JPS59119999A - Ultrasonic wave transducer - Google Patents
Ultrasonic wave transducerInfo
- Publication number
- JPS59119999A JPS59119999A JP22697482A JP22697482A JPS59119999A JP S59119999 A JPS59119999 A JP S59119999A JP 22697482 A JP22697482 A JP 22697482A JP 22697482 A JP22697482 A JP 22697482A JP S59119999 A JPS59119999 A JP S59119999A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric ceramic
- ultrasonic waves
- earth
- conductive adhesive
- matching layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 25
- 239000000853 adhesive Substances 0.000 claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 abstract description 8
- 238000000576 coating method Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 3
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
- G01N29/245—Ceramic probes, e.g. lead zirconate titanate [PZT] probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/04—Wave modes and trajectories
- G01N2291/042—Wave modes
- G01N2291/0423—Surface waves, e.g. Rayleigh waves, Love waves
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は診断のための医療機器の分野に城し、特Ｃ二超
音波プローブにおけるトランスジューサＣ二関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention is in the field of medical equipment for diagnosis, and specifically relates to a transducer C2 in a C2 ultrasound probe.
従来より、超音波プローブＣ二おけるトランスジューサ
としての圧電振動子として圧電セラミックが用いられ、
そ上
の使用する用途に応じて圧電セラミック例えばリング状
。Conventionally, piezoelectric ceramics have been used as piezoelectric vibrators as transducers in ultrasound probes.
Piezoelectric ceramics, for example ring-shaped, depending on the intended use.
ダイス状又はアレイ状Ｃ二切断して分割していた。It was divided into two parts in the form of dice or arrays.
ところで切断して分割されたセラミックに電圧を印加す
るには、分割された各々の素子から夫々にアースを取ら
なければならないが、アレイ状の場合Ｃは素子が短冊形
であるため、そのすべての素子の両端から容易に共通ア
ースとして取り出すことができる。By the way, in order to apply a voltage to a ceramic that has been cut and divided, it is necessary to ground each of the divided elements, but in the case of an array C, since the elements are rectangular, all of the It can be easily taken out as a common ground from both ends of the element.
しかし、リング状或はダイス状の場合Ｃ二は、同心円状
或は格子状の切断が行なわれるため、その切断された周
辺以外の中央部分に位置する素子から直接ｇニアースを
取ることができなかった０）で、従来例えばリング状の
場合（二は第１図≦二示すようＣニパンキング祠１（−
固着したセラミック２の上面Ｃ二各分割された素子２ａ
、２ｂ、２ｃ、２ｄ （二またがって薄い銅箔６をハン
ダ付けして、その周辺よりアースを取り出すことが提案
されていた。However, in the case of ring-shaped or die-shaped C2, since cutting is performed in a concentric circle or lattice pattern, it is not possible to directly obtain the g-nearth from the element located in the center part other than the cut periphery. Conventionally, for example, in the case of a ring-shaped case (2 is shown in Fig. 1≦2), C Nipanking shrine 1 (-
Upper surface C of fixed ceramic 2 Each divided element 2a
, 2b, 2c, 2d (It was proposed to solder a thin copper foil 6 across the two and take out the ground from the surrounding area.
