JPS6018314A - Conductive molding material - Google Patents
Conductive molding materialInfo
- Publication number
- JPS6018314A JPS6018314A JP58124734A JP12473483A JPS6018314A JP S6018314 A JPS6018314 A JP S6018314A JP 58124734 A JP58124734 A JP 58124734A JP 12473483 A JP12473483 A JP 12473483A JP S6018314 A JPS6018314 A JP S6018314A
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- conductive
- layer
- pellet
- master
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/12—Making granules characterised by structure or composition
- B29B9/14—Making granules characterised by structure or composition fibre-reinforced
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/02—Making granules by dividing preformed material
- B29B9/06—Making granules by dividing preformed material in the form of filamentary material, e.g. combined with extrusion
Abstract
Description
【発明の詳細な説明】
［発明の技術分野］
本発明は、合成樹脂の強度を低下させることなく、尋゛
市性充填月が均一に分散でき、電磁波シールド効果が人
さく、かつ電気特性に優れた信頼性の高い導電性成形材
料に関する。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention is characterized by the fact that the universal filling material can be uniformly dispersed without reducing the strength of the synthetic resin, the electromagnetic shielding effect is small, and the electrical properties are good. Concerning excellent and highly reliable conductive molding materials.
［発明の技術的青用とその問題点］
近汗、外部の妨害電波から電子回路を保護し、かつ光信
回路等から発生４る不要な電波を外部に漏洩するのを防
出づるために、電子機器の筺体を電磁波シールド拐料に
より形成することが要求されている。 このような電磁
波シールド材料としては、金１１バー１５導Ｔｈ＆性合
成イＡ１１１１行ｔ９が挙げられるが、前者の金属（Ｊ
ＩＱれた電磁波シールド効果を右Ｊ−る反面、市い、１
島価、加工性が悪い等の欠点があるため、導電性合成樹
脂の使用が主流となりつつある。[Technical use of the invention and its problems] In order to protect electronic circuits from external interference radio waves and to prevent unnecessary radio waves generated from optical communication circuits etc. from leaking to the outside, There is a demand for housings of electronic devices to be made of electromagnetic shielding material. Examples of such electromagnetic shielding materials include gold 11 bar 15 conductive Th & synthetic IA1111 row t9, but the former metal (J
Although it has a high electromagnetic shielding effect, it is difficult to use.
Because they have drawbacks such as poor island value and poor processability, the use of conductive synthetic resins is becoming mainstream.
合成樹脂に嘱′）電性をイ」勾する方法としては、合成
樹脂を成形後、導電性塗料を塗布したり、金属を溶射、
メッキしたりしく一表面に導電層を形成りる方法と、合
成樹脂内部にカーボンや金属粉末ｄするいは金属繊維等
の導電性の充填材を添加Ｊる内部添加法がある。 前者
の合成樹脂表面に導電層を形成１−る方法は、工程が増
えて■ｌ産性に乏しく、また導電層が長時間の使用にＪ
、り剥がれてしまうという欠点があるため、後者の内部
添加法に期待が寄Ｕられ”Ｃいる。 しかしながら、後
者の内部添加法にも次のような問題があっｌ（。 づな
わら所望の電磁波シールド効果を有Ｊるためには、カー
ボンや金属粉あるいは金属繊維等の￥；ｌ電性の充填材
を多量に配合りる必要があり、そのし１、果分１１９゜
不良を起こしたり、成形品の１幾械的強度が低トすると
いう欠点があった。 さらに金属等を合成樹脂に充填し
た場合、合成樹脂を劣化さＵるどい）問題があった。
強度を低１・さＵないＪ、うに３ｊ′）電性充填材にシ
ランカップリング層を設＋Ｊ ／ｊのしあるが導電性が
著しく田舎されるという欠点がｉ１９っだ。 また、金
属繊維や柔軟性に富む機紹充痩イΔはｗ体の状態でｊ５
ν状化しやずく、混合のために解ぎ（よぐし等の前処理
工程を必要とする。 更に比重のｊｕいや形状の違いか
ら均一に混線することは、高度の技術と技能を必要どＪ
゛る。 また、作業者が充填イΔの取り扱い時、綴紐が
皮Ｉｎにささったり触れたりして痛み、カユミ等身体的
昔痛を伴うなど環境衛生上の問題も発生しやすい。 従
って成形材わの製造は、できる限り短かい工程で、かつ
クローズドシステムで゛稼動できそして充填４Ａの形態
も一定（変化しない）のものが望まれていた。Methods of imparting electrical properties to synthetic resin include applying conductive paint, thermal spraying metal, etc. after molding the synthetic resin.
