JPS60102098A - Ultrasonic wave probe - Google Patents
Ultrasonic wave probeInfo
- Publication number
- JPS60102098A JPS60102098A JP58209464A JP20946483A JPS60102098A JP S60102098 A JPS60102098 A JP S60102098A JP 58209464 A JP58209464 A JP 58209464A JP 20946483 A JP20946483 A JP 20946483A JP S60102098 A JPS60102098 A JP S60102098A
- Authority
- JP
- Japan
- Prior art keywords
- vibrator
- back plate
- ultrasonic
- ultrasonic transducer
- signal extraction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims description 16
- 238000000605 extraction Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 6
- 230000003014 reinforcing effect Effects 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- 239000000463 material Substances 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000005259 measurement Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- JPJZHBHNQJPGSG-UHFFFAOYSA-N titanium;zirconium;tetrahydrate Chemical compound O.O.O.O.[Ti].[Zr] JPJZHBHNQJPGSG-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の属する技術分野〕
本発明は、超音波探触子に係り、とくに医用機器その他
の精密測定用として多用されている超音波探触子に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Technical field to which the invention pertains] The present invention relates to an ultrasonic probe, and particularly to an ultrasonic probe that is frequently used for precision measurement in medical equipment and other devices.
超音波探触子に装填きれる］辰動子には、円板状のもの
や矩形状のものなど種々のものがある。一方、医用およ
び精密測定用の超音波探触子としては、広範囲Ｖこわた
る根測定物を精密測定し７【がらその変化を信号処理し
てＣ凡Ｔもしくは記録紙上に記録するものが多いことか
ら、その測定精度の向上を図るために１例えば分解能が
良いこと或いは出力側全面から略均−レベルの超音波出
力があること等、種々の要件を充足していることが必要
とされている。There are various kinds of radial elements that can be loaded into an ultrasonic probe, such as disc-shaped ones and rectangular ones. On the other hand, as ultrasonic probes for medical use and precision measurements, there are many that precisely measure the root measurement object over a wide range, process the changes in signals, and record them on recording paper. Therefore, in order to improve the measurement accuracy, it is necessary to satisfy various requirements, such as good resolution or approximately average level ultrasonic output from the entire output side. .
第１図はいし第２図に従来より使用されている医用もし
くは精密測定用の探触子の一例を示す。FIGS. 1 to 2 show an example of a conventionally used probe for medical or precision measurement.
この従来例においては、まず分解能向上全意図して高周
仮の振動子が使用され、また超音波出力の向上およびビ
ームの分数防止を図るため整合層３および音響レンズ２
が各々装着されている。更に前記振動子１の背面側には
振動子保持体としての背＆４が固着装備されている。な
お、５はケースを示す。In this conventional example, a high-frequency temporary transducer is first used with the intention of improving resolution, and a matching layer 3 and an acoustic lens 2 are used to improve the ultrasonic output and prevent beam fractionation.
are installed on each. Further, on the rear side of the vibrator 1, a back &4 as a vibrator holder is fixedly attached. Note that 5 indicates a case.
そして、前記振動子１は、第３図ないし第５図に示すよ
うに、ジルコン酸チタン敏鉛などの圧電素子１０に対し
て電極１１．１２が図の如き形状に付され、かつリード
線１３．１４が各図に示す如くハンダ付されたものが一
政に多く使用されている。この場合、＆動子ｌは、第６
図の如くグイシング加工によって細分化された状態の本
のが使用されている。As shown in FIGS. 3 to 5, the vibrator 1 has electrodes 11 and 12 attached to a piezoelectric element 10 made of titanium zirconate or the like in the shape shown in the figure, and a lead wire 13. .14 is often used in Issei with soldering as shown in each figure. In this case, the &move l is the 6th
As shown in the figure, books are used that have been cut into pieces by the guising process.
しかしながら、この振動子１０グイシング加工により細
分化された振動子ＩＡ、ＩＡ、・・・の各々は、例えば
その幅ｌが０．１５（Ｔｎｒ４’）で振動子Ｉ人相瓦間
の間隔Ｓが０．０２１ｍπｍ〕という値であることから
、ハンダ伺作業により隣り合う振動子ＩＡ。However, each of the transducers IA, IA, . Since the value is 0.021 mπm], the transducers IA are adjacent to each other due to the soldering process.
