JPS60160601A - Electronic part - Google Patents
Electronic partInfo
- Publication number
- JPS60160601A JPS60160601A JP1556284A JP1556284A JPS60160601A JP S60160601 A JPS60160601 A JP S60160601A JP 1556284 A JP1556284 A JP 1556284A JP 1556284 A JP1556284 A JP 1556284A JP S60160601 A JPS60160601 A JP S60160601A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- burr
- resin
- inclined surface
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の属する技術分野〕
本発明は、トランスファモールドにより樹脂封止されて
作られる電子部品の形状に関する−ものである。DETAILED DESCRIPTION OF THE INVENTION [Technical field to which the invention pertains] The present invention relates to the shape of an electronic component manufactured by resin sealing using transfer molding.
従来の電子部品において、トランスファーモールドによ
り樹脂封止し、その形状を例えば六面体に象る場合は、
第１図信）、第２図（イ）に示すように電子部品１を金
型内にセットし、ポット２からライン３を通して樹脂注
入口４より樹脂を注入し、第１図（ロ）、第２図（ロ）
に示すように電子部品ｌの形状を六面体に象る。その場
合、樹脂注入口４は七頭部１ａ或いは、第２図信）に示
すように金型にセットされた電子部品１の側部１ｂに対
向してもうけられるのが一般的であった。When conventional electronic parts are resin-sealed using transfer molding and the shape is shaped into a hexahedron, for example,
As shown in Figure 1 (B), electronic component 1 is set in a mold as shown in Figure 2 (A), and resin is injected from pot 2 through line 3 through resin injection port 4, as shown in Figure 1 (B). Figure 2 (b)
As shown in the figure, the shape of the electronic component 1 is modeled on a hexahedron. In that case, the resin injection port 4 was generally provided facing the side part 1b of the electronic component 1 set in the mold, as shown in the head part 1a or the second figure).
ところでモールド金型から樹脂封止された電子部品ｌを
取シ出し、第１図（ロ）、第２図ｃ口）に示すように個
々の完成された電子部品ｌとするには、樹脂注入口２の
部分で硬化して電子部品１の表面に付着したバリ５を分
離させね°ばならない。バリ５を電子部品１から完全分
離させ電子部品の頭部及び側部を平坦にする作業が行な
われるが、分離のやシ方によりバリ５′が電子部品上に
突起物として残ることが多々ある。また、この残った注
入口を完全に取シ除く為機械的に例えば切断型等で切り
落し、平屋にすることが行なわれるが、切断特電子部品
に直接ストレスが加わる為、電子部品にクラックが生じ
、品質トラブルの原因となる。By the way, in order to take out the resin-sealed electronic component l from the mold and make it into individual completed electronic components l as shown in Fig. 1 (b) and Fig. 2 c), resin injection is performed. The burr 5 that has hardened at the entrance 2 and adhered to the surface of the electronic component 1 must be separated. Work is carried out to completely separate the burr 5 from the electronic component 1 and flatten the head and sides of the electronic component, but depending on how the separation is done, the burr 5' often remains as a protrusion on the electronic component. . In addition, in order to completely remove the remaining injection port, it is mechanically cut off using a cutting die, etc., to make it flat, but since stress is applied directly to the cut electronic parts, cracks may occur in the electronic parts. , causing quality problems.
電子部品を使う生産工程にて、電子部品は機械により直
接正確につかまれプリント板に挿入されたり、組立機械
への供給を行なわれるが、電子部品ｌの頭部や側面等に
突起したバリ５があれば、そのバリ５のため、電子部品
ｌを、正確につかみ、これを整列させることが難しく、
正しく位置決めすることができないという欠点を有して
いた。In the production process that uses electronic components, electronic components are directly and accurately grabbed by machines and inserted into printed boards or supplied to assembly machines, but burrs 5 protruding on the heads and sides of electronic components may occur. If there is, the burr 5 makes it difficult to grasp the electronic component l accurately and align it.
This has the disadvantage that correct positioning cannot be performed.
本発明の目的は上記欠点を除去し、プリント板への挿入
や組立機械への供給を容易かつ正確に行なうことができ
るようにした電子部品を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned drawbacks and to provide an electronic component that can be easily and accurately inserted into a printed circuit board or fed to an assembly machine.
本発明は樹脂封止によシ角形に成形された電子部品にお
いて、部品本体の互いに直交する２面間の隅部に傾斜面
を付し、該傾斜面を樹脂封止時に生ずるバリの形成面と
したことを特徴とする電子部品である。The present invention provides an electronic component molded into a rectangular shape by resin sealing, in which an inclined surface is attached to the corner between two mutually perpendicular surfaces of the component body, and the inclined surface is used as a surface where burrs are formed during resin sealing. This is an electronic component characterized by the following.
以下に、本発明の実施例を図面を用いて説明する。 Embodiments of the present invention will be described below with reference to the drawings.
