JPH05291715A - Metal core-containing board for printed wiring use - Google Patents
Metal core-containing board for printed wiring useInfo
- Publication number
- JPH05291715A JPH05291715A JP9434892A JP9434892A JPH05291715A JP H05291715 A JPH05291715 A JP H05291715A JP 9434892 A JP9434892 A JP 9434892A JP 9434892 A JP9434892 A JP 9434892A JP H05291715 A JPH05291715 A JP H05291715A
- Authority
- JP
- Japan
- Prior art keywords
- metal core
- printed wiring
- metal
- board
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、特に放熱性を必要とす
る電子機器等に用いられる印刷配線用基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board used for electronic equipment and the like which requires heat dissipation.
【０００２】[0002]
【従来の技術】従来、電子機器等に用いられる印刷配線
用基板は、フェノール樹脂、エポキシ樹脂等を含浸させ
た紙やガラス布等（プリプレグ）と金属箔を積層しプレ
スにより加熱、加圧成形して得られる。このような紙や
ガラス布と樹脂からなる基板は熱伝導率が低く、発熱量
の多い大電力半導体素子等が直接搭載できず、別途放熱
板等に搭載する必要がある。一方、放熱性を付与した配
線板としては金属芯配線板があり、これは金属板表面に
樹脂を塗布して絶縁層を形成し金属箔を接着して得られ
る。このような金属芯基板では、表裏両面の回路形成は
可能であるがこれらを電気的に接続するスルーホールの
形成は金属板が電気的に導体であるため困難である。こ
れに対し、金属板に明けた孔に絶縁樹脂を充填してから
プリプレグと積層する方法（例えば特開昭59-105216号
公報）や、金属板に明けた孔にプリプレグの過剰の樹脂
を充填するような方法（例えば特開昭59-213431号公
報、特開昭59-213432号公報参照）が提案されている。
しかし、これらの方法ではプリプレグを使用しているた
め、孔中に充填された樹脂には基材が含まれず、熱膨張
率等の物性が絶縁層部分とは異なり、スルーホール部の
電気的信頼性に不安が残る。2. Description of the Related Art Conventionally, a printed wiring board used for electronic equipment is laminated with paper or glass cloth (prepreg) impregnated with phenol resin, epoxy resin or the like and a metal foil, and heated and pressed by a press. Obtained. Such a substrate made of paper or glass cloth and resin has a low thermal conductivity and cannot be directly mounted with a large power semiconductor element or the like that generates a large amount of heat, but must be mounted separately on a heat sink or the like. On the other hand, there is a metal core wiring board as a wiring board having heat dissipation property, which is obtained by applying a resin on the surface of a metal plate to form an insulating layer and bonding a metal foil. With such a metal core substrate, circuits can be formed on both front and back surfaces, but it is difficult to form through holes for electrically connecting these because the metal plate is an electrical conductor. On the other hand, a method of filling an insulating resin in a hole opened in a metal plate and then laminating it with a prepreg (for example, Japanese Patent Laid-Open No. 59-105216), or filling an excess resin in the hole opened in a metal plate Such a method (see, for example, JP-A-59-213431 and JP-A-59-213432) has been proposed.
However, since the prepreg is used in these methods, the resin filled in the holes does not contain the base material, and the physical properties such as the coefficient of thermal expansion are different from those of the insulating layer part, and the electrical reliability of the through hole part is different. Anxiety remains in sex.