ＩＡのいくつかが短絡したり、リード線１３゜１４装着
用の・・／ダを各振動子１人毎に一様に付着することが
困難である等より、当該作業には多くの熟練を要するば
かりでなく生産性が悲いという不都合があった。Because some of the IA's were short-circuited and it was difficult to uniformly attach the lead wires 13 and 14 to each transducer, the work required a lot of skill. Not only was it necessary, but it was also inconvenient in terms of productivity.
本発明は、かかる従来技術の有する不都合を改善し、生
産性および品質の均一性を図るとともに振動子の全面よ
り略均−強度の超片波を出力し得る精密測定用の超音波
探触子全提供することを、その目的とする。The present invention is an ultrasonic probe for precision measurements that improves the disadvantages of the prior art, improves productivity and uniformity of quality, and is capable of outputting ultrasonic waves of approximately uniform intensity from the entire surface of the transducer. Its purpose is to provide all.
そこで、本発明では、糸勤子全背板に固着したのちグイ
シング加工により該振動子を細分化すると共に、その外
面に整合層およびレンズ体を各々積層してなる超音波探
触子において、前記背板の両側面に補強板を固着し、こ
の補強板には信号引出し用の複数の電極を形成し、この
電極と前記振動子側端の折返兄し電極とをワイヤボンデ
ィング法により導通せしめる等の構成を採用し、これに
よって前記目的を達成しようとするものである。Therefore, in the present invention, in an ultrasonic probe in which the transducer is fixed to the entire back plate of the transducer, the transducer is segmented by a guising process, and a matching layer and a lens body are laminated on the outer surface of the transducer. A reinforcing plate is fixed to both sides of the back plate, a plurality of electrodes for signal extraction are formed on this reinforcing plate, and electrical conduction is established between these electrodes and the folded-over electrode at the end of the vibrator side by wire bonding, etc. The purpose of the present invention is to achieve the above object by employing the following configuration.
以下、本発明の第１実施例を第７直ないし第１１図に基
づいて説明する。Hereinafter, a first embodiment of the present invention will be described based on FIGS. 7 to 11.
これらの図において、ｌは前述した従来例の場合と同様
に超音波振動子を示し、４は振動子保持体としての背板
を示す。前記超音波振動子１としてはジルコンぽチタン
酸鉛等の圧電素子を素材としたものが使用でれ、また背
板４としては前述した従来例と同隊Ｖこプラスチック系
又はゴム系部材が主素材として使用されている。この背
板４は。In these figures, l indicates an ultrasonic transducer as in the case of the conventional example described above, and 4 indicates a back plate as a transducer holder. The ultrasonic transducer 1 may be made of a piezoelectric element such as zirconate lead titanate, and the back plate 4 may be made of the same plastic or rubber material as the conventional example described above. used as a material. This back plate 4.
超音波振動子ｌを装着する面の両角部４Ａ、４Ｂが図に
示す如く面取りされた状態となっているが、必ずしもこ
のように加工されていないものであってもよい。更に、
この背板４の両側面には補強板２０．２１が固着嘔れて
いる。この各補強板２０゜２１は、熱膨張係数が小さい
弾性部材１例えば金属製酸化物等により形成されたもの
が素材として使用されている。１だ、当該各補強板２０
，２１の外面には、前記１沼音波振動子１を送受信用振
動子として使用するための信号引出し成極２０Ａ。Although both corners 4A and 4B of the surface on which the ultrasonic transducer 1 is mounted are chamfered as shown in the figure, they may not necessarily be processed in this way. Furthermore,
Reinforcement plates 20 and 21 are fixed to both sides of the back plate 4. The reinforcing plates 20 and 21 are made of an elastic member 1 having a small coefficient of thermal expansion, such as a metal oxide. 1, each reinforcing plate 20
, 21 is provided with a signal extraction polarization 20A for using the first sonic wave transducer 1 as a transmitting/receiving transducer.
２０人、・・・、２１Ａ、２１Ａ、・・・が複数箇所に
設けられている。20 people, . . . , 21A, 21A, . . . are provided at multiple locations.
