JPS60154143A - Inspecting method of glossy surface body - Google Patents
Inspecting method of glossy surface bodyInfo
- Publication number
- JPS60154143A JPS60154143A JP995784A JP995784A JPS60154143A JP S60154143 A JPS60154143 A JP S60154143A JP 995784 A JP995784 A JP 995784A JP 995784 A JP995784 A JP 995784A JP S60154143 A JPS60154143 A JP S60154143A
- Authority
- JP
- Japan
- Prior art keywords
- area
- signal
- glossy surface
- memory
- binary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、′はんだ“付部位等の光沢面を有する物体の
形状および表面状態が所定の状態でおるが否かを自動的
に検査する方法に関するものである。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention provides a method for automatically inspecting whether the shape and surface condition of an object having a glossy surface, such as a ``solder'' area, are in a predetermined state. It is related to.
印刷基板等に対するはんだ付の良否を自動的に検査する
ため、従来は、′はんだ′付部位に対して一方向からの
み光線を照射し、テレビジョンカメラによシ対象部位を
撮像のうえ、これによって得られた映像信号を２値化し
、この２値化値号に基づいて１はんだ“付部位の形状お
よび表面状態を判断することが行なわれている。Conventionally, in order to automatically inspect the quality of soldering on printed circuit boards, etc., a beam of light is irradiated onto the ``soldered'' area from only one direction, and a television camera is used to image the target area. The video signal obtained by the method is binarized, and the shape and surface condition of the solder area are determined based on the binarized value.
しかし、従来の手段では、′はんだ“付部位のみならず
１周辺の導体パターンおよびシルク印刷された記号等も
高反射率であり、これらと１はんだ′付部位との判別が
不可能となる一方、２値化信号を得るためのスレシホー
ルドレベルを高い値に設定すると、′はんだ′付部位の
高反射部のみが抽出され、′はんだ′付部位の形状判断
が不正確となる欠点を生じている。However, with conventional means, not only the ``solder'' area but also the conductor pattern and silk-printed symbols around 1 have high reflectance, making it impossible to distinguish between these and the 1-solder area. If the threshold level for obtaining a binary signal is set to a high value, only the highly reflective parts of the 'soldered' area will be extracted, resulting in an inaccurate shape judgment of the 'soldered' area. ing.
また、スリット光またはスポット状ビーム光忙よる走査
照射を用い、対象物体の形状を３次元的に認識する手段
も開発されているが、この場合は、装置が大規模かつ高
価となる欠点を生ずる。In addition, a method has been developed that uses scanning irradiation using slit light or spot beam light to three-dimensionally recognize the shape of the target object, but in this case, the disadvantage is that the device is large-scale and expensive. .
本発明は、従来のかかる欠点を根本的に解決する目的を
有し、光沢面物体へ周囲から光線を照射して撮像を行な
い、これ釦よって得られた映像信号から、光沢面物体の
高反射成分のみを抽出し。The purpose of the present invention is to fundamentally solve such drawbacks of the conventional art. Extract only the ingredients.
抽出した信号に基づいて光沢面物体の面積をめ。Find the area of the shiny object based on the extracted signal.
この面積とあらかじめ定めた面積とを比較し、これの結
果に応じて光沢面物体の形状および表面状態が所定の状
態か否かを判断するものとした極めて効果的な、光沢面
物体の検査方法を提供するものである。This area is compared with a predetermined area, and based on the results, it is determined whether the shape and surface condition of the shiny surface object are in a predetermined state or not. An extremely effective method for inspecting a shiny surface object. It provides:
し実施例〕
以下、実施例を示す図によって本発明の詳細な説明する
。EXAMPLES] Hereinafter, the present invention will be described in detail with reference to figures showing examples.
