JPS6027466U - Base material for flexible circuit boards - Google Patents

Base material for flexible circuit boards

Info

Publication number
JPS6027466U
JPS6027466U JP11934083U JP11934083U JPS6027466U JP S6027466 U JPS6027466 U JP S6027466U JP 11934083 U JP11934083 U JP 11934083U JP 11934083 U JP11934083 U JP 11934083U JP S6027466 U JPS6027466 U JP S6027466U
Authority
JP
Japan
Prior art keywords
flexible circuit
base material
circuit boards
circuit board
base film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11934083U
Other languages
Japanese (ja)
Inventor
邦彦 小林
Original Assignee
日本メクトロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本メクトロン株式会社 filed Critical 日本メクトロン株式会社
Priority to JP11934083U priority Critical patent/JPS6027466U/en
Publication of JPS6027466U publication Critical patent/JPS6027466U/en
Pending legal-status Critical Current

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Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案のフレキシブル回路基板用基材の概念的
な拡大断面構成図、第２図は第１図の基材を使用した両
面フレキシブル回路基板の概念的な拡大断面構成図であ
る。 １・・・・・・絶縁ベースフィルム、２・・・・・・接
着剤、３・・・・・・薄い導電箔、４・・・・・・厚い
導電箔。FIG. 1 is a conceptual enlarged sectional view of the base material for a flexible circuit board of the present invention, and FIG. 2 is a conceptual enlarged sectional view of a double-sided flexible circuit board using the base material of FIG. 1...Insulating base film, 2...Adhesive, 3...Thin conductive foil, 4...Thick conductive foil.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁ベースフィルムと導電箔とからなるフレキシブル回
路基板用基材において、上記絶縁ベースフィルムの両面
に各々厚さの異なる導電箔を被着するように構成してな
るフレキシブル回路基板用基材。A base material for a flexible circuit board comprising an insulating base film and a conductive foil, the base material for a flexible circuit board comprising conductive foils having different thicknesses attached to both sides of the insulating base film.
JP11934083U 1983-07-30 1983-07-30 Base material for flexible circuit boards Pending JPS6027466U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11934083U JPS6027466U (en) 1983-07-30 1983-07-30 Base material for flexible circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11934083U JPS6027466U (en) 1983-07-30 1983-07-30 Base material for flexible circuit boards

Publications (1)

Publication Number Publication Date
JPS6027466U true JPS6027466U (en) 1985-02-25

Family

ID=30273929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11934083U Pending JPS6027466U (en) 1983-07-30 1983-07-30 Base material for flexible circuit boards

Country Status (1)

Country Link
JP (1) JPS6027466U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006054684A1 (en) * 2004-11-19 2006-05-26 Multi Inc. Printed wiring board and production method of printed wiring borad
JP2011109082A (en) * 2009-10-22 2011-06-02 Nippon Steel Chem Co Ltd Flexible double-sided copper-clad laminate, flexible circuit board, and multilayered circuit board
WO2017212966A1 (en) * 2016-06-09 2017-12-14 三菱電機株式会社 Flexible printed board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5715483A (en) * 1980-07-01 1982-01-26 Toshiba Chem Prod Both-side steel-lined laminated board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5715483A (en) * 1980-07-01 1982-01-26 Toshiba Chem Prod Both-side steel-lined laminated board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006054684A1 (en) * 2004-11-19 2006-05-26 Multi Inc. Printed wiring board and production method of printed wiring borad
JP2006147881A (en) * 2004-11-19 2006-06-08 Multi:Kk Printed wiring board and manufacturing method therefor
JP4713131B2 (en) * 2004-11-19 2011-06-29 株式会社マルチ Printed wiring board and method for manufacturing the printed wiring board
JP2011109082A (en) * 2009-10-22 2011-06-02 Nippon Steel Chem Co Ltd Flexible double-sided copper-clad laminate, flexible circuit board, and multilayered circuit board
WO2017212966A1 (en) * 2016-06-09 2017-12-14 三菱電機株式会社 Flexible printed board
JPWO2017212966A1 (en) * 2016-06-09 2019-02-21 三菱電機株式会社 Flexible printed circuit board

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