JPS60124074U - Damper for laminating printed circuit boards - Google Patents
Damper for laminating printed circuit boardsInfo
- Publication number
- JPS60124074U JPS60124074U JP1156684U JP1156684U JPS60124074U JP S60124074 U JPS60124074 U JP S60124074U JP 1156684 U JP1156684 U JP 1156684U JP 1156684 U JP1156684 U JP 1156684U JP S60124074 U JPS60124074 U JP S60124074U
- Authority
- JP
- Japan
- Prior art keywords
- damper
- printed circuit
- circuit boards
- laminating printed
- laminating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はプリント基板の多層化のための積層の機構を示
し、第２図は従来のダンパーの機能を説明するための図
で、第３図は本考案によるダンパーの断面であり、図に
於いて２ＡＢはダンパー、３ＡＢはプリプレーグ、９は
硬体をそれぞれ示す。Fig. 1 shows the lamination mechanism for multi-layering printed circuit boards, Fig. 2 is a diagram for explaining the function of a conventional damper, and Fig. 3 is a cross section of the damper according to the present invention. 2AB is a damper, 3AB is a prepreg, and 9 is a hard body.
Claims (1)
、ダンパーとほぼ同一面積を底面とする樹脂硬体の角錐
状体を貼り合せたことを特徴とするプリント基板の積層
用ダンパー。A damper for laminating printed circuit boards, characterized in that a pyramid-shaped body of a hard resin body having a bottom surface having approximately the same area as the damper is bonded to a damper or a pad of a lamination press that forms multiple layers of printed circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1156684U JPS60124074U (en) | 1984-01-30 | 1984-01-30 | Damper for laminating printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1156684U JPS60124074U (en) | 1984-01-30 | 1984-01-30 | Damper for laminating printed circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60124074U true JPS60124074U (en) | 1985-08-21 |
Family
ID=30493804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1156684U Pending JPS60124074U (en) | 1984-01-30 | 1984-01-30 | Damper for laminating printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60124074U (en) |
-
1984
- 1984-01-30 JP JP1156684U patent/JPS60124074U/en active Pending
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