JPS6041298A - Chip part attaching machine - Google Patents
Chip part attaching machineInfo
- Publication number
- JPS6041298A JPS6041298A JP58149800A JP14980083A JPS6041298A JP S6041298 A JPS6041298 A JP S6041298A JP 58149800 A JP58149800 A JP 58149800A JP 14980083 A JP14980083 A JP 14980083A JP S6041298 A JPS6041298 A JP S6041298A
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- chip
- suction nozzle
- nozzle
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は角型や円筒型等のチップ部品をチーピンクパー
ツ又はマガジンからチップ部品装着機で自動装着させる
際、吸着ミスを起こしたチップ部品を取り除き再び起動
きせるチップ部品装着機に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is for removing chip parts that have caused suction errors when automatically mounting square or cylindrical chip parts from chip pin parts or magazines using a chip part mounting machine. This relates to a chip component mounting machine that can be restarted.
従来例の構成とその問題点
近年−ＦＡ（ファクトリ−・オートメーション）化に伴
なってリードレスタイプの部品を装着するチップ部品装
着機が重要視されてきている。Conventional Structure and its Problems In recent years, chip component mounting machines for mounting leadless type components have been gaining importance as FA (factory automation) becomes more widespread.
第１図は上記に示すような従来のチップ部品装着機の正
面図である。FIG. 1 is a front view of a conventional chip component mounting machine as shown above.
第１図において１は装着ヘッド本体（図示せず）に摺動
自在に支承された装着駆動軸−２は装着駆動軸１の先端
に設けられチップ部品３を吸着して印刷配線基８ｉ（以
下プリント基板という。）４に装着する吸着ノズル、６
は吸着ノズル２で吸着したチップ部品を吸着ノズル２の
先端中央に動かし保持するセンタリング爪、６はチップ
部品３をテーピングしたテープを装填しているバーツカ
セクトである。In FIG. 1, reference numeral 1 denotes a mounting drive shaft 2 that is slidably supported on a mounting head main body (not shown). A mounting drive shaft 2 is provided at the tip of the mounting drive shaft 1 and attracts a chip component 3 to a printed circuit board 8i (hereinafter referred to as (referred to as a printed circuit board.) Suction nozzle attached to 4, 6
6 is a centering claw that moves and holds the chip component sucked by the suction nozzle 2 to the center of the tip of the suction nozzle 2, and 6 is a bar cassette in which the tape on which the chip component 3 is taped is loaded.
以」二のように構成した従来のチップ部品装着機につい
て以下その動作について説明する。The operation of the conventional chip component mounting machine configured as described above will be explained below.
まずパーツカセット４に設けたチップ部品３を吸着する
ため吸着ノズル２を装着駆動軸１によって下降運動させ
る。そしてチップ部品３を吸着し３ 、
た後、上列させセンタリング爪６によって吸着ノズル２
の中央にチップ部品３を保持させるように位置出しを行
なう。その後吸着ノズル２を装着駆動軸１がプリント基
板４土に前進移動した後再び下降運動してプリント基板
４上に移動させ装着させている。First, the suction nozzle 2 is moved downward by the mounting drive shaft 1 in order to suction the chip component 3 provided in the parts cassette 4. After picking up the chip parts 3 , they are placed in an upper row and the centering claw 6 is used to move the chip parts 3 to the suction nozzle 2 .
Positioning is performed so that the chip component 3 is held in the center. Thereafter, the suction nozzle 2 is mounted on the printed circuit board 4 by the mounting drive shaft 1 which moves forward onto the printed circuit board 4 and then moves downward again to move it onto the printed circuit board 4 and mount the suction nozzle 2 thereon.
