surface on the substrate surface, which is performed after copper plating is applied to the entire surface of the contour-processed substrate including both surfaces and end surfaces, is performed by applying an etching resist solution to the substrate. A method for producing a printed board comprising the steps of filling the through holes of the substrate with the resist by immersing it in the resist solution, and removing the etching resist applied to the end surface of the substrate as a result of the process, wherein the resist solution A second solvent-removal type etching resist solution is used as a first solvent-removal type etching resist solution, and the first resist is removed by polishing only the entire surface of the substrate excluding the through-holes, and then the first resist is removed. A method for manufacturing a printed board, comprising forming a predetermined resist pattern on the surface of a substrate using an etching resist, and then removing the first resist remaining after being applied to the end surface of the substrate using a solvent. 2. The method of manufacturing a printed board according to claim 1, characterized in that an organic solvent peelable resist is used as the first resist, and an alkali peelable resist is used as the second resist. 3. The method of manufacturing a printed board according to claim 1, characterized in that an alkaline peelable resist is used as the first resist, and an organic solvent peelable resist is used as the second resist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15642077A JPS6054798B2 (en) | 1977-12-27 | 1977-12-27 | Printed board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15642077A JPS6054798B2 (en) | 1977-12-27 | 1977-12-27 | Printed board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5489258A JPS5489258A (en) | 1979-07-16 |
| JPS6054798B2 true JPS6054798B2 (en) | 1985-12-02 |
Family
ID=15627354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15642077A Expired JPS6054798B2 (en) | 1977-12-27 | 1977-12-27 | Printed board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6054798B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0247278Y2 (en) * | 1987-05-15 | 1990-12-12 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5626496A (en) * | 1979-08-10 | 1981-03-14 | Matsushita Electric Ind Co Ltd | Method of manufacturing through hole printed circuit board |
| JPS58100493A (en) * | 1981-12-10 | 1983-06-15 | 東京応化工業株式会社 | Method of producing through hole printed circuit board |
| JPS5974693A (en) * | 1982-10-21 | 1984-04-27 | 東京応化工業株式会社 | Method of producing through hole circuit board |
| JPS62224996A (en) * | 1986-03-27 | 1987-10-02 | イビデン株式会社 | Printed wiring board and manufacture of the same |
-
1977
- 1977-12-27 JP JP15642077A patent/JPS6054798B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0247278Y2 (en) * | 1987-05-15 | 1990-12-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5489258A (en) | 1979-07-16 |
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