【０００３】[0003]
【発明が解決しようとする課題】このような問題に対
し、成形材料を用いて金属芯入り基板を成形する方法が
あるが、一般の成形基板に主に用いられている熱可塑性
樹脂、例えばポリエーテルエーテルケトン、ポリエーテ
ルスルフォン、ポリエーテルイミド等は、成形温度が３
００℃前後と非常に高く寸法安定性等に問題がある。ま
た、溶融粘度が高いため、成形中に金属芯が成形圧で移
動、変形しやすい。さらに、耐熱性が良好な樹脂は価格
が高い。これに対し、熱硬化性樹脂は成形温度を低くで
き寸法安定性が良好である。また、耐熱性が良好であり
ながら価格が低い。一方、電源回路などの基板では大電
流を流すために回路となる金属箔等を厚くしたり、金属
板を加工した回路導体を新たに付加する方法（例えば特
開平3-227094号公報）がある。しかし金属箔等を厚くす
ると、エッチング等の回路形成の時間が増加したり、ソ
ルダレジストのカバーリング性が悪くなったりするた
め、コスト面や作業面で不利となる。また、新たな回路
導体を付加することもコストや時間がかかり好ましくな
い。本発明はかかる状況に鑑みなされたもので、放熱
性、耐熱性に優れかつスルーホール形成が可能であり、
大電流回路を基板内部に形成できる金属芯入り印刷配線
用基板を提供するものである。To solve such problems, there is a method of molding a substrate with a metal core by using a molding material. However, a thermoplastic resin such as polyresin, which is mainly used for general molding substrates, is used. The molding temperature of ether ether ketone, polyether sulfone, polyether imide, etc. is 3
It is very high at around 00 ° C and has problems in dimensional stability and the like. Further, since the melt viscosity is high, the metal core is easily moved and deformed by the molding pressure during molding. In addition, resins with good heat resistance are expensive. On the other hand, the thermosetting resin can lower the molding temperature and has good dimensional stability. Moreover, the heat resistance is good, but the price is low. On the other hand, there is a method (for example, Japanese Patent Application Laid-Open No. 3-227094) in which a metal foil or the like that becomes a circuit is thickened or a circuit conductor made by processing a metal plate is newly added to a substrate such as a power supply circuit in order to flow a large current. . However, if the metal foil or the like is thickened, the time for forming a circuit such as etching increases and the covering property of the solder resist deteriorates, which is disadvantageous in terms of cost and work. Further, it is not preferable to add a new circuit conductor because it requires cost and time. The present invention has been made in view of such a situation, and is excellent in heat dissipation and heat resistance and capable of forming a through hole,
It is intended to provide a printed wiring board with a metal core in which a large current circuit can be formed inside the board.
【０００４】[0004]
【課題を解決するための手段】すなわち本発明は、基板
表面及び／または裏面に外層回路形成用の導体を有し、
基板内部に放熱用の金属芯を有する金属芯入り印刷配線
用基板において、該金属芯が内層回路となるパターンを
有する１枚以上の金属板からなり、絶縁層が熱硬化性樹
脂を用いた成形材料の硬化物であることを特徴とする。
以下、本発明を詳細に説明する。That is, the present invention has a conductor for forming an outer layer circuit on the front surface and / or the back surface of a substrate,
In a printed wiring board with a metal core having a metal core for heat dissipation inside the substrate, the metal core is made of one or more metal plates having a pattern to be an inner layer circuit, and the insulating layer is formed using a thermosetting resin. It is a cured product of the material.
Hereinafter, the present invention will be described in detail.
