JPS6034268B2 - IC lead frame - Google Patents
IC lead frameInfo
- Publication number
- JPS6034268B2 JPS6034268B2 JP57097668A JP9766882A JPS6034268B2 JP S6034268 B2 JPS6034268 B2 JP S6034268B2 JP 57097668 A JP57097668 A JP 57097668A JP 9766882 A JP9766882 A JP 9766882A JP S6034268 B2 JPS6034268 B2 JP S6034268B2
- Authority
- JP
- Japan
- Prior art keywords
- tab
- lead frame
- resin
- lead
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
この発明は、ＩＣ用リードフレームに関し、特にレジン
モールドパツケージと共に用いられるに用リードフレー
ムに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lead frame for an IC, and more particularly to a lead frame for an IC used with a resin mold package.
従来提案されているこの種のＩＣ用リードフレームとし
ては、レジンモールドパツケージの辺にほぼ平行になる
ようにタブ吊りリードを設けたものがあるが、このよう
なりードフレームでは、タブの安定性が悪いため、モー
ルド金型にレジンを注入する際にタブがレジンに押し流
されてタブ位置が変動し、コネクタワィャが断線する等
の不都合があった。Conventionally proposed lead frames for this type of IC include those in which tab suspension leads are provided almost parallel to the sides of the resin mold package, but such lead frames have poor tab stability. Therefore, when resin is injected into the mold, the tab is swept away by the resin, causing the tab position to fluctuate, resulting in inconveniences such as disconnection of the connector wire.
この発明の目的は、このような不都合のない改良された
レジンモールドＩＣ用リードフレームを提供することに
ある。An object of the present invention is to provide an improved lead frame for resin molded ICs that is free from such inconveniences.
この発明によれば、レジンモールドパッケージの対角線
に沿う方向にタブ吊りリードが配置される。According to this invention, the tab suspension leads are arranged in a direction along the diagonal line of the resin mold package.
以下、添付図面に示す実施例について詳述する。第１図
及び第２図は、この発明の一実施例によるＩＣ用リード
フレーム及びこれを用いたレジンモールドＩＣをそれぞ
れ示すもので、１０はリードフレーム、１２Ａ，１２Ｂ
はリードフレーム１０の外枠部、１４はリードフレーム
１０の、ＩＣチップ（半導体べレツト）を固定すべきタ
ブ、１６Ａ〜１６Ｄはしジンモールド／ぐツケージ２２
の対角線方向にタブー４を吊るタブ吊りリード、１８は
ボンディングワイヤ（コネクタワィャ）が接続されるべ
きリード、２０はしジンダム部である。Hereinafter, embodiments shown in the accompanying drawings will be described in detail. 1 and 2 respectively show a lead frame for IC according to an embodiment of the present invention and a resin molded IC using the lead frame, 10 is a lead frame, 12A, 12B
14 is an outer frame portion of the lead frame 10, 14 is a tab of the lead frame 10 to which an IC chip (semiconductor pellet) is to be fixed, 16A to 16D is a ladder mold/gear cage 22.
18 is a lead to which a bonding wire (connector wire) is to be connected, and 20 is a dam section.
第１図に示すリードフレーム１０を用いて第２図に示す
ようなレジンモールドにを製作するにあたっては、タブ
ー４上にＩＣチップを固定し且つチップ上の各電極をボ
ンディングワイヤを介して各リー日こ接続してからリー
ドフレーム１０をモールド金型の上型と下型との間には
さむようにセットする。When manufacturing a resin mold as shown in FIG. 2 using the lead frame 10 shown in FIG. 1, an IC chip is fixed on the tab 4 and each electrode on the chip is connected to each lead via a bonding wire. After the connections are made, the lead frame 10 is set so as to be sandwiched between the upper and lower molds of the mold.
このとき、レジンダム部２０が上下の型の間でモールド
用レジンが外方へ流出するのを防止する役目をする。モ
ールド用レジンは破線Ａで示すレジン注入口からａ方向
にモールドキヤビティ内に注入され、レジンダム部２０
‘こ取囲まれたキヤビテイ内部分（タブー４、インナー
リード部、図示しないＩＣチップ、コネクタワイャなど
）を被覆する。注入したレジンを硬化させてからモール
ド金型からモールド品を取出し、外枠部１２Ａ，１２Ｂ
からパッケージ部２２を切断分離する。このとき、レジ
ンダム部２０などの不要部も切断除去される。この結果
、第２図に示すように、パッケージ２２からリード１８
が突出した形のレジンモールドにが得られる。上記した
この発明のリードフレームによれば、タブ吊りリード１
６Ａ〜１６Ｄがパッケージ２２の対角線方向すなわち、
４角形のタブの角部から、その角部を規定するタブの２
辺に対して鈍角をなす方向に伸びる線上に沿って設けら
れているため、タブ１４の安定性がすこぶる良好で、レ
ジン注入時に流入レジンによるタブ１４の変位を最小に
することができ、従って、コネクタワィャの断線事故等
を禾然に防止することができる。At this time, the resin dam part 20 serves to prevent the molding resin from flowing out between the upper and lower molds. The resin for the mold is injected into the mold cavity in the direction a from the resin injection port indicated by the broken line A, and the resin is injected into the mold cavity in the direction a.