There are two methods: one is to form a conductive layer on one surface, such as by plating, and the other is an internal addition method, which is to add conductive fillers such as carbon, metal powder, or metal fibers inside the synthetic resin. The former method of forming a conductive layer on the surface of a synthetic resin increases the number of steps and is poor in productivity.
However, the latter internal addition method has the disadvantage of peeling off, so expectations are high for the latter internal addition method. However, the latter internal addition method also has the following problems. In order to have a shielding effect, it is necessary to incorporate a large amount of electrically conductive fillers such as carbon, metal powder, or metal fibers, which may result in 119° defects, There was a drawback that the geometrical strength of the molded product was low.Furthermore, when the synthetic resin was filled with metal, etc., there was a problem that the synthetic resin deteriorated.
Although there is a silane coupling layer added to the conductive filler to reduce the strength, the drawback is that the conductivity is significantly reduced. In addition, metal fibers and highly flexible machine introduction ∆ are j5 in the w-body state.
A pre-processing process such as loosening is required for mixing the ν-shaped yazuki.Furthermore, due to differences in specific gravity and shape, it requires advanced technology and skill to mix the wires uniformly.
It's true. In addition, when an operator handles the filling material Δ, the binding string may get stuck in or touch the skin In, causing physical pain such as pain and itching, which is likely to cause environmental health problems. Therefore, it has been desired that the molded material can be produced in as short a process as possible, that it can be operated in a closed system, and that the form of the filling 4A is constant (does not change).
いいかえれば電磁波シールド効果が大ぎく、合成樹脂と
の混合が均一に（・き、環境ｔＲＪ生上もよい、しかも
合成樹脂の強度を低１；又は劣化させたりすることのイ
；い導電性成形（不利が得られていないのが実情Ｃ・あ
る。In other words, the electromagnetic shielding effect is great, the mixture with the synthetic resin is uniform, the environmental resistance is good, and the strength of the synthetic resin is low. (The reality is that there is no disadvantage.
１光明のし！的］
４＜発明（よ、このような点に対処してなされたもの−
Ｃ′ンン電１イｌ光Ｉ１３を祠の形態とｆｉを定量化し
安定して供給づると其に合成樹脂に均一に分散すること
がでさ゛、環境ｔｉ１７ ’−ＬＪ−もよく、電磁波シ
ールド効果が大ぎく、機械的強度が高く、かつ電気時ｉ
ｊｌに優れた信頼性の高いｙ；４電性成形材斜をＪｉ？
供することを目的としている。1 light of light! ] 4<Invention (something that was made to address these points)
By quantifying the form and fi of the shrine and stably supplying the C'n electric light I13, it is possible to disperse it uniformly into the synthetic resin, the environment is good, and the electromagnetic shielding effect is good. is large, mechanical strength is high, and electric current i
Highly reliable y with excellent jl; Ji?
The purpose is to provide
し発明の（■要」
本発明は前記の目的を達成づべく鋭意Ｉσ１究を中ねた
結果、後述のヂタネー１へカップリング層を４ｉする金
属ｗ４紐などの表面に合成樹脂層を形成した導電性充填
材を用いることによって、前ｎ１２の目的が達成される
ことを見い出した。Summary of the Invention: As a result of intensive research into Iσ1 in order to achieve the above-mentioned object, the present invention is based on the invention, in which a synthetic resin layer is formed on the surface of a metal w4 string, etc., which provides a coupling layer to Ditane 1, which will be described later. It has been found that by using a conductive filler, the object of n12 above is achieved.
