JPS5950455U - 発光ダイオ−ド装置 - Google Patents
発光ダイオ−ド装置Info
- Publication number
- JPS5950455U JPS5950455U JP14550382U JP14550382U JPS5950455U JP S5950455 U JPS5950455 U JP S5950455U JP 14550382 U JP14550382 U JP 14550382U JP 14550382 U JP14550382 U JP 14550382U JP S5950455 U JPS5950455 U JP S5950455U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- mold body
- diode device
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は従来装置を示す断面図、第2図は光指 ・向性
性を示す特性図、第3図は本考案の実施例を示す断面図
である。 11.12.13・・・第1〜第3リード、11a。 12a・・・反射器、14.15・・・発光ダイオード
ペレット、16・・・第1モールド体、17・・・第2
モールド体。
性を示す特性図、第3図は本考案の実施例を示す断面図
である。 11.12.13・・・第1〜第3リード、11a。 12a・・・反射器、14.15・・・発光ダイオード
ペレット、16・・・第1モールド体、17・・・第2
モールド体。
Claims (1)
- 一端に夫々反射器が形成された複数のリード、該リード
の各反射器底面に配された発光ダイオードペレット、上
記各反射器を個別に被覆する第1モールド体、上記各反
射器を一体にモールドする第2のモールド体を具備し、
上記第1モールド体はフィシ(光散乱剤)入り透光性材
料からなり、また第2モールド体は透光性材料からなる
ことを特徴とする発光ダイオード装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14550382U JPS5950455U (ja) | 1982-09-24 | 1982-09-24 | 発光ダイオ−ド装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14550382U JPS5950455U (ja) | 1982-09-24 | 1982-09-24 | 発光ダイオ−ド装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5950455U true JPS5950455U (ja) | 1984-04-03 |
Family
ID=30324154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14550382U Pending JPS5950455U (ja) | 1982-09-24 | 1982-09-24 | 発光ダイオ−ド装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5950455U (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6321692A (ja) * | 1986-07-15 | 1988-01-29 | アンリツ株式会社 | Led表示装置とその製造方法 |
JPH033762U (ja) * | 1989-06-01 | 1991-01-16 | ||
EP0936682A1 (en) * | 1996-07-29 | 1999-08-18 | Nichia Chemical Industries, Ltd. | Light emitting device and display device |
JP2001119075A (ja) * | 1996-12-27 | 2001-04-27 | Nichia Chem Ind Ltd | 発光ダイオード及びそれを用いたled表示装置 |
US9196800B2 (en) | 1996-06-26 | 2015-11-24 | Osram Gmbh | Light-radiating semiconductor component with a luminescence conversion element |
-
1982
- 1982-09-24 JP JP14550382U patent/JPS5950455U/ja active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6321692A (ja) * | 1986-07-15 | 1988-01-29 | アンリツ株式会社 | Led表示装置とその製造方法 |
JPH033762U (ja) * | 1989-06-01 | 1991-01-16 | ||
US9196800B2 (en) | 1996-06-26 | 2015-11-24 | Osram Gmbh | Light-radiating semiconductor component with a luminescence conversion element |
EP0936682A1 (en) * | 1996-07-29 | 1999-08-18 | Nichia Chemical Industries, Ltd. | Light emitting device and display device |
EP0936682B1 (en) * | 1996-07-29 | 2000-08-23 | Nichia Chemical Industries, Ltd. | Light emitting device and display device |
JP2001119075A (ja) * | 1996-12-27 | 2001-04-27 | Nichia Chem Ind Ltd | 発光ダイオード及びそれを用いたled表示装置 |
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