JPS60149702A - Manufacture of sintered material for vacuum switch contact part - Google Patents
Manufacture of sintered material for vacuum switch contact partInfo
- Publication number
- JPS60149702A JPS60149702A JP59260106A JP26010684A JPS60149702A JP S60149702 A JPS60149702 A JP S60149702A JP 59260106 A JP59260106 A JP 59260106A JP 26010684 A JP26010684 A JP 26010684A JP S60149702 A JPS60149702 A JP S60149702A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- matrix
- impregnation
- sintering
- impregnating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/0203—Contacts characterised by the material thereof specially adapted for vacuum switches
- H01H1/0206—Contacts characterised by the material thereof specially adapted for vacuum switches containing as major components Cu and Cr
Landscapes
- Powder Metallurgy (AREA)
- Manufacture Of Switches (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、焼結材料を最初に、マトリックスを形成する
高い融点の金属粉末から混合、プレス成形および焼結並
びに続いての低融点含浸材料でのマトリックスの含浸処
理によって製造する、真空スイッチ接点の為の焼結材料
の製造方法に関する。か＼るスイッチ接点は高い遮断容
量の中程度の電圧系統における真空スイッチに特に適し
ている。DETAILED DESCRIPTION OF THE INVENTION The present invention provides for preparing a sintered material by first mixing, pressing and sintering a high melting point metal powder forming a matrix and subsequent impregnation treatment of the matrix with a low melting point impregnating material. The present invention relates to a method for manufacturing a sintered material for vacuum switch contacts. Such a switch contact is particularly suitable for vacuum switches in medium voltage systems with high breaking capacity.
真空スイッチまたは真空火花間隙の為の接点を製造する
方法は公知であり、この場合骨格物体を高い融点の金属
粉末からプレス成形および焼結によって製造し、その後
に骨格物体の表面に低融点の含浸材料より成る板を載せ
そしてこの物体を真空下に、最初に溶融する材料の溶融
温度よシ下の温度のもとて金属表面から痕跡量の酸素が
除かれるまでの間加熱する。その後に温度を低い溶融温
度の金属の溶融温度に加熱し、その際に小孔が含浸材料
で充填される。この場合、骨格物体はクロムより成シ、
含浸材料は銅、銀またハ、＜０．３％のジルコン、タン
タルまたはチタンを含有する銅合金より成る（ドイツ特
許出願公開第４５２１．５０４号）。この方法の欠点は
、マトリックスの焼結および含浸処理を上記の工程段階
として実施しそして、両方の主成分が互の内に溶解され
ることによって導電率が低下するので、か＼る接点中の
銅または調合ｉの十分な導電率が充分に利用できないこ
とである。別の欠点は、上記の材料を用いる際に接点が
溶着する傾向を排除できないことである。Methods for producing contacts for vacuum switches or vacuum spark gaps are known, in which a skeleton body is produced from a high-melting metal powder by pressing and sintering, and the surface of the skeleton body is then impregnated with a low melting point. A plate of material is mounted and the object is heated under vacuum to a temperature below the melting temperature of the first melting material until traces of oxygen are removed from the metal surface. The temperature is then raised to the melting temperature of the low melting temperature metal, and the pores are filled with the impregnating material. In this case, the skeletal object is made of chromium,
The impregnating material consists of copper, silver or copper alloys containing <0.3% of zircon, tantalum or titanium (German Patent Application No. 4521.504). The disadvantage of this method is that the sintering and impregnation treatment of the matrix is carried out as the above process steps and that the conductivity in such contacts is reduced as both main components are dissolved into each other. The sufficient conductivity of copper or formulation i is not fully available. Another drawback is that when using the above-mentioned materials, the tendency for the contacts to weld cannot be ruled out.
特許請求の範囲に規定しである如き本発明は、高い融点
のマトリックス材料が低い融点の含浸材料中に溶解する
ことを阻止したスイッチ接点部材の製造方法を提供する
という課題を解決した。本発明によって得られる長所は
、従来の方法およびこうして得られる接点特有の欠点を
克服したことであシ、特に方法全体を唯一のサイクルで
実施するのに利用できることである。The invention as defined in the claims has solved the problem of providing a method of manufacturing a switch contact member in which dissolution of the high melting point matrix material into the low melting point impregnating material is prevented. The advantages offered by the invention are that it overcomes the disadvantages inherent in conventional methods and the contacts thus obtained, and in particular that it can be used to carry out the entire method in a single cycle.