即ち、本発明は表面にヂタネー１〜カップリング層を右
Ｊる艮繊維状導電性充填月を束ねた表面に合成樹脂層を
形成一体化し、ベレット状に切μｌｉ シてなるマスタ
ーベレッ］〜ど、ペレッ１〜状の合成樹脂からなるナチ
ュラルベレッ１−とを主成分とりることを特徴と覆る導
電性成形月オ′シひある。That is, the present invention is a master beret formed by forming and integrating a synthetic resin layer on the surface of bundled fibrous conductive fillers with a coupling layer formed on the surface thereof, and cutting it into a pellet shape. The conductive molded shell is characterized in that the main component is natural pellets made of pellet-shaped synthetic resin.
本発明のチタネートカップリング層形成に用いるチタネ
ー１〜カップリング剤としては、’９ ’ｎｉ ｆｉｌ
、 ４阻害しないリン、硫黄系のカップリング剤を用い
るのが好ましい。 例えばイソゾ［」ビル１〜リドｌ゛
′シルベンゼンスルホニルチタネート、イソソし１ビル
１〜リス〈ジＡクチルバイロホスフｘ’−ト）チタネー
１へ、ヒス（ジオクチルパイロホスフェ−１へ）オキシ
アセテ−１〜チタネー１〜．ビス（ジオクチルバイｌＪ
ホスーノエ−１へ）土チレンチタネートおよびイソゾに
１ピル１へり（ジＡクチールホスフエート）チタネート
が子げられ、単独又は２種以上の混合物として用いる。As the titanate 1 to coupling agent used for forming the titanate coupling layer of the present invention, '9' ni fil
, 4. It is preferable to use a phosphorus- and sulfur-based coupling agent that does not inhibit. For example, isozo['biru 1 to lydo l'' silbenzenesulfonyl titanate, isozo['biru 1 to lys(diActyl pyrophosphate x'-to) titanate 1, his(to dioctylpyrophosphate 1) oxyacetate 1 ~ Titane 1 ~. Bis(dioctyl bis lJ)
Phosnoe-1) One pill, one heli (diA ctyl phosphate) titanate is added to tilentitanate and isozo, and used alone or as a mixture of two or more.
それらの樹造式を第１表に示した。Their tree construction formulas are shown in Table 1.
第１表
本発明に用いる長繊維状導電性充填材としては、銅、ツ
ノルミニウム、鉄、ニッケル、亜鉛若しくはそれらの合
金等の金属綴紐、ガラス、炭素、ボロン等の無機繊組、
又は銅、ニッケル等の金属層をイｊ８１る＋ｉｌ′ｉ′
記の無（幾謀玲１１等が挙げられる。Table 1 The long fiber conductive filler used in the present invention includes metal cords such as copper, tunoruminium, iron, nickel, zinc, or alloys thereof, inorganic fibers such as glass, carbon, and boron,
Or a metal layer such as copper or nickel
There is no record (Ikushirei 11 etc.).
これらの長繊維は細いほどよく、また通常１００〜５０
０００ Ａ＼の細線を東ねたものを用いる。The thinner these long fibers are, the better, and usually 100 to 50
Use a thin line of 000 A\ with the east side.
本発明の前記ＩＳ！繊維状ン１；１電性充填材の表面に
用いる合成イ６（脂どしでは、例えばボリスヂレン樹脂
、Ａ Ｉ３ Ｓ樹ＩＩイ、ポリカーボネート樹脂、変性
Ｐ Ｉ） ０樹脂’、：ｑ ／ＪＸ子（）られる３、
ここで用いる合成樹脂はナチコレルベレッ１〜に用いる
合成樹脂と同種又は同一のものＣ′もＪ、い。 またナ
チュラルベレットの合成樹脂と狂合りることによっＣ界
面に形成される第一りの合成樹脂が補強動床をもつもの
、づなわ１うブレンドポリマーとなるＪ、うなものでも
よい。The IS of the present invention! Fibrous 1; 1 Synthetic material used on the surface of the electrically conductive filler 6 (For fats, for example, borisdylene resin, A I3 S resin, polycarbonate resin, modified PI) 0 Resin', :q /JX () 3,
The synthetic resin used here is the same or the same as the synthetic resin used in Nachikolerbere 1~. Alternatively, the first synthetic resin formed at the C interface by mixing with the synthetic resin of the natural pellet may have a reinforcing moving bed, or the first synthetic resin may become a blended polymer.