そして、前記背板４に一対し、また補強板２０゜２１が
第８図矢印Ａ、Ａの如く当接して固着でれ、次に超音波
振動子１が同図矢印Ｂのμｍ１＜当接でｆｔ加熱接看さ
れるようになっている。このため、背板４の熱変形か補
強板２０．２１の作用ＩＩこより抑制されるため、超音
波振動子１は帖完全に平面状態を維持して、しかも強固
に前記背板４に固着式第９図は、前述した超音波振動子
１の固着後にグイシング加工によって当該超音波振動子
１をｆｆＪｌ分化した状態を示す。この場合、６振動子
ＩＡ。Then, the reinforcing plates 20 and 21 come into contact with the back plate 4 as shown by arrows A and A in FIG. It is designed to be heated at ft. Therefore, thermal deformation of the back plate 4 is suppressed by the action of the reinforcing plate 20.21, so that the ultrasonic transducer 1 maintains a completely flat state and is firmly fixed to the back plate 4. FIG. 9 shows a state in which the ultrasonic transducer 1 is divided into ffJl by guising processing after the ultrasonic transducer 1 is fixed. In this case, 6 oscillator IA.
ＩＡ、・・・の寸法ｌおよび相互間の距離Ｓは従来のも
のと同一に設定されている。また、これら各振動子ＩＡ
、ｌＡ、・・・の谷々の電極面３１．３２および折返え
し電極面３１Ａ、３２八ｉｄ第８図に示す如く予め形成
されており、又当該折返光し電極面３１Ａ、３２Ａが形
成芒れている圧電素子１０は、その端部１０Ａ、ＩＯＢ
か丸味加工きれ、これによって当該折返えし電極面３１
Ａ 、 ３２ Ａの付着強度が著しく強化されている
。式らにこの振Ｌ１の子ＩＡは、その有効振動領域Ｕか
振動子ＩＡの圧電素子１０−１弗分全体Ｔの内側中央ｊ
３１５ ｉＣ’ａ定されていることかも、指向性ビーム
か常に探触子の中心線上にくるように設定ぜれている。The dimension l of IA, . . . and the distance S between them are set to be the same as in the conventional one. In addition, each of these oscillators IA
, lA, . . . are formed in advance as shown in FIG. The piezoelectric element 10 which is notched has its end 10A, IOB
The rounding process is completed, which results in the folded electrode surface 31
The adhesion strength of A and 32 A is significantly enhanced. According to the equation, the child IA of this vibration L1 is located at the effective vibration area U or the inner center j of the entire piezoelectric element 10-1 of the vibrator IA.
The directional beam is also set so that it is always on the center line of the probe.
第１０図ないし第１１図は、Ｐｉ！Ｊ記谷振動子ＩＡの
折返えし電極面３１Ａ、３２Ａと補強板２０゜２１上の
谷イムー号引出し電極２０Ａ、２０八、・・・と金ワイ
ヤボンディング法により結纒し専辿した状態金示す。こ
れにより従来のノーンタ付に関する不都合が大幅Ｖこ改
善てれている。この場合、不実施例では振動子ＩＡが複
数個のグループごとにブロック化されて所定め周波数の
電圧ノ（ルスが印加されるように形成されている。補強
板２１側の谷情号引出し電極２１Ａ、２１Ａ、・・・Ｖ
こついても全く同様になっている。そして、このワイヤ
ボンディングにより形成される各リード線４０．４１は
、図に示す如く全体的に背板４側にわん曲されるように
して装備され、これによってその後のも工程におけるリ
ード線４０．４１の離脱事故か大幅に抑制されている。Figures 10 and 11 show Pi! The folded electrode surfaces 31A, 32A of the J-Kiya vibrator IA and the lead electrodes 20A, 208, . show. As a result, the inconveniences associated with conventional non-tapering have been significantly improved. In this case, in the non-embodiment, the vibrators IA are divided into blocks into multiple groups and are formed so that a voltage pulse of a predetermined frequency is applied. The valley information extraction electrode on the reinforcement plate 21 side 21A, 21A,...V
Even if you get stuck, it's exactly the same. Each of the lead wires 40, 41 formed by this wire bonding is installed so as to be bent as a whole toward the back plate 4 as shown in the figure, so that the lead wires 40, 41 in the subsequent process. 41 breakaway accidents have been significantly reduced.