【０００５】図１に本発明の金属芯入り印刷用配線板に
めっきスルーホールと回路形成を施したものの例の断面
図を示す。本発明の基板は、基板の表面及び／または裏
面の外層回路となる導体１と放熱用金属芯２、及びこれ
らを電気的に絶縁する絶縁樹脂３からなる。放熱用金属
芯には回路となるパターンが施されており、内層回路２
１を形成する。外層回路となる導体は、特に限定するも
のではなく、基板の成形時に一体成形された金属箔でも
よいし、基板成形後に無電解めっき等で形成しためっき
金属でもよい。金属箔としては用途に応じてどのような
ものでもよいが、はんだ付け性や回路形成性、価格等か
ら考えて一般の印刷配線用基板に使用されている銅箔が
好ましい。また、金属箔の絶縁樹脂と接する面は、粗化
したりカップリング剤や接着剤等の処理を施すことによ
り、絶縁樹脂との接着性を向上することができる。無電
解めっきは用途に応じてどのようなものでもよいが、は
んだ付け性や回路形成性、価格等から考えて一般の印刷
配線用基板に使用されている銅めっきが好ましい。ま
た、めっきされる絶縁樹脂表面を物理的及び／または化
学的に粗化することにより、めっき金属との接着性を向
上することができる。FIG. 1 shows a sectional view of an example of a printed wiring board with a metal core according to the present invention in which plated through holes and circuits are formed. The substrate of the present invention comprises a conductor 1 which forms an outer layer circuit on the front surface and / or the back surface of the substrate, a metal core 2 for heat radiation, and an insulating resin 3 which electrically insulates these. The heat dissipation metal core is provided with a circuit pattern, and the inner layer circuit 2
1 is formed. The conductor to be the outer layer circuit is not particularly limited, and may be a metal foil integrally formed at the time of forming the substrate, or a plated metal formed by electroless plating or the like after the substrate is formed. Although any metal foil may be used depending on the application, a copper foil used for a general printed wiring board is preferable in consideration of solderability, circuit formability, price, and the like. In addition, the surface of the metal foil in contact with the insulating resin can be improved in adhesiveness with the insulating resin by roughening or treating with a coupling agent or an adhesive. The electroless plating may be any one depending on the application, but copper plating used for general printed wiring boards is preferable in consideration of solderability, circuit formability, price and the like. Further, by physically and / or chemically roughening the surface of the insulating resin to be plated, the adhesiveness with the plating metal can be improved.
【０００６】放熱用金属芯には内層回路となるパターン
が施されている。このパターンは１枚の金属板から不要
な部分を除去したものでもよいし、複数の金属板を組み
合わせたものでもよい。また、パターンを連結させた金
属板を基板に成形した後、該連結部分を切除して各々の
パターンを独立させたものでもよい。金属板の材質は、
それぞれ異なってもよいし同一であってもよく、銅、ア
ルミニウム、鉄等の金属、またはステンレス等の合金
や、亜鉛や錫、ニッケル等のめっきを施したもの等どの
ようなものでもよいが、放熱性の必要な部分では熱伝導
率の高いものが好ましく、回路として使用する部分では
電気伝導率の高いものが好ましい。また、基板内でのこ
れらの金属板の配置関係は、平面方向に配置されていて
もよいし厚さ方向で一部または全部が重なっていてもよ
く、また入れ子になっていてもよい。隣あう２枚の金属
板同士は、溶接やはんだ付け等で接合されたりはめ込み
等で固定されて接触していてもよいが、絶縁が必要な場
合は一定間隔で離れている必要がある。このような金属
芯の表面には脱脂や粗化、カップリング剤処理等を行な
うことができ、絶縁樹脂との接着性を向上することがで
きる。The metal core for heat dissipation is provided with a pattern to be an inner layer circuit. This pattern may be formed by removing an unnecessary portion from one metal plate, or may be formed by combining a plurality of metal plates. Alternatively, a metal plate having patterns connected to each other may be formed on a substrate and then the connection portion may be cut off to make each pattern independent. The material of the metal plate is
They may be different from each other or may be the same, and any metal such as metal such as copper, aluminum and iron, alloy such as stainless steel, plated with zinc, tin, nickel or the like may be used, A part having a high heat conductivity is preferable in a part requiring heat dissipation, and a part having a high electric conductivity is preferable in a part used as a circuit. In addition, the arrangement relationship of these metal plates in the substrate may be arranged in the plane direction, may partially or entirely overlap in the thickness direction, or may be nested. Two adjacent metal plates may be in contact with each other by being joined by welding, soldering or the like or being fixed by fitting or the like, but if insulation is required, they need to be separated at regular intervals. The surface of such a metal core can be subjected to degreasing, roughening, treatment with a coupling agent, etc., and the adhesiveness with the insulating resin can be improved.
