JPS6040360B2 - Numerical control punch press for printed circuit boards - Google Patents
Numerical control punch press for printed circuit boardsInfo
- Publication number
- JPS6040360B2 JPS6040360B2 JP54119330A JP11933079A JPS6040360B2 JP S6040360 B2 JPS6040360 B2 JP S6040360B2 JP 54119330 A JP54119330 A JP 54119330A JP 11933079 A JP11933079 A JP 11933079A JP S6040360 B2 JPS6040360 B2 JP S6040360B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- die
- circuit board
- board material
- punch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Details Of Cutting Devices (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Punching Or Piercing (AREA)
Description
【発明の詳細な説明】
本発明は、プリント基板用材料の任意の位置に任意の形
状の穴を数値制御装置による指令に応じてプレス加工す
るプリント基板用数値制御パンチプレスに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a numerically controlled punch press for printed circuit boards that presses holes of arbitrary shapes at arbitrary positions in printed circuit board materials in accordance with instructions from a numerical control device.
従来のプリント基板用数値制御パンチプレス部の作動部
分を第１図に示す。FIG. 1 shows the operating parts of a conventional numerically controlled punch press for printed circuit boards.
第１図に示す装置はパンチプレス部１と誘導部２とを有
し、プリント基板材料３を所要の位置に誘導して穴あげ
を行なつｏパンチプレス部１は上部フレーム４を下部フ
レーム５とを有し、上部フレーム４に取付けたプレス６
は図示しない制御装置の指令に応じてポンチ７を作動さ
せる。The apparatus shown in FIG. 1 has a punch press part 1 and a guiding part 2, and the punch press part 1 guides the printed circuit board material 3 to a required position to make holes. and a press 6 attached to the upper frame 4.
operates the punch 7 in response to a command from a control device (not shown).
上部フレーム４に固定したポンチ案内板８はポンチ７の
上下に際してポンチ７を案内する。下部フレーム５に固
定したヘッド９に固着したダィ固定用プレス１０にダィ
１１を取付けてポンチ７と共鰯させる。誘導部２のベー
ス１３は下部フレーム５に固着する。A punch guide plate 8 fixed to the upper frame 4 guides the punch 7 when moving it up and down. A die 11 is attached to a die fixing press 10 fixed to a head 9 fixed to a lower frame 5, and sardines are made together with a punch 7. The base 13 of the guiding part 2 is fixed to the lower frame 5.
ベース１３上に取付けた縦ガイドロッド１４，１５に縦
誘導板１６を滑動可能に係合させる。縦議導板１６の底
面に固着したロッド１７を縦作動装置１８に結合する。
縦作動装置１８は図示ない制御装置の出力信号に応じて
ロッド１７、縦誘導板１６を所要寸法だけ動かす。凝議
導板１６上に横ガイドロッド１９，２０を固着する。A vertical guide plate 16 is slidably engaged with vertical guide rods 14 and 15 mounted on a base 13. A rod 17 fixed to the bottom of the vertical guiding plate 16 is connected to a vertical actuating device 18.
The vertical actuating device 18 moves the rod 17 and the vertical guide plate 16 by a required dimension in response to an output signal from a control device (not shown). Lateral guide rods 19 and 20 are fixed on the discussion guide plate 16.
横ガイドロッド１９，２０は横議導板２１を横方向のみ
に階動させる。横議導部板２１の底面に固着したロッド
２２を横作動装置２３に結合する。横作動装置２３は図
示しない制御装置の出力信号に応じて、ロッド２２、横
議導部板２１を所要の横方向分力と応ずる寸法だけ動か
す。横作動装置２３は縦誘導板１６に取付け、制御装置
との間はケーブルで接続する。横議導板２１にクランプ
２４，２５によってプリント基板用材料３を取付ける。The lateral guide rods 19 and 20 move the lateral guide plate 21 only in the lateral direction. A rod 22 fixed to the bottom of the lateral guide plate 21 is connected to a lateral actuator 23. The lateral actuator 23 moves the rod 22 and the lateral guide plate 21 by a dimension corresponding to a required lateral component force in response to an output signal from a control device (not shown). The lateral actuating device 23 is attached to the vertical guide plate 16 and connected to the control device by a cable. The printed circuit board material 3 is attached to the horizontal guide plate 21 using clamps 24 and 25.
