JPH1168359A - Heat radiator and manufacture therefor - Google Patents
Heat radiator and manufacture thereforInfo
- Publication number
- JPH1168359A JPH1168359A JP21883497A JP21883497A JPH1168359A JP H1168359 A JPH1168359 A JP H1168359A JP 21883497 A JP21883497 A JP 21883497A JP 21883497 A JP21883497 A JP 21883497A JP H1168359 A JPH1168359 A JP H1168359A
- Authority
- JP
- Japan
- Prior art keywords
- fin
- conductor
- fin base
- thermal conductor
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、空調装置の熱交換
及び半導体素子の放熱等に用いられる放熱器及びその製
造方法に関し、詳しくは、放熱フィンを形成するフィン
基台部に熱良導体を埋設して、フィン基台部の熱伝導性
を高め、放熱器の放熱効率を高めながら、熱良導体を埋
設することに伴う問題をなくそうとする技術に係るもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiator used for heat exchange of an air conditioner and heat radiation of a semiconductor element, and a method of manufacturing the same. More specifically, a heat conductor is embedded in a fin base for forming a radiation fin. Thus, the present invention relates to a technique for improving the thermal conductivity of the fin base portion and improving the heat radiation efficiency of the radiator, while eliminating the problem associated with embedding a good heat conductor.
【０００２】[0002]
【従来の技術】従来、フィン基台部に半導体素子等の発
熱体を接触させて放熱フィンにより放熱を図る放熱器に
おいて、フィン基台部への発熱部（図示せず）の接触面
積が少ないと、フィン基台部の放熱フィン側への熱伝導
性が悪くなり、放熱効率が低いものとなっていた。2. Description of the Related Art Conventionally, in a radiator in which a heating element such as a semiconductor element is brought into contact with a fin base portion to radiate heat by radiating fins, a contact area of a heating portion (not shown) with the fin base portion is small. In this case, the heat conductivity of the fin base portion to the radiation fin side is deteriorated, and the radiation efficiency is low.
【０００３】そこで、フィン基台部２の熱伝導性を向上
させる方法として、図５に示すように、放熱器Ａａのフ
ィン基台部２を分割し、分割基台２ａ，２ａ間にフィン
基台部２に比べて熱伝導性の良い熱良導体３をサンドイ
ッチ状に挟んで放熱器Ａａを構成するものが一般的であ
る。In order to improve the thermal conductivity of the fin base 2, as shown in FIG. 5, the fin base 2 of the radiator Aa is divided, and the fin base 2 is divided between the divided bases 2a. In general, a radiator Aa is formed by sandwiching a good thermal conductor 3 having a higher thermal conductivity than the base portion 2 in a sandwich manner.
【０００４】[0004]
【発明が解決しようとする課題】ところが、このような
放熱器Ａａでは、フィン基台部２が分割され、分割基台
２ａ，２ａ間に熱良導体３が介装されていて、分割基台
２ａ，２ａと熱良導体３の熱膨張係数が異なるため、膨
張・収縮の繰り返しにより、分割基台２ａ，２ａと熱良
導体３とが剥離し、結果として、放熱効率が低くなると
いう問題があった。However, in such a radiator Aa, the fin base 2 is divided, and the good heat conductor 3 is interposed between the divided bases 2a, 2a. , 2a and the good thermal conductor 3 have different thermal expansion coefficients, so that the repetition of expansion and contraction causes the separation bases 2a, 2a and the good thermal conductor 3 to peel off, resulting in a problem that the heat radiation efficiency is reduced.
【０００５】本発明は、このような問題に鑑みて発明し
たものであって、その目的とするところは、放熱フィン
を形成するフィン基台部に熱良導体を埋設して、フィン
基台部の熱伝導性を高め、放熱器の放熱効率を高めなが
ら、熱良導体とフィン基台部との剥離をなくすことがで
きる放熱器を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to embed a good heat conductor in a fin base for forming a heat radiation fin and to provide a fin base. It is an object of the present invention to provide a radiator capable of improving heat conductivity and improving the heat radiation efficiency of the radiator and eliminating the separation between the good heat conductor and the fin base.
【０００６】[0006]
【課題を解決するための手段】請求項１の発明において
は、放熱フィン１を設けたフィン基台部２にフィン基台
部２よりも熱伝導性の良い熱良導体３を埋設した放熱器
であって、フィン基台部２は埋設された熱良導体３の表
裏において分割されていないことを特徴とするものであ
る。According to the first aspect of the present invention, there is provided a radiator in which a good heat conductor 3 having better thermal conductivity than the fin base 2 is embedded in a fin base 2 on which a heat radiating fin 1 is provided. In addition, the fin base 2 is not divided on the front and back of the buried thermal conductor 3.