しかしながら上記従来のチップ部品装着機は吸着ノズル
２によってパーツカセット６よりチップ部品２′ｆ：吸
着する場合、パーツカセット６のテーピング品質が安定
していないためテーピングパーツから吸い一ヒげたチッ
プ部品が吸着ノズル２の先端で正規の形で保持できない
場合が生じることがあった。この場合センサー（図示せ
ず）等で吸着異常全検知しチップ部品装着機を停止させ
ていた。However, when the above-mentioned conventional chip component mounting machine adsorbs the chip component 2'f: from the parts cassette 6 by the suction nozzle 2, the taping quality of the parts cassette 6 is not stable, so the chip component that has been sucked from the taped part is adsorbed. There have been cases where the tip of the nozzle 2 cannot be held in a proper shape. In this case, a sensor (not shown) or the like would detect any suction abnormality and stop the chip component mounting machine.
この時再起動させるために異常な状態で吸着保持してい
る部品を取り除かねばならず、丑た品質トラブルを起さ
ないためにも人手による繁雑な操作を必要とし時間が長
くかかり機器の効率を著しく低下させるという欠点を有
していた。At this time, in order to restart the equipment, parts that have been suctioned and held in an abnormal state must be removed, and in order to avoid quality problems, complicated manual operations are required, which takes a long time and reduces the efficiency of the equipment. This had the disadvantage of significantly lowering the performance.
発明の目的
特開昭ＧＯ−４１２９８（２）
本発明は上記従来の欠点に鑑みなされたもので一チツプ
部品が異常な状態で吸着保持した際の除去作業と修正操
作に伴う繁雑が作業を不必要にし機器の効率化を高める
ことを目的とする。Purpose of the Invention JP-A No. 41298 (2) The present invention has been made in view of the above-mentioned drawbacks of the conventional art, and the complicated removal and repair operations that occur when a single chip component is suctioned and held in an abnormal state make the work difficult. The purpose is to increase the efficiency of equipment needed.
発明の構成
上記目的を達成するため本発明のチップ部品装着機はテ
ーピングパーツ又はマガジンから１つのチップ部品をつ
かみ取る手段と一前記チツブ部品の挾持姿態の良否を検
出するセンサ出力に応動し。Structure of the Invention In order to achieve the above object, the chip component mounting machine of the present invention has a means for grasping one chip component from a taping part or a magazine, and responds to a sensor output for detecting the quality of the clamping state of the chip component.
前記チップ部品を印刷配線基板の所定位置に移進し装着
するように構成すると共に、前記チップ部品の挾持姿態
が悪いと判断した場合のみ前記チップ部品を前記印刷配
線基板とは異なる位置に除去するように移送する手段を
設けた構成となっている。The chip component is configured to be moved and attached to a predetermined position on the printed wiring board, and the chip component is removed to a position different from the printed wiring board only when it is determined that the chip component is held in a bad manner. The structure includes a means for transporting it in this way.
この構成によりチップ部品が異常吸着した場合チップ部
品を別の位置に除去することになる。With this configuration, if a chip component is abnormally attracted, the chip component will be removed to another position.
実施例の説明
本発明の一実施例について図面に基づき説明する０
第２図Ｃｔ、本発明の一実施例のチップ部品装着機の正
面図である。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. FIG. 2Ct is a front view of a chip component mounting machine according to an embodiment of the present invention.
第２図において、第１図と同一部材には同一番号を付１
〜説明を省略する。１′はチップ部品装着装置、７は吸
着ノズル２に異常吸着したチップ部品３を吸い込むよう
に内径を定めその一端をチップ部品３の方向に向けたノ
ズル、８はノズル７の他端を接続した真空ポンプ用パイ
プ、９は真空ポンプ（図示せず）を備えチップ部品を吸
引・除去する除去ホｙパ、１０はノズル７、真空用パイ
プ８゜除去ホッパ９よりなる除去装置１１を固持するシ
リンダ、１２はシリンダを吸着ノズル３に移動させるシ
リンダ軸−１３はシリンダを移動するために真空用パイ
プ１４ａ、１４ｂに交互に吸気、排気を行かう駆動装置
、１６はシリンダの位置を検知する前進用マグネットス
イッチ１６ａ、後進用マグネットスイッチ１ｅｂと除去
ホクパ９と駆動装置１３とを制御する駆動回路−１７は
吸着ノズル２でチップ部品３を吸着させる真空ポンプ、
１８は吸着ノズル２と真空ポンプ１７の真空用ノ（イブ
６、ミ
１９に設けられ空気圧を検知するエアーセンサー２ｏは
エアーセンサ１８と駆動回路１６に接続しチップ部品装
着装置１′等を制御する制御装置である。In Figure 2, parts that are the same as those in Figure 1 are designated with the same numbers.
