JPS6042915B2 - Circuit board wiring test method - Google Patents
Circuit board wiring test methodInfo
- Publication number
- JPS6042915B2 JPS6042915B2 JP52125458A JP12545877A JPS6042915B2 JP S6042915 B2 JPS6042915 B2 JP S6042915B2 JP 52125458 A JP52125458 A JP 52125458A JP 12545877 A JP12545877 A JP 12545877A JP S6042915 B2 JPS6042915 B2 JP S6042915B2
- Authority
- JP
- Japan
- Prior art keywords
- inspected
- wiring board
- printed wiring
- circuit board
- measurement probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Description
【発明の詳細な説明】
本発明は回路基板の布線試験方法に関し、とくに回路
パターンに於ける回路断線、回路間ブリッジ、スルホー
ル導通抵抗等を検査する布線試験方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wiring testing method for a circuit board, and more particularly to a wiring testing method for inspecting circuit breaks, bridges between circuits, through-hole conduction resistance, etc. in a circuit pattern.
従来、この種の布線試験はあらかじめ被検査回路基板
（以下、回路基板の典型例としてプリント配線板を例に
挙げて説明する）のパターンに対応して必要検査位置に
測定プローブを配置した測定プローブ支持板を検査治具
として使用するのが通常であり、被検査プリント配線板
の回路パターンに合せた専用の測定プローブ支持板を製
作する必要があり、比較的多品種少量生産のプリント配
線板の特質から生産数量が一定数量に足りない場合、検
査ヘッド自体のコストを考慮すると本検査方式の適用が
困難となることが少なくなく、検査ヘッドのコスト低下
が強く要望されていた。Conventionally, this type of wiring test has been carried out by placing measurement probes at the required inspection positions in advance in accordance with the pattern of the circuit board to be tested (hereinafter, a printed wiring board will be explained as a typical example of a circuit board). Normally, a probe support plate is used as an inspection jig, and it is necessary to manufacture a dedicated measurement probe support plate that matches the circuit pattern of the printed wiring board to be inspected. Due to this characteristic, if the production quantity is insufficient to a certain amount, it is often difficult to apply this inspection method when considering the cost of the inspection head itself, and there has been a strong desire to reduce the cost of the inspection head.
また、前述の従来方式を改良した方式として多数の測定
プローブを所定のピッチで格子状に配列したプローブ支
持板と被検査プリント配線板との間に、被検査プリント
配線板の検査必要個所にのみ測定プローブを通しうる孔
あるいは欠除部を有した絶縁材からなるマスクプレート
を介在させ、検査個所として必要となる測定プローブの
みを選択して検査を行うことにより被検査プリント配線
板の品種毎の準備コストを低下させた方式も使用してい
たがこの場合、検査必要個所が必ず所定の格子上（例え
ば２．５４Ｔｒ！、／ ｎ−ｌ、）に位置している必要
があり、検査必要個所が所定の格子上にない非標準設計
のプリント配線板及び標準設計であつても２種以上の基
準格子が混在し、た設計のプリント配線板に対してはか
かる改良方式は全く適用が不可能であつた。さらに、マ
スクプレートの孔位置精度の問題により測定プローブが
検査必要個所に接触しない場合も少なくなかつた。 こ
れら従来例を第１図及び第２図を参照して詳述すると、
第１図において、測定プローブ支持板１０に固定された
上下に伸縮可能な測定プローブ１１は被検査プリント配
線板２０のパターンに合せて通常ランドの位置２１を対
象に配置され、測定プローブ支持板１０は交換可能な形
で布線試験装置（図示省略）に固定される。In addition, as an improved method of the conventional method described above, a large number of measurement probes are arranged in a grid pattern at a predetermined pitch between the probe support plate and the printed wiring board to be inspected. By interposing a mask plate made of insulating material with holes or cutouts through which the measurement probes can pass, and performing the inspection by selecting only the measurement probes necessary for the inspection points, it is possible to inspect each type of printed wiring board to be inspected. A method that reduced the preparation cost was also used, but in this case, the location that required inspection must be located on a predetermined grid (for example, 2.54Tr!, /n-l,), and the location that required inspection This improvement method cannot be applied at all to printed wiring boards with non-standard designs that do not lie on a prescribed grid, and printed wiring boards with designs in which two or more types of reference grids coexist even in standard designs. It was hot. Furthermore, due to problems with the accuracy of the hole positions in the mask plate, there were many cases in which the measurement probe did not come into contact with the area that needed to be inspected. These conventional examples will be explained in detail with reference to FIGS. 1 and 2.