バリ５が頭部１ａおよび側面１ｂよシ外部へ出ないよう
にするための傾斜面６を有している。この傾斜面６は電
子部品１の互いに直交する２面間の隅部に形成されてい
る。第３図（ロ）では電子部品１の頭部ｌａをなす平面
と側部１ｂをなす平面との交錯する部分に形成されてい
る。It has an inclined surface 6 to prevent the burr 5 from coming out from the head 1a and side surface 1b. This inclined surface 6 is formed at a corner between two mutually orthogonal surfaces of the electronic component 1. In FIG. 3(b), it is formed at the intersection of the plane forming the head la of the electronic component 1 and the plane forming the side portion 1b.
したがって、第３園内に示すように樹脂注入口４を電子
部品ｌの傾斜面（バリ形成面）６に対向する位置に配し
、該注入口４から樹脂を射出させて電−子部品３を封止
するとともにその形状を象る。Therefore, as shown in the third garden, the resin injection port 4 is arranged at a position facing the inclined surface (burr forming surface) 6 of the electronic component 1, and the resin is injected from the injection port 4 to form the electronic component 3. Seal it and model its shape.
注入後、モールド金型から取シ出し、電子部品１とバリ
５とを手作業や機械により分離させる。本発明において
は、電子部品１の傾斜面６にバリ５が形成されることに
なるが、この傾斜面６は内側に後退しであるため、電子
部品の頭部１ａの延長上平面や側面１ｂの延長上平面よ
りバリ５が外に飛びだすことはない。この為ロボットや
機械（例えばプリント板への部品自動挿入機）によシミ
子部品頭部やｍ＋面を基準としてつかんでも、突起物が
なく平面の為正確に正しく位置決めすることができる。After injection, the mold is removed, and the electronic component 1 and the burr 5 are separated manually or mechanically. In the present invention, the burr 5 is formed on the sloped surface 6 of the electronic component 1, but since this sloped surface 6 is recessed inward, the burr 5 is formed on the extended plane of the head 1a of the electronic component or on the side surface 1b. As an extension of , the burr 5 does not protrude beyond the plane. Therefore, even if a robot or machine (for example, an automatic parts insertion machine for a printed board) grasps the shim head part or the m+ surface as a reference, it can be accurately and correctly positioned because there are no protrusions and the part is flat.
以上説明したように本発明は部品本体の隅部に傾斜面を
付し該傾斜面をバリの形成面としたので、バリが電子部
品の表面より突出することを回避でき、したがって電子
部品の表面上に突起物がなくなシ、自動挿入機等にその
まま装填でき、また従来のようにバリを完全に剃シ落す
ための機械加工が不要になシ、電子部品にストレスを加
えることがなく、品質を高品位に維持できる効果を有す
るものである。As explained above, the present invention provides an inclined surface at the corner of the component body and uses the inclined surface as a burr formation surface, so that it is possible to prevent the burr from protruding from the surface of the electronic component. There are no protrusions on the top, so it can be loaded directly into automatic insertion machines, etc., and there is no need for machining to completely remove burrs, which is required in the past, and there is no stress on electronic components. This has the effect of maintaining high quality.
第１図（イ）、第２図（イ）は樹脂封止状態を示す構成
図、第１図（ロ）、第２図（ロ）は従来の一般的な樹脂
封止後の電子部品を示す図、第３図（イ）は本発明にお
ける樹脂封止状態を示す構成図、第３図（ロ）は本発明
に係る樹脂封止後の電子部品を示す図である。
ｌ・・電子部品、６・・傾斜面。
第１図
第２図
（イ）
（ロ）
第３図
（イ）
（ロ）Figures 1 (a) and 2 (a) are configuration diagrams showing the state of resin sealing, and Figures 1 (b) and 2 (b) show electronic components after conventional general resin sealing. FIG. 3(a) is a configuration diagram showing a resin-sealed state in the present invention, and FIG. 3(b) is a diagram showing an electronic component after resin-sealing according to the present invention. l...Electronic parts, 6...Slanted surface. Figure 1 Figure 2 (A) (B) Figure 3 (A) (B)
Claims (1)
て、部品本体の互いに直交する２面間の隅部に傾斜面を
付し、該傾斜面を樹脂封止時に生、するバリの形成面と
したことを特徴とする電子部品。(1) In an electronic component molded into a rectangular shape by resin sealing, an inclined surface is attached to the corner between two mutually perpendicular surfaces of the component body, and the inclined surface is used to prevent burrs generated during resin sealing. An electronic component characterized by having a formed surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1556284A JPS60160601A (en) | 1984-01-31 | 1984-01-31 | Electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1556284A JPS60160601A (en) | 1984-01-31 | 1984-01-31 | Electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60160601A true JPS60160601A (en) | 1985-08-22 |
Family
ID=11892187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1556284A Pending JPS60160601A (en) | 1984-01-31 | 1984-01-31 | Electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60160601A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015207679A (en) * | 2014-04-22 | 2015-11-19 | ニチコン株式会社 | Resin mold type capacitor and method of manufacturing the same, and molding form |
-
1984
- 1984-01-31 JP JP1556284A patent/JPS60160601A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015207679A (en) * | 2014-04-22 | 2015-11-19 | ニチコン株式会社 | Resin mold type capacitor and method of manufacturing the same, and molding form |
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