JPS60248341A - Manufacture of metal-based wiring substrate - Google Patents

Manufacture of metal-based wiring substrate

Info

Publication number
JPS60248341A
JPS60248341A JP59105216A JP10521684A JPS60248341A JP S60248341 A JPS60248341 A JP S60248341A JP 59105216 A JP59105216 A JP 59105216A JP 10521684 A JP10521684 A JP 10521684A JP S60248341 A JPS60248341 A JP S60248341A
Authority
JP
Japan
Prior art keywords
resin
metal
metal plate
impregnated
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59105216A
Other languages
Japanese (ja)
Inventor
Takeshi Kano
武司 加納
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP59105216A priority Critical patent/JPS60248341A/en
Publication of JPS60248341A publication Critical patent/JPS60248341A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0007—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/24—Aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2317/00—Animal or vegetable based
    • B32B2317/12—Paper, e.g. cardboard
    • B32B2317/125—Paper, e.g. cardboard impregnated with thermosetting resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To obtain the titled substrate that enables the insulation of the through-hole inner wall surfaces and the terminal connecting sections to be easy and complete, by filling opening sections at prescribed positions of a metal plate with an opaque resin, and molding a metal foil onto the metal plate via a resin- impregnated substrate under pressure and heating. CONSTITUTION:A plate of a metal such as aluminium, copper, stainless steel, iron or an alloy is formed with opening sections including holes, notches or the like at prescribed positions for through-holes or terminal connecting sections, and the opening sections are filled with an opaque resin that has been obtained by adding a colorant, fillr or the like to a thermoplastic resin or thermosetting resin such as a phenolic resin, epoxy resin, polyimide resin, fluorine plastic, etc. A foil of a metal such as copper, aluminium or the like is placed via a resin-impregnated resni obtained by impregnating paper or glass with a phenolic resin, polyimide resin or the like on the upper surface of undersurface of the metal plate, and they are molded under heating and pressing to obtain the desired substrate.

Description

【発明の詳細な説明】 〔技術分野〕 本発明はコンピューター、電子機器、電気機器等に用い
られる金属ベース配線基板の製造方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing metal-based wiring boards used in computers, electronic equipment, electrical equipment, and the like.

〔背景技術］ 従来、配線基板の放熱性を高めるために金属ベース配線
基板が用いられてい為が、スＶホーＶ穴加工や端子接続
部加工等において穴内壁面が従来のフェノール樹脂低基
材積層板やエポキシ樹脂ガラス布基材積層板の電気絶線
性と異なり金属による導電性のため絶縁処理をする必要
があり多数の小口径大内や端子接続部を電気絶縁処理す
ることは面倒な作業であり且つ信頼性に乏しいものであ
った。[Background technology] Conventionally, metal-based wiring boards have been used to improve the heat dissipation of wiring boards, but when processing V-holes or terminal connections, the inner wall surface of the hole is replaced by a conventional phenolic resin low-base material lamination. Unlike the electrical insulation properties of plates and epoxy resin glass cloth base laminates, insulation treatment is required due to the conductivity of metals, and it is a troublesome task to electrically insulate many small-diameter inner parts and terminal connections. However, it was also unreliable.

〔発明の目的〕[Purpose of the invention]

本発明の目的とするところは、スＶホーＶ穴内壁面や端
子接続部の絶縁処理を容易且つ完全におこなうことので
きる金属ベース配線基板の製造方法を提供することにあ
み。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a metal-based wiring board that allows easy and complete insulation treatment of the inner wall surface of the V-hole and the terminal connection portion.

〔発明の開示〕[Disclosure of the invention]

本発明は所要位置に開口部を設けた金属板の該開口部を
不透明樹脂で充填後、金属板の上面及び又は下面に所要
枚数の樹脂含浸基材を介して金属箔を配設後、加熱加圧
成形により一体化することを特徴とする金属ベース配線
基板の製造方法で以下本発明を詳しく説明する。The present invention involves filling the openings of a metal plate with an opaque resin in a predetermined position, placing metal foil on the upper and/or lower surfaces of the metal plate via a required number of resin-impregnated base materials, and then heating the metal plate. The present invention will be described in detail below using a method for manufacturing a metal base wiring board, which is characterized in that it is integrated by pressure molding.