In FIG. 1, a measuring probe 11 that is fixed to a measuring probe support plate 10 and is vertically extendable and retractable is arranged at a normal land position 21 in accordance with the pattern of a printed wiring board 20 to be inspected. is fixed to the wiring test device (not shown) in a replaceable manner.
また、各測定プローブ１１より引き出された検査配線（
図示省略）は独立にコネクタ等の接続部品により布線試
験装置の計測部（図示省略）に接続される。被検査プリ
ント配線板２０は位置決めピン１２により測定プローブ
支持板１０の定位置上に装着される。この状態で被検査
プリント配線板２０とプローブ支持板１０との距離をプ
ローブ支持板１０の板面と垂直方向に近つけ、測定プロ
ーブ１１を被検査プリント配線板２０の所定の検査個所
に充分接触させ、電気的導通状態を保つた上で測定プロ
ーブ間を布線試験装置計測部により電気的に走査し、回
路断線、回路間ブリッジ等を検査している。第２図は第
１図の従来方式を改良した例で、測定プローブ支持板１
０には測定プローブ１１が一定のピッチで格子状に配置
され、測定プローブ支持板１０の板面に対向して被検査
プリント配線板２０はセットされるが、プリント配線板
の設計格子と測定プローブ支持板１０の測定プローブ１
１の配置格子とが互いに水平位置関係において一致する
ように位置決めピン１２が使用される。この時被検査プ
リント配線板２０と測定プローブ支持板１０との間に電
気的絶縁条件に被検査プリント配線板の所定の検査個所
に相当する特定位置に穴明けをしたマスクプレート３０
を介在させ、位置決めピン１２によつて被検査プリント
配線板２０の設計格子と一致するように測定プローブ支
持板１０上に位置決めされる。この状態で被検査プ．リ
ント配線板２０と測定プローブ支持板１０の距離を測定
プローブ支持板１０の板面と垂直方向に近づけると、所
定の検査個所はマスクプレート３０の逃げ孔３１を測定
プローブ１１が貫挿し、被検査プリント配線板２０の検
査ポイントに接触し！電気的に検査可能状態となり、一
方、非検査個所はマスクプレートに穴あけされていない
ため測定プローブ１１はマスクプレート３０に遮断され
被検査プリント配線板２０に接触せず、電気的に絶縁状
態となる。以上の如く、従来方法では被検査プリント配
線板の品種が変るごとにその回路パターンに合せた専用
の測定プローブ支持板が個々に必要であり、コストがか
さみ、プリント配線板のパターン変更に容易に対応出来
ない欠点を有しており、さらに測定プローブを一定のピ
ッチで配置し、マスクプレートによつて必要な検査端子
を選択する方式では被検査プリント配線板の検査端子が
所定の格子上にない場合、検査が不可能であることは前
述の通りである。In addition, the test wiring drawn out from each measurement probe 11 (
(not shown) is independently connected to a measurement section (not shown) of the wiring test device by a connecting part such as a connector. The printed wiring board 20 to be inspected is mounted at a fixed position on the measurement probe support plate 10 by positioning pins 12 . In this state, the distance between the printed wiring board 20 to be inspected and the probe support plate 10 is brought closer in the direction perpendicular to the surface of the probe support plate 10, and the measurement probe 11 is sufficiently brought into contact with the predetermined test location of the printed wiring board 20 to be inspected. After maintaining electrical continuity, the measurement section of the wiring test device electrically scans the distance between the measurement probes to check for circuit breaks, bridges between circuits, etc. Figure 2 shows an improved example of the conventional method shown in Figure 1, in which the measurement probe support plate 1
0, the measurement probes 11 are arranged in a grid pattern at a constant pitch, and the printed wiring board 20 to be inspected is set facing the surface of the measurement probe support plate 10. Measuring probe 1 on support plate 10
Positioning pins 12 are used so that the one arrangement grid corresponds to each other in horizontal positional relationship. At this time, a mask plate 30 is provided between the printed wiring board 20 to be inspected and the measurement probe support plate 10 with holes drilled at specific positions corresponding to predetermined inspection points on the printed wiring board to be inspected to maintain electrical insulation conditions.