【０００７】スルーホールを形成する部分の金属芯に
は、スルーホール径より大きな貫通孔や切り欠きを設け
てあることが好ましい。このことにより、金属芯と絶縁
樹脂を介して絶縁性に優れたスルーホールを得ることが
できる。金属芯の一部は、絶縁樹脂に被覆されずに露出
していることが好ましい。この露出部分で、基板に搭載
するリレーやコネクタ等の部品と回路である金属芯を電
気的に接続することができる。また、発熱量の多い半導
体素子や放熱器、冷却器等を露出した金属芯に直接搭載
することにより、更に放熱性を向上することができる。
絶縁層となる成形材料の熱硬化性樹脂としては、フェノ
ール樹脂、エポキシ樹脂、ポリイミド樹脂、不飽和ポリ
エステル樹脂、トリアジン樹脂等どのようなものでもよ
く、何種類か併用してもよい。特に、エポキシ樹脂に硬
化剤としてフェノール樹脂を配合した系では耐熱性、電
気特性等に優れている。また、これらの樹脂には硬化反
応を促進する硬化促進剤や難燃性を付与する難燃助剤、
着色剤、離型剤などの添加剤を適宜適量配合することが
できる。It is preferable that a through hole or a notch having a diameter larger than the diameter of the through hole is provided in the metal core at the portion where the through hole is formed. As a result, it is possible to obtain a through hole having an excellent insulating property through the metal core and the insulating resin. It is preferable that a part of the metal core is exposed without being covered with the insulating resin. At this exposed portion, it is possible to electrically connect components such as a relay and a connector mounted on the substrate to a metal core that is a circuit. Further, by directly mounting the semiconductor element, the radiator, the cooler, etc., which generate a large amount of heat, on the exposed metal core, the heat dissipation can be further improved.
As the thermosetting resin of the molding material for the insulating layer, any resin such as phenol resin, epoxy resin, polyimide resin, unsaturated polyester resin, triazine resin may be used, and several kinds thereof may be used in combination. Particularly, a system in which a phenol resin is mixed with an epoxy resin as a curing agent is excellent in heat resistance and electric characteristics. Further, in these resins, a curing accelerator that accelerates the curing reaction or a flame retardant aid that imparts flame retardancy,
Additives such as colorants and release agents can be appropriately added in appropriate amounts.
【０００８】このような樹脂系には種々の充填剤を配合
することにより、熱伝導率を向上したり熱膨張係数を芯
材に整合することができる。例えば溶融シリカ、結晶シ
リカ、アルミナ、窒化珪素等の無機物や、シリコーン、
テフロン等の有機物の粉末等が使用でき、単独または何
種か併用してもよいが、本発明の目的からは熱伝導率の
高いものが好ましい。充填剤の粒径は成形金型のゲート
に詰まらない程度の大きさ以下であればよく、またその
形状はどのようなものでもよい。充填剤の配合量は特に
限定するものではないが、樹脂組成物の溶融粘度や硬化
物の熱伝導率、熱膨張係数等から２０〜８０体積％の範
囲が好ましい。充填剤を配合する場合、樹脂との接着性
を高めるためシラン系カップリング剤に代表されるよう
な表面処理剤を添加してもよい。成形方法については注
型、移送成形、射出成形、圧縮成形等一般の成形材料の
成形方法を用いることができ、必要に応じて加熱、加圧
してもよい。By blending various fillers in such a resin system, the thermal conductivity can be improved and the thermal expansion coefficient can be matched with the core material. For example, inorganic materials such as fused silica, crystalline silica, alumina, silicon nitride, silicone,
Powders of organic substances such as Teflon can be used, and they may be used alone or in combination of several kinds, but those having a high thermal conductivity are preferable for the purpose of the present invention. The particle size of the filler may be any size that does not cause the gate of the molding die to be clogged, and the shape thereof may be any shape. The blending amount of the filler is not particularly limited, but is preferably in the range of 20 to 80% by volume in view of the melt viscosity of the resin composition, the thermal conductivity of the cured product, the thermal expansion coefficient and the like. When the filler is blended, a surface treatment agent typified by a silane coupling agent may be added in order to enhance the adhesiveness with the resin. As a molding method, a general molding material molding method such as casting, transfer molding, injection molding or compression molding can be used, and heating or pressurization may be performed as necessary.