プリント基板材料３のポンチ７の中心に対する相互位置
の情報に基いて数値制御装置は縦作動装置１８、横作動
装置２３を作動させてプリント基板材料３を所要位タ暦
に動かし、プレス６を作動させ、ポンチ７はダィ１１と
共働して所要形状の穴あげを行なう。第１図に示す装置
はプリント基板材料３の縦横方向の動き‘こ際して、プ
リント基板材料の下面が常にダーィ１１の上面に接触す
るため、ダィ１１の綾部の鋭角部がプリント基板材料の
欧質の裏面にかき傷を生じ、回路パターンの印刷の一部
が消滅する欠点があった。本発明の目的は、上述の欠点
を除去し、プリント基板材料の縦横方向の移動に際して
プリント基板材料にかき傷等を生じない数値制御パンチ
プレスを提供するにある。Based on the information on the mutual position of the printed circuit board material 3 with respect to the center of the punch 7, the numerical control device operates the vertical actuating device 18 and the horizontal actuating device 23 to move the printed circuit board material 3 to a desired position and operates the press 6. Then, the punch 7 works together with the die 11 to punch a hole in the desired shape. In the apparatus shown in FIG. 1, when the printed circuit board material 3 moves in the vertical and horizontal directions, the lower surface of the printed circuit board material always comes into contact with the upper surface of the die 11, so that the acute angles of the traverse portions of the die 11 touch the printed circuit board material. The problem was that the back side of the European material was scratched, and part of the printed circuit pattern disappeared. SUMMARY OF THE INVENTION It is an object of the present invention to provide a numerically controlled punch press which eliminates the above-mentioned drawbacks and which does not cause scratches or the like on the printed circuit board material when moving the printed circuit board material in the longitudinal and lateral directions.
本発明によって、回路パタ−ン等を印刷エッチングされ
たプリント基板材料を支持して平面内液横方向に移動さ
せる誘導部と、上記プリント基板材料の所要の位置に所
要形状の欠あげを行なうパンチとダィとを有するパンチ
プレス部と、誘導部とパンチプレス部とを作動させる指
令信号を生ずる数値制御装置とを有するプリント基板用
数値制御パンチプレス部において、誘導部がプリント基
板材料を移動位層ぎめする間上記ダィをプリント基板材
料に接触しない位置に下降させるダィ上下装置を備える
。本発明を例示とした実施例並びに図面について説明す
る。According to the present invention, there is provided a guiding part that supports a printed circuit board material on which a circuit pattern or the like has been printed and etched and moves the liquid laterally in a plane, and a punch that cuts out a desired shape at a desired position on the printed board material. In the numerically controlled punch press unit for printed circuit boards, which has a punch press unit having a die and a numerical control device that generates a command signal to operate the guide unit and the punch press unit, the guide unit moves the printed circuit board material in a position. A die raising and lowering device is provided to lower the die to a position where it does not contact the printed circuit board material during layering. Embodiments and drawings illustrating the present invention will be described.
第２図、第３図は本発明によるプリント基板用数値制御
パンチプレスの実施例を示す。FIGS. 2 and 3 show an embodiment of a numerically controlled punch press for printed circuit boards according to the present invention.
第２図に示す装置はパンチプレス部３１と誘導部２とを
有し、プリント基板材料３を所要の位置に議導して穴あ
げを行なう。図示を明瞭にするためには誘導部２は第１
図の装置と同様とし、同じ符号によって同様の部分又は
部品を示し、重複説明しない。本発明によるパンチプレ
ス部３１は上部フレ−ム３４と下部フレーム３５とを有
し、上部フレーム３４に取付けたプレス３６は図示しな
い制御装置の指令に応じてポンチ３７を作動させる。上
部フレーム３４に固定したポンチ案内板３８はポンチ３
７の上下に際してポンチ３７を案内する。こ）までは第
１図とさま）、同様である。本発明によって、下部フレ
ーム３５に固着したほゞ円筒状の支持部材４１の上端に
ダィ案内板４２を取付ける。The apparatus shown in FIG. 2 has a punch press section 31 and a guide section 2, and guides the printed circuit board material 3 to a desired position to punch holes. For clarity of illustration, the guiding part 2 is
It is similar to the apparatus shown in the figures, and similar parts or components are designated by the same reference numerals and will not be described again. The punch press unit 31 according to the present invention has an upper frame 34 and a lower frame 35, and a press 36 attached to the upper frame 34 operates a punch 37 in response to commands from a control device (not shown). A punch guide plate 38 fixed to the upper frame 34 is connected to the punch 3
The punch 37 is guided when moving the punch 7 up and down. Up to this point, it is the same as in Figure 1. According to the present invention, a die guide plate 42 is attached to the upper end of a substantially cylindrical support member 41 fixed to the lower frame 35.