are positioned on the measurement probe support plate 10 using the positioning pins 12 so as to match the design grid of the printed wiring board 20 to be inspected. In this state, the test target. When the distance between the lint wiring board 20 and the measurement probe support plate 10 is brought closer in the direction perpendicular to the plate surface of the measurement probe support plate 10, the measurement probe 11 penetrates the relief hole 31 of the mask plate 30 at the predetermined inspection location, and Touch the inspection point on the printed wiring board 20! It becomes electrically testable, and on the other hand, the measurement probe 11 is blocked by the mask plate 30 and does not come into contact with the printed wiring board 20 to be tested, and becomes electrically insulated since the mask plate is not made with holes in the non-test locations. . As described above, in the conventional method, each time the type of printed wiring board to be inspected changes, a dedicated measurement probe support plate is required for each circuit pattern, which increases costs and makes it difficult to easily change the pattern of the printed wiring board. Furthermore, in the method of arranging measurement probes at a fixed pitch and selecting the necessary test terminals using a mask plate, the test terminals of the printed wiring board to be tested are not on the predetermined grid. As mentioned above, in this case, inspection is impossible.
本発明の目的は上述した欠点を解決した汎用性のある低
コストの布線試験方法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a versatile, low-cost wiring test method that overcomes the above-mentioned drawbacks.
） 本発明によれば、マスクプレートの代りに所定の回
路パターンを有する回路基板を介して特定のプローブと
被検査回路基板の所定部とを導通させることを特徴とす
る回路基板の布線試験方法が得られる。) According to the present invention, there is provided a wiring test method for a circuit board, characterized in that a specific probe and a predetermined portion of the circuit board to be tested are electrically connected through a circuit board having a predetermined circuit pattern instead of a mask plate. is obtained.
より詳しく述べると本発明によれば、プ・ローブを所定
のピッチで格子状に配列したプローブ支持体の特定プロ
ーブを選択して被検査回路基板のプローブの配列位置か
らずれた所定部との電気的な導通を得る回路基板の布線
試験方法において、上記電気的導通を得る手段として中
継配線板゛を用い、この中継配線板はプローブ支持体列
に面する側に上記特定プローブに対応する位置に測定プ
ローブ受け座を有し、上記被検査回路基板と面する側に
上記所定部に対応する接触座を有し、上記測定プローブ
受け座と接触座とは測定プローブ受け座に設けたスルー
ホールを介してこのスルーホールと上記接触座とを導通
する短い導体パターンで電気的に接続されていることを
特徴とする回路基板の布線試験方法が得られる。次に本
発明の一実施例につき、第３図乃至第５図を参照して詳
細に説明する。More specifically, according to the present invention, a specific probe of a probe support in which probes are arranged in a lattice shape at a predetermined pitch is selected and electrical contact is made with a predetermined portion of the circuit board to be inspected that is deviated from the probe arrangement position. In the circuit board wiring test method for obtaining electrical continuity, a relay wiring board is used as a means for obtaining electrical continuity, and this relay wiring board has a position corresponding to the specific probe on the side facing the probe support row. a measuring probe receiving seat, and a contact seat corresponding to the predetermined portion on the side facing the circuit board to be inspected, and the measuring probe receiving seat and the contact seat are through holes provided in the measuring probe receiving seat. A wiring test method for a circuit board is obtained, which is characterized in that the through hole and the contact seat are electrically connected by a short conductive pattern through which the through hole and the contact seat are electrically connected. Next, one embodiment of the present invention will be described in detail with reference to FIGS. 3 to 5.
第３図において測定プローブ１１は測定プローブ支持板
１０に配置され、従来方式と同様に一定のピッチで格子
状に配置される。このピッチは通常２．５４Ｔｒ＄Ｌ等
を採用するが、その他にも検査対象となるプリント配線
板の設計基準に従つて特定のピッチが選択される。この
ように全共通的に測定プローブを配置した測定プローブ
支持板１０の板面に対向して被検査プリント配線板２０
が位置決めピン１２により定位置に装着されるが、この
時被検査プリント配線板２０と測定プローブ支持板１０
との間に中継プリント板４０を介在させ、同じ位置決め
ピン１２を介して定位置に装着する。第４図は中継プリ
ント板４０の部分拡大図であり、導通パターン４１は測
定プローブ受け座４１ａ（裏面）と導通回路４１ｂと第
３図に示す被検査プリント配線板２０の回路パターン上
の検査ポイント２１と接触すべき接触座４１ｃとを含ん
でいる。中継プリント板４０を被検査プリント配線板２
０と測定プローブ支持板１０との間に介在させた時、測
定プローブ受け座４１ａはプローブ支持板１０の側にあ
り、中継プリント板４０を貫通するスルホール及び導通
回路４１ｂを介して被検査プリント配線板２０の側にあ