式らに、これら各リード線４０゜４１部分は、第１１図
に示１−如く全体的にモールド部材５０によって被覆さ
れ、これによって前述したリード線４０．４１の離脱が
完全に防止されるとともに、折返光し電極３１Ａ、３２
八部分の異物による欠４Ｌｔ！ｌｌ故も排除し得るとい
う利点が生じる。はらにｉ＋１記リード緋４０，４１が
図の如く背板４に沿って配設されていることからモール
ド部材５０も少量の付着で充分となり、これがため各振
動子ＩＡに異物が必要以上に付４ｆることがなくなると
いう利点かめる。Equably, each of the lead wires 40 and 41 is entirely covered with a molding member 50 as shown in FIG. , light-reflecting electrodes 31A, 32
4Lt missing due to foreign matter in 8 parts! There is an advantage that this can also be eliminated. Furthermore, since the i+1 leads 40 and 41 are arranged along the back plate 4 as shown in the figure, a small amount of molding member 50 is also sufficient to adhere, and this prevents unnecessary foreign matter from attaching to each vibrator IA. The advantage is that there will be no more 4F.
紀１２図に第２実施例を示す。この実施例は、リード勝
４０．４１％−同一の４１５号引出し電極２ｏＡ，ｔは
２１Ａに導通する複θの振動子ＩＡについては、七のグ
ループ内の複数の振動子ＩＡ全全体図に示す如く剪２電
性接着剤４２にてコンタクト式せグこもので５る。この
編付、リード線４０のワイヤボンディングは、例えは図
の如く２本に省略してもよい。その他の構成は前述した
第１実施例と同一と７２っている。A second embodiment is shown in Fig. 12 of the Era. This example has a lead win of 40.41% - the same No. 415 extraction electrode 2oA, t is conductive to 21A, multiple θ oscillators IA, multiple oscillators IA in groups of seven are shown in the overall diagram. Glue it with a contact-type separator using dielectric adhesive 42. This knitting and wire bonding of the lead wires 40 may be omitted to two wires as shown in the figure, for example. The other configurations are the same as those of the first embodiment described above.
このよ） ＶＣ ｌ，ても前述し７ζ第１実施例と同一
の作用効果を有するほか、ワイヤボンディングの作業１
時１ｔｊｊが更に短紬芒れるという利点か，）る。In addition to having the same function and effect as the 7ζ first embodiment described above, the wire bonding work 1
Is it an advantage that 1tjj can be made even shorter?
以上のように、不発明によると、角形に形成でれた超音
波振動子を７）板に固着したのちダ・ｆシ／グ加工によ
り当該超音波振動子な細分化し、これによって形成てれ
る谷超廿波＆勤子の外面に整合層およびレンズ体を・谷
々積層してなる超音波探触子において、目１Ｊ記官板の
長手方向の両側■に補強板を固／ａｆるとともに、該補
強板には外部回路に導通される複数の信号引出し電極を
設は一前記超音彼振動子に予め形成した折返えし電極と
前記信号引出し電極とを、ワイヤボンディング法により
導通せしめるという構成？採用したので、リード線のハ
ンダ付に伴う従来技術の不都合’ｄ− Ｇｇてｙｎ消１
−ることかでき、これがため、従来のようなノ１ンダそ
の他の異物の付着および振動子相互間のノ・ンダ付に伴
う導通４１故が全くなく ＋”、ｃ リ、各振動子とも
それぞれ全く同一条件のもとにリード線が装着されるた
め６振動子とも振動条件が同じとなり、従って、かかる
点において全体的に陥均−な強度の超音波を出力するこ
とができ、同時に作業時間が大幅に短縮烙れ、さらに品
質が向上し、従って中圧性向上を充分に図り得るという
従来にない優れた効果を生じる。As described above, according to the invention, the ultrasonic transducer formed into a rectangular shape is fixed to a plate, and then the ultrasonic transducer is divided into pieces by the D/F marking process. In an ultrasonic probe in which a matching layer and a lens body are laminated on the outer surface of an ultrasonic probe, reinforcing plates are fixed on both sides of the J register board in the longitudinal direction. The reinforcing plate is provided with a plurality of signal extraction electrodes that are electrically connected to an external circuit, and the folded electrodes formed in advance on the ultrasonic transducer and the signal extraction electrodes are electrically connected by a wire bonding method. composition? This eliminates the disadvantages of conventional technology associated with soldering lead wires.
