JPS6013772U - Printed circuit board for mounting chipped components - Google Patents
Printed circuit board for mounting chipped componentsInfo
- Publication number
- JPS6013772U JPS6013772U JP10480683U JP10480683U JPS6013772U JP S6013772 U JPS6013772 U JP S6013772U JP 10480683 U JP10480683 U JP 10480683U JP 10480683 U JP10480683 U JP 10480683U JP S6013772 U JPS6013772 U JP S6013772U
- Authority
- JP
- Japan
- Prior art keywords
- chipped
- circuit board
- printed circuit
- components
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図Ａはチップ化部品の正面図、第１図Ｂはその側面
図である。第２図は第１図Ａ及び第１図Ｂに示すチップ
化部品をプリント基板上に搭載する場合の従来の導電パ
ターン配置図である。第３図はチップ化部品をプリント
基板上にはんだ付けした時に傾むいてはんだ付けされた
状態を示す説明図である。第４図は本考案の導電パター
ンの配置図である。第５図は表面張力の強さを説明する
ための説明図である。
１・・・・・・リード端子、２・・・・・・リード端子
、３・・・・・・リード端子、４・・・・・・導電パタ
ーン、５・・・・・・導電パターン、６・・・・・・導
電パターン、７・・・・・・導電パターン。FIG. 1A is a front view of the chipped component, and FIG. 1B is a side view thereof. FIG. 2 is a conventional conductive pattern layout diagram when the chip-formed components shown in FIGS. 1A and 1B are mounted on a printed circuit board. FIG. 3 is an explanatory diagram showing a state in which the chip-shaped component is soldered on a printed circuit board in an inclined manner. FIG. 4 is a layout diagram of the conductive pattern of the present invention. FIG. 5 is an explanatory diagram for explaining the strength of surface tension. 1... Lead terminal, 2... Lead terminal, 3... Lead terminal, 4... Conductive pattern, 5... Conductive pattern, 6... Conductive pattern, 7... Conductive pattern.
Claims (1)
市しているチップ化部品をはんだ付けして搭載するプリ
ント基板において、リード端子の１本側をはんだ付けす
る導電パターンは横幅をリード端子の２本側をはんだ付
けする導電パターンの横幅と同一長にし、縦方向長をそ
れの２倍の長さにしたことを特徴とするチップ化部品搭
載用プリント基板。In a printed circuit board on which chipped components are soldered and mounted, with two lead terminals of the same size on one side and one on the other side, the conductive pattern to which one lead terminal is soldered has a horizontal width. A printed circuit board for mounting chipped components, characterized in that the two sides of the lead terminals are the same length as the width of the conductive pattern to be soldered, and the length in the vertical direction is twice the length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10480683U JPS6013772U (en) | 1983-07-05 | 1983-07-05 | Printed circuit board for mounting chipped components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10480683U JPS6013772U (en) | 1983-07-05 | 1983-07-05 | Printed circuit board for mounting chipped components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6013772U true JPS6013772U (en) | 1985-01-30 |
Family
ID=30245932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10480683U Pending JPS6013772U (en) | 1983-07-05 | 1983-07-05 | Printed circuit board for mounting chipped components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6013772U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017092506A (en) * | 2017-02-28 | 2017-05-25 | 日亜化学工業株式会社 | Package for light emitting device, light emitting device including the same, and lighting system including light emitting device |
-
1983
- 1983-07-05 JP JP10480683U patent/JPS6013772U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017092506A (en) * | 2017-02-28 | 2017-05-25 | 日亜化学工業株式会社 | Package for light emitting device, light emitting device including the same, and lighting system including light emitting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6013772U (en) | Printed circuit board for mounting chipped components | |
| JPS58195484U (en) | Printed circuit board mounting structure | |
| JPS59121175U (en) | terminal mounting device | |
| JPS59123364U (en) | circuit device | |
| JPS596865U (en) | Electrical component | |
| JPS6022863U (en) | Modular structure | |
| JPS58150862U (en) | Chip parts mounting device | |
| JPS599568U (en) | Electronic component mounting structure | |
| JPS60119777U (en) | Assembly structure of parts | |
| JPS609233U (en) | chipped semiconductor device | |
| JPS59161673U (en) | thick film integrated circuit | |
| JPS59191763U (en) | Mounting structure of printed circuit board | |
| JPS5841980U (en) | Terminal connection structure | |
| JPS58193662U (en) | multilayer printed wiring board | |
| JPS5996870U (en) | printed wiring board | |
| JPS6071185U (en) | Insulating sheet structure | |
| JPS6035517U (en) | inductance element | |
| JPS6022764U (en) | Connector for printed circuit board mounting | |
| JPS5974760U (en) | Double-sided printed wiring body | |
| JPS6066068U (en) | Chip parts mounting device | |
| JPS58118676U (en) | Sub printed circuit board | |
| JPS583057U (en) | printed circuit board circuit unit | |
| JPS5952658U (en) | Chip parts mounted printed circuit board | |
| JPS58138370U (en) | LSI package spacer | |
| JPS5849462U (en) | Printed board |