ダィ案内板４２にあげた穴はダィ４３をポンチ３７と同
一軸線として垂直方向に可動に案内する。ダィ４３を垂
直に上下するためのダィ上昇機構を第３図に示す。支持
部村４１内にはダィ４３の外径よりも値に小さい外蓬を
有するリフト棒４４を垂直方向に滑動可能とする。リフ
ト棒４４の下端に形成した溝４５内を水平方向に板カム
４６が可動とする。リフト綾４４は下方は板カム４６に
接触し、上方はダィ４３を支持する。板カム４６は第３
図に示す通り、支持部材４１の案内スロット４７に案内
されて水平方向に可動とし、下部フレーム３５に固着し
た案内部材４８によって一端を案内される。A hole formed in the die guide plate 42 guides the die 43 movably in the vertical direction along the same axis as the punch 37. A die lifting mechanism for vertically raising and lowering the die 43 is shown in FIG. A lift rod 44 having an outer diameter smaller than the outer diameter of the die 43 is vertically slidable within the support village 41. A plate cam 46 is movable horizontally within a groove 45 formed at the lower end of the lift rod 44. The lift shaft 44 contacts the plate cam 46 on the lower side and supports the die 43 on the upper side. The plate cam 46 is the third
As shown in the figure, it is movable in the horizontal direction guided by a guide slot 47 of the support member 41, and guided at one end by a guide member 48 fixed to the lower frame 35.
板カム４６に連結したロッド４９をェアシリンダ５０に
よって動かす。板カム４６に斜面部５１を形成し、ェア
シリンダ５０を引込位置とした時にリフト棒４４が下り
、ダイ４３の上面はダィ案内板４２の上面よりも引込む
ようにする。装置の作動について説明する。A rod 49 connected to a plate cam 46 is moved by a air cylinder 50. A slope part 51 is formed on the plate cam 46 so that when the air cylinder 50 is set to the retracted position, the lift rod 44 is lowered and the upper surface of the die 43 is retracted more than the upper surface of the die guide plate 42. The operation of the device will be explained.
プリント基板材料３を位漕ぎめする時は、第１にェアシ
リンダ５０を作動てロッド４９、板カム４６を引込位置
とし、リフト袴４４の溝４５は板カム４６の斜面部５１
に接触して支持部材４２内を下方に動き、ダィ４３は下
方に動く。次に制御装置は縦作動装置１８、横作動装置
２３を作動させて縦誘導板１６、横議導板２４をそれぞ
れ所定寸法だけ動かし、プリント基板材料３の特定の位
置をポンチ３７の軸線に一致させる。２の動きの間、プ
リント基板材料３はクランプ２４，２５によって支持さ
れて動き、ダィ４３は下方位置にあるためダイ４３の上
面とプリント基板材料３の下面との間は５肌程度の間隙
が形成される。When positioning the printed circuit board material 3, first actuate the air cylinder 50 to bring the rod 49 and the plate cam 46 into the retracted position, and the groove 45 of the lift hakama 44 is aligned with the slope part 51 of the plate cam 46.
The die 43 moves downward within the support member 42 in contact with the die 43 . Next, the control device operates the vertical actuating device 18 and the horizontal actuating device 23 to move the vertical guiding plate 16 and the horizontal guiding plate 24 by predetermined dimensions, respectively, to align the specific position of the printed circuit board material 3 with the axis of the punch 37. let During the movement of step 2, the printed circuit board material 3 moves while being supported by the clamps 24 and 25, and since the die 43 is in the downward position, there is a gap of about 5 skins between the upper surface of the die 43 and the lower surface of the printed circuit board material 3. is formed.