The enclosed internal parts of the cavity (the tab 4, the inner lead part, the IC chip (not shown), the connector wire, etc.) are covered. After the injected resin is cured, the molded product is removed from the mold, and the outer frame parts 12A, 12B are removed.
The package portion 22 is cut and separated from the package portion 22. At this time, unnecessary parts such as the resin dam part 20 are also cut and removed. As a result, as shown in FIG.
A resin mold with a protruding shape is obtained. According to the lead frame of the present invention described above, the tab suspension lead 1
6A to 16D are in the diagonal direction of the package 22, that is,
From the corner of the square tab, 2 of the tab that defines the corner
Since it is provided along a line extending in a direction making an obtuse angle to the side, the stability of the tab 14 is very good, and the displacement of the tab 14 by the inflowing resin during resin injection can be minimized, and therefore, It is possible to completely prevent accidents such as disconnection of connector wires.
その上、タブ１４に安定性がよいためＩＣチップを取付
けるダィボンディング作業等がやりやすいこと、夕ブ吊
りをパッケージの角部のみで行なうためリード本数を多
くとれることなどの付加効果もある。In addition, there are additional effects such as the good stability of the tab 14, which makes it easy to perform die bonding work for attaching the IC chip, and the number of leads that can be obtained because the tube is hung only at the corners of the package.
第１図は、この発明によるＩＣ用リードフレームを示す
平面図、第２図は、第１図のりードフレームを用いてレ
ジン封止されたにを示す平面図である。
１０……リードフレーム、１２Ａ，１２Ｂ……外枠部、
１４・・・・・・タブ、１６Ａ〜１６Ｄ・・…・タプ吊
りリード、１８……リード、２０……レジンダム部、２
２……レジンモールドパツケージ。
第１図第２図FIG. 1 is a plan view showing an IC lead frame according to the present invention, and FIG. 2 is a plan view showing a lead frame sealed with resin using the lead frame shown in FIG. 10... Lead frame, 12A, 12B... Outer frame part,
14...Tab, 16A-16D...Tap hanging lead, 18...Lead, 20...Resin dam part, 2
2...Resin mold package. Figure 1 Figure 2
Claims (1)
端が近接して設けられたボンデイングワイヤ接続用の複
数のリードと、これらのリードの他端でこれらを支持す
る枠部と、前記４角形のタブの４つの角部から前記枠部
に延在する前記タブ支持用のタブ吊りリードとを有し、
前記タブ吊りリードは前記４角形のタブの角度からその
角部を挾むタブの２辺に対して鈍角をなすような方向に
延在して成ることを特徴とするリードフレーム。1. A rectangular tab for supporting an IC chip, a plurality of leads for bonding wire connection whose one end is provided close to this tab, a frame portion supporting these leads at the other end; tab suspension leads for supporting the tab extending from the four corners of the square tab to the frame;
The lead frame is characterized in that the tab suspension lead extends from the angle of the quadrangular tab in a direction forming an obtuse angle to two sides of the tab that sandwich the corner of the tab.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57097668A JPS6034268B2 (en) | 1982-06-09 | 1982-06-09 | IC lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57097668A JPS6034268B2 (en) | 1982-06-09 | 1982-06-09 | IC lead frame |
Related Child Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19250684A Division JPS6084852A (en) | 1984-09-17 | 1984-09-17 | Manufacture of resin-molded ic |
| JP19250584A Division JPS6089950A (en) | 1984-09-17 | 1984-09-17 | Resin mold ic |
| JP19250784A Division JPS6084853A (en) | 1984-09-17 | 1984-09-17 | Ic lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58162A JPS58162A (en) | 1983-01-05 |
| JPS6034268B2 true JPS6034268B2 (en) | 1985-08-07 |
Family
ID=14198413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57097668A Expired JPS6034268B2 (en) | 1982-06-09 | 1982-06-09 | IC lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6034268B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6068639A (en) * | 1983-08-31 | 1985-04-19 | Toshiba Corp | Resin-sealed semiconductor device |
| JPS6084853A (en) * | 1984-09-17 | 1985-05-14 | Hitachi Ltd | Ic lead frame |
| JPS6089950A (en) * | 1984-09-17 | 1985-05-20 | Hitachi Ltd | Resin mold ic |
| JPS6084852A (en) * | 1984-09-17 | 1985-05-14 | Hitachi Ltd | Manufacture of resin-molded ic |
| US5022797A (en) * | 1985-09-09 | 1991-06-11 | Hitachi, Ltd. | Diamond tool |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50127565A (en) * | 1974-03-27 | 1975-10-07 |
-
1982
- 1982-06-09 JP JP57097668A patent/JPS6034268B2/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50127565A (en) * | 1974-03-27 | 1975-10-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58162A (en) | 1983-01-05 |
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