る接触座４１ｃに接続されている。測定プローブ受け座
４１ａは測定プローブ配列格子と同一格子上に設ける必
要がある接触座４１ｃは被検査プリント配線板２０の検
査ポイント２１の配列に合せて任意に設けることが可能
である。なお被検査プリント配線板２０の検査端子２１
が測定プローブの配列格子上にある時は当然測定プロー
ブ受け座４１ａと接触座４１ｃは同一位置上となる。こ
の構成において、カム又はリンク等の密着機構の動作に
より、被検査プリント配線板２０と測定プローブ支持板
１０とを近接させると、検査個所は測定プローブ１１が
中継プリント板４０の、導通パターン４１の測定プロー
ブ受け座４１ａに接触し、さらに接触座４１ｃは被検査
プリント配線板２０の検査ポイント２１に面接触にて接
続するため検査可能状態となり、一方非検査個所は中継
プリント板４０に導通パターンが存在しないた，め測定
プローブ１１は被検査プリント配線板２０に接触せず電
気的に絶縁状態となる。なお、本実施例において中継プ
リント板４０は被検査プリント配線板２０の表面の状態
に追随出来るように例えばフレキシブルプリント配線板
の！様な材質から形成されることが好ましい。In FIG. 3, the measurement probes 11 are arranged on the measurement probe support plate 10, and are arranged in a grid pattern at a constant pitch as in the conventional system. This pitch is usually 2.54Tr$L, but a specific pitch is also selected in accordance with the design standard of the printed wiring board to be inspected. A printed wiring board 20 to be inspected is placed facing the surface of the measurement probe support plate 10 on which measurement probes are commonly arranged.
is mounted in a fixed position by the positioning pin 12, but at this time, the printed wiring board 20 to be inspected and the measurement probe support plate 10
A relay printed board 40 is interposed between the two and the same positioning pins 12 are used to attach the relay printed board 40 to the fixed position. FIG. 4 is a partially enlarged view of the relay printed wiring board 40, in which the conduction pattern 41 includes the measurement probe receiving seat 41a (back side), the conduction circuit 41b, and the inspection points on the circuit pattern of the printed wiring board 20 to be inspected shown in FIG. 21 and a contact seat 41c to be in contact with the contact seat 41c. The relay printed board 40 is connected to the printed wiring board 2 to be inspected.
0 and the measurement probe support plate 10, the measurement probe receiving seat 41a is on the side of the probe support plate 10, and the printed wiring to be inspected is inserted through the through hole penetrating the relay printed board 40 and the conduction circuit 41b. It is connected to the contact seat 41c on the side of the plate 20. The measurement probe receiving seat 41a needs to be provided on the same grid as the measurement probe array grid.The contact seat 41c can be provided arbitrarily according to the arrangement of the inspection points 21 of the printed wiring board 20 to be inspected. In addition, the inspection terminal 21 of the printed wiring board 20 to be inspected
When is on the measurement probe arrangement grid, the measurement probe receiving seat 41a and the contact seat 41c are naturally on the same position. In this configuration, when the printed wiring board 20 to be inspected and the measurement probe support plate 10 are brought close to each other by the operation of a close contact mechanism such as a cam or a link, the measurement probe 11 is connected to the conductive pattern 41 of the relay printed board 40 at the inspection location. The contact seat 41c contacts the measurement probe receiving seat 41a, and is connected to the inspection point 21 of the printed wiring board 20 to be inspected by surface contact, so that it is ready for inspection. Therefore, the measurement probe 11 does not come into contact with the printed wiring board 20 to be inspected and is electrically insulated. In this embodiment, the relay printed wiring board 40 is made of, for example, a flexible printed wiring board so that it can follow the surface condition of the printed wiring board 20 to be inspected. It is preferable that it is made of various materials.
以上の説明から明らかなように、本発明によれば被検査
プリント配線板の品種が変わつた場合接続パターンの異
なつた中継プリント板を準備するだけで良く、本発明に
要するコスト及び準備時間は従来の専用測定プローブ支
持板方式に比べ、大幅に改善される。As is clear from the above description, according to the present invention, when the type of printed wiring board to be inspected changes, it is only necessary to prepare a relay printed wiring board with a different connection pattern, and the cost and preparation time required for the present invention are lower than that of the conventional printed wiring board. This is a significant improvement over the dedicated measurement probe support plate method.