~Description omitted. 1' is a chip component mounting device, 7 is a nozzle whose inner diameter is set so as to suck the chip component 3 abnormally attracted to the suction nozzle 2, and one end of the nozzle is directed toward the chip component 3. 8 is a nozzle to which the other end of the nozzle 7 is connected. A vacuum pump pipe, 9 a removal hopper equipped with a vacuum pump (not shown) for sucking and removing chip parts, 10 a cylinder holding a removal device 11 consisting of a nozzle 7, a vacuum pipe 8 and a removal hopper 9; , 12 is a cylinder shaft for moving the cylinder to the suction nozzle 3; 13 is a drive device that alternately inhales and exhausts air into vacuum pipes 14a and 14b in order to move the cylinder; 16 is a forward drive device that detects the position of the cylinder; A drive circuit 17 that controls the magnet switch 16a, the backward magnet switch 1eb, the removal picker 9, and the drive device 13 includes a vacuum pump that causes the chip component 3 to be sucked by the suction nozzle 2;
Reference numeral 18 denotes an air sensor 2o provided at the suction nozzle 2 and the vacuum nozzle of the vacuum pump 17 (eve 6, 19) to detect air pressure, which is connected to the air sensor 18 and the drive circuit 16 to control the chip component mounting device 1', etc. It is a control device.
以−ヒのように構成された本実施例について以下その動
作について説明する。The operation of this embodiment configured as described above will be explained below.
今、第２図はパーツカセット６に装填しているテーピン
グ品質の不安定性などによって、吸着ノズル２先端にチ
ップ部品３が異常な状態で吸着した場合を示している。Now, FIG. 2 shows a case where a chip component 3 is abnormally attracted to the tip of the suction nozzle 2 due to instability in the quality of the taping loaded in the parts cassette 6.
この場合、吸着ノズル２が上昇しセンタリング爪６が動
作するが、チップ部品３が正規の状態で吸着ノズル２に
保持されていないため真空用パイプ１９内の空気圧が正
常時と異なり、この空気圧の異常をエアーセンサ２０が
検知し、吸着ミスを示す信号が出力される。−力制御回
路２０ではこの吸着ミスの信号全入力すると、チップ部
品装着機１′を停止させると同時に駆動回路１６にチッ
プ部品３を除去するための信号を送る。駆動回路１５は
駆動装置１３から真空用パイプ１４ｂに空気を送りシリ
ンダ軸１２に沿つ７−−
てシリンダ１ｏを前進させノズル７の先端がチップ部品
３を覆うように進捷せ、前進用マグネットスイッチ１６
ａの泣面確認の信号を入力してシリンダ１０を停市させ
る。ぞｌ〜てその後吸着ノズル２での吸着力よりも強い
吸引力でチップ部品３をノズル７の巾に吸い込まぜ、チ
ップ部品３は除去ホッパ９に集められる。チップ部品３
を除去した後は真空用パイプ１４ａに空気を送ってシリ
ンダ１０ｆ：後退させ後進用マグネク）スイッチ１６ｂ
の出力によりシリンダ１０は停市することになる。In this case, the suction nozzle 2 rises and the centering claw 6 operates, but since the chip component 3 is not held in the suction nozzle 2 in a normal state, the air pressure in the vacuum pipe 19 is different from normal. The air sensor 20 detects the abnormality and outputs a signal indicating a suction error. - When the force control circuit 20 receives all the signals indicating this suction error, it stops the chip component mounting machine 1' and at the same time sends a signal to the drive circuit 16 to remove the chip component 3. The drive circuit 15 sends air from the drive device 13 to the vacuum pipe 14b and moves the cylinder 1o forward along the cylinder axis 12 so that the tip of the nozzle 7 covers the chip part 3, and the advancing magnet switch 16
The cylinder 10 is stopped by inputting a signal for confirming the surface of a. Thereafter, the chip parts 3 are sucked into the width of the nozzle 7 with a suction force stronger than that of the suction nozzle 2, and the chip parts 3 are collected in the removal hopper 9. Chip parts 3
After removing the air, send air to the vacuum pipe 14a, move the cylinder 10f backward, and turn the reverse magnetic switch 16b.