第１図は、光線の照射状況を示す図でｓｂ、導体からな
るランド１上に形成された１はんだ′付部位２に対し１
周囲の各方向斜上方から複数の光源３ａ〜３１＋によシ
同時に光線を照射しておシ、光源３ａ〜３ｂとして白熱
電球等の高輝度を有する点光源に近いものを用いれば、
１はんだ′付部位２の表面が光沢面となっているため、
光源３１〜３ｈと対応した高反射部が生じ、′はんだ“
付部位２を目視方向からテレビジョンカメラ等によシ撮
像し１％はんだ“付部位２の光源３ａ〜３ｈによる照射
に甚づく反射光中高反射成分のみを抽出するスレシホー
ルドレベルによル、撮像によって得られノヒ映像信号を
２値化すれば、不要な反射光成分が除去され、この信号
に応じて第２図に示す映像が得られる。Fig. 1 is a diagram showing the irradiation situation of light beams, and shows sb, 1 solder spot 2 formed on land 1 made of conductor, 1 solder spot 2;
If a plurality of light sources 3a to 31+ simultaneously emit light from obliquely upward in each direction around the area, and if the light sources 3a to 3b are similar to point light sources with high brightness such as incandescent light bulbs,
1. Since the surface of the soldering part 2 is a glossy surface,
A highly reflective area corresponding to the light sources 31 to 3h is generated, and the ``solder''
The applied area 2 is imaged by a television camera or the like from the visual direction, and the threshold level is set to extract only the medium and high reflection components of the reflected light caused by the irradiation of the 1% solder applied area 2 with the light sources 3a to 3h. If the Nohi video signal obtained by imaging is binarized, unnecessary reflected light components are removed, and the video shown in FIG. 2 is obtained according to this signal.
すなわち、光源３ａ〜３ｈと対応してこれらと同数の輝
点４ａ〜４ｈが高反射成分によシ得られ、各輝点４ａ〜
４ｈの合計面積Ｓは、′はんだ“付部位２の突出曲率を
含む形状および表面状態の平滑度に応じて定まシ、これ
らの標準状態にしたがって後述の基準面積８０がめられ
る。That is, the same number of bright spots 4a to 4h corresponding to the light sources 3a to 3h are obtained by the high reflection component, and each bright spot 4a to 4h is
The total area S of 4h is determined according to the shape including the protruding curvature of the ``soldering'' portion 2 and the smoothness of the surface condition, and a reference area 80, which will be described later, is determined according to these standard conditions.
第３図乃至第５図は、他の実施例を示す光線の照射およ
び撮像状況の図であシ、第３図においては、′はんだ′
付部位２の直上を回転中心とするアーム５によ多光源３
を吊下し、′はんだ′付部位２の周囲を回転させておυ
、光源３０回転と同期して目視方向から撮像を反復して
行ない、各撮像によって得た映像信号を前述と同様に処
理のうえ合成すれば、第２図の映像が得られる。3 to 5 are diagrams of light irradiation and imaging situations showing other embodiments. In FIG. 3, 'solder'
A multi-light source 3 is mounted on an arm 5 whose rotation center is directly above the attachment part 2.
Hang it and rotate it around the 'soldering' part 2.
If images are repeatedly taken from the viewing direction in synchronization with the rotation of the light source 30, and the image signals obtained from each image are processed and combined in the same manner as described above, the image shown in FIG. 2 is obtained.
第４図は、印刷基板６上に散在する複数の１はんだ“付
部位２ａ〜２ｃ等を対象とする場合で、１、印刷基板６
の周囲上方から複数の光源３ａ〜３ｈによシ同時に光線
を照射するものとし、テレビジョンカメラを印刷基板６
と対向させたうえ、信号処理上撮像視野を限定し、′は
んだ“付部位２ａ〜２ｃ等の対象とするものに応じて移
動させ、または。FIG. 4 shows a case in which a plurality of single solder areas 2a to 2c scattered on the printed circuit board 6 are targeted.
A plurality of light sources 3a to 3h simultaneously irradiate light beams from above around the printed circuit board 6, and a television camera is connected to the printed circuit board 6.
In addition, the imaging field of view is limited for signal processing, and is moved depending on the object such as the ``soldering'' parts 2a to 2c.
テレビジョンカメラを固定し、信号処理上撮像視野を移
動させるものとしている。The television camera is fixed, and the imaging field of view is moved for signal processing.
また、第５図においては、リング７およびアーム８によ
シ、光源３ａ〜３ｈおよびテレビジョンカメラ９を一体
化し、図上省略した支持機構によシ支持のうえ移動自在
とし、目的の対象部位へ全体を同時に移動させるものと
なっている。In addition, in FIG. 5, the ring 7 and the arm 8, the light sources 3a to 3h, and the television camera 9 are integrated, and are supported by a support mechanism (not shown in the figure) so that they can be moved freely to target the target area. The entire system is moved simultaneously.
第６図は、電気的構成を示すブロック図であシ、基板６
０対象部位をテレビジョンカメラ９によシ撮像し、これ
によって得られた映像信号を２値化回路１１へ与え、こ
こにおいて、′はんだ′付部位２からの高反射成分のみ
を抽出するスレシホールドレベルにより２値化がなされ
、この２値化信号が信号処理部１２へ与えられる。FIG. 6 is a block diagram showing the electrical configuration of the board 6.