従って、プリント基板材料３は位層ぎめの間にダ４３を
接触せず、下面に傷のつくことはない。プリント基板材
料３の位暦ぎめが完了すれば制御装置はェアシリンダ５
０を作動させてロッド４９、板カム４６を伸長位置とす
る。Therefore, the printed circuit board material 3 does not come into contact with the dent 43 during layering, and the lower surface is not scratched. When the positioning of the printed circuit board material 3 is completed, the control device turns on the air cylinder 5.
0 to bring the rod 49 and plate cam 46 into the extended position.
板カム４６の斜面部５１はリフト榛４４を上昇させリフ
ト棒４６の平面の端縁はリフト榛４４の溝４５に接触し
てポンチ作業間リフト榛４４を所定位置に保つ。リフト
榛４４の上昇によってダィ４３は上昇してプリント基板
材料３の下面に接触する。こ）で制御装置はプレス３６
に指令信号を送り、プレス３６は作動してポンチ３７を
下方に動かし、プリント基板材料３の所定位置に所定形
状の穴あげを行なう。この間ポンチ３７はダイ４３と共
働する。プリント基板材料３の穴あげが終了すれば、制
御装置はプレス３６を引込位置としてポンチ３７を引込
ませ、同時にェアシリンダ５０を引込位置としてロッド
４９、板カム４６を引込ませる。ＩＪフト榛４４の下端
の溝４５は板カム４６の斜面部５１に接触して下方に動
き、ダィ４３は下方に動いてプリント基板材料３の下面
から離れる。上述の工程を繰る重してプリント基板材料
３の所定位置に所定数の所定形状の穴あげを行なう。こ
の間に所要に応じてポンチ３７、ダィ４３を変換して所
要の穴の寸法に適合させる。上述した通り、回路パター
ンを印刷エッチングされたプＩＪント基板材料の任意の
位置に任意の形状の穴を１個ずつ数値制御による指令信
号に応じてプレス加工するプリント基板用数値制御パン
チプレスにおいて、本発明によって、プリント基板材料
の位暦ぎめのために所定位置まで動かす間はダィをプリ
ント基板材料に接触しない位置まで下降させ、プレス加
工時のみにダイを上昇させるダィ上下装置を使用する。The sloped portion 51 of the plate cam 46 raises the lift bar 44, and the planar edge of the lift bar 46 contacts the groove 45 of the lift bar 44 to maintain the lift bar 44 in a predetermined position during punching operations. As the lift bar 44 rises, the die 43 rises and comes into contact with the lower surface of the printed circuit board material 3. In this), the control device is press 36
A command signal is sent to the press 36, the press 36 is operated, the punch 37 is moved downward, and a hole of a predetermined shape is punched at a predetermined position in the printed circuit board material 3. During this time, the punch 37 cooperates with the die 43. When drilling of the printed circuit board material 3 is completed, the control device sets the press 36 to the retracted position and causes the punch 37 to retract, and at the same time sets the air cylinder 50 to the retracted position and causes the rod 49 and plate cam 46 to retract. The groove 45 at the lower end of the IJ foot 44 contacts the slope portion 51 of the plate cam 46 and moves downward, and the die 43 moves downward and separates from the lower surface of the printed circuit board material 3. By repeating the above steps, a predetermined number of holes of a predetermined shape are bored at predetermined positions in the printed circuit board material 3. During this time, the punch 37 and die 43 are changed as required to match the required hole dimensions. As mentioned above, in a numerically controlled punch press for printed circuit boards, holes of arbitrary shapes are pressed one by one at arbitrary positions of printed circuit board material on which circuit patterns have been printed and etched, in response to command signals by numerical control. According to the present invention, a die lifting device is used that lowers the die to a position where it does not touch the printed circuit board material while moving it to a predetermined position for positioning the printed circuit board material, and raises the die only during press processing. .
これによってプリント基板材料の移動間、ダィ表面とプ
リント基板材料下面との接触によるかき傷、印刷回路の
損傷等を防止できる。本発明によって附加するダィ上下
袋瞳は２位贋作動であるため簡単な構造であり、安価に
製造することができる。This prevents scratches and damage to the printed circuit due to contact between the die surface and the lower surface of the printed circuit board material during movement of the printed circuit board material. The die upper and lower blind pupils added according to the present invention have a simple structure and can be manufactured at low cost since they are operated in a second position.
