JPS60134239A - Mask substrate - Google Patents
Mask substrateInfo
- Publication number
- JPS60134239A JPS60134239A JP58243409A JP24340983A JPS60134239A JP S60134239 A JPS60134239 A JP S60134239A JP 58243409 A JP58243409 A JP 58243409A JP 24340983 A JP24340983 A JP 24340983A JP S60134239 A JPS60134239 A JP S60134239A
- Authority
- JP
- Japan
- Prior art keywords
- film
- transparent
- reticle
- mask
- electrically conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
【発明の詳細な説明】
(a)発明の技術分野
本発明は半導体装置の製造に於けるリック゛ラフイ丁程
に用いられるレティクル、マスクマスク。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a reticle and mask used for rickrography in the manufacture of semiconductor devices.
或いはワーキングマスク等のマスク基板に被着するペリ
クル膜の改良に関す。Or it relates to the improvement of a pellicle film attached to a mask substrate such as a working mask.
(b)(支i季丁の背景
半導体装置、特に大規模集積回路の生産に於し)′乙マ
スクによるパターン露光工程は製品歩留りを左右する重
要な役割を有する。(b) (Background of Support) In the production of semiconductor devices, especially large-scale integrated circuits, the pattern exposure process using a mask plays an important role in determining the product yield.
係るパターン露光工程の露光用マスクX4よレティクル
マスク基板は、すり傷があったり、塵埃カζ付着してい
たりすると、これが半導体ウェーハに焼付られて欠陥と
なる。本発明は、露光用マスクまたはレティクルを保護
するためのペリクル膜の改善を意図する。If the exposure mask X4 or reticle mask substrate in the pattern exposure process has scratches or has dust attached thereto, this will be burned onto the semiconductor wafer and become a defect. The present invention contemplates improvements to pellicle membranes for protecting exposure masks or reticles.
(C)従来技術と問題点
露光装置または縮小投影装置に装填するレティクル等の
マスクに対し一ζ、パターン面保護をなすペリクル膜の
構成を説明する。(C) Prior Art and Problems The structure of a pellicle film that protects a pattern surface of a mask such as a reticle loaded into an exposure device or a reduction projection device will be explained.
図はレティクルに装着のペリクル験の斜視図である。The figure is a perspective view of a pellicle mounted on a reticle.
図中、lはレティクル(パターン形成のガラス基板)、
2と3はレティクルの両面に被着された金属製の長方形
枠体、4は周囲が前記枠体2に張着された例えば厚さ数
ミクロン(μm)程度の透明膜1通称ペリクル股と呼ば
れる本発明の対象とする膜体である。勿論、レティクル
の裏面側枠体3にも前記透明膜が張着される。該枠体張
着の透明膜とレティクル基板面とは数龍の間隔がある。In the figure, l is a reticle (glass substrate for pattern formation),
2 and 3 are metal rectangular frames attached to both sides of the reticle, and 4 is a transparent film 1 with a thickness of, for example, several microns (μm), which is attached to the frame 2 around the periphery. This is a membrane object of the present invention. Of course, the transparent film is also attached to the back side frame 3 of the reticle. There is a distance of several lengths between the transparent film attached to the frame and the surface of the reticle substrate.
透明膜が張着された防塵用透明膜を張った枠体とレティ
クルを、露光装置に装填してパターン露光をなすが、露
光時たとえ透明膜に塵埃が落ちても前記膜4により保護
され下方に位置するウェーハにば、塵埃像が出ない様に
なっている(ウェーハは図示されない)。A frame and a reticle covered with a transparent film for dustproofing are loaded into an exposure device and pattern exposure is performed.During exposure, even if dust falls on the transparent film, it is protected by the film 4 and the reticle is placed in the exposure device. The dust image does not appear on the wafer located at (the wafer is not shown).
しかしながら、従来、ペリクル膜は前記厚さの極薄いポ
リプロピレン、或いはニトロセルローズなどのフィルム
を用いるが、帯電しやすく吸着の塵埃は除去し難く、或
いはまた図示状態に透明膜長りイ」け時に付着していた
内面側にある塵埃・異物は、直接レティクル面に落丁し
これが露光パターン欠陥となることが問題である。However, conventionally, the pellicle film uses a film made of ultra-thin polypropylene or nitrocellulose, which has the above-mentioned thickness, but it is easily charged and it is difficult to remove the adsorbed dust, or the transparent film adheres to the film as shown in the figure when it is long. The problem is that dust and foreign matter on the inner surface of the reticle drop directly onto the reticle surface, causing defects in the exposure pattern.
(d)発明の目的
本発明は、前記の例えばポリプロピレンフィルム等の絶
縁性フィルム特有の帯電現象よる塵埃吸着障害を無くし
て、欠陥のないパターン露光を行うことである。(d) Object of the Invention The object of the present invention is to eliminate the above-mentioned problem of dust adsorption caused by the charging phenomenon peculiar to insulating films such as polypropylene films, and to perform defect-free pattern exposure.
(e)発明の構成
前記目的は、基板と、その表面に設けたマスクパターン
と、8亥マスクパターンを被覆する透明のペリクル膜と
を有し、該ペリクルH’Aが導電性の映とすることによ
り達成される。(e) Structure of the Invention The object is to have a substrate, a mask pattern provided on the surface thereof, and a transparent pellicle film covering the mask pattern, and the pellicle H'A is a conductive film. This is achieved by
(()発明の実施例 以下2本発明の一実施例を詳細に説明する。(() Examples of the invention Two embodiments of the present invention will be described in detail below.