0 The target part is imaged by the television camera 9, the video signal obtained by this is given to the binarization circuit 11, and here a threshold is set to extract only the high reflection component from the 'soldered' part 2. Binarization is performed according to the hold level, and this binary signal is provided to the signal processing section 12.
信号処理部１２は、プロセッサおよび各種のメモリ等に
よりｅ成され、メモリ中のプログラムをプロセッサが実
行し、信号処理動作を行なっておシ、′はんだ′付部位
２の形状および表面状態を判断し、これの結果に応じて
ブラウン管表示装置１３を制御のうえ、ｌ’−０ＫＪま
たは「ＮＧ Ｊ等の文字表示を行なうものとなっている
。The signal processing unit 12 is composed of a processor and various types of memory, etc., and the processor executes a program in the memory, performs signal processing operations, and determines the shape and surface condition of the 'soldered' part 2. , the cathode ray tube display device 13 is controlled according to the result, and characters such as l'-0KJ or "NG J" are displayed.
第７図は、プロセッサによる信号処理動作のフローチャ
ートであシ、２値化回路１１からの″′２値化信号をメ
モリへ格納＃１０１を行なってから。FIG. 7 is a flowchart of the signal processing operation by the processor, after the binary signal from the binarization circuit 11 is stored in the memory #101.
１光源数Ｎ、と輝点数Ｎ、との比較＃１０２を行ない、
これの結果が１ＮＩ″：：Ｎｔ’？ ’ １０３のＹＥ
Ｓであれば、１輝点の合計面積Ｓを演算“１０４を行な
ったうえ、″Ｓと基準面積Ｓｏとを比較′１０５を行な
い、これの結果がはソ一致し’ｓ＝ｓ。？“のＹＥＳと
なれば、良好と判断し、ブラウン管表示装置１３によシ
、’ＯＫ表示１１０７を行なう。Compare #102 between the number of light sources N and the number N of bright spots,
The result of this is 1NI''::Nt'?' 103 YE
If S, the total area S of one bright spot is calculated by ``104'', and ``S'' is compared with the reference area So by ``105'', and the result is ``S=s''. ? If the result is YES, it is determined that the condition is good, and an 'OK display 1107 is displayed on the cathode ray tube display device 13.
以上に対し、ステップ１０３または１０６がＮＯであれ
ば、不良と判断し、ブラウン管表示装置１３によシゝＮ
Ｇ表示１１０８を行なう。Regarding the above, if step 103 or 106 is NO, it is determined to be defective and the CRT display device 13 is turned off.
G display 1108 is performed.
たソし、光源３の照射方向は１条件に応じて位置数およ
び照射角度を定めればよく、テレビジョンカメラ９を用
いるほか、他の撮像装置を用いても同様でｌ）、表示を
表示灯または音響等によシ行なうことも任意であると共
に、′はんだ′付部位２のみならず、光沢面を有する各
種の物体を対象とすることができる。However, the irradiation direction of the light source 3 only needs to be determined by the number of positions and the irradiation angle according to one condition, and in addition to using the television camera 9, other imaging devices can be used as well. It is optional to use lights, sounds, etc., and it is possible to target not only the 'soldering' part 2 but also various objects having glossy surfaces.
また、第７図においては、ステップ１０２ 、１０３と
１０４〜１０６とを入替えてもよく、場合によっては、
ステップ１０２，１０３を省略しても同等の結果が得ら
れる等、本発明は種々の変形力上自在である。Furthermore, in FIG. 7, steps 102 and 103 and steps 104 to 106 may be interchanged, and in some cases,
The present invention is flexible in terms of various deformation forces, such as the same result being obtained even if steps 102 and 103 are omitted.
以上の説明によシ明らかなとおシ１本発明によれば、対
象とする光沢面物体以外からの反射光による影響が排除
されると共に、基準面積との比較によシ、対象とする光
沢面物体の形状および表面状態が正確に判断され、各種
光沢面物体の自動検査上、顕著な効果が得られる。As is clear from the above explanation, 1.According to the present invention, the influence of reflected light from other than the target glossy surface object is eliminated, and the target glossy surface The shape and surface condition of an object can be accurately determined, and a remarkable effect can be obtained in automatic inspection of various objects with glossy surfaces.