けれども上記の構成Ｃ二よってアースの取り出しを行な
うと、圧電セラミックの上面の銅箔が作用して不用振動
を生じさせ、圧電セラミックから発射する超音波の音響
特性（−悪い影響を及ばＴ原因となる。更に、音曽特性
を改善するために圧電セラミツクの上面に成形したコー
テイング材を接着して整合層を形成する場合（二、第２
図（二示すようにハンダ付けしだ銅箔によって接着面が
不拘−Ｃ二なり、接着不良などが起こる。又、圧電セラ
ミックの上面Ｃニエボキシ系樹脂のコーテイング材を塗
布して整合層を形成する場合には、研Ｈｔ二よりコーテ
ィング層の一定の厚みを得るが、この研摩によって銅箔
１が剥出になったり或は剥がれたりして安全性からも好
ましくないことＣ二なる。However, when the ground is taken out using the above configuration C2, the copper foil on the top surface of the piezoelectric ceramic acts and causes unnecessary vibrations, which may cause the acoustic characteristics of the ultrasonic waves emitted from the piezoelectric ceramic (-- if it has a negative effect, it may cause T. Furthermore, in order to improve the acoustic characteristics, when a matching layer is formed by adhering a coating material molded on the top surface of the piezoelectric ceramic (second, second
As shown in Figure 2, the bonding surface becomes unrestrained due to the soldering copper foil, resulting in poor adhesion.In addition, a coating material of Nieboxy resin is applied to the top surface of the piezoelectric ceramic to form a matching layer. In some cases, a certain thickness of the coating layer is obtained by polishing, but this polishing causes the copper foil 1 to become exposed or peel off, which is not desirable from a safety standpoint.
本発明は上記事情≦１鑑みてなされたもので、例えはリ
ング状やダイス状の場合でも周辺以外の中央部分Ｃ二位
置する素子から容易にアースを取り出すことができると
共に、圧電セラミックから発射される超音波の音響特性
を損うことのない超音波トランスジューサを提供するこ
とを目的とするものである。The present invention has been made in view of the above circumstances≦1, and even in the case of a ring-shaped or dice-shaped element, it is possible to easily take out the ground from the element located in the central part C2 other than the periphery, and it is possible to emit the ground from the piezoelectric ceramic. The object of the present invention is to provide an ultrasonic transducer that does not impair the acoustic characteristics of ultrasonic waves.
上記目的を達成するための本発明の概要は゛、分割され
た各素子より成る圧電セラミックの超音波発射面に、導
電性接着剤を介して整合層を形成したことを特徴とする
ものである。To achieve the above object, the present invention is characterized in that a matching layer is formed on the ultrasonic emission surface of a piezoelectric ceramic made of divided elements via a conductive adhesive.
以下、本発明の一実施例を図面を参照して説明する。第
６図は超音波トランスジューサの要部を示す概略斜視図
である。第３図ｆ二おいて、２２はレーザ加工によって
同心円状に切断された各素子２２ａ、２２ｂ、２２ｃ、
２２ｄより成る圧電セラミックであり、該セラミック２
２はバンキング２１の上面≦二固着している。バッキン
グ２１の下方には前記の各素子２２ａ、２２ｂ、２２ｃ
、２２ｄからバッキング２１の内部を挿通した夫々のリ
ード線２３が出ている。Hereinafter, one embodiment of the present invention will be described with reference to the drawings. FIG. 6 is a schematic perspective view showing the main parts of the ultrasonic transducer. In FIG. 3 f2, 22 denotes each element 22a, 22b, 22c cut concentrically by laser processing,
22d, the piezoelectric ceramic 2
2 is fixed to the upper surface of the banking 21≦2. Below the backing 21 are the aforementioned elements 22a, 22b, 22c.
, 22d, the respective lead wires 23 inserted through the inside of the backing 21 come out.
第４図は圧電セラミック２２の超音波発射面上Ｃ二形成
して整合層２４となるエポキシ樹脂Ｃ二て成形されたコ
ーテイング材２４Ａの概略説明図である。このコーテイ
ング材２４Ａは音皆的特性の改善に効果的な一定の厚さ
、例えばその媒質の波長λとで、圧電セラミック２２の
外径と等しくなるように形成され、然もその周縁には切
欠部２５が設けられている。エポキシ樹脂より成るコー
テイング材２４Ａの片面全域には導電性接着剤２６が塗
布されている。FIG. 4 is a schematic explanatory diagram of a coating material 24A formed on the ultrasonic emission surface of the piezoelectric ceramic 22 and molded with an epoxy resin C2 to become the matching layer 24. This coating material 24A is formed to have a certain thickness effective for improving the acoustic characteristics, for example, the wavelength λ of the medium, and to be equal to the outer diameter of the piezoelectric ceramic 22, and has a notch on its periphery. A section 25 is provided. A conductive adhesive 26 is applied to the entire surface of one side of the coating material 24A made of epoxy resin.
