JPS599495A - Heat pipe type radiator - Google Patents
Heat pipe type radiatorInfo
- Publication number
- JPS599495A JPS599495A JP57118686A JP11868682A JPS599495A JP S599495 A JPS599495 A JP S599495A JP 57118686 A JP57118686 A JP 57118686A JP 11868682 A JP11868682 A JP 11868682A JP S599495 A JPS599495 A JP S599495A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat pipe
- radiator
- fins
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、ラジオ受信機、ステレオ装置等のパワ一段増
幅回路におけるパワートランジスタから発生する熱を効
果的に放散させるだめのヒートパイプ式放熱装置に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat pipe type heat dissipation device for effectively dissipating heat generated from a power transistor in a single-stage power amplification circuit of a radio receiver, stereo device, or the like.
従来、この種の装置は、第1図に示したように構成され
ている。第1図において、■はパワートランジスタ、2
はアルミブロック、3はヒートパイプ、4はアルミニー
−ムあるいは銅等の熱伝導性の良好な放熱フィンである
。アルミブロック2は2個一対で、ヒートパイプ3の一
端部を両側から挾み、ビス5で固定されている。また、
放熱フィン4はヒート・やイブ3の他端側に複数枚並べ
て配置されている。しかしながら、このよう々構造では
、使用部品点数が多く、従って組立生産性が悪かった。Conventionally, this type of device has been constructed as shown in FIG. In Figure 1, ■ is a power transistor, 2
3 is an aluminum block, 3 is a heat pipe, and 4 is a heat dissipation fin made of aluminum or copper with good heat conductivity. The aluminum blocks 2 are arranged in pairs and sandwich one end of the heat pipe 3 from both sides, and are fixed with screws 5. Also,
A plurality of heat radiation fins 4 are arranged side by side on the other end side of the heat sink 3. However, in this structure, a large number of parts are used, resulting in poor assembly productivity.
さらに、放熱性能も悪いため、放熱面積を広げる必要か
ら放熱フィン4の枚数を増したり、大きくしたりしなけ
ればならず、従ってス啄−スファクタが極めて悪かった
。Furthermore, the heat dissipation performance was poor, and the number of heat dissipation fins 4 had to be increased or the size of the heat dissipation fins 4 had to be increased in order to increase the heat dissipation area, and therefore the space factor was extremely poor.
発明の目的
そこで、本発明は、上記従来例の欠点を解消し/やワー
トランジスタ等の発熱素子から発生する熱を効果的に放
散させる、組立生産性の良好なヒートパイプ式放熱装置
を提供するものである。Purpose of the Invention Therefore, the present invention provides a heat pipe type heat dissipation device which eliminates the drawbacks of the above-mentioned conventional example and/or effectively dissipates heat generated from a heat generating element such as a power transistor and has good assembly productivity. It is something.
発明の構成
本発明は、板部の一方の面にヒー) zRイブを嵌装す
る、断面が略半円状の溝を有し、他方の面に直角に複数
の放熱フィンを突設した放熱器を使用するもので、押出
加工により複数のフィンを板部と一体的に形成し、また
溝は、押出加工された放熱器にプレス加工を施して形成
する。Structure of the Invention The present invention provides a heat dissipation device having a groove having a substantially semicircular cross section into which a heat sink is fitted on one surface of a plate portion, and a plurality of heat dissipation fins protruding at right angles from the other surface. A plurality of fins are formed integrally with the plate part by extrusion, and the grooves are formed by pressing the extruded heat radiator.
実施例の説明
第2図は、本発明の一実施例を示したもので、6は放熱
器であり、通常、アルミニウム、銅等の熱伝導率の冒い
金属からなる。放熱器6は、板部6aの片側に複数のフ
ィン6bが直角に突出するように押出加工され、との押
出加工品のプレス加工時に、板部6aに、第3図のよう
なヒー) z9イゾ3の径に対応した半径Rを有する断
面が略半円状の溝7と爪8を同時加工する。しかし、押
出方向と直交する方向に半円状の溝7を設けることは、
従来のアルミ押出品の肉厚(例えば溝7の長さを約25
0調とし、肉厚t1は通常3■程度)では、加工が困難
であるから、本実施例の場合、板部6aの肉厚t1を1
胴とし、フィン6bの肉厚t2を0.5mmに設定して
いる。ヒートパイプ方式の放熱器では肉厚が薄くても性
能に問題はないので、押出加工後のプレスによシ、半円
状の溝7を容易に刀ロエすることができる。DESCRIPTION OF THE EMBODIMENTS FIG. 2 shows an embodiment of the present invention, in which numeral 6 denotes a heat sink, which is usually made of a metal with poor thermal conductivity, such as aluminum or copper. The heat sink 6 is extruded so that a plurality of fins 6b protrude at right angles from one side of the plate part 6a, and when the extruded product is pressed, the plate part 6a is heated as shown in FIG. A groove 7 and a pawl 8 having a substantially semicircular cross section having a radius R corresponding to the diameter of the groove 3 are simultaneously machined. However, providing the semicircular groove 7 in the direction perpendicular to the extrusion direction
The wall thickness of conventional aluminum extrusions (for example, the length of groove 7 is approximately 25 mm)
0 tone, and the wall thickness t1 is usually about 3 cm), it is difficult to process, so in this embodiment, the wall thickness t1 of the plate portion 6a is set to 1
The thickness t2 of the fin 6b is set to 0.5 mm. Since there is no problem with the performance of the heat pipe type radiator even if the wall thickness is thin, the semicircular groove 7 can be easily formed by pressing after extrusion processing.
