JPS5815374U - circuit printed circuit board - Google Patents

circuit printed circuit board

Info

Publication number
JPS5815374U
JPS5815374U JP10728681U JP10728681U JPS5815374U JP S5815374 U JPS5815374 U JP S5815374U JP 10728681 U JP10728681 U JP 10728681U JP 10728681 U JP10728681 U JP 10728681U JP S5815374 U JPS5815374 U JP S5815374U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
circuit
board
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10728681U
Other languages
Japanese (ja)
Inventor
辰夫 中野
新一郎 浅井
和男 加藤
Original Assignee
電気化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 電気化学工業株式会社 filed Critical 電気化学工業株式会社
Priority to JP10728681U priority Critical patent/JPS5815374U/en
Publication of JPS5815374U publication Critical patent/JPS5815374U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の実施例の回路プリント、基板の断面図を
示す。 符号、１・・・接着剤、２・・・金属箔、３・・・回路
金属箔、４・・・回路プリント板、５・・・接着剤、６
・・・金属板。The drawing shows a cross-sectional view of a circuit printed circuit board according to an embodiment of the present invention. Code, 1...Adhesive, 2...Metal foil, 3...Circuit metal foil, 4...Circuit printed board, 5...Adhesive, 6
...Metal plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属板上に回路プリント板を設けた基板において、回路
プリント板が接着剤１を介して金属箔２と回路金属箔３
とを接合したものから構成されたことを特徴とする回路
プリント基板。In a board in which a printed circuit board is provided on a metal plate, the printed circuit board is bonded to a metal foil 2 and a circuit metal foil 3 via an adhesive 1.
A printed circuit board characterized in that it is composed of a bonded circuit board.
JP10728681U 1981-07-21 1981-07-21 circuit printed circuit board Pending JPS5815374U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10728681U JPS5815374U (en) 1981-07-21 1981-07-21 circuit printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10728681U JPS5815374U (en) 1981-07-21 1981-07-21 circuit printed circuit board

Publications (1)

Publication Number Publication Date
JPS5815374U true JPS5815374U (en) 1983-01-31

Family

ID=29901733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10728681U Pending JPS5815374U (en) 1981-07-21 1981-07-21 circuit printed circuit board

Country Status (1)

Country Link
JP (1) JPS5815374U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62135464U (en) * 1986-02-19 1987-08-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62135464U (en) * 1986-02-19 1987-08-26

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