JPS5996946A - Copper foil for laminated board and copper lined laminated board using said foil - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は電気機器、電子機器、計算機器、コンピュータ
ー機器等に用いられる電気用薄層板に用いられる積層板
用銅箔およびこれを用いた銅張積層板に関するもので、
その目的とするところは銅箔の接着力を向上せしめるこ
とにある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a copper foil for laminates used for electrical thin laminates used in electrical equipment, electronic equipment, computing equipment, computer equipment, etc., and a copper-clad laminate using the same. ,
Its purpose is to improve the adhesive strength of copper foil.

従来の銅張積層板は銅箔接着面を物理的、化学的に粗面
化して投錨効果による接着力向上を試みたり、特殊配合
によシ接着層自身の接着力を向上させたシする試みがな
されていたが前者については通常、１０層板に用いられ
る銅箔厚さが０．０１８〜０．０７５と極度に薄いため
接着を向上させるような粗面化処理は実質上不可能であ
り、後者については特殊配合なるがだめの取扱上の制約
、加工上の制約、価格上昇を招来し一般的に広く普及す
るものではなく又、両者共に銅箔表面の酸化銅皮膜の層
間剥離により接着力向上は小きいものであった。For conventional copper-clad laminates, attempts have been made to improve the adhesive strength of the adhesive layer itself by roughening the copper foil adhesive surface physically or chemically to create an anchor effect, or to improve the adhesive strength of the adhesive layer itself through special formulations. However, in the case of the former, the thickness of the copper foil used for the 10-layer board is extremely thin, ranging from 0.018 to 0.075 mm, so surface roughening treatment to improve adhesion is virtually impossible. However, the latter method is not widely used due to the special formulation, which leads to handling restrictions, processing restrictions, and price increases. The power increase was small.

本発明は上記欠、咀を解決するもので、銅箔の片面に酸
化銅皮膜を存在させずに接着剤層を設けてなる銅箔を用
いた銅張積層板のため従来のように酸化銅皮膜での層間
剥離がないので銅箔を粗面化したシ、特殊配合接着剤を
用いることなく接着力を大巾に向上せしめることができ
たものである。The present invention solves the above-mentioned deficiencies and disadvantages, and is intended to solve the above-mentioned problems, and because it is a copper-clad laminate using a copper foil in which an adhesive layer is provided on one side of the copper foil without the presence of a copper oxide film, it is difficult to use copper oxide as in the past. Since there is no interlayer peeling in the film, the adhesive strength can be greatly improved without using a roughened copper foil or a specially formulated adhesive.

以下本発明の詳細な説明する。本発明に用いる銅箔は従
来から用いられている積層板用銅箔をそのまま用いるこ
とができるがただ重要なことは片面に酸化銅皮膜を存在
させずに接着剤層を設けることが必要である。具体的に
は無酸素雰囲気中で、例えば真窒下或は不活性ガス中で
酸化皮膜を発生させることなく銅箔に接着剤層を設ける
ものである。酸化皮膜の発生した鋼箔から始める場合は
酸化銅の除去も上記無酸素雰囲気でおこなう必要がある
。接着剤層を設けた後の取扱は通常雰囲気中で取扱うこ
とができる。＃Ｇｊ板用横用樹脂てはフェノール樹脂、
エポキシ樹脂、不飽和ポリエステル樹脂、メラミン樹脂
、ポリイミド、ポリブタジェン、ポリアミド、ポリアミ
ドイミド、ポリスルフォン、ポリブチＶンテレ７タンー
ト、ポリエーテルエーテルケトン、弗化樹脂等の単独、
父性物、混合物等が用いられ必要に応じて粘度ｉ１．．
ｌ整に水、メチルアルコール、アセトン、シクロヘキサ
ノン、スチレン等の溶媒を添加したもので、債層板用基
材トしては、ガラス、アスベスト等の無機繊維やポリエ
ステル、ポリアミド、ポリビニルアルコール、アクリル
等の有機合成繊維や木綿等の天然繊維からなる織布、不
織布、マット或は紙又はこれらの組合せ基材等で、上記
積層板用樹脂を積層板用基材に含ひ、乾燥したグリプレ
グを所要枚数重ねた片面および又は両面に本発明の銅箔
の接着層側をプリプレグ側と対向させて載置した積層体
を積層成形して一体化した銅張を前層板である。The present invention will be explained in detail below. The copper foil used in the present invention can be the copper foil for laminated boards used conventionally, but the important thing is that it is necessary to provide an adhesive layer on one side without the presence of a copper oxide film. . Specifically, the adhesive layer is provided on the copper foil in an oxygen-free atmosphere, for example, under nitrogen or in an inert gas, without generating an oxide film. When starting from a steel foil with an oxide film, copper oxide must also be removed in the above-mentioned oxygen-free atmosphere. After the adhesive layer is provided, the adhesive layer can be handled in a normal atmosphere. ＃Gj board horizontal resin is phenolic resin,
Epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polybutylene 7-tanto, polyetheretherketone, fluorinated resin, etc. alone,
Paternal substances, mixtures, etc. are used, and the viscosity i1. ．．
It is made by adding solvents such as water, methyl alcohol, acetone, cyclohexanone, styrene, etc. to the base material for bond laminated boards, such as inorganic fibers such as glass and asbestos, polyester, polyamide, polyvinyl alcohol, acrylic, etc. A woven fabric, non-woven fabric, mat, paper, or a combination of these materials made of organic synthetic fibers or natural fibers such as cotton, which contains the above-mentioned laminate resin in the laminate substrate, and requires dried Gripreg. The front laminate is a copper-clad plate formed by laminating and molding a laminate in which a number of sheets of the copper foil of the present invention are placed on one side and/or both sides with the adhesive layer side facing the prepreg side and integrated.