第５図は、本発明の超音波トランスジューサの概略斜視
図で、圧電セラミック２２の超音波発射ｆｆ１ｊ＋二導
電性接着剤２６を介してコーテイング材２４Ａを固着す
ることによって整合層２４を形成した状態を示したもの
である。第５図において、２７は前記切欠部２５Ｃおい
て一端をハンダ付けしたアースリード線である。FIG. 5 is a schematic perspective view of the ultrasonic transducer of the present invention, showing the state in which the matching layer 24 is formed by fixing the coating material 24A via the ultrasonic emission ff1j of the piezoelectric ceramic 22 and the biconductive adhesive 26. This is what is shown. In FIG. 5, reference numeral 27 is a ground lead wire having one end soldered at the notch 25C.
本発明の超音波トランスジューサは圧電セラミック２２
の超音波発射面に導電性接着剤２６より成る金鳥層が設
けられているため、アースリード線２７をハンダ付けす
るだけで各素子２２＆、２２ｂ。The ultrasonic transducer of the present invention includes a piezoelectric ceramic 22
Since a metal layer made of conductive adhesive 26 is provided on the ultrasonic emission surface of the device, each element 22&, 22b can be connected simply by soldering the ground lead wire 27.
２２ｃ 、 ２２ｄの導通が可能となり、各素子のセラ
ミック電極は−、括してアース（１落すことができるこ
とになる。22c and 22d become conductive, and the ceramic electrodes of each element can be collectively grounded (1).
本発明は前記実施例に限定されるものではなく、本発明
の要旨の範囲内で種々の変形例を包含することは言うま
でもない。例えば、圧電セラミックの超音波発射面（二
導電性接着剤２６を塗布した後に、その上面Ｃ１更にエ
ポキシ系の樹脂を塗布し研摩して一定の厚みの整合層２
４を形成してもよい。It goes without saying that the present invention is not limited to the embodiments described above, and includes various modifications within the scope of the gist of the present invention. For example, an ultrasonic emission surface of a piezoelectric ceramic (after applying a biconductive adhesive 26, its upper surface C1 is further coated with an epoxy resin and polished to form a matching layer 2 of a certain thickness).
4 may be formed.
又、本発明は実施例１二示したリング状のトランスジュ
ーサに限らず、ダイス状のトランスジューサやアレイ状
のトランスジューサ（二も適用できる。Furthermore, the present invention is not limited to the ring-shaped transducer shown in Embodiments 1 and 2, but can also be applied to dice-shaped transducers and array-shaped transducers (2).
以上説明したように、本発明によると例えばリング状や
ダイス状≦二分割された素子から容易にアースを取り出
すことができ、然も圧′覗セラミックから発射される超
音波の音響特性を損なうことのない超音波トランスジュ
ーサを提供することができる。又、導電性接着剤は一般
の接着剤に比べて音響インピーダンスが高いため、接着
層の厚みの精度はそれほど厳密でなく、製造上において
極めて便利である。As explained above, according to the present invention, it is possible to easily extract the ground from, for example, a ring-shaped or dice-shaped element divided into two parts, and at the same time, the acoustic characteristics of the ultrasonic waves emitted from the piezoelectric ceramic are not impaired. Ultrasonic transducer can be provided without. Furthermore, since the conductive adhesive has a higher acoustic impedance than general adhesives, the accuracy of the thickness of the adhesive layer is not so strict, which is extremely convenient in manufacturing.