例えばナナ−１−シルベレツ１−がスヂレン系の合成樹
脂Ｃある揚台には、変性Ｐ Ｐ○樹脂、ポリブタン１″
ン（ｆｌＪ脂、ポリカーボネート樹脂等を使用すると好
結果が１ニアられる。 こうＪ−ることにより界面に形
成される第三の合成樹脂が補強効果をｂら、これらの成
形材料を成形しく“得られる成形品の特＝Ｐｌを改善す
ることができる。For example, on a platform where Nana-1-Silberez-1- is a styrene-based synthetic resin C, modified P P○ resin, polybutane 1''
Good results can be obtained by using resins such as flJ resin, polycarbonate resin, etc. By doing this, the third synthetic resin formed at the interface has a reinforcing effect, making it easier to mold these molding materials. It is possible to improve the characteristic = Pl of the molded product.
マスターベレットは、長繊維状η？ｉｆ ’ｌ）ｌ光１
ｊ＋（祠の表面にチタネー１〜カップリング層を形成さ
Ｉ、次いでこれを束ねた表面に合成樹脂層を形成一体１
にし、ペレッ１〜状切断してつくる。 またツブｌノル
ベレッ１〜はベレット状の所望の合成樹脂を用い前記マ
スターベレン１への樹脂と同種同一のｂの（パもあるい
は異なってもよい。 史【こ前記したルンドポリマーを
形成ＪるものでｂＪ、い１． マスターベレッｌ〜とナ
チュラルベレットの配合割合（よ通常マスターベレット
１重量部に対しツブ舅うルベレット １〜２０重量部配
合Ｊることがθｒましい１゜以下図面を用いて本発明の
９９７１２ イノｊ成形イＡＦｌ を賢きらに説明Ｊる
。 第１図は本発明に用いる］“′、１電゛１゛Ｉ充填
イシの断面図で長繊軒（状導電１（１充１ｉ＋ＡＩの表
面にナタネートカツブリング層２が形成され（いる、。Is the master pellet long fibrous η? if 'l)l light 1
j + (form titanium 1 to coupling layer I on the surface of the shrine, then form a synthetic resin layer on the surface where these are bundled together 1
Then, cut into pellets into 1~ shape. In addition, for the Lund polymers 1 to 1, a desired synthetic resin in the form of pellets is used to form the same kind of resin as the resin for the master polymer 1 (which may be different or different). 1. The blending ratio of Master Beret and Natural Beret (Usually, it is preferable to mix 1 to 20 parts by weight of Ruberet to 1 part by weight of Master Beret. 99712 Invention 99712 Molding Invention AFl will be explained wisely. Figure 1 is a cross-sectional view of a 1-electrode 1 (1-electrode) I filling stone used in the present invention. A natanate coupling layer 2 is formed on the surface of 1i+AI.
通常充填何１を束ねヂタネー１〜カツゾリンク剤の液中
を通過させＣ充填＋Ｊ １の表面に（ｔｌ−？２さμる
、。Normally, the filling materials are bundled together and passed through the solution of Ditane 1 to Katzolink agent, and then applied to the surface of C filling + J 1 (tl-?2).
第２図はマスターベレッ１への断面図で、充填々２１の
表面にチタネー１〜カップリング層２が形成された繊串
（１を多数束ねて、その束ねた表面に合成樹脂層３を形
成さｕ′でいる。 第３図はマスターペレツ１−の見取
図で中心に束ねた充填月４があり、その表面に合成樹脂
３が形成されてマスターペレット５ど゛する。 製造さ
れるマスターペレットは通常断面が円形であるが必ずし
も円形でなくとも偏平で゛しＪ、＜ 、ＱＪに形状Ｇこ
制約されない。FIG. 2 is a cross-sectional view of the master beret 1, which is a fiber skewer (a large number of skewers 1 are bundled together and a synthetic resin layer 3 is formed on the surface of the bundle), on which titanium 1 to coupling layers 2 are formed on the surface of the filling 21. Figure 3 is a sketch of the master pellets 1-, with a bundled filling moon 4 in the center, and a synthetic resin 3 formed on its surface to form the master pellet 5. The master pellets produced are usually Although the cross section is circular, it does not necessarily have to be circular but can be flat, and the shape G is not limited to J, <, QJ.