Therefore, there is no conduction caused by the adhesion of solder or other foreign matter and the contact between the vibrators, which is the case in the past. Since the lead wires are attached under exactly the same conditions, the vibration conditions are the same for all six transducers. Therefore, it is possible to output ultrasonic waves of uniform intensity overall at this point, and at the same time, the working time is reduced. This results in an unprecedented and excellent effect of significantly shortening the heating time, further improving quality, and thereby sufficiently improving medium pressure properties.
丑た、前述したワイヤボンディング（でより形成される
谷リード線を前記背板（１１．１１へわん曲せしめると
共に、このリード線部分全体をモールドにより被覆する
ことにより、当該リード線の離脱事故を更に少なくし、
同時にモールド部材が少量ですみ、全体的に耐久性を著
しく増大せしめることができるという従来にない優れた
超音波探触子を提供することができる。In addition, by bending the valley lead wire formed by the wire bonding described above to the back plate (11. Even less;
At the same time, it is possible to provide an unprecedented and excellent ultrasonic probe that requires only a small amount of molding material and has significantly increased overall durability.
第１図は従来例を示す外観図、第２図は第１図の■−■
線に浴った断面図、第３図ないし第６図は各々従来例を
示す説明図、第７図は本発明の第１実施例を示す分解斜
視図、第８図はダイシング加工前の超音波振動子を示す
斜視図、第９図は超音波揚動子のグイシング加工後の状
況を示す斜視図、第１０図はワイヤボンディング法によ
るリード線の装漸状況を示す斜視図、第１１図１ｊ、第
１０図における振！ｉｉυ子部分を含んだ縦断面図、第
１２図は第２実施例を示す斜視図である。
１、ＩＡ・・・超音波振動子、２・・・レンズ体、３・
・・整合層、４・・・背板、２０．２１・・・補強板、
２０Ａ、２１Ａ・・・信号引出し電極、３１Ａ、３２°
人・・・折返えし′成極、５０・・・モールド部材。
第１図
第 ２ 図
１Ｉ １０
’、、’＞
第６図
第７図
第６図
！
第９図ユFigure 1 is an external view showing a conventional example, and Figure 2 is from ■ to ■ in Figure 1.
3 to 6 are explanatory diagrams showing conventional examples, FIG. 7 is an exploded perspective view showing the first embodiment of the present invention, and FIG. 8 is a cross-sectional view taken before dicing. FIG. 9 is a perspective view showing the state of the ultrasonic lifter after guising processing; FIG. 10 is a perspective view showing the state of lead wire mounting by wire bonding; FIG. 11 is a perspective view showing the sonic vibrator; 1j, swing in figure 10! FIG. 12 is a longitudinal sectional view including the iiυ child portion and a perspective view showing the second embodiment. 1. IA... Ultrasonic transducer, 2... Lens body, 3.
... Matching layer, 4... Back plate, 20.21... Reinforcement plate,
20A, 21A...Signal extraction electrode, 31A, 32°
Person: Folded back, 50: Mold member. Figure 1 Figure 2 Figure 1I 10 ',,'> Figure 6 Figure 7 Figure 6! Figure 9
Claims (2)
たのちグイシング加工により当該超音波振動子全細分化
し、これによって形成される各超音波振動子の外面に整
合層およびレンズ体を各々積層してなる超音波探触子に
おいて、前記背板の長手方向の両側面に補強板を固着す
るとともに、該補強板には外部回路に導通される複数の
信号引出し電極を設け、前記超音波振動子Ｖこ予め形成
し之折返えし電極と前記信号引出し電極とを、ワイヤボ
ンディング法により導通ぜしめたことを特徴とする超音
波探触子。(1) After fixing the rectangular ultrasonic transducer to the back plate, the ultrasonic transducer is completely segmented by a guising process, and a matching layer and lens are placed on the outer surface of each ultrasonic transducer thus formed. In an ultrasonic probe formed by laminating bodies, reinforcing plates are fixed to both sides in the longitudinal direction of the back plate, and the reinforcing plates are provided with a plurality of signal extraction electrodes that are electrically connected to an external circuit, An ultrasonic probe characterized in that the pre-formed folded electrode of the ultrasonic transducer V and the signal extraction electrode are electrically connected by a wire bonding method.