【０００７】請求項２の発明においては、請求項１に加
えて、熱良導体３は板状のものであることを特徴とする
ものである。請求項３の発明においては、請求項１に加
えて、熱良導体３は線状のものであることを特徴とする
ものである。請求項４の発明においては、請求項１乃至
請求項３のいずれかに記載の発明に加えて、放熱フィン
１及びフィン基台部２は押出し成形され、熱良導体３は
押出し成形方向に伸びていることを特徴とするものであ
る。According to a second aspect of the present invention, in addition to the first aspect, the thermal conductor 3 is plate-shaped. According to a third aspect of the present invention, in addition to the first aspect, the thermal conductor 3 is linear. According to a fourth aspect of the present invention, in addition to any one of the first to third aspects, the radiating fins 1 and the fin base 2 are extruded, and the thermal conductor 3 extends in the extrusion molding direction. It is characterized by having.
【０００８】請求項５の発明においては、請求項１に加
えて、熱良導体３は、小片状のものであることを特徴と
するものである。請求項６の発明においては、放熱フィ
ン１を設けたフィン基台部２の内部にフィン基台部２よ
りも熱伝導性の良い熱良導体３を埋設させた放熱器の製
造方法であって、フィン基台部２を分割し、分割された
分割基台２ａ，２ａ間に熱良導体３の小片４を混入させ
て押出し成形することを特徴とするものである。According to a fifth aspect of the present invention, in addition to the first aspect, the good thermal conductor 3 is in the form of a small piece. In a sixth aspect of the present invention, there is provided a method of manufacturing a radiator in which a good heat conductor 3 having higher thermal conductivity than the fin base 2 is embedded in the fin base 2 on which the heat radiation fin 1 is provided, The fin base portion 2 is divided, and a small piece 4 of the thermal conductor 3 is mixed between the divided bases 2a, 2a and extruded.
【０００９】請求項１の構成においては、フィン基台部
２を分割することがなく、フィン基台部２は一体化され
ていて、膨張・収縮が繰り返されてもフィン基台部２と
熱良導体３が剥離することがなく、結果として、フィン
基台部２の熱伝導性を長期にわたって向上させることが
できる。請求項２の構成においては、請求項１に加え
て、熱良導体３は市販されているような銅板でよく、特
別に製作する必要がなく、結果として、放熱器Ａを安価
に製造できる。In the structure of the first aspect, the fin base 2 is not divided, and the fin base 2 is integrated, so that the fin base 2 and the fin base 2 are kept in heat even when expansion and contraction are repeated. The good conductor 3 does not peel off, and as a result, the thermal conductivity of the fin base 2 can be improved over a long period of time. In the structure of the second aspect, in addition to the first aspect, the thermal conductor 3 may be a commercially available copper plate, and does not need to be specially manufactured. As a result, the radiator A can be manufactured at low cost.
【００１０】請求項３の構成においては、請求項１に加
えて、板状のものと比べて使用量が少なく、一層、安価
に製造できる。請求項４の構成においては、請求項１乃
至請求項３のいずれかに記載の発明に加えて、押出し部
材をどのような位置で切断し、どのような長さで製品に
しても熱良導体３を略均一に含有していて、熱伝導のば
らつきが生じることがなく、製品の機能を安定化させる
ことができる。[0010] In the structure of the third aspect, in addition to the first aspect, the amount of use is smaller than that of the plate-shaped one, and it can be manufactured at a lower cost. In the configuration of claim 4, in addition to the invention described in any one of claims 1 to 3, the extruded member is cut at any position and the product is produced at any length. Is contained substantially uniformly, and there is no variation in heat conduction, and the function of the product can be stabilized.
【００１１】請求項５の構成においては、請求項１に加
えて、板状や線材のものと比べて使用量が少なく、一
層、安価に製造できる。請求項６の構成においては、分
割された分割基台２ａ，２ａ間に熱良導体３としての小
片が混入していて、板状の熱良導体に比べて、熱良導体
３自体が一体化されていなく、膨張・収縮時の反りを軽
減でき、フィン基台部２と熱良導体３との剥離を回避で
き、それでいて、押出し部材をどのような位置で切断
し、どのような長さで製品にしても熱良導体３を略均一
に含有していて、熱伝導のばらつきが生じることがな
く、製品の機能を安定化させることができる。According to the fifth aspect of the present invention, in addition to the first aspect, the amount of use is smaller than that of a plate-like or wire rod, and it can be manufactured at a lower cost. In the configuration of claim 6, a small piece as the good heat conductor 3 is mixed between the divided bases 2a, 2a, and the good heat conductor 3 itself is not integrated as compared with the plate-like good heat conductor. In addition, it is possible to reduce the warpage at the time of expansion and contraction, and to avoid separation between the fin base portion 2 and the good thermal conductor 3, and yet cut the extruded member at any position and at any length to produce a product. Since the thermal conductor 3 is contained substantially uniformly, the function of the product can be stabilized without variation in thermal conduction.