以゛Ｔ本発明を実施例にもとすいて説明する。Hereinafter, the present invention will be explained based on examples.

実施例 厚さ０．０８５ｍの債１−板用銅箔を窒素ガス雰囲気中
で塩酸処理して酸化銅を除去し中和、水洗、乾燥後、変
性エポキシ樹脂接着剤を塗布して銅箔の片面に酸化銅皮
物の存在なしに接着剤層を設けた債ノー板用銅箔を得た
。次に樹脂Ｊｆｃ５０重量％（以下単に％と記す）のｆ
ｕ層板用フェノール樹脂をクラフト紙に樹脂量が５０％
になるように含浸、乾燥してグリプレグを得、このグリ
プレグ６枚を重ねだ上、下面に上記積層板用銅箔の接着
剤層側をグリプレグ側と対向させて載置した積層体を成
形圧力］　００　ｋｑ／（ｙｉ、１６０°Ｃで６０分間
債１・層成形して銅張債Ｊ―板を得た。Example: Bond 1-plate copper foil with a thickness of 0.085 m was treated with hydrochloric acid in a nitrogen gas atmosphere to remove copper oxide, neutralized, washed with water, dried, and then coated with a modified epoxy resin adhesive to bond the copper foil. A copper foil for a bond board was obtained which had an adhesive layer on one side without the presence of a copper oxide layer. Next, f of resin Jfc 50% by weight (hereinafter simply referred to as %)
Phenol resin for U-layer board is added to kraft paper with a resin content of 50%.
Gripreg was obtained by impregnating and drying to obtain Gripreg, and 6 sheets of Gripreg were stacked on top of each other, and a laminate was placed on the bottom surface with the adhesive layer side of the copper foil for laminate facing the Gripreg side. ] 00 kq/(yi, one layer of the bond was formed at 160° C. for 60 minutes to obtain a copper-clad bond J-board.

従来例 厚さ０．０８５ｍの積層板用銅箔を実施例と回しグリプ
レグ６枚の上、下面に載置した積層体を成形圧力１００
ｋｇＡ−れ　１６０°Ｃで６０分間積層成形　して銅張
債層板を得た。Conventional example A laminate copper foil with a thickness of 0.085 m was placed on the upper and lower surfaces of 6 Gripregs by rotating it with the example and molding pressure 100.
A copper clad bond laminate was obtained by lamination molding at 160°C for 60 minutes.

実施例と従来例の銅張（ｋ層板の接着強度は第１表で明
白なように本発明の槓Ｐａｌ板用銅箔全用いた銅張ｔｒ
ｔ層板の接着強度は大きく本発明の恨れていることを確
認した。As is clear from Table 1, the adhesion strength of the copper-clad (k-layer board) of the example and the conventional example is as follows.
It was confirmed that the adhesive strength of the T-layer plate was significantly inferior to that of the present invention.

第１表 特許出願人 松下電工株式会社 代理人弁理士　　竹　元　敏　九 （ほか２名）Table 1 patent applicant Matsushita Electric Works Co., Ltd. Representative Patent Attorney Toshiku Takemoto (2 others)

Claims (2)

【特許請求の範囲】[Claims] （１）銅箔の片面に酸化銅皮膜を存在させずに接着剤層
を設けてなることを特徴とする積層板用銅箔。(1) A copper foil for a laminate, characterized in that an adhesive layer is provided on one side of the copper foil without the presence of a copper oxide film. （２）樹脂含浸基材の片面および又は両面に銅箔を載置
してからｆｌＪ成形によって一体化してなる銅張積層板
において、銅箔の片面に酸化銅皮膜を存在させずに接着
剤層を設けてなる銅箔を用いたことを特徴とする銅張積
層板。(2) In a copper-clad laminate in which copper foil is placed on one and/or both sides of a resin-impregnated base material and then integrated by flJ molding, an adhesive layer is formed without the presence of a copper oxide film on one side of the copper foil. A copper-clad laminate characterized by using a copper foil provided with.