JPS6027466U - Base material for flexible circuit boards - Google Patents
Base material for flexible circuit boardsInfo
- Publication number
- JPS6027466U JPS6027466U JP11934083U JP11934083U JPS6027466U JP S6027466 U JPS6027466 U JP S6027466U JP 11934083 U JP11934083 U JP 11934083U JP 11934083 U JP11934083 U JP 11934083U JP S6027466 U JPS6027466 U JP S6027466U
- Authority
- JP
- Japan
- Prior art keywords
- flexible circuit
- base material
- circuit boards
- circuit board
- base film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案のフレキシブル回路基板用基材の概念的
な拡大断面構成図、第2図は第1図の基材を使用した両
面フレキシブル回路基板の概念的な拡大断面構成図であ
る。
1・・・・・・絶縁ベースフィルム、2・・・・・・接
着剤、3・・・・・・薄い導電箔、4・・・・・・厚い
導電箔。FIG. 1 is a conceptual enlarged sectional view of the base material for a flexible circuit board of the present invention, and FIG. 2 is a conceptual enlarged sectional view of a double-sided flexible circuit board using the base material of FIG. 1...Insulating base film, 2...Adhesive, 3...Thin conductive foil, 4...Thick conductive foil.
Claims (1)
路基板用基材において、上記絶縁ベースフィルムの両面
に各々厚さの異なる導電箔を被着するように構成してな
るフレキシブル回路基板用基材。A base material for a flexible circuit board comprising an insulating base film and a conductive foil, the base material for a flexible circuit board comprising conductive foils having different thicknesses attached to both sides of the insulating base film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11934083U JPS6027466U (en) | 1983-07-30 | 1983-07-30 | Base material for flexible circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11934083U JPS6027466U (en) | 1983-07-30 | 1983-07-30 | Base material for flexible circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6027466U true JPS6027466U (en) | 1985-02-25 |
Family
ID=30273929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11934083U Pending JPS6027466U (en) | 1983-07-30 | 1983-07-30 | Base material for flexible circuit boards |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6027466U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006054684A1 (en) * | 2004-11-19 | 2006-05-26 | Multi Inc. | Printed wiring board and production method of printed wiring borad |
JP2011109082A (en) * | 2009-10-22 | 2011-06-02 | Nippon Steel Chem Co Ltd | Flexible double-sided copper-clad laminate, flexible circuit board, and multilayered circuit board |
WO2017212966A1 (en) * | 2016-06-09 | 2017-12-14 | 三菱電機株式会社 | Flexible printed board |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5715483A (en) * | 1980-07-01 | 1982-01-26 | Toshiba Chem Prod | Both-side steel-lined laminated board |
-
1983
- 1983-07-30 JP JP11934083U patent/JPS6027466U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5715483A (en) * | 1980-07-01 | 1982-01-26 | Toshiba Chem Prod | Both-side steel-lined laminated board |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006054684A1 (en) * | 2004-11-19 | 2006-05-26 | Multi Inc. | Printed wiring board and production method of printed wiring borad |
JP2006147881A (en) * | 2004-11-19 | 2006-06-08 | Multi:Kk | Printed wiring board and manufacturing method therefor |
JP4713131B2 (en) * | 2004-11-19 | 2011-06-29 | 株式会社マルチ | Printed wiring board and method for manufacturing the printed wiring board |
JP2011109082A (en) * | 2009-10-22 | 2011-06-02 | Nippon Steel Chem Co Ltd | Flexible double-sided copper-clad laminate, flexible circuit board, and multilayered circuit board |
WO2017212966A1 (en) * | 2016-06-09 | 2017-12-14 | 三菱電機株式会社 | Flexible printed board |
JPWO2017212966A1 (en) * | 2016-06-09 | 2019-02-21 | 三菱電機株式会社 | Flexible printed circuit board |
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