【０００９】[0009]
【作用】本発明の金属芯入り印刷配線用基板は、基板内
部に金属芯を内挿するため優れた放熱性が得られる。ま
た、内挿した金属芯に回路となるパターンが施されてい
るため、そのまま大電流を流すことができる。更に、絶
縁層が熱硬化性樹脂を用いた成形材料の硬化物であるた
め、優れた耐熱性とスルーホール形成性が得られる。The printed wiring board with metal core of the present invention has excellent heat dissipation because the metal core is inserted inside the board. Further, since the inserted metal core is provided with a circuit pattern, a large current can be passed as it is. Furthermore, since the insulating layer is a cured product of a molding material using a thermosetting resin, excellent heat resistance and through-hole formability can be obtained.
【００１０】[0010]
【実施例】以下、実施例に基づき本発明を説明するが、
本発明はこの実施例に限定されるものではない。The present invention will be described below based on examples.
The invention is not limited to this example.
【００１１】実施例１ ＥＳＣＮ−１９５（住友化学(株)製オルソクレゾール ノボラック型エポキシ樹脂、商品名） ：１００重量部 ＨＰ−８００Ｎ（日立化成工業(株)製フェノールノボ ラック樹脂、商品名） ： ５０重量部 アルミナ粉 ：９５０重量部 エポキシシランカップリング剤 ： ３重量部 トリフェニルホスフィン ： ５重量部 カーボンブラック着色剤 ： １重量部 上記化合物を充分混練して熱硬化性の成形材料を得た。
回路パターンに切り抜いた厚さ１mmの銅板３枚と、厚さ
３５μm の金属箔２枚を、上下とも深さ０．３mmのキャ
ビティを有する金型に配置した。これに上記成形材料を
移送プレスで１７５℃、９０秒で移送、成形したものを
１７５℃、５時間後硬化して、厚さ１．６７mm、１００
mm角の金属芯入り銅張基板を得た。Example 1 ESCN-195 (Sumitomo Chemical Co., Ltd. orthocresol novolac type epoxy resin, trade name): 100 parts by weight HP-800N (Phenol novolac resin, trade name of Hitachi Chemical Co., Ltd.): 50 parts by weight Alumina powder: 950 parts by weight Epoxy silane coupling agent: 3 parts by weight Triphenylphosphine: 5 parts by weight Carbon black colorant: 1 part by weight The above compounds were sufficiently kneaded to obtain a thermosetting molding material.
Three copper plates having a thickness of 1 mm and two metal foils having a thickness of 35 μm, which were cut out into a circuit pattern, were placed in a mold having a cavity having a depth of 0.3 mm on both sides. The above molding material was transferred to this by a transfer press at 175 ° C. for 90 seconds, and the molded material was post-cured at 175 ° C. for 5 hours to give a thickness of 1.67 mm, 100
A copper clad substrate with a square metal corner was obtained.
【００１２】実施例２ 回路パターンに切り抜いた厚さ１mmの銅板３枚と、直径
１．５mmのスルーホール形成用の貫通孔と該銅板３枚が
入る部分の貫通孔を設けた厚さ１mmのアルミ板を金属芯
として用いたこと以外は実施例１と同様に成形して、厚
さ１．６７mm、１００mm角の金属芯入り銅張基板を得
た。EXAMPLE 2 Three 1 mm thick copper plates cut out into a circuit pattern, through holes for forming through holes having a diameter of 1.5 mm, and through holes in the area where the three copper plates are inserted are provided. A copper clad substrate with a metal core having a thickness of 1.67 mm and a size of 100 mm was obtained by molding in the same manner as in Example 1 except that an aluminum plate was used as the metal core.