ンスクーベレッ１〜の製造方法を第４図を用いて説明−
りれば、長い化紺状導電性充填祠１０を束ねてヂタネー
１〜カップリング液１１中を通過させ表ｉ１＋ｉ処理を
？−１い次イテ・前記充＋ｙｘ′４Ａ１ｏ ヲ押出＋幾
１２のダイス１３を通し合成樹脂で被覆成形１４し、さ
らにこれを）Ｊツーｒイング１５してマスターペレット
１６とりる。 この製造工程を速続に行うことか経詩的
に便利である。 しかし場合により連続的な製造」−稈
でなくてす、Ｊ、い。 本発明の導電性成形４Δオ′３
１はマスターペレットとナヂュラルベレッ１へどを主成
分とＪ゛るが必要に応じて仙の成分を加えでもよい。
本発明の成形）ｔ／Ｊ利は電毎長波シールドを必要とづ
る電子機器等のハウジング等として使用される。The manufacturing method of Nskuberet 1~ will be explained using Fig. 4.
If so, bundle the long dark blue conductive fillers 10 and pass them through the dithering 1 to the coupling liquid 11 to perform the table i1+i treatment. -1 Next, the above-mentioned material is extruded and passed through a 12-inch die 13 to be coated and molded with a synthetic resin (14), and this is then subjected to J-tooling (15) to obtain a master pellet (16). It is historically convenient to carry out this manufacturing process rapidly. But in some cases continuous production' - not culm, J, i. Conductive molding 4Δo'3 of the present invention
1 has master pellets and natural berets as its main ingredients, but other ingredients may be added as needed.
The molded product of the present invention) is used as a housing for electronic equipment, etc. that requires a long-wave shield.
「発明の実施例」 次に本発明の実施例についＣ説明りる、。“Embodiments of the invention” Next, embodiments of the present invention will be explained.
実施例 １〜２
第２表に示づ組成に従い、直径約５０μ口！の長尺銅繊
維を３００本束とし、酸洗い乾燥後ヂタネートカップリ
ング液中を通過さじで前記長尺（１・ＪＩＨ紺の表面処
理を行った。 こうして１！イられたｆ／Ｉ’？−−１
〜力ツプリング層を右づ゛る導電＋ｑ充填拐にボリスヂ
レン樹脂を薄く被覆一体化して直径約２ ｍ ｍどじ、
長さ ５ｍｍにツノツーｊ−イングしてマスターペレッ
トを得た。 このマスターペレッ１へ１容にλ１シ？＠
のボリスヂレン樹脂のプヂーＬラルペレッ１〜を機械的
に混合して導電性成形材料を製造した。 ＋”、ｊ １
．’）れだ成形′４Ａ斜を用いて射出成形を行っ（成形
品を１！また。 成形品の機械的特性と電気的特↑（［
の試ハロｊを・行ったので第２表に示した。Examples 1-2 According to the composition shown in Table 2, the diameter is approximately 50 μm! A bundle of 300 long copper fibers of 1. '?--1
~The power spring layer is integrated with a thin coating of Borisdylene resin on the conductive + q filling layer, with a diameter of approximately 2 mm.
A master pellet was obtained by cutting the pellet to a length of 5 mm. Is this master pellet 1 λ1 in 1 volume? @
A conductive molding material was prepared by mechanically mixing Pudji L Ral pellets 1 to 1 of Borisdylene resin. +”, j 1
．． ') Execute injection molding using a 4A slope (molded product 1! Also. Mechanical properties and electrical properties of the molded product ↑([
The results are shown in Table 2.
比較例 １〜２
実施例１〜２ど同拝に第２表に示す組成に従い導ｉｌｌ
性成形祠わ１を製造した。 比較例１ではカップリング
処理をしないもの、比較例２ではシランカップリング剤
を用いて処理した以外は同一にして成形材料、成形品を
得−Ｃ，機械的特性および電気的特性を試験したので第
２表に示した。Comparative Examples 1-2 Examples 1-2 were prepared according to the composition shown in Table 2.