本発明に用いる金属板としては、アＶミニウム、銅、真
鍮、ステンレス鋼、　鉄、ニリケル等の里独或は合金等
を用いることができ、スＶホール穴や端子接続部等の所
要位置に穴や切欠部等の開口部を設けておく必要がある
。次いで該開口部にフェノール樹脂、エポキシ樹脂、不
飽和ポリエステル樹脂、ポリイミｒ、ポリウレタン、ポ
リブタジェン、ポリアミド、弗化樹脂等の熱硬化性樹脂
や熱可塑性樹脂に着色剤や充填剤等を添加して不透明に
した樹脂を充填し未硬化のまま或は硬化させてから金属
板の上面及び又は下面に所要枚数のフェノール樹脂、ク
レゾール樹脂、エポキシ［脂、不飽和ポリエステル樹脂
、ポリイミド、ポリブタジェン、ポリアミド、弗化樹脂
等を含浸させた紙、ガラス布等の樹脂含浸基材を介して
銅、アＭミニウム、真鍮、ニッケＭ１ステンレス鋼、鉄
等の金属箔に必要に応じて接着層を設けたものを髪設後
、加熱加圧成形により一体化させて金属ベース配線基板
を得るものである。このようにして得られた金属ベース
配線基板にあってはスルホール穴や端子接続部用切欠部
の電気絶縁処理が完全且つ容易におこなえ更に樹脂層が
不透明であるため樹脂層の存在が明瞭である長所を併せ
もつものである。As the metal plate used in the present invention, metal plates or alloys such as aluminum, copper, brass, stainless steel, iron, and Nilikel can be used. It is necessary to provide an opening such as a hole or notch. Next, a coloring agent, a filler, etc. are added to the opening into a thermosetting resin or thermoplastic resin such as phenol resin, epoxy resin, unsaturated polyester resin, polyimir, polyurethane, polybutadiene, polyamide, or fluorinated resin to make it opaque. The resin is filled with resin, left uncured or after it is cured, and then the required number of sheets of phenol resin, cresol resin, epoxy resin, unsaturated polyester resin, polyimide, polybutadiene, polyamide, fluoride are applied to the upper and/or lower surfaces of the metal plate. Hair is coated with metal foil such as copper, aluminum, brass, nickel M1 stainless steel, iron, etc., with an adhesive layer as necessary, through a resin-impregnated base material such as paper or glass cloth impregnated with resin, etc. After installation, the metal base wiring board is obtained by integrating them by heat and pressure molding. In the metal-based wiring board obtained in this way, the electrical insulation treatment of the through holes and the notches for terminal connections can be completely and easily performed, and furthermore, since the resin layer is opaque, the presence of the resin layer is clearly visible. It has both advantages.

以下本発明を実施例にもとすいて説明する。The present invention will be explained below using examples.

実施例 厚さ１ｆｌのアルミニウム板のスルホ−Ｍ穴部及び端子
接続用切欠部にエポキシ樹脂（シェル化学株式会社製、
商品名工ピコ−）　８２Ｂ　）　１００重量部（以下単
に部と記す）、ジシアンジアミド５部。Example: Epoxy resin (manufactured by Shell Chemical Co., Ltd.,
100 parts by weight (hereinafter simply referred to as parts) of dicyandiamide 5 parts.

