JPS5999743A - Package for integrated circuit - Google Patents
Package for integrated circuitInfo
- Publication number
- JPS5999743A JPS5999743A JP20864182A JP20864182A JPS5999743A JP S5999743 A JPS5999743 A JP S5999743A JP 20864182 A JP20864182 A JP 20864182A JP 20864182 A JP20864182 A JP 20864182A JP S5999743 A JPS5999743 A JP S5999743A
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- package
- transfer member
- integrated circuit
- recessed section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は放熱を良好にした集積回路パッケージに関する
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an integrated circuit package with improved heat dissipation.
集積回路は熱に弱いため、高密度実装或いは高温環境等
の熱環境のあまシ良くない条件下で使用する場合には、
熱伝導性の良好な伝熱部材を集積回路パッケージに接触
させこの伝熱部材を放熱板或いはヒートパイプ等に接続
させて集積回路パッケージの放熱性を高めたり、冷却し
たシする方法がとられている。Integrated circuits are sensitive to heat, so when using them in unfavorable thermal environments such as high-density packaging or high-temperature environments,
A method has been adopted in which a heat transfer member with good thermal conductivity is brought into contact with the integrated circuit package, and this heat transfer member is connected to a heat sink, a heat pipe, etc. to improve the heat dissipation performance of the integrated circuit package or to cool the integrated circuit package. There is.
この場合、第1図に示すようにプリント基板1にリード
2によ仄装着される集積回路のパッケージ3には、従来
伝熱部材を固定するだめの特別な手段を持っていない。In this case, as shown in FIG. 1, an integrated circuit package 3, which is attached to a printed circuit board 1 through leads 2, does not conventionally have any special means for fixing the heat transfer member.
このため、第2図に示すように、伝熱部材4を接着剤5
によってパッケージ3に接□触させたシ、或いは、伝熱
部材4にネジ6を取シ付けこめネジ6に′よらて伝熱部
材4をプリント基板1に固定し伝熱部材4とプリント基
鈷の間に集積回路パッケージ3を挾臥込示ことによって
接触させるよ靴していた!□
しか尼、赫着剤をんい□る方□法では、パッケージ3と
伝熱部材4との間の熱伝導性が接着剤の介在□によシ低
下、Ll−る。 ″ □また□、ネジ固定
の場合に龜、ネジ固定部間で伝熱部材4が彎曲しパッケ
ージ3との接−面積が十分に得られない□だけ+:外ク
りジ6等の部品点数も多くなる等どちらも問題を有して
いた。For this reason, as shown in FIG.
Alternatively, attach the screws 6 to the heat transfer member 4, fix the heat transfer member 4 to the printed circuit board 1 by tightening the screws 6', and connect the heat transfer member 4 and the printed circuit board. By holding the integrated circuit package 3 between the shoes, you can make contact with it! However, in the method of using adhesive, the thermal conductivity between the package 3 and the heat transfer member 4 is reduced due to the presence of the adhesive. ″ □Also, when fixing with screws, the heat transfer member 4 is curved between the screw fixing part and the contact area with the package 3 is insufficient. Only □+: Number of parts such as outer screw 6, etc. Both had problems, such as an increase in the number of
本発明は上記の実情に鑑みてなされたもので、ネジ、接
着剤等を不用とし、しかもパッケージ面に伝熱部材を良
好に密着させ両者間の熱伝達性を向上させるために、集
積回路パッケージ平坦面上に沿って伝熱部材をスライド
案内するガイド部を集積回路パッケージに設け、伝熱部
材をガイド部に挿通するだけでパッケージと伝熱部材と
が密着できる構成とした。The present invention has been made in view of the above-mentioned circumstances, and is an integrated circuit package that eliminates the need for screws, adhesives, etc., and also improves heat transfer between the two by bringing the heat transfer member into good contact with the package surface. The integrated circuit package is provided with a guide portion that slides and guides the heat transfer member along a flat surface, and the package and the heat transfer member can be brought into close contact by simply inserting the heat transfer member through the guide portion.
以下、本発明の実施例を図面に基づいて詳細に説明する
。尚、従来図と同一部分には同一符号を付して説明を省
略する。Embodiments of the present invention will be described in detail below with reference to the drawings. Incidentally, the same parts as in the conventional drawings are given the same reference numerals and the description thereof will be omitted.
第3図は本発明に係わる集積回路ノくツケージの1実施
例を示すものである。FIG. 3 shows one embodiment of an integrated circuit package according to the present invention.
図において、11は本実施例によるデュアルインライン
型の集積回路ノくツケージで、例えば樹脂等で成形され
ている。このノくツケージ11は両側に集積回路のり一
ド12が装着され、このり一ド12をプリント基板1に
はんだ付けする。そして、パッケージ11の上面中央部
は凹状に形成され、との凹部11Aの両側壁に沿ってガ
イ)”溝11Bが形成されている。該ガイド溝11Bの
高さ方向の寸法は;押通する伝熱部材13の厚さを考慮
して伝熱部材13と凹部11Aの底面とが密着するよう
に適切な値にする。In the figure, reference numeral 11 denotes a dual in-line type integrated circuit chip cage according to this embodiment, which is molded from, for example, resin. Integrated circuit glue 12 is attached to both sides of this nut cage 11, and the glue 12 is soldered to the printed circuit board 1. The center part of the upper surface of the package 11 is formed into a concave shape, and a guide groove 11B is formed along both side walls of the concave part 11A.The dimension in the height direction of the guide groove 11B is; Considering the thickness of the heat transfer member 13, the thickness is set to an appropriate value so that the heat transfer member 13 and the bottom surface of the recess 11A come into close contact.