【００１３】比較例１ ジシアンジアミド硬化系エポキシ樹脂ワニスを厚さ０．
２mmのガラス布に含浸させた後、乾燥させプリプレグを
得た。これを８枚積層し両面に厚さ３５μm の銅箔を配
置し、プレスにより１７０℃、９０分加熱、加圧成形し
て厚さ１．６７mmの銅張積層板を得た。Comparative Example 1 A dicyandiamide curing type epoxy resin varnish having a thickness of 0.
After impregnating a 2 mm glass cloth, it was dried to obtain a prepreg. Eight pieces of this were laminated, and a copper foil having a thickness of 35 μm was arranged on both sides, and heated at 170 ° C. for 90 minutes and pressed to obtain a copper-clad laminate having a thickness of 1.67 mm.
【００１４】比較例２ ジシアンジアミド硬化系エポキシ樹脂ワニスを厚さ０．
１mmのガラス布に含浸させた後、乾燥させプリプレグを
得た。厚さ１．５mmのアルミ板の片面にこのプリプレグ
１枚と比較例１で用いた銅箔１枚を配置し、比較例１と
同様に成形して厚さ１．６４mmのアルミベース銅張積層
板を得た。Comparative Example 2 A dicyandiamide curing type epoxy resin varnish having a thickness of 0.
After impregnating a 1 mm glass cloth, it was dried to obtain a prepreg. One prepreg and one copper foil used in Comparative Example 1 were placed on one side of an aluminum plate having a thickness of 1.5 mm, and molded in the same manner as in Comparative Example 1 to laminate an aluminum base copper clad having a thickness of 1.64 mm. I got a board.
【００１５】比較例３ 直径１．５mmのスルーホール形成用の貫通孔を設けた厚
さ１mmの銅板を金属芯として用いたこと以外は実施例１
と同じ方法で作製し、金属芯入り銅張り基板を得た。Comparative Example 3 Example 1 except that a 1 mm thick copper plate provided with through holes for forming through holes having a diameter of 1.5 mm was used as the metal core.
A copper clad substrate containing a metal core was obtained by the same method as described above.
【００１６】以上のようにして得られた基板を用いて、
熱伝導率、はんだ耐熱性、スルーホール形成性を評価し
た。熱伝導率の測定は、銅箔を除去した１００mm角の基
板を、平面プローブを用いた熱線法による熱伝導率計
（ＱＴＭＤ３：京都電子工業(株)製）で行なった。はん
だ耐熱性の測定は、基板を２５mm角に切断し、８５℃、
８５％ＲＨの恒湿高温槽内で５０時間加湿し、３００℃
のはんだ浴に５分間浮かべた後のふくれの有無を目視観
察した。スルーホール形成性の評価は、ドリルを用いて
孔明けした内面に無電解銅めっきを施してめっきスルー
ホールを形成し、断面を顕微鏡観察した。なお、実施例
１では金属芯の無い部分にスルーホールを形成した。結
果を表１に示す。Using the substrate obtained as described above,
The thermal conductivity, solder heat resistance, and through hole formability were evaluated. The thermal conductivity was measured by using a 100 mm square substrate from which the copper foil was removed and using a thermal conductivity meter (QTMD3: manufactured by Kyoto Electronics Manufacturing Co., Ltd.) by a hot wire method using a flat probe. Solder heat resistance is measured by cutting the board into 25 mm square, 85 ℃,
Humidify for 50 hours in a constant humidity and high temperature tank of 85% RH at 300 ° C.