A molded mill 1 was manufactured. In Comparative Example 1, no coupling treatment was performed, and in Comparative Example 2, the same molding materials and molded products were obtained except that treatment was performed using a silane coupling agent. It is shown in Table 2.
鈎２表
実施例の本発明の導電性成形材料が電磁波シールド効果
が大きく、機械的、電気的特性に（Ωれていることがわ
かる。It can be seen that the conductive molding material of the present invention shown in Table 2 has a large electromagnetic shielding effect and has excellent mechanical and electrical properties (Ω).
［発明の効果」
以上説明した如く本発明の導電性成形材料はヂクネー１
゛カップリング層を有づる長繊維状導電性充填イΔの表
部に合成樹脂層を形成−イホ化したマスターベレッ１へ
を用いたことにより、尋電性充１ｉｌが均一に分子ｉｋ
でさ、環境衛生上もよい、電磁波シールド効果の人さい
、電気的特性が優れ、かつ合成樹脂の強度を低−トさけ
ることのない信頼性の高いｌマ電性成形＋Ｊ ′Ａ’ｌ
を１！イることかできる。[Effects of the Invention] As explained above, the conductive molding material of the present invention
゛By forming a synthetic resin layer on the surface of the long fibrous conductive filler ∆ having a coupling layer--by using the blanked master beret 1, the conductive conductive filler 1il is uniformly distributed in molecular ik.
Well, it is good for environmental hygiene, has electromagnetic shielding effect, has excellent electrical properties, and is highly reliable without sacrificing the strength of synthetic resin.
1! I can cum.
’Ｉ Ｆｉｌ ｒｆＤ Ｏ） Ｉｉ’Ａ ｊ、’ｌ ’
Ｘ 説明第１図は本発明に使用Ｊる心電性充填材の断面
図、第２図はマスターベレッ１への断面図、第３図は！
スターベレッ１〜の見取図、第４図は本発明に用いる！
スターベレッ１〜の製造方法を示ず図である３゜
１．１０・・・導電１ノを充１眞（Δ、 ２・・・チタ
ネートカップリング層、 ３・・・合成樹脂層、 ４・
・・束ねた導電性充用Ｕ、 ５，１６・・・−２スター
ペレツ１へ、１１・・・チタネートカップリング液、
１２・・・押出機、 １３・・・ダイス、 １４・・・
被覆形成、 ′１５〕・・・カッティング。'I Fil rfD O) Ii'A j,'l'
X Explanation Figure 1 is a sectional view of the electrocardial filling material used in the present invention, Figure 2 is a sectional view of the master bellet 1, and Figure 3 is!
The sketches of Star Beret 1~, Figure 4 are used in the present invention!
3゜1.10...Conductivity 1 No. is filled (Δ, 2...Titanate coupling layer, 3...Synthetic resin layer, 4.
・Bundled conductive charging U, 5, 16...-2 to star pellets 1, 11... Titanate coupling liquid,
12... Extruder, 13... Dice, 14...
Covering formation, '15]...Cutting.
Claims (1)
状導電性充填祠を束ねた表面に合成樹脂層を形成−仏化
し、ペレット状に切断してなるマスターペレットと、ペ
レット状の合成樹脂からなるナヂニｌラルペレッ１〜と
を主成分どづることを特徴とづる導電性成形月利。 ２ ブータネ−１〜力ツプリング層は、イソプロピルト
リドデシルヘンセンスルホニルヂタネート、イソゾ［Ｊ
ビルトリス（ジオクヂルパイロ小スフニー１〜）チタネ
ー１〜、ビス（ジオクチルバイロホスフ１−１〜）オキ
シアセテ−１〜ヂタネー１〜、ビス（ジオクチルパイロ
ｉ］ｓスフェ−１〜）土ヂレンチタネートおよびイソプ
ロピル１へり（ジオクチルボスノ工−ト）チタネートの
いずれかによって形成されたものであることを特徴とす
る特許請求の範囲第１項記載の導電性成形月利。 ３ 長繊維状の導電性充填材は、金属繊維若しくは無（
幾繊維又は表面に金属層を右づる無１幾繊維であること
を特徴とする特許請求の範囲第１項又は第２項記載の導
電付成形月別、。 ４ マスターベレットは、ヂタネー１へカップリング液
中を通過さけて表面にチタネー１〜カップリング層を右
せしめた長繊維状尊重性充填材を束ねた表面に合成樹脂
層を形成一体化し、ベレッ１へ状に切断する、一連の連
続した」−稈で製造ザることを特徴とする特許請求の範
囲第１項ないし第３項いずれが記載の導電性成形月利。 ５ マスターペレットの合成樹脂層とブブコノルベレッ
トの合成樹脂とがブレンドボリン−を形成づることを特
徴とする特許請求の範囲第１項ないし第４項いずれが記
載の導電・１１１成形拐料。 ６ マスターペレットの合成樹脂層どプヂー１ラルペレ
ッ１〜の合成樹脂とが同一の合成樹脂であることを特徴
とする特許請求の範１ＩＩｌ第１項イよいし第５項いず
れか記載の導電性成形材料。[Scope of Claims] 1 Formation of a synthetic resin layer on the surface of bundled long fiber helical conductive filling stones on which a coupling layer is attached to the surface of the material 1 - A master pellet formed by forming a material and cutting it into pellets. A conductive molding product characterized in that the main component is Nadiniral Pellet 1 consisting of pellet-shaped synthetic resin. 2 Butane-1~The force springing layer is made of isopropyl tridodecylhensensulfonylditanate, isozo[J