The cylinder 10 is stopped due to the output.
その後シーケンスプログラム（図示せず）の追加によっ
てチップ部品装着装置１′は除去したチップ部品３と同
じもの全所たに吸着させ装着動作を再起動させる。Thereafter, by adding a sequence program (not shown), the chip component mounting apparatus 1' causes the chip component 3 that has been removed to pick up the same chip components 3 at all locations, and restarts the mounting operation.
以−にのように本実施例によれば、チップ部品装着機１
′の吸着ノズル２にチップ部品３が正規の形で保持して
いるかどうかをエアーセンサ１８で検知し、異常時には
吸着ミスを示す信号を出力してチップ部品３（ｉｌ−取
り除き、このチップ部品３と同じものを新たに吸着σせ
てチップ部品装着機１′の再起動を自動的に行うので、
従来のようにチップ部品３の異常吸着時に人手による異
常部品の除去作業と修正操作に伴う繁雑な作業が不必要
となりチップ部品装着装置１′の装着能力を向上させる
ことができると同時に異常時に伴う手間等の損失を極力
抑えることができる。″！タチップ部品３′？：吸い込
むため、チップ部品３が他の位置に飛散することもなく
他のプリント基板４上に落ちて生じる２次不良の発生を
心配する必要がない。As described above, according to this embodiment, the chip component mounting machine 1
The air sensor 18 detects whether the chip component 3 is properly held in the suction nozzle 2 of The chip component mounting machine 1' is automatically restarted by newly suctioning the same thing as σ.
This eliminates the need for manual removal and correction of the abnormal component when the chip component 3 is abnormally picked up as in the past, and improves the mounting ability of the chip component mounting device 1'. Loss of time and effort can be minimized. ``!Tchip component 3'?: Since the chip component 3 is sucked in, there is no need to worry about the occurrence of secondary defects caused by the chip component 3 falling onto other printed circuit boards 4 without being scattered to other positions.
発明の効果
以上のように本発明のチップ部品装着機によれば、吸着
ノズルにチップ部品が正規の形で保持しない時は、その
チップ部品を除去し新たにチップ部品を吸着させて自動
的に再起動させるので１人手による異常部品の除去作業
と修正操作に伴う繁雑な作業が不必要となり装着能力を
向上させることができ、異常時に伴う損失を極力抑える
ことができる等、その効果は大なるものがある。Effects of the Invention As described above, according to the chip component mounting machine of the present invention, when a chip component is not held in the normal shape in the suction nozzle, the chip component is removed and a new chip component is sucked and the chip component is automatically placed. Since the system is restarted, the complicated work associated with removing and correcting abnormal parts by one person is no longer necessary, the installation ability can be improved, and losses associated with abnormalities can be minimized, which has great effects. There is something.