前記帯電障害の解決にあたり、枠体2 (又は3)にそ
の周囲が張着される光透過膜あるいは透明膜4を導電性
プラスチックスで形成する(図参照)。To solve the above-mentioned charging problem, a light-transmitting film or a transparent film 4, which is attached around the frame 2 (or 3), is formed of conductive plastic (see the figure).
つまり、當温、常室下に於いて、4電性ポリマを添加し
たないしはフィルムの表面固有抵抗を低くした光透過プ
ラスチックフィルムを使用してペリクル膜を形成し°ζ
帯電防止をする。In other words, a pellicle film is formed using a light-transmissive plastic film to which a tetraelectric polymer has been added or whose surface resistivity has been lowered at room temperature and under normal room conditions.
Prevent static electricity.
更に、導電性フィルムを形成する他の実施例として従来
の前記極薄いポリプロピレンフィルムに対し、光透過性
を低下させない厚さで、フィルム表面に光透過性のよい
酸化錫5n02またはIn2O3等の透明導電膜を蒸着
手段により映厚さlOO人程度に被着した導体化処理フ
ィルムを用いて前記アルミニウム組成の枠体2に直接張
り付ける。この場合、透明導電膜はフィルム全面に蒸着
しても良いが、前記塵埃による投影像が出ない昂光装置
の投光レンズの光学的設定条件を考慮して、 M着’4
HQ(導体)中50μm以−卜とする適宜ピッチの格子
構成のマトリックスを蒸着形成するも構わない。Furthermore, as another example of forming a conductive film, a transparent conductive material such as tin oxide 5N02 or In2O3 with good light transmittance is added to the film surface with a thickness that does not reduce the light transmittance to the conventional extremely thin polypropylene film. A conductive film is deposited by vapor deposition means to a film thickness of about 10 mm, and is directly attached to the frame 2 of the aluminum composition. In this case, the transparent conductive film may be deposited on the entire surface of the film, but in consideration of the optical setting conditions of the light projecting lens of the light-enhancing device, in which the projected image due to the dust does not appear,
A matrix having a lattice structure with an appropriate pitch of 50 μm or more may be formed by vapor deposition in the HQ (conductor).
このような導体化処理フィルムによる透明薄膜でペリク
ル膜を形成すれば、レティクル取扱時の摺動摩擦や移動
に際し生起する静電気による作業室(クリーンルーム)
内塵埃を吸着するなどの問題が解決されることになる。If a pellicle film is formed with a transparent thin film made of such a conductive film, it will be possible to eliminate static electricity generated during sliding friction and movement when handling the reticle (clean room).
Problems such as adsorption of internal dust will be solved.
(g)発明の効果
以上、詳細に説明した本発明のペリクル膜によれば、前
記の如く静電気による塵埃の付着を防止することが出来
る。その結果とし゛ζ、塵埃によるパターン欠陥がなく
なる利点がある。(g) Effects of the Invention According to the pellicle film of the present invention described in detail above, it is possible to prevent dust from adhering to the film due to static electricity, as described above. As a result, there is an advantage that pattern defects due to dust are eliminated.
図は、レティクル(マスク)基板に装着する本発明の実
施例に係るペリクル股斜視図である。The figure is a perspective view of a pellicle crotch according to an embodiment of the present invention attached to a reticle (mask) substrate.
Claims (1)
し1該ペリクル映が導電性の映であることを特徴とする
マスク基板。[Claims] A substrate and a mask turn provided on its surface. 1. A mask substrate comprising: a transparent pellicle N odor covering the mask pattern, and wherein the pellicle image is a conductive image.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58243409A JPS60134239A (en) | 1983-12-23 | 1983-12-23 | Mask substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58243409A JPS60134239A (en) | 1983-12-23 | 1983-12-23 | Mask substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60134239A true JPS60134239A (en) | 1985-07-17 |
Family
ID=17103428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58243409A Pending JPS60134239A (en) | 1983-12-23 | 1983-12-23 | Mask substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60134239A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS635344A (en) * | 1986-06-25 | 1988-01-11 | Daicel Chem Ind Ltd | Production of antireflection coated pellicle |
JPH0253087A (en) * | 1988-08-18 | 1990-02-22 | Sharp Corp | Image forming device with optical picture memory |
WO2000036467A1 (en) * | 1998-12-14 | 2000-06-22 | Koninklijke Philips Electronics N.V. | Photomask provided with an esd-precluding envelope |
JPWO2014188579A1 (en) * | 2013-05-24 | 2017-02-23 | ヤマハ発動機株式会社 | Application trial device, dispenser and electronic component mounting device |
-
1983
- 1983-12-23 JP JP58243409A patent/JPS60134239A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS635344A (en) * | 1986-06-25 | 1988-01-11 | Daicel Chem Ind Ltd | Production of antireflection coated pellicle |
JPH0253087A (en) * | 1988-08-18 | 1990-02-22 | Sharp Corp | Image forming device with optical picture memory |
WO2000036467A1 (en) * | 1998-12-14 | 2000-06-22 | Koninklijke Philips Electronics N.V. | Photomask provided with an esd-precluding envelope |
JPWO2014188579A1 (en) * | 2013-05-24 | 2017-02-23 | ヤマハ発動機株式会社 | Application trial device, dispenser and electronic component mounting device |
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