以上のように、従来、1枚ずつ単独に製作したフィンを
ヒートパイプに嵌め込んでいたのに対し、本実施例では
、多数のフィン6bを押出加工により同時に一体形成す
ることができ、またヒートパイプ3も爪8を用いて容易
に取り付けることができる。ヒートパイプ3を、このよ
うにフィン6bと@交する方向に通せば、パワートラン
ジスタ1の発熱に対し、空気の対流、熱伝導面で優れた
放熱特性が得られる。As described above, whereas in the past, the fins 6b were manufactured individually one by one and fitted into the heat pipe, in this embodiment, a large number of fins 6b can be integrally formed at the same time by extrusion processing, and the heat pipe The pipe 3 can also be easily attached using the claws 8. By passing the heat pipe 3 in the direction intersecting the fins 6b in this manner, excellent heat dissipation characteristics can be obtained in terms of air convection and heat conduction with respect to the heat generated by the power transistor 1.
発明の詳細 な説明したように、本発明によれば、 (1)部品点数を大幅に削減することができる。Details of the invention As explained above, according to the present invention, (1) The number of parts can be significantly reduced.
(2)部品点数が減るので組立てが容易になり、従って
生産性が大幅に向上する。(2) Since the number of parts is reduced, assembly becomes easier, and therefore productivity is greatly improved.
(3) 生産性の向上により大幅なコストダウンが可
能となる。(3) Significant cost reductions are possible due to improved productivity.
(4)放熱効果が高まり、従って小形化が可能となって
ス被−スフ了りタが良くなる。(4) The heat dissipation effect is enhanced, and therefore miniaturization becomes possible, and the surface area is improved.
特の効果を有する。It has a special effect.
第1図は、従来のヒート・母イブ式放熱装置の斜視図、
第2図は、本発明の一実施例の斜視図、第3図は、同側
面から見た半円状溝を示す図である。
1・・・パワートランジスタ、3・・・ヒートパイプ、
6・・・放熱器、6a・・・板部、6b・・・放熱フィ
ン、7・・・半円状溝。
(5)
第3図
□″Figure 1 is a perspective view of a conventional heat/main tube type heat dissipation device.
FIG. 2 is a perspective view of one embodiment of the present invention, and FIG. 3 is a diagram showing a semicircular groove viewed from the same side. 1... Power transistor, 3... Heat pipe,
6... Heat radiator, 6a... Plate portion, 6b... Heat radiation fin, 7... Semicircular groove. (5) Figure 3 □″
Claims (1)
に直角に複数の放熱フィンが突設された放熱器と、前記
略半円状の溝に嵌装されたヒートパイプとからな9、前
記板部に取り付けられたパワートランジスタ等の発熱素
子から発生する熱を放散することを特徴とするヒート・
ぐイブ式放熱装置。A radiator having a groove with a substantially semicircular cross section on one surface of a plate part and a plurality of radiating fins protruding from the other surface at right angles, and a radiator fitted in the substantially semicircular groove. The heat pipe is characterized by dissipating heat generated from a heating element such as a power transistor attached to the plate portion.
Guib type heat dissipation device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57118686A JPS599495A (en) | 1982-07-09 | 1982-07-09 | Heat pipe type radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57118686A JPS599495A (en) | 1982-07-09 | 1982-07-09 | Heat pipe type radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS599495A true JPS599495A (en) | 1984-01-18 |
Family
ID=14742674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57118686A Pending JPS599495A (en) | 1982-07-09 | 1982-07-09 | Heat pipe type radiator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS599495A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4908737A (en) * | 1987-12-08 | 1990-03-13 | Mitsubishi Denki Kabushiki Kaisha | Mounting structure of a small-sized acoustic component |
WO1999039145A1 (en) * | 1998-01-30 | 1999-08-05 | Hitachi, Ltd. | Heat pipe type cooling device, method of producing the same and cooling plate for heat pipe type cooling device |
JP2004228484A (en) * | 2003-01-27 | 2004-08-12 | Toshiba Corp | Cooling device and electronic device |
JP2015137848A (en) * | 2014-01-24 | 2015-07-30 | 崇賢 ▲黄▼ | Heat radiator for portable electric device |
CN106500171A (en) * | 2016-12-14 | 2017-03-15 | 河南三元光电科技有限公司 | A kind of radiator for electric heater |
CN111670332A (en) * | 2017-12-28 | 2020-09-15 | 古河电气工业株式会社 | Cooling device |
-
1982
- 1982-07-09 JP JP57118686A patent/JPS599495A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4908737A (en) * | 1987-12-08 | 1990-03-13 | Mitsubishi Denki Kabushiki Kaisha | Mounting structure of a small-sized acoustic component |
WO1999039145A1 (en) * | 1998-01-30 | 1999-08-05 | Hitachi, Ltd. | Heat pipe type cooling device, method of producing the same and cooling plate for heat pipe type cooling device |
JP2004228484A (en) * | 2003-01-27 | 2004-08-12 | Toshiba Corp | Cooling device and electronic device |
JP2015137848A (en) * | 2014-01-24 | 2015-07-30 | 崇賢 ▲黄▼ | Heat radiator for portable electric device |
CN106500171A (en) * | 2016-12-14 | 2017-03-15 | 河南三元光电科技有限公司 | A kind of radiator for electric heater |
CN111670332A (en) * | 2017-12-28 | 2020-09-15 | 古河电气工业株式会社 | Cooling device |
CN111670332B (en) * | 2017-12-28 | 2022-02-01 | 古河电气工业株式会社 | Cooling device |
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