以下に本発明の実施例を記す。５０重量％の工業用の純
粋クロム粉末（クロム含有量９８％、粒度０．１〜０．
１６關）、４７．５重量％の還元銅混合物を製造し、２
５０ ＭＰａの圧力でプレス成形して理論密度の７５％
の密度である成形体を得る。同様に空隙容積に相応する
量の１０％の過剰量の銅粉末を２５０ ＭＰａの圧力で
プレス成形して同じ基礎面積の成形体を得、そして粉末
混合物から製造された成形体の上に置く。互に揃えて置
かれた成形体を真空炉に装入しそして１０’−２Ｐａの
圧力に減圧した後に、低融点の共融混合物Ｏｕ／Ｂによ
って生じる液相の形成および同時的脱気下に１０５０℃
で２時間焼結する。焼結の間に冶金反応が硼化クロムを
形成する。その後に温度を１１５０℃に高めそして１時
間この温度に維持する。その際に被覆物が溶融しそして
更に進行する脱気と共に焼結体中に浸入する。次に真空
炉を９００℃に冷却しそしてこの温度に２時間維持する
。この熱処理の間に硼素が細分散状態で分布する金属組
織構造成分の形の共融合金Ｃ！ｕ／Ｂから析出する。形
成される硼化クロムによって著しく制限された溶解クロ
ム成分が含浸合金から同様に細分散状態で分離されるの
で、良好な導電性の銅が導電の為の接点において無制限
に自由に使用される。確かめられた空隙容積に少なくと
も等量である、用いる含浸材料残量を、被覆物としてプ
レス加工物上に緊密な板の形で置くことができる。焼結
工程は、含浸材料の溶融温度以下である温度のもとで実
施するが、少なくとも添加量′ト含浸材料とが共融混合
物を形成する温度で行なう。この場合＜１０２Ｐａの圧
力の減圧の作用下に同時に焼結体の脱気も行われる。更
に液相の形成によつて焼結促進効果が達成される。添加
材料によって低下する含浸材料の表面張力が、含浸材料
が既に細かい小孔中に吸込まれそしてそれによって次の
含浸処理にプラスの影響を及ぼすことを実現させる。更
に、添加材料が高い融点のマトリックス材料と冶金反応
に入シ、その際にマトリックス材料を粘着性の表面層が
取シ巻き、それによってマ） ＩＪラックス料と後に続
く含浸工程で後から注ぎたす含浸材料との間の溶解が阻
止される。焼結後に温度を少なくとも含浸材料の溶融温
度に高めそしてこの温度に所定の時間維持し、それによ
って１％の残留小孔含有量にまで小孔の充填を焼結体の
同時的な脱気下に行なう。次に温度を下げた後に熱処理
の結果、添加材料がそして有るかも知れない僅かな割合
の溶解マトリックス材料が共融合金から温度□の低下と
共に増大する溶解性の為に含浸材料中に細かく分散分布
した状態で分離する。この分離はマ） ＩＪラックス料
と含浸材料との相界面の脆弱化を生せしめ、それによっ
て溶着傾向が阻止される。Examples of the present invention are described below. 50% by weight industrial pure chromium powder (chromium content 98%, particle size 0.1-0.
16), produced a 47.5% by weight reduced copper mixture, and
Press molded at a pressure of 50 MPa to achieve 75% of the theoretical density.
