JPS60178653A - Stack structure of semiconductor rectifying device - Google Patents

Stack structure of semiconductor rectifying device

Info

Publication number
JPS60178653A
JPS60178653A JP3427384A JP3427384A JPS60178653A JP S60178653 A JPS60178653 A JP S60178653A JP 3427384 A JP3427384 A JP 3427384A JP 3427384 A JP3427384 A JP 3427384A JP S60178653 A JPS60178653 A JP S60178653A
Authority
JP
Japan
Prior art keywords
wind
cooling
semiconductor element
semiconductor
cooling body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3427384A
Other languages
Japanese (ja)
Inventor
Masanori Nakao
正紀 中尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Engineering Co Ltd
Hitachi Ltd
Original Assignee
Hitachi Engineering Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Engineering Co Ltd, Hitachi Ltd filed Critical Hitachi Engineering Co Ltd
Priority to JP3427384A priority Critical patent/JPS60178653A/en
Publication of JPS60178653A publication Critical patent/JPS60178653A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To enhance the cooling efficiency, and to contrive the prevention of decrease in insulation by reducing deposit of dust by a method wherein the semiconductor element section is provided with a wind shield spacer. CONSTITUTION:In the titled device with cooling bodies superposed on a flat semiconductor element and then pressed, in the case of forced wind-cooling, the presence of the wind shield spacer 1 at the wind inlet and outlet enables the wind to flow through the side of the cooling body 2, and to become difficult of flowing to the semiconductor element 3. Accordingly, the wind not so effective in cooling which has been flowing conventionally through the element 3 comes to cool the most effective part of the cooling body 2 in the neighborhood of the element 3, resulting in the enhancement of cooling efficiency. Besides, the deposit of dust to the element 3 is reduced and the decrease in insulation can be prevented by lessening wind to the element 3.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は平型半導体素子に冷却体を重ねて加圧した半導
体整流装置に係り、特に、強制風冷に好適なスタック構
造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a semiconductor rectifier in which a cooling body is stacked on a flat semiconductor element and pressurized, and particularly relates to a stack structure suitable for forced air cooling.

〔発明の背景〕[Background of the invention]

従沫の半導体整流装置では風は目的とする冷却体以外の
半導体素子にも流れ、風の有効利用がなされていなかっ
た。In the conventional semiconductor rectifier, the wind flowed to semiconductor elements other than the intended cooling body, and the wind was not utilized effectively.

また、風が半導体素子に流れるため、塵埃が付着し、絶
縁低下を起こす欠点があった。In addition, since wind flows through the semiconductor elements, dust adheres to them, resulting in a reduction in insulation.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、風の流れを有効に利用し、半導体素子
のＳ８緑低下を防ぐスタン４１４４造を毘共するにある
、 〔発明の概要〕 本発明の要点は、半導体素子部に対しτ風の遮へいスペ
ーサを設番づ、風が冷却体側へ流れるようにして冷却効
率を上げ４Ｌ導体素子部への風の流れを減らし、塵埃の
付着を少なくし絶縁低下を防止するにある。An object of the present invention is to provide a stand 4144 structure that effectively utilizes wind flow and prevents S8 green deterioration of semiconductor elements. A wind shielding spacer is installed to allow wind to flow toward the cooling body to increase cooling efficiency, reduce the flow of wind to the 4L conductor element, reduce dust adhesion, and prevent insulation deterioration.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の一実施例を第】図、第２図により説明す
る。Hereinafter, one embodiment of the present invention will be explained with reference to FIGS.

平型半導体素子に冷却体を重ねて加圧した半導体整流装
置において、強制風冷の場合、第１図に示すように、風
速へいスペーサ】が風の入口及び出口にあると、風は冷
却体２側を通って流れ、半導体素子３には流匙にくくな
り、従来、半導体索子３を通って流れていた冷却にあま
り有効でない風が、冷却体２の半導体素子３に近くで最
も有効である部分を冷却することになり、冷却効率を上
げることかできる。In the case of forced air cooling in a semiconductor rectifier in which a cooling body is stacked on a flat semiconductor element and pressurized, if wind velocity spacers are placed at the inlet and outlet of the wind, as shown in Figure 1, the wind will flow through the cooling body. The wind that is not very effective for cooling, which conventionally flows through the semiconductor cable 3, is most effective near the semiconductor device 3 of the cooling body 2. By cooling a certain area, you can increase the cooling efficiency.

また、半導体素子３への風を減らすことにより、半導体
素子３・）、の塵埃の付着を少なくし、絶縁低下を防止
することができる。なお、４は絶縁碍ｒ−５５は加圧機
構部である、。Furthermore, by reducing the wind blowing onto the semiconductor element 3, it is possible to reduce the adhesion of dust to the semiconductor element 3, and to prevent a decrease in insulation. Note that 4 is an insulator R-55 is a pressurizing mechanism section.

〔発明の効果〕〔Effect of the invention〕

本発明によれば半導体素子の絶縁低下を防ぐことができ
る。According to the present invention, deterioration in insulation of a semiconductor element can be prevented.

図面の１ｍ　ｒ）ｔな説明 第１図は本発明の一実旅Ｑ−でよｊるスタシクｉｌ造の
平面図であり、第２回はその正面図であ乙。Explanation of the drawings: Figure 1 is a plan view of the construction of the building according to the present invention, and Figure 2 is a front view thereof.

１・・風ｉｚ／＼いスペーサ、２・・・冷却体、３・・
半入二体素子、４・・・絶編間子、５・・・加圧Ｑ構部
。1...Wind iz/spacer, 2...Cooling body, 3...
Half-contained two-body element, 4... absolute spacer, 5... pressurized Q structure.

代理人　弁理上２　高橋明夫 不１図 系２図Agent Patent attorney 2 Akio Takahashi No 1 drawing System 2 diagram

Claims (1)

【特許請求の範囲】 １、平型半導体素子に冷却体を重ねて加圧してなる半導
体整流装置において、 前記平型半導体素子部に対して風が前記冷却体側へ流れ
るように風の遮へいスペーサを設けたことを特徴とする
半導体整流装置のスタック構造。[Claims] 1. In a semiconductor rectifying device formed by stacking and pressurizing a cooling body on a flat semiconductor element, a wind shielding spacer is provided so that air flows toward the cooling body with respect to the flat semiconductor element part. A stack structure of a semiconductor rectifying device characterized by providing a stack structure of a semiconductor rectifier.
JP3427384A 1984-02-27 1984-02-27 Stack structure of semiconductor rectifying device Pending JPS60178653A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3427384A JPS60178653A (en) 1984-02-27 1984-02-27 Stack structure of semiconductor rectifying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3427384A JPS60178653A (en) 1984-02-27 1984-02-27 Stack structure of semiconductor rectifying device

Publications (1)

Publication Number Publication Date
JPS60178653A true JPS60178653A (en) 1985-09-12

Family

ID=12409550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3427384A Pending JPS60178653A (en) 1984-02-27 1984-02-27 Stack structure of semiconductor rectifying device

Country Status (1)

Country Link
JP (1) JPS60178653A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4940450A (en) * 1987-06-17 1990-07-10 Mitsubishi Jidosha Kogyo Kabushiki Kaisha Power transmission system using toothed belt of engine for vehicle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4940450A (en) * 1987-06-17 1990-07-10 Mitsubishi Jidosha Kogyo Kabushiki Kaisha Power transmission system using toothed belt of engine for vehicle

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