さらに従来からのマスクプレートにより測定プローブを
選択する方式に比べて本発明の方式では被検査プリント
配線板の検査ポイントが基準格子上に無い場合でも検査
可能であり、汎用性拡大の効果がある。なお、以上の説
明は本発明をプリント配線板の布線試験について適用し
た場合について行つたが、プリント配線板以外にも広く
プローブを接触させて検査しうる種々の配線板、例えば
薄膜、厚膜集積回路等にも広く応用出来るものである。Furthermore, compared to the conventional method of selecting measurement probes using a mask plate, the method of the present invention allows inspection even when the inspection point of the printed wiring board to be inspected is not on the reference grid, and has the effect of expanding versatility. The above explanation has been made regarding the case where the present invention is applied to the wiring test of printed wiring boards. It can also be widely applied to integrated circuits and the like.
第１図、第２図は従来方式を説明するための斜視図、第
３図は本発明の一実施例を説明するための斜視図、第４
図は本発明による中継プリント板の拡大図、第５図は本
発明の一実施例を説明するための断面図である。
１０・・・・・・測定プローブ支持板、１１・・・・・
・測定プローブ、１２・・・・・位置決めピン、２０・
・・・・・被検査プリント配線板、２１・・・・・・検
査ポイント、３０・・・・・・マスクプレート、３１・
・・・・・逃げ孔、４０・・・・・・中継プリント板、
４１・・・・・・接続パターン、４１ａ・・・・・・測
定プローブ受け座、４１ｂ・・・・・・導通回路、４１
ｃ・・・・・・接触座。Figures 1 and 2 are perspective views for explaining the conventional system, Figure 3 is a perspective view for explaining an embodiment of the present invention, and Figure 4 is a perspective view for explaining an embodiment of the present invention.
The figure is an enlarged view of a relay printed board according to the present invention, and FIG. 5 is a sectional view for explaining one embodiment of the present invention. 10...Measurement probe support plate, 11...
・Measuring probe, 12...Positioning pin, 20・
...Printed wiring board to be inspected, 21...Inspection point, 30...Mask plate, 31...
... Escape hole, 40 ... Relay printed board,
41... Connection pattern, 41a... Measurement probe receiving seat, 41b... Continuity circuit, 41
c...Contact locus.
Claims (1)
ブ支持体の特定プローブを選択して被検査回路基板の前
記プローブの配列位置からずれた所定部との電気的な導
通を得る回路基板の布線試験方法において、前記電気的
導通を得る手段として中継配線板を用い、該中継配線板
は前記プローブ支持体列に面する側に前記特定プローブ
に対応する位置に測定プローブ受け座を有し、前記被検
査回路基板と面する側に前記所定部に対応する接触座を
有し、前記測定プローブ受け座と接触座とは前記測定プ
ローブ受け座に設けたスルーホールを介して該スルーホ
ールと前記接触座とを導通する短い導体パターンで電気
的に接続されていることを特徴とする回路基板の布線試
験方法。1 Wiring of a circuit board to select a specific probe of a probe support in which probes are arranged in a grid at a predetermined pitch and to obtain electrical continuity with a predetermined portion of the circuit board to be inspected that is shifted from the arrangement position of the probes. In the test method, a relay wiring board is used as the means for obtaining electrical continuity, and the relay wiring board has a measurement probe receiving seat at a position corresponding to the specific probe on the side facing the probe support row, and the A contact seat corresponding to the predetermined portion is provided on the side facing the circuit board to be inspected, and the measurement probe receiving seat and the contact seat make contact with the through hole through a through hole provided in the measurement probe receiving seat. A wiring test method for a circuit board, which is characterized in that the wiring is electrically connected to a circuit board through a short conductive pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52125458A JPS6042915B2 (en) | 1977-10-18 | 1977-10-18 | Circuit board wiring test method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52125458A JPS6042915B2 (en) | 1977-10-18 | 1977-10-18 | Circuit board wiring test method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5457665A JPS5457665A (en) | 1979-05-09 |
| JPS6042915B2 true JPS6042915B2 (en) | 1985-09-25 |
Family
ID=14910584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52125458A Expired JPS6042915B2 (en) | 1977-10-18 | 1977-10-18 | Circuit board wiring test method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6042915B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61105817U (en) * | 1984-12-19 | 1986-07-05 | ||
| JPS62147318A (en) * | 1985-12-23 | 1987-07-01 | Sueo Okada | Mechanism for preventing excessive rotation of water meter |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6367978U (en) * | 1986-10-22 | 1988-05-07 |
-
1977
- 1977-10-18 JP JP52125458A patent/JPS6042915B2/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61105817U (en) * | 1984-12-19 | 1986-07-05 | ||
| JPS62147318A (en) * | 1985-12-23 | 1987-07-01 | Sueo Okada | Mechanism for preventing excessive rotation of water meter |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5457665A (en) | 1979-05-09 |
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