かかる構成によれば、第4図に示すようにプリント基板
1上に配列された集積回路パンケージ11の上面に設け
た伝熱部材ガイド部のガイド溝11Bに沿って伝熱部材
13を矢印方向に挿通させるだけで、パッケージ11の
凹部11A底面に伝熱部材13の平坦面を直接かつ一様
に密着できる。従って、パッケージ11と伝熱部材13
との間の熱伝達性が向上する。また、配列された集積回
路パッケージ11が互いに多少ずれていても伝熱部材1
3の挿通が無理なくできるようへガイド溝11B間の幅
を伝熱部材130幅よシも多少太きくしておくとよい。According to this configuration, as shown in FIG. 4, the heat transfer member 13 is moved in the direction of the arrow along the guide groove 11B of the heat transfer member guide portion provided on the upper surface of the integrated circuit pancage 11 arranged on the printed circuit board 1. The flat surface of the heat transfer member 13 can be directly and uniformly brought into close contact with the bottom surface of the recess 11A of the package 11 by simply inserting the heat transfer member 13 through the heat transfer member 13. Therefore, the package 11 and the heat transfer member 13
Improves heat transfer between the Moreover, even if the arranged integrated circuit packages 11 are slightly shifted from each other, the heat transfer member 1
It is preferable to make the width between the guide grooves 11B somewhat larger than the width of the heat transfer member 130 so that the guide grooves 11B can be inserted easily.
尚、伝熱部材ガイド部はパッケージ上面だけで々く第5
図のように上下両面に設けてもよく、まだ下面側だけで
もよい。更に本発明の対象とする集積回路パッケージは
デュアルインライン型パツケー7に限るものではない。Note that the heat transfer member guide portion is located only on the top surface of the package.
It may be provided on both the upper and lower surfaces as shown in the figure, or it may be provided only on the lower surface side. Further, the integrated circuit package to which the present invention is applied is not limited to the dual in-line package 7.
以上述べたように本発明によれば、集積回路パッケージ
面に沿ってかつパッケージ面と密着させて伝熱部材を案
内するガイド部を集積回路パッケージに設ける構成とし
たので、伝熱部材をバック−ジ面に接触固定する際にネ
ジ或いは接着剤を使用しなくてすみ、しかも従来よシも
パッケージと伝熱部材間の熱伝達性を良好にできる。寸
た、伝熱部材の取シ付は作業を極めて簡単に行なうこと
ができる。As described above, according to the present invention, the integrated circuit package is provided with a guide portion that guides the heat transfer member along the integrated circuit package surface and in close contact with the package surface. There is no need to use screws or adhesives when contacting and fixing the package to the package surface, and the heat transfer between the package and the heat transfer member can be improved compared to conventional methods. In short, mounting the heat transfer member can be done extremely easily.
第1図は従来の集積回路パッケージの正面図、第2図は
従来の伝熱部材取付状態を示す斜視図、第3図は本発明
の1実施例を示す正面図、第4図は同上実施例の伝熱部
材取付状態を示す斜視図、第5図は本発明の別の実施例
を示す正面図である。
11・・・集積回路パッケージ 11A・・・四部1
1B・・・ガイド溝 13・・・伝熱部材特 許 出
願 人 日産自動車株式会社代理人弁理士笹 島 富
二雄Fig. 1 is a front view of a conventional integrated circuit package, Fig. 2 is a perspective view showing a conventional heat transfer member attached state, Fig. 3 is a front view showing an embodiment of the present invention, and Fig. 4 is an implementation of the same. FIG. 5 is a perspective view showing an example of a state in which the heat transfer member is attached, and FIG. 5 is a front view showing another embodiment of the present invention. 11...Integrated circuit package 11A...Four parts 1
1B... Guide groove 13... Heat transfer member patent applicant Fujio Sasashima, patent attorney representing Nissan Motor Co., Ltd.
Claims (1)
いに密着させるべく前記伝熱部材を前記パッケージ平坦
面に沿って案内するガイド部を設けたことを特徴とする
集積回路パッケージ。An integrated circuit package, comprising: a guide portion that guides the heat transfer member along the flat surface of the package to bring the flat surface of the integrated circuit package and the flat surface of the heat transfer member into close contact with each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20864182A JPS5999743A (en) | 1982-11-30 | 1982-11-30 | Package for integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20864182A JPS5999743A (en) | 1982-11-30 | 1982-11-30 | Package for integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5999743A true JPS5999743A (en) | 1984-06-08 |
Family
ID=16559599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20864182A Pending JPS5999743A (en) | 1982-11-30 | 1982-11-30 | Package for integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5999743A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0785575A3 (en) * | 1996-01-17 | 1998-09-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and semiconductor module |
EP2927954A1 (en) * | 2014-04-02 | 2015-10-07 | Brusa Elektronik AG | Fastening system for a power module |
-
1982
- 1982-11-30 JP JP20864182A patent/JPS5999743A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0785575A3 (en) * | 1996-01-17 | 1998-09-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and semiconductor module |
US5834842A (en) * | 1996-01-17 | 1998-11-10 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device, semiconductor module, and radiating fin |
EP2927954A1 (en) * | 2014-04-02 | 2015-10-07 | Brusa Elektronik AG | Fastening system for a power module |
US9497876B2 (en) | 2014-04-02 | 2016-11-15 | Brusa Elektronik Ag | Fastening systems for power modules |
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