炭酸カルシウム２０部からなる不透明エポキシ樹脂を充
填後、上下面に厚さ０．１ｆｌのエポキシ樹脂含浸ガラ
ス布を夫々に２枚づつ介して厚さ０．０３５　ｆｌの銅
箔を配設後、１７０℃で９０分間、４ｏ　Ｋｇ／ｃ−に
加熱加圧成形して金属ベース配線基板を得た。After filling with an opaque epoxy resin consisting of 20 parts of calcium carbonate, copper foil with a thickness of 0.035 fl was placed on the upper and lower surfaces through two pieces of epoxy resin-impregnated glass cloth with a thickness of 0.1 fl, respectively. A metal base wiring board was obtained by heating and press molding at 4°C for 90 minutes.

従来例 厚さ１闘のアルミニウム板の上、下面に実施例と同じ樹
脂含浸基材を夫々２枚づつ介して厚さ０．０３５　ｆｌ
の銅箔を配設後、実施例と同じ成形条件で成形して得た
金属ベース配線基板のスルホール穴部及び端子接続用切
欠部にエポキシ樹脂（実施例と同じ）１００部、ジシア
ンジアミド５部からなるエポキシ樹脂を充填し１７０℃
で９０分間加熱して硬化させた。Conventional example: Two resin-impregnated base materials, which are the same as those in the embodiment, are placed on the top and bottom surfaces of an aluminum plate with a thickness of 0.035 fl.
After placing the copper foil, 100 parts of epoxy resin (same as in Example) and 5 parts of dicyandiamide were applied to the through-holes and terminal connection notches of the metal-based wiring board obtained by molding under the same molding conditions as in Example. Filled with epoxy resin and heated to 170℃
It was heated for 90 minutes to harden it.

〔発明の効果〕〔Effect of the invention〕

実施例及び従来例で得られた金属ベース配線基板の生産
性及び開口部信頼性は第１表で明白なように本発明の金
属ベース配線基板の性能はよく本発明の優れてい石こと
を確認した。As is clear from Table 1, the productivity and aperture reliability of the metal-based wiring boards obtained in Examples and Conventional Examples confirm that the performance of the metal-based wiring boards of the present invention is good and is the superiority of the present invention. did.

第　１　表 特許出願人 松下電工株式会社 代理人弁理士　竹元敏丸（ほか２名）Table 1 patent applicant Matsushita Electric Works Co., Ltd. Representative Patent Attorney Toshimaru Takemoto (and 2 others)

Claims (1)

【特許請求の範囲】[Claims] （１）所定位置に開口部を設けた金属板の該開口部を不
透明樹脂で充填後、金属板の上面及び又は下面に所要枚
数の樹脂含浸基材を介して金属箔を配設後、加熱加圧成
形により一体化することを特徴とする金属ベース配線基
板の製造方法。(1) After filling the openings of a metal plate with an opening at a predetermined position with opaque resin, placing metal foil on the upper and/or lower surfaces of the metal plate via the required number of resin-impregnated base materials, and then heating. A method for manufacturing a metal-based wiring board, characterized in that it is integrated by pressure molding.
JP59105216A 1984-05-24 1984-05-24 Manufacture of metal-based wiring substrate Pending JPS60248341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59105216A JPS60248341A (en) 1984-05-24 1984-05-24 Manufacture of metal-based wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59105216A JPS60248341A (en) 1984-05-24 1984-05-24 Manufacture of metal-based wiring substrate

Publications (1)

Publication Number Publication Date
JPS60248341A true JPS60248341A (en) 1985-12-09

Family

ID=14401472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59105216A Pending JPS60248341A (en) 1984-05-24 1984-05-24 Manufacture of metal-based wiring substrate

Country Status (1)

Country Link
JP (1) JPS60248341A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61287291A (en) * 1985-06-14 1986-12-17 三菱樹脂株式会社 Metal based laminate board
JPS61292993A (en) * 1985-06-20 1986-12-23 三菱樹脂株式会社 Manufacture of metal based laminate board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61287291A (en) * 1985-06-14 1986-12-17 三菱樹脂株式会社 Metal based laminate board
JPS61292993A (en) * 1985-06-20 1986-12-23 三菱樹脂株式会社 Manufacture of metal based laminate board

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