JPS60124088U - printed wiring device - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図乃至第３図は従来のプリント基板半田付構体を説
明するためのもので、第１図は組立前の、　　　斜視図
、第２図は組立・半田付後の側断面図、第３図は第２図
の一部拡大斜視図、第４図乃至第７図は本考案の一実施
例を説明するためのもので、第４図は組立前の斜視図、
第５図は組立後で半田付前の一部拡大斜視図、第６図は
第５図のＡ−Ａ線に沿う断面図、第７図は第５図の半田
付後の部分断面斜視図である。 ８・・・枠形ベース、１０・・・プリント基板、１２゜
１４・・・半田付は予定部分（判田位置）、１３ａ。 １３ｂ・・・切欠き、１５ａｉ１５ｂ・・・突起、１８
・・・半田。Figures 1 to 3 are for explaining a conventional printed circuit board soldering structure. Figure 1 is a perspective view before assembly, Figure 2 is a side sectional view after assembly and soldering, and Figure 3 is a side sectional view after assembly and soldering. The figure is a partially enlarged perspective view of FIG. 2, FIGS. 4 to 7 are for explaining an embodiment of the present invention, and FIG. 4 is a perspective view before assembly;
Figure 5 is a partially enlarged perspective view after assembly and before soldering, Figure 6 is a sectional view taken along line A-A in Figure 5, and Figure 7 is a partially sectional perspective view of Figure 5 after soldering. It is. 8...Frame-shaped base, 10...Printed circuit board, 12° 14...Soldering is planned for portion (handa position), 13a. 13b...notch, 15ai15b...protrusion, 18
···solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 枠形ベース内定位置にプリント基板を収納し、その周辺
を部分的に半田固着するものにおいて、前記プリント基
板はその周辺の半田位置に切欠き、　を形成すると共に
この切欠きに対応して嵌合する突起を前記ベース内面に
設けたことを特徴とするプリント配線装置。A printed circuit board is housed in a predetermined position of a frame-shaped base, and the periphery thereof is partially fixed by soldering, and the printed circuit board is provided with a notch at a soldering position in the periphery thereof, and is fitted in a manner corresponding to the notch. A printed wiring device characterized in that a protrusion is provided on the inner surface of the base.