After floating for 5 minutes in the solder bath, the presence or absence of blisters was visually observed. The evaluation of the through hole formability was performed by electroless copper plating the inner surface of the hole, using a drill to form a plated through hole, and observing the cross section with a microscope. In Example 1, the through hole was formed in the portion without the metal core. The results are shown in Table 1.
【００１７】[0017]
【表１】 [Table 1]
【００１８】表１から明らかなように、実施例１及び２
の熱伝導率は比較例１に比べ高く、比較例２、３と同様
に放熱性が良好であった。また、実施例１、２及び比較
例３のスルーホール形成は比較例１と同等で容易であ
り、スルーホール部にはボイド、未充填の発生がなく、
絶縁性も良好であった。更に、実施例１及び２では内層
回路を金属芯として内挿したため、大電流回路を新たに
付加する必要が無かった。As is apparent from Table 1, Examples 1 and 2
The thermal conductivity was higher than that of Comparative Example 1, and the heat dissipation was good as in Comparative Examples 2 and 3. Further, the formation of the through holes of Examples 1 and 2 and Comparative Example 3 is the same as that of Comparative Example 1 and is easy, and there are no voids or unfilled portions in the through holes
The insulation was also good. Furthermore, in Examples 1 and 2, since the inner layer circuit was inserted as a metal core, it was not necessary to newly add a large current circuit.
【００１９】[0019]
【発明の効果】以上の説明から明らかなように、本発明
の金属芯入り印刷配線用基板は従来の金属ベース基板と
同等以上の放熱性を有し、かつ耐熱性に優れ、スルーホ
ール形成が可能であり、大電流が流せる内層回路を内挿
することができ、その産業的価値は高い。As is clear from the above description, the printed wiring board with a metal core of the present invention has a heat dissipation property equal to or higher than that of a conventional metal base substrate, and is excellent in heat resistance, so that a through hole can be formed. It is possible and can interpolate the inner layer circuit which can flow a large current, and its industrial value is high.
【図１】本発明の金属芯入り印刷配線用基板に、めっき
スルーホールと回路を形成したものの断面図である。FIG. 1 is a cross-sectional view of a printed wiring board with a metal core according to the present invention in which plated through holes and circuits are formed.
１…導体、２…放熱用金属芯、２１…内層回路、３…絶
縁樹脂、４…スルーホール部DESCRIPTION OF SYMBOLS 1 ... Conductor, 2 ... Heat dissipation metal core, 21 ... Inner layer circuit, 3 ... Insulating resin, 4 ... Through hole part
フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ２９Ｌ 31:34 4Ｆ Continuation of front page (51) Int.Cl. 5 Identification code Office reference number FI technical display area B29L 31:34 4F
Claims (3)
成用の導体を有し、基板内部に放熱用の金属芯を有する
金属芯入り印刷配線用基板において、該金属芯が内層回
路となるパターンを有する１枚以上の金属板からなり、
絶縁層が熱硬化性樹脂を用いた成形材料の硬化物である
ことを特徴とする金属芯入り印刷配線用基板。1. A printed wiring board having a metal core, which has a conductor for forming an outer layer circuit on the front surface and / or the back surface of the substrate and has a metal core for heat dissipation inside the substrate, wherein the metal core serves as an inner layer circuit. Consisting of one or more metal plates having
A printed wiring board with a metal core, wherein the insulating layer is a cured product of a molding material using a thermosetting resin.
スルーホール形成用の貫通孔または切り欠きが設けられ
ていることを特徴とする請求項１に記載の金属芯入り印
刷配線用基板。2. The printed wiring board with a metal core according to claim 1, wherein the metal core is provided with a through hole or a notch for forming a through hole having a diameter larger than that of the through hole.