A molded body having a density of . Similarly, a 10% excess of copper powder corresponding to the void volume is pressed at a pressure of 250 MPa to obtain a shaped body of the same basic area and placed on the shaped body produced from the powder mixture. After charging the molded bodies placed in alignment with each other in a vacuum furnace and reducing the pressure to a pressure of 10'-2 Pa, the formation of a liquid phase caused by the low melting point eutectic mixture Ou/B and simultaneous degassing. 1050℃
Sinter for 2 hours. During sintering, metallurgical reactions form chromium boride. The temperature is then increased to 1150° C. and maintained at this temperature for 1 hour. The coating then melts and, with further degassing, penetrates into the sintered body. The vacuum oven is then cooled to 900° C. and maintained at this temperature for 2 hours. During this heat treatment, eutectic alloy C in the form of a metallographic structural component in which boron is distributed in a finely dispersed state! Precipitates from u/B. Since the dissolved chromium component, which is significantly limited by the chromium boride formed, is likewise separated in a finely divided manner from the impregnated alloy, copper, which has good electrical conductivity, is free to be used without restriction in the contacts for electrical conduction. The remaining amount of the impregnating material used, which is at least equal to the determined void volume, can be placed in the form of a tight plate on the pressing workpiece as a covering. The sintering step is carried out at a temperature that is below the melting temperature of the impregnating material, but at a temperature at which at least the added amount of the impregnating material forms a eutectic mixture. In this case, the sintered body is simultaneously degassed under the effect of a vacuum at a pressure of <102 Pa. Furthermore, a sintering promotion effect is achieved by the formation of a liquid phase. The surface tension of the impregnating material, which is reduced by the added material, makes it possible for the impregnating material to be sucked into the already fine pores and thereby positively influencing the subsequent impregnation process. In addition, the additive material enters into a metallurgical reaction with the high melting point matrix material, during which the matrix material is surrounded by a sticky surface layer, thereby making it possible to remove the IJ lux material and subsequent pouring in the subsequent impregnation step. Dissolution between the impregnated material and the impregnated material is prevented. After sintering, the temperature is raised to at least the melting temperature of the impregnated material and maintained at this temperature for a predetermined time, thereby filling the pores to a residual pore content of 1% with simultaneous degassing of the sintered body. go to Then, as a result of the heat treatment after lowering the temperature, the additive material and possibly a small proportion of the dissolved matrix material are released from the eutectic alloy into a finely dispersed distribution in the impregnated material due to its solubility, which increases with decreasing temperature. Separate in this state. This separation causes weakening of the phase interface between the IJ lux material and the impregnating material, thereby inhibiting the tendency to weld.
代理人江崎光好
代理人江崎光史
第１頁の続き
０発 明 者 ハンスーペーテル・バ ドイツ民主共−
デル セ、１６ベー
０発明者 ベルント・デーヤ ドイツ民主共。Agent Mitsuyoshi Ezaki Agent Mitsufumi Ezaki Continued from page 1 0 Inventor Hans-Peter Ba German Democratic Party -
Der Se, 16be0 Inventor Bernd Deja German Democratic Party.
セ、材Ce, wood
Claims (1)
融点の金属粉末から混合、プレス成形および焼結並びに
続いての低融点含浸材料でのマトリックスの含浸処理に
よって製造する、真空スイッチ接点部材の為の焼結材料
の製造方法において、次の方法段階 （ａ） プレス成形すべき粉末が 一高融点のマトリックス材料の粉末全体量−含浸材料の
１部、正確には含浸材料の５０〜７０重量％； 一焼結温度のもとで含浸材料と共融混合物を形成しそし
てマトリックス材料と反応する−その際に、マトリック
ス材料を 取シ囲みそして熱処理の際に含浸材料か成される一添加
材料、−シかも接点全体の１〜５重量％； より成る粉末混合物であり、 （ｂ） 含浸材料の残量を予めプレス成形した物体上に
コーテイング物として適用し、 （ｃ）焼結を、含浸材料の溶融温度以下だが少なくとも
含浸材料と添加材料との間で生ずる共融の温度にある温
度のもとで実施しそしてこの温度を少なくとも１時間維
持し、（ｄ） 含浸処理を含浸材料の溶融温度以上の温
度のもとで実施し、その際この温度を少なくとも３０分
維持し、 熱処理を行なう ことを特徴とする、上記真空スイッチ接点部材の為の焼
結材料の製造方法。 （２）添加材料として硼素を特徴とする特許請求の範囲
・第１項記載の方法。 ルで実施する特許請求の範囲第１項記載の方法。 （４） ０．１〜０．１６１１ｍの粒度の金属粉末を用
いる特許請求の範囲第１項記載の方法。 （５）含浸材料より成るコーテイング物を成形の際に載
せたま＼プレス成形する特許請求の範囲第１項記載の方
