JPS6025149U - Bump electrode formation wafer - Google Patents

Bump electrode formation wafer

Info

Publication number
JPS6025149U
JPS6025149U JP1983116690U JP11669083U JPS6025149U JP S6025149 U JPS6025149 U JP S6025149U JP 1983116690 U JP1983116690 U JP 1983116690U JP 11669083 U JP11669083 U JP 11669083U JP S6025149 U JPS6025149 U JP S6025149U
Authority
JP
Japan
Prior art keywords
bump electrode
electrode formation
wafer
formation wafer
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983116690U
Other languages
Japanese (ja)
Other versions
JPS642443Y2 (en
Inventor
隆史 水口
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1983116690U priority Critical patent/JPS6025149U/en
Publication of JPS6025149U publication Critical patent/JPS6025149U/en
Application granted granted Critical
Publication of JPS642443Y2 publication Critical patent/JPS642443Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/141—Disposition
    • H01L2224/1418—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/14181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Electrodes Of Semiconductors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、従来のバンプ電極を持つペレットウェーハの
断面図、第２図は、そのバンプメッキ状態を説明するメ
ッキ液槽の概略断面図、第３図は、ウェーハ上の位置と
バンプ電極高さ寸法との関係を示す特性曲線図、第４図
は、この考案の第一実施例を示すペレットウェーハの平
面図、第５図はそのＡ−Ａ線にて切断した断面図、第６
図は、そ・のバンプメッキ状態を示すメッキ液槽の概略
断面図、第７図はバンプメッキ形成済ペレットウェーハ
の断面図、第８図はそのウェーハをブレーキングしたペ
レットを封止したダイオードの断面図、第９図は、この
考案の第二実施例を示すペレットウェーハの平面図であ
る。 ９・・・・・・メッキ液槽、１１，１１．・・・、１２
．１２・・・・・・バンプ電極、１５，１５・・・・・
・通電電極、１６・・・・・・ペレットウェーハ。 幻“ −”−、−”１“ □　　ＯFigure 1 is a cross-sectional view of a pellet wafer with conventional bump electrodes, Figure 2 is a schematic cross-sectional view of a plating bath explaining the bump plating state, and Figure 3 is a diagram showing the position on the wafer and the height of the bump electrodes. FIG. 4 is a plan view of a pellet wafer showing the first embodiment of this invention, FIG. 5 is a cross-sectional view taken along line A-A, and FIG.
The figure is a schematic cross-sectional view of the plating liquid bath showing the bump plating state, Figure 7 is a cross-sectional view of a pellet wafer on which bump plating has been formed, and Figure 8 is a diagram of the diode that sealed the pellet that braked the wafer. The sectional view, FIG. 9, is a plan view of a pellet wafer showing a second embodiment of this invention. 9...Plating liquid tank, 11,11. ..., 12
．． 12...Bump electrode, 15,15...
- Current-carrying electrode, 16... Pellet wafer. Illusion “ −”−, −”1” □ O

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 多数の素子を区画形成したウエーノ１に、通電電極を設
けておきメッキ液槽に浸して通電し、バンプ電極を形成
するものにおいて、前記ウェーハの通電電極を、ウェー
ハの周辺部を除いた箇所に設けたことを特徴とするバン
ブ電極形成ウエーノ１゜A wafer 1 in which a large number of elements are divided is provided with a current-carrying electrode and immersed in a plating solution bath and energized to form a bump electrode. Bump electrode forming waeno 1゜ characterized by providing
JP1983116690U 1983-07-27 1983-07-27 Bump electrode formation wafer Granted JPS6025149U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983116690U JPS6025149U (en) 1983-07-27 1983-07-27 Bump electrode formation wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983116690U JPS6025149U (en) 1983-07-27 1983-07-27 Bump electrode formation wafer

Publications (2)

Publication Number Publication Date
JPS6025149U true JPS6025149U (en) 1985-02-20
JPS642443Y2 JPS642443Y2 (en) 1989-01-20

Family

ID=30268898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983116690U Granted JPS6025149U (en) 1983-07-27 1983-07-27 Bump electrode formation wafer

Country Status (1)

Country Link
JP (1) JPS6025149U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817638A (en) * 1981-07-24 1983-02-01 Hitachi Ltd Bump forming device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817638A (en) * 1981-07-24 1983-02-01 Hitachi Ltd Bump forming device

Also Published As

Publication number Publication date
JPS642443Y2 (en) 1989-01-20

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