第１図は従来のトランスジューサを示す概略斜視図、第
２因は第１図の１ｕ１１面図、第３図はリング状のトラ
ンスジューサの要部を示す概略斜視図、第４図は整合層
となるコーテイング材の概略説明図、第５図は本発明の
超音波トランスジューサの概略斜視図である。
２１・・・バンキング、 ２２・・・圧電セラミック
、２２ａ、２２ｂ、２２ｃ、２２ｄ ・−圧電セラミッ
クの各素子、２′５・・・リード線、 ２４・・・整合
層、 ２４Ａ・・・コーティング利、 ２５・・・切
欠部、 ２６・・・導電性接着剤、 ２７・・・アー
スリード線代理人 弁理士 則 近 憲 佑（ほか１
名）第２図Fig. 1 is a schematic perspective view showing a conventional transducer, the second factor is a 1u11 side view of Fig. 1, Fig. 3 is a schematic perspective view showing the main parts of a ring-shaped transducer, and Fig. 4 is a matching layer. A schematic explanatory view of the coating material, and FIG. 5 is a schematic perspective view of the ultrasonic transducer of the present invention. 21... Banking, 22... Piezoelectric ceramic, 22a, 22b, 22c, 22d - each piezoelectric ceramic element, 2'5... Lead wire, 24... Matching layer, 24A... Coating layer , 25... Notch, 26... Conductive adhesive, 27... Earth lead wire agent, patent attorney Noriyuki Chika (and 1 others)
name) Figure 2
Claims (1)
いて、分割された各素子より成る圧電セラミックの超音
波発射面に、導電性接着剤を介して整合層を形成し、導
電性接着剤部分がら前記各素子からのアースを取り出し
たことを特徴とする超音波トランスシューブ。In a transducer having a matching layer on an ultrasonic emission surface, a matching layer is formed on the ultrasonic emission surface of a piezoelectric ceramic consisting of each divided element via a conductive adhesive, and each An ultrasonic transformer stub characterized by removing the ground from the element.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22697482A JPS59119999A (en) | 1982-12-27 | 1982-12-27 | Ultrasonic wave transducer |
| AU22588/83A AU544464B2 (en) | 1982-12-27 | 1983-12-20 | Ultrasonic transducer |
| EP83113002A EP0112562A3 (en) | 1982-12-27 | 1983-12-22 | Ultrasonic transducer and method for manufacturing the same |
| US06/662,626 US4611372A (en) | 1982-12-27 | 1984-10-19 | Method for manufacturing an ultrasonic transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22697482A JPS59119999A (en) | 1982-12-27 | 1982-12-27 | Ultrasonic wave transducer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59119999A true JPS59119999A (en) | 1984-07-11 |
Family
ID=16853529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22697482A Pending JPS59119999A (en) | 1982-12-27 | 1982-12-27 | Ultrasonic wave transducer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59119999A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62160914U (en) * | 1986-03-31 | 1987-10-13 | ||
| JPH0386874U (en) * | 1989-12-25 | 1991-09-03 | ||
| JPH06184A (en) * | 1992-06-19 | 1994-01-11 | Matsushita Electric Ind Co Ltd | Ultrasonic probe |
| JP2002521163A (en) * | 1998-07-31 | 2002-07-16 | ボストン・サイアンティフィック・リミテッド | Off-aperture electrical connection for ultrasonic transducers |
| KR100721315B1 (en) | 2005-11-30 | 2007-05-25 | 디피씨(주) | Noise filter |
-
1982
- 1982-12-27 JP JP22697482A patent/JPS59119999A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62160914U (en) * | 1986-03-31 | 1987-10-13 | ||
| JPH0386874U (en) * | 1989-12-25 | 1991-09-03 | ||
| JPH06184A (en) * | 1992-06-19 | 1994-01-11 | Matsushita Electric Ind Co Ltd | Ultrasonic probe |
| JP2002521163A (en) * | 1998-07-31 | 2002-07-16 | ボストン・サイアンティフィック・リミテッド | Off-aperture electrical connection for ultrasonic transducers |
| KR100721315B1 (en) | 2005-11-30 | 2007-05-25 | 디피씨(주) | Noise filter |
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