たのちグイシング加工により当該超音波振動子を１テ相
分化し、これによって形成される各超音波振動子の外面
に整合層およびし／ズ体を各々積層してなる超音波探触
子において、前記背板の長手方向の両側面１ｔＣＦｉｌ
ｉ強板な固着するとともに、該補強板にｋｊ二外部回路
に４通さ才する複数の信号引出し電極を設け、ｒ？ｆｌ
記超音波衰動子に予め形成した折返えし電極と前記信号
引出し電極とを、ワイヤボンディング法により導通せし
め、同時にこれら各リード線を前記背板側へわん曲せし
めると共に、このリード線部分全体をモールドによ０被
覆したことを特徴とする超音波探触子。(2) After fixing the rectangular ultrasonic transducer to the back plate, the ultrasonic transducer is divided into one phase by a guising process, and a matching layer is formed on the outer surface of each ultrasonic transducer. In an ultrasonic probe formed by laminating a glass body and a glass body, 1tCFil on both sides in the longitudinal direction of the back plate.
In addition to firmly fixing the reinforcing plate, a plurality of signal extraction electrodes are provided on the reinforcing plate, and four signal extraction electrodes are connected to the two external circuits. fl
The folded electrodes formed in advance on the ultrasonic attenuator and the signal extraction electrodes are electrically connected by a wire bonding method, and at the same time, each lead wire is bent toward the back plate, and the entire lead wire portion is An ultrasonic probe characterized by being coated with a mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58209464A JPS60102098A (en) | 1983-11-08 | 1983-11-08 | Ultrasonic wave probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58209464A JPS60102098A (en) | 1983-11-08 | 1983-11-08 | Ultrasonic wave probe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60102098A true JPS60102098A (en) | 1985-06-06 |
Family
ID=16573298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58209464A Pending JPS60102098A (en) | 1983-11-08 | 1983-11-08 | Ultrasonic wave probe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60102098A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0572294U (en) * | 1992-03-10 | 1993-10-05 | 正義 岸上 | Paper feeding device for toilet paper holder |
| CN107280704A (en) * | 2017-04-10 | 2017-10-24 | 深圳深超换能器有限公司 | Two-dimensional ultrasound corrugated battle array probe and preparation method thereof |
| JP2018126203A (en) * | 2017-02-06 | 2018-08-16 | オリンパス株式会社 | Ultrasonic vibrator, ultrasonic probe, and ultrasonic endoscope |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52131675A (en) * | 1976-04-27 | 1977-11-04 | Tokyo Shibaura Electric Co | Probe for ultrasonic diagnostic device |
| JPS5666992A (en) * | 1979-11-02 | 1981-06-05 | Yokogawa Hokushin Electric Corp | Manufacture of ultrasonic probe and ultrasonic probe concerned |
| JPS5720099A (en) * | 1980-05-21 | 1982-02-02 | Siemens Ag | Ultrasonic wave converter and method of producing same |
-
1983
- 1983-11-08 JP JP58209464A patent/JPS60102098A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52131675A (en) * | 1976-04-27 | 1977-11-04 | Tokyo Shibaura Electric Co | Probe for ultrasonic diagnostic device |
| JPS5666992A (en) * | 1979-11-02 | 1981-06-05 | Yokogawa Hokushin Electric Corp | Manufacture of ultrasonic probe and ultrasonic probe concerned |
| JPS5720099A (en) * | 1980-05-21 | 1982-02-02 | Siemens Ag | Ultrasonic wave converter and method of producing same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0572294U (en) * | 1992-03-10 | 1993-10-05 | 正義 岸上 | Paper feeding device for toilet paper holder |
| JP2018126203A (en) * | 2017-02-06 | 2018-08-16 | オリンパス株式会社 | Ultrasonic vibrator, ultrasonic probe, and ultrasonic endoscope |
| CN107280704A (en) * | 2017-04-10 | 2017-10-24 | 深圳深超换能器有限公司 | Two-dimensional ultrasound corrugated battle array probe and preparation method thereof |
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