第１図は従来のチップ部品装着機の正面図、第９−２．
２図は本発明の一実施例のチップ部品装着機の正面図で
ある。
１′・・・・・・チップ部品装着装置、２・・・・・・
吸着ノズル−３・・・・・・チップ部品−７・・・・・
・ノズル−１１・−・・・・除去装置、１８・・・・・
・エアーセンサ。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図FIG. 1 is a front view of a conventional chip component mounting machine, and FIG. 9-2. FIG. 2 is a front view of a chip component mounting machine according to an embodiment of the present invention. 1'... Chip component mounting device, 2...
Suction nozzle-3...Chip parts-7...
・Nozzle-11---Removal device, 18---
・Air sensor. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
figure
Claims (1)
つかみ取る手段と、前記チップ部品の挟持姿態の良否を
検出するセンサ出力に応動し、前記チップ部品を印刷配
線基板の所定位置に移進し装着するように構成すると共
に、前記チップ部品の挟持姿態が悪いと判断した場合の
み前記チップ部品を前記印刷配線基板とは異なる位置に
除去するように移送する手段を設けてなるチップ部品装
着機。A means for grabbing one chip component from a taping part or a magazine, and a means for moving and mounting the chip component to a predetermined position on a printed wiring board in response to a sensor output for detecting whether the chip component is in a good or bad state. A chip component mounting machine comprising: a means for transporting the chip component so as to remove it to a position different from the printed wiring board only when it is determined that the chip component is held in a bad manner;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58149800A JPH0632430B2 (en) | 1983-08-17 | 1983-08-17 | Chip component mounting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58149800A JPH0632430B2 (en) | 1983-08-17 | 1983-08-17 | Chip component mounting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6041298A true JPS6041298A (en) | 1985-03-04 |
| JPH0632430B2 JPH0632430B2 (en) | 1994-04-27 |
Family
ID=15482987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58149800A Expired - Lifetime JPH0632430B2 (en) | 1983-08-17 | 1983-08-17 | Chip component mounting machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0632430B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62250696A (en) * | 1986-04-24 | 1987-10-31 | 富士電機株式会社 | Parts fitting apparatus of electronic parts mounting machine |
| JPH01160097A (en) * | 1987-12-17 | 1989-06-22 | Matsushita Electric Ind Co Ltd | Electronic component mounting device |
| JPH01302900A (en) * | 1988-05-31 | 1989-12-06 | Sanyo Electric Co Ltd | Device for detecting existence of component |
| JPH066082A (en) * | 1992-06-22 | 1994-01-14 | Matsushita Electric Ind Co Ltd | Electronic part installation equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5524494A (en) * | 1978-08-09 | 1980-02-21 | Sanyo Electric Co | Device for attaching electronic circuit element |
| JPS5553271U (en) * | 1978-10-04 | 1980-04-10 | ||
| JPS57198698A (en) * | 1981-06-01 | 1982-12-06 | Tokyo Shibaura Electric Co | Part position detector |
-
1983
- 1983-08-17 JP JP58149800A patent/JPH0632430B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5524494A (en) * | 1978-08-09 | 1980-02-21 | Sanyo Electric Co | Device for attaching electronic circuit element |
| JPS5553271U (en) * | 1978-10-04 | 1980-04-10 | ||
| JPS57198698A (en) * | 1981-06-01 | 1982-12-06 | Tokyo Shibaura Electric Co | Part position detector |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62250696A (en) * | 1986-04-24 | 1987-10-31 | 富士電機株式会社 | Parts fitting apparatus of electronic parts mounting machine |
| JPH01160097A (en) * | 1987-12-17 | 1989-06-22 | Matsushita Electric Ind Co Ltd | Electronic component mounting device |
| JPH01302900A (en) * | 1988-05-31 | 1989-12-06 | Sanyo Electric Co Ltd | Device for detecting existence of component |
| JPH066082A (en) * | 1992-06-22 | 1994-01-14 | Matsushita Electric Ind Co Ltd | Electronic part installation equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0632430B2 (en) | 1994-04-27 |
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