図面の藤単な説明
第１図は従来のプリント基板用数値制御パンチプレスの
作動部分を示す斜視図、第２図は本発明によるプリント
基板用数値制御パンチプレスの作動部分の斜視図、第３
図は第２図のパンチプレスのダィ上下装置の拡大斜視図
である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing the operating parts of a conventional numerically controlled punch press for printed circuit boards, FIG. 2 is a perspective view of the operating parts of the numerically controlled punch press for printed circuit boards according to the present invention, and FIG.
The figure is an enlarged perspective view of the die up-and-down device of the punch press shown in FIG. 2.
符号の説明 １，３１・・・パンチプレス部、２・・・
誘導部、３・・・プリント基板材料、６，３６・・・プ
レス、７，３７…ポンチ、１１，４３…ダイ、１…縦誘
導板、１８・・・縦作動装置、２１・・・横議導板、２
３・・・横作動装置、４１・…・・支持部材、４４・・
・リフト榛、４５…溝、４６…板カム、５０…エッチン
グ、５１・・・斜面部。Explanation of symbols 1, 31...Punch press section, 2...
Guide part, 3... Printed circuit board material, 6, 36... Press, 7, 37... Punch, 11, 43... Die, 1... Vertical guide plate, 18... Vertical actuator, 21... Horizontal Leadership board, 2
3... Lateral actuation device, 41... Support member, 44...
- Lift ridge, 45...Groove, 46...Plate cam, 50...Etching, 51...Slope portion.
第１図 第２図 第３図Figure 1 Figure 2 Figure 3
Claims (1)
板材料を支持して平面内縦横方向に移動させる誘導部と
、上記プリント基板材料の所要の位置に所要形状の穴あ
け行なうパンチとダイとを有するパンチプレス部と、上
記誘導部とパンチプレス部とを作動させる指令信号を生
ずる数値制御装置とを有するプリント基板用数値制御パ
ンチプレス部において、上記誘導部がプリント基板材料
を移動位置ぎめする間上記ダイをプリント基板材料に接
触しない位置に下降させるダイ上下装置を備えるこを特
徴とするプリント基板用数値制御パンチプレス。1. A punch press section having a guide section that supports and moves the printed circuit board material on which a circuit pattern etc. has been printed and etched in the vertical and horizontal directions within the plane, and a punch and die that punches holes in the desired shape at the desired positions in the printed circuit board material. and a numerical control device for generating a command signal for actuating the guide section and the punch press section, the die being printed while the guide section moves and positions the printed circuit board material. A numerically controlled punch press for printed circuit boards, characterized in that it is equipped with a die lifting device that lowers the die to a position where it does not come into contact with the substrate material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54119330A JPS6040360B2 (en) | 1979-09-19 | 1979-09-19 | Numerical control punch press for printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54119330A JPS6040360B2 (en) | 1979-09-19 | 1979-09-19 | Numerical control punch press for printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5645099A JPS5645099A (en) | 1981-04-24 |
| JPS6040360B2 true JPS6040360B2 (en) | 1985-09-10 |
Family
ID=14758798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54119330A Expired JPS6040360B2 (en) | 1979-09-19 | 1979-09-19 | Numerical control punch press for printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6040360B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60228099A (en) * | 1984-04-20 | 1985-11-13 | 株式会社日立製作所 | Punching working method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3392613A (en) * | 1965-10-23 | 1968-07-16 | Houdaille Industries Inc | Punching machine |
| GB1322123A (en) * | 1971-03-26 | 1973-07-04 | Strandell P O | Punching apparatus |
| JPS5437983A (en) * | 1977-08-31 | 1979-03-20 | Amada Co Ltd | Punching work device |
-
1979
- 1979-09-19 JP JP54119330A patent/JPS6040360B2/en not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3392613A (en) * | 1965-10-23 | 1968-07-16 | Houdaille Industries Inc | Punching machine |
| GB1322123A (en) * | 1971-03-26 | 1973-07-04 | Strandell P O | Punching apparatus |
| JPS5437983A (en) * | 1977-08-31 | 1979-03-20 | Amada Co Ltd | Punching work device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5645099A (en) | 1981-04-24 |
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