図は本発明の実施例を示し、第１図は光線の照射状況を
示す図、第２図は２値化信−号によって得られる映像を
示す図、第３図乃至第５図は他の実施例を示す光線の照
射状況および撮像状況の図。
第６図は電気的構成を示すブロック図、第７図は信号処
理動作のフローチャートである。
２．２ａ〜２Ｃ・・・−はんだ“付部位（光沢面物体）
、３ 、３ｍ−０−３ｈ・・・・光源、 ９・・・・・
テレビジョンカメラ、１１・・・・２値化回路。
１２・・・・信号処理部。
特許出願人 日 立電子株式会社
代 理 人 山 川 政 樹（ｔｌか２名）ル
１：
第１図
第４図
第６図The figures show an embodiment of the present invention, in which Fig. 1 shows the irradiation situation of the light beam, Fig. 2 shows the image obtained by the binarized signal, and Figs. 3 to 5 show other examples. FIG. 4 is a diagram of a light irradiation situation and an imaging situation showing an example. FIG. 6 is a block diagram showing the electrical configuration, and FIG. 7 is a flowchart of the signal processing operation. 2.2a to 2C...-Solder area (glossy surface object)
, 3, 3m-0-3h... light source, 9...
Television camera, 11...binarization circuit. 12...Signal processing section. Patent applicant Hitachi Electronics Co., Ltd. Agent Masaki Yamakawa (TL or 2 people) 1: Figure 1 Figure 4 Figure 6
Claims (1)
、該撮像によって得られた映像信号から前記物体の前記
照射による反射光の高反射成分を抽出し、該抽出によっ
て得られた信号に基づき前記物体の面積をめたうえあら
かじめ定めた基準面積と比較し、該比較結果のはｙ−散
によシ前記物体の形状および表面状態が良好であること
を判断することを特徴とした光沢面物体の検査方法。A glossy surface object is irradiated with a light beam from the surroundings to image the object, a high reflection component of the light reflected by the irradiation of the object is extracted from the video signal obtained by the imaging, and the signal obtained by the extraction is The area of the object is determined based on the area and compared with a predetermined reference area, and the comparison result is determined based on Y-dispersion to determine that the shape and surface condition of the object are good. Inspection method for surface objects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP995784A JPS60154143A (en) | 1984-01-25 | 1984-01-25 | Inspecting method of glossy surface body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP995784A JPS60154143A (en) | 1984-01-25 | 1984-01-25 | Inspecting method of glossy surface body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60154143A true JPS60154143A (en) | 1985-08-13 |
Family
ID=11734423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP995784A Pending JPS60154143A (en) | 1984-01-25 | 1984-01-25 | Inspecting method of glossy surface body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60154143A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4854757A (en) * | 1986-10-13 | 1989-08-08 | Kabushiki Kaisha Toshiba | Automatic sheet feeder movable between active and inactive positions |
| US6608921B1 (en) | 1998-08-21 | 2003-08-19 | Nec Electronics Corporation | Inspection of solder bump lighted with rays of light intersecting at predetermined angle |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5048856A (en) * | 1973-09-01 | 1975-05-01 | ||
| JPS5892903A (en) * | 1981-11-30 | 1983-06-02 | Hitachi Ltd | Cubiform detecting method and detector therefor |
| JPS58115314A (en) * | 1981-12-28 | 1983-07-09 | Matsushita Electric Works Ltd | Measuring device of flatness |
| JPS58127337A (en) * | 1982-01-25 | 1983-07-29 | Hitachi Ltd | Inspection method for junction part and apparatus for the same |
-
1984
- 1984-01-25 JP JP995784A patent/JPS60154143A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5048856A (en) * | 1973-09-01 | 1975-05-01 | ||
| JPS5892903A (en) * | 1981-11-30 | 1983-06-02 | Hitachi Ltd | Cubiform detecting method and detector therefor |
| JPS58115314A (en) * | 1981-12-28 | 1983-07-09 | Matsushita Electric Works Ltd | Measuring device of flatness |
| JPS58127337A (en) * | 1982-01-25 | 1983-07-29 | Hitachi Ltd | Inspection method for junction part and apparatus for the same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4854757A (en) * | 1986-10-13 | 1989-08-08 | Kabushiki Kaisha Toshiba | Automatic sheet feeder movable between active and inactive positions |
| US6608921B1 (en) | 1998-08-21 | 2003-08-19 | Nec Electronics Corporation | Inspection of solder bump lighted with rays of light intersecting at predetermined angle |
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