露出していることを特徴とする請求項１に記載の金属芯
入り印刷配線用基板。3. The printed wiring board with a metal core according to claim 1, wherein a part of the metal core is exposed without being covered with the insulating resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4094348A JP2842037B2 (en) | 1992-04-14 | 1992-04-14 | Printed wiring board with metal core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4094348A JP2842037B2 (en) | 1992-04-14 | 1992-04-14 | Printed wiring board with metal core |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05291715A true JPH05291715A (en) | 1993-11-05 |
| JP2842037B2 JP2842037B2 (en) | 1998-12-24 |
Family
ID=14107783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4094348A Expired - Lifetime JP2842037B2 (en) | 1992-04-14 | 1992-04-14 | Printed wiring board with metal core |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2842037B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1126935A (en) * | 1997-07-03 | 1999-01-29 | Denki Kagaku Kogyo Kk | Metal base circuit board |
| WO2000079848A1 (en) * | 1999-06-21 | 2000-12-28 | Mitsubishi Denki Kabushiki Kaisha | Method for producing circuit-forming board, circuit-forming board, and carbon sheet |
| KR100843368B1 (en) * | 2007-03-02 | 2008-07-03 | 삼성전기주식회사 | Fabricating method of multi layer printed circuit board |
| KR20150104072A (en) * | 2012-09-12 | 2015-09-14 | 주식회사 두산 | Metal foil for radiating heat, method of preparing the same, and metal-clad laminate for radiating heat and multi-layer printed circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5350469A (en) * | 1976-10-19 | 1978-05-08 | Nippon Paint Co Ltd | Method of producing metal base printed circuit board |
| JPS6265395A (en) * | 1985-09-17 | 1987-03-24 | オ−ケ−プリント配線株式会社 | Printed circuit board |
| JPS6465895A (en) * | 1987-09-07 | 1989-03-13 | Hitachi Cable | Mesh-shaped metal core substrate |
| JPH01228191A (en) * | 1988-03-09 | 1989-09-12 | Eito Kogyo:Kk | Metal core printed wiring board and manufacture thereof |
| JPH03195081A (en) * | 1989-12-25 | 1991-08-26 | Sanyo Electric Co Ltd | Hybrid circuit and its manufacture |
-
1992
- 1992-04-14 JP JP4094348A patent/JP2842037B2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5350469A (en) * | 1976-10-19 | 1978-05-08 | Nippon Paint Co Ltd | Method of producing metal base printed circuit board |
| JPS6265395A (en) * | 1985-09-17 | 1987-03-24 | オ−ケ−プリント配線株式会社 | Printed circuit board |
| JPS6465895A (en) * | 1987-09-07 | 1989-03-13 | Hitachi Cable | Mesh-shaped metal core substrate |
| JPH01228191A (en) * | 1988-03-09 | 1989-09-12 | Eito Kogyo:Kk | Metal core printed wiring board and manufacture thereof |
| JPH03195081A (en) * | 1989-12-25 | 1991-08-26 | Sanyo Electric Co Ltd | Hybrid circuit and its manufacture |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1126935A (en) * | 1997-07-03 | 1999-01-29 | Denki Kagaku Kogyo Kk | Metal base circuit board |
| WO2000079848A1 (en) * | 1999-06-21 | 2000-12-28 | Mitsubishi Denki Kabushiki Kaisha | Method for producing circuit-forming board, circuit-forming board, and carbon sheet |
| US6629362B2 (en) | 1999-06-21 | 2003-10-07 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing a circuit print board |
| CN100393183C (en) * | 1999-06-21 | 2008-06-04 | 三菱电机株式会社 | Method for producing circuit-forming board, circuit-forming board, and carbon sheet |
| KR100843368B1 (en) * | 2007-03-02 | 2008-07-03 | 삼성전기주식회사 | Fabricating method of multi layer printed circuit board |
| KR20150104072A (en) * | 2012-09-12 | 2015-09-14 | 주식회사 두산 | Metal foil for radiating heat, method of preparing the same, and metal-clad laminate for radiating heat and multi-layer printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2842037B2 (en) | 1998-12-24 |
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