Biltris (dioctyl pyro-sphine 1~) titanate 1~, bis(dioctyl pyrophosph 1-1~) oxyacetate-1~ditane 1~, bis(dioctyl pyro i] sphene 1~) dilentitanate and isopropyl 1~ The conductive molding material according to claim 1, characterized in that it is formed from any one of (dioctylbosinoate) titanate. 3. The conductive filler in the form of long fibers is made of metal fibers or nothing (
3. The electrically conductive molded material according to claim 1 or 2, characterized in that it is made of fibers or fibers without a metal layer on the surface thereof. 4 The master pellet is made by forming a synthetic resin layer on the surface of the bundled long fiber-like filler, which has titanium 1 to the coupling layer on the surface, while avoiding passing through the coupling liquid to the titanium 1. 4. A conductive molding according to any one of claims 1 to 3, characterized in that it is produced in a series of continuous culms which are cut into strips. 5. The conductive/111 molded material according to any one of claims 1 to 4, characterized in that the synthetic resin layer of the master pellet and the synthetic resin of Bubuconorberet form a blended resin. 6. The conductive molding according to any one of claims 1 to 5, wherein the synthetic resin layer of the master pellet is the same synthetic resin as the synthetic resin of the master pellets 1 to 1. material.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58124734A JPS6018314A (en) | 1983-07-11 | 1983-07-11 | Conductive molding material |
| EP83109901A EP0131067B2 (en) | 1983-07-11 | 1983-10-04 | Conductive synthetic resin molding material |
| DE8383109901T DE3375248D1 (en) | 1983-07-11 | 1983-10-04 | Conductive synthetic resin molding material |
| US06/540,563 US4530779A (en) | 1983-07-11 | 1983-10-11 | Conductive synthetic resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58124734A JPS6018314A (en) | 1983-07-11 | 1983-07-11 | Conductive molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6018314A true JPS6018314A (en) | 1985-01-30 |
Family
ID=14892784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58124734A Pending JPS6018314A (en) | 1983-07-11 | 1983-07-11 | Conductive molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6018314A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS568218A (en) * | 1979-06-29 | 1981-01-28 | Unitika Ltd | Preparation of master pellet for preparing glass-fiber- reinforced thermoplastic polyester resin and molding material |
| JPS5790020A (en) * | 1980-11-26 | 1982-06-04 | Toyota Central Res & Dev Lab Inc | Production of fiber-reinforced resin material for molding |
-
1983
- 1983-07-11 JP JP58124734A patent/JPS6018314A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS568218A (en) * | 1979-06-29 | 1981-01-28 | Unitika Ltd | Preparation of master pellet for preparing glass-fiber- reinforced thermoplastic polyester resin and molding material |
| JPS5790020A (en) * | 1980-11-26 | 1982-06-04 | Toyota Central Res & Dev Lab Inc | Production of fiber-reinforced resin material for molding |
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