JPS6063975U - Lead plate - Google Patents

Lead plate

Info

Publication number
JPS6063975U
JPS6063975U JP1983156024U JP15602483U JPS6063975U JP S6063975 U JPS6063975 U JP S6063975U JP 1983156024 U JP1983156024 U JP 1983156024U JP 15602483 U JP15602483 U JP 15602483U JP S6063975 U JPS6063975 U JP S6063975U
Authority
JP
Japan
Prior art keywords
lead plate
area
terminals
recorded
cores
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983156024U
Other languages
Japanese (ja)
Inventor
祐三 藤村
福永　哲
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP1983156024U priority Critical patent/JPS6063975U/en
Publication of JPS6063975U publication Critical patent/JPS6063975U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図は従来のリード板の形状とその欠点を
示す図、第３図は本考案に係るリード板の形状とその利
点を示す図、第４図は第３図の平面図である。 １は配線基板、２及び４は端子、３は太陽電池素子、５
はリード板、７及び７′は凸状部、８は隙間。Figures 1 and 2 are diagrams showing the shape of a conventional lead plate and its drawbacks, Figure 3 is a diagram showing the shape of a lead plate according to the present invention and its advantages, and Figure 4 is a plan view of Figure 3. It is. 1 is a wiring board, 2 and 4 are terminals, 3 is a solar cell element, 5
is a lead plate, 7 and 7' are convex portions, and 8 is a gap.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 端子間を接続するリード板に於て、上記リード板の端子
との結合面に核間の面積よりも小さめの−凸状部を膨出
形成してなることを特徴とするリード板。1. A lead plate for connecting terminals, characterized in that a convex portion smaller in area than the area between the cores is formed on a surface of the lead plate that connects with the terminals.
JP1983156024U 1983-10-05 1983-10-05 Lead plate Pending JPS6063975U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983156024U JPS6063975U (en) 1983-10-05 1983-10-05 Lead plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983156024U JPS6063975U (en) 1983-10-05 1983-10-05 Lead plate

Publications (1)

Publication Number Publication Date
JPS6063975U true JPS6063975U (en) 1985-05-07

Family

ID=30344406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983156024U Pending JPS6063975U (en) 1983-10-05 1983-10-05 Lead plate

Country Status (1)

Country Link
JP (1) JPS6063975U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150065754A (en) * 2012-09-28 2015-06-15 선파워 코포레이션 Methods and structures for forming and improving solder joint thickness and planarity control features for solar cells

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150065754A (en) * 2012-09-28 2015-06-15 선파워 코포레이션 Methods and structures for forming and improving solder joint thickness and planarity control features for solar cells
JP2015530758A (en) * 2012-09-28 2015-10-15 サンパワー コーポレイション Method for forming and improving solder joint thickness and planarity control mechanisms for solar cells

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