法。[Claims] (1) A sintered material is first produced from a high melting point metal powder forming a matrix by mixing, pressing and sintering and subsequent impregnation treatment of the matrix with a low melting point impregnating material. , in the method for producing a sintered material for a vacuum switch contact part, the following method step (a) is carried out: the powder to be pressed contains the total amount of powder of the matrix material with a high melting point - a part of the impregnated material, more precisely impregnated 50-70% by weight of the material; forms a eutectic mixture with the impregnating material under the sintering temperature and reacts with the matrix material - surrounding the matrix material and removing the impregnating material during heat treatment. (b) Applying the remaining amount of the impregnating material as a coating onto the pre-press-formed object; (c) ) carrying out the sintering at a temperature below the melting temperature of the impregnating material but at least at the temperature of the eutectic occurring between the impregnating material and the additive material and maintaining this temperature for at least one hour; (d) impregnating; Production of a sintered material for a vacuum switch contact member as described above, characterized in that the treatment is carried out at a temperature above the melting temperature of the impregnated material, and this temperature is maintained for at least 30 minutes to carry out the heat treatment. Method. (2) The method according to claim 1, characterized in that boron is used as the additive material. 2. The method of claim 1, which is carried out in a computer. (4) The method according to claim 1, in which metal powder with a particle size of 0.1 to 0.1611 m is used. (5) The method according to claim 1, in which the coated material made of the impregnated material is press-molded while being placed thereon during molding.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DD01H/257796-4 | 1983-12-12 | ||
| DD83257796A DD219619A1 (en) | 1983-12-12 | 1983-12-12 | PROCESS FOR PRODUCING SINTERED MATERIALS FOR VACUUM SWITCH CONTACT PANEL |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60149702A true JPS60149702A (en) | 1985-08-07 |
Family
ID=5552815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59260106A Pending JPS60149702A (en) | 1983-12-12 | 1984-12-11 | Manufacture of sintered material for vacuum switch contact part |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0144846B1 (en) |
| JP (1) | JPS60149702A (en) |
| AT (1) | ATE34873T1 (en) |
| DD (1) | DD219619A1 (en) |
| DE (1) | DE3471806D1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01165706A (en) * | 1987-12-22 | 1989-06-29 | Kawasaki Steel Corp | Sintered compact having double phase structure and manufacture thereof |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4699763A (en) * | 1986-06-25 | 1987-10-13 | Westinghouse Electric Corp. | Circuit breaker contact containing silver and graphite fibers |
| DE19537657A1 (en) * | 1995-10-10 | 1997-04-17 | Abb Patent Gmbh | Method and device for producing a contact piece |
| DE19933111A1 (en) * | 1999-07-15 | 2001-01-18 | Abb Patent Gmbh | Vacuum chamber for low power switching, has sintered structure applied to inner surface of cylinder lid to form fixed contact |
| DE19960876A1 (en) * | 1999-12-17 | 2001-06-21 | Abb Patent Gmbh | Method for producing a contact piece blank and a contact piece, as well as a contact piece blank, a contact piece and a contact piece arrangement for axial magnetic field applications in a vacuum chamber |
| DE10010723B4 (en) * | 2000-03-04 | 2005-04-07 | Metalor Technologies International Sa | Method for producing a contact material semifinished product for contact pieces for vacuum switching devices and contact material semi-finished products and contact pieces for vacuum switching devices |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2310317A1 (en) * | 1973-03-01 | 1974-09-05 | Siemens Ag | Copper alloy contact for vacuum reed relay - contg. boron, zirconium, lanthanium, cerium or chromium for higher strength |
| GB1459475A (en) * | 1974-05-23 | 1976-12-22 | English Electric Co Ltd | Manufacture of contact ekements for vacuum interrupters |
| US3960554A (en) * | 1974-06-03 | 1976-06-01 | Westinghouse Electric Corporation | Powdered metallurgical process for forming vacuum interrupter contacts |
| US4190753A (en) * | 1978-04-13 | 1980-02-26 | Westinghouse Electric Corp. | High-density high-conductivity electrical contact material for vacuum interrupters and method of manufacture |
-
1983
- 1983-12-12 DD DD83257796A patent/DD219619A1/en not_active IP Right Cessation
-
1984
- 1984-11-16 AT AT84113919T patent/ATE34873T1/en not_active IP Right Cessation
- 1984-11-16 EP EP84113919A patent/EP0144846B1/en not_active Expired
- 1984-11-16 DE DE8484113919T patent/DE3471806D1/en not_active Expired
- 1984-12-11 JP JP59260106A patent/JPS60149702A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01165706A (en) * | 1987-12-22 | 1989-06-29 | Kawasaki Steel Corp | Sintered compact having double phase structure and manufacture thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0144846B1 (en) | 1988-06-01 |
| EP0144846A3 (en) | 1986-01-02 |
| EP0144846A2 (en) | 1985-06-19 |
| DD219619A1 (en) | 1985-03-06 |
| ATE34873T1 (en) | 1988-06-15 |
| DE3471806D1 (en) | 1988-07-07 |
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