【００１２】[0012]
（実施の形態１）図１は本発明の請求項１、請求項２及
び請求項４に関する実施の形態１を示し、同図（ａ）は
斜視図、同図（ｂ）は断面図である。図において矢印イ
は押出し成形方向を示している。(Embodiment 1) FIGS. 1A and 1B show a first embodiment of the present invention, wherein FIG. 1A is a perspective view, and FIG. 1B is a sectional view. . In the figure, arrow A indicates the direction of extrusion molding.
【００１３】放熱器Ａは、放熱フィン１を一連に設けた
フィン基台部２の内部にフィン基台部２よりも熱伝導性
の良い熱良導体３を埋設させたものである。放熱フィン
１及びフィン基台部２は、例えば、アルミニウムを用い
る。熱良導体３は市販されている銅板を用いる。熱良導
体３をフィン基台部２に埋設させるのに、押出し成形す
るものであり、埋設されるフィン基台部２の表裏にフィ
ン基台部２を分割することがなく、フィン基台部２は一
体化されている。押出し成形された押出し部材を必要な
長さに切断して製品とする。The radiator A has a fin base 2 provided with a series of radiating fins 1 and a heat conductor 3 having a higher thermal conductivity than the fin base 2 embedded therein. The radiation fins 1 and the fin base 2 are made of, for example, aluminum. As the thermal conductor 3, a commercially available copper plate is used. Extrusion molding is performed to bury the thermal conductor 3 in the fin base 2, and the fin base 2 is not divided on the front and back of the buried fin base 2. Are integrated. The extruded extruded member is cut into a required length to obtain a product.
【００１４】この場合、熱良導体３の銅板は特別に形成
されたものではなく、通常市販されているものでよい。
熱良導体３は銅に限らず、アルミニウムよりも熱伝導性
の良いものであればよい。しかして、膨張・収縮が繰り
返されても、フィン基台部２は分割されていなく、フィ
ン基台部２と熱良導体３が剥離することがなく、結果と
して、フィン基台部２の熱伝導性を長期にわたって向上
させることができる。In this case, the copper plate of the thermal conductor 3 is not specially formed but may be a commercially available one.
The good thermal conductor 3 is not limited to copper, and may be any material having better thermal conductivity than aluminum. Thus, even if expansion and contraction are repeated, the fin base 2 is not divided, and the fin base 2 and the good heat conductor 3 do not peel off. As a result, the heat conduction of the fin base 2 Properties can be improved over a long period of time.
【００１５】（実施の形態２）図２は本発明の請求項
１、請求項３及び請求項４に関する実施の形態２を示
し、同図（ａ）は斜視図、同図（ｂ）は断面図である。
図において矢印イは押出し成形方向を示している。但
し、本実施の形態の基本構成は実施の形態１と共通であ
り、共通する部分については同一の符号を付して説明は
省略する。(Embodiment 2) FIG. 2 shows a second embodiment according to claims 1, 3 and 4 of the present invention, wherein FIG. 2 (a) is a perspective view and FIG. FIG.
In the figure, arrow A indicates the direction of extrusion molding. However, the basic configuration of the present embodiment is the same as that of the first embodiment, and the common components are denoted by the same reference numerals and description thereof is omitted.
【００１６】本実施の形態２においては、熱良導体３は
複数の銅線を用い、互いに平行にフィン基台部２内に埋
設される。銅線は特別に用意されたものではなく、通常
市販されているものでよい。しかして、熱良導体３は市
販されているような銅線でよく、特別に製作する必要が
なく、放熱器Ａを安価に製造できる。In the second embodiment, the thermal conductor 3 is embedded in the fin base 2 in parallel with each other using a plurality of copper wires. The copper wire is not specially prepared but may be a commercially available one. The heat conductor 3 may be a commercially available copper wire, and does not need to be specially manufactured, and the radiator A can be manufactured at low cost.
【００１７】（実施の形態３）図３は本発明の請求項
１、請求項４及び請求項５に関する実施の形態３を示
し、同図（ａ）は斜視図、同図（ｂ）は断面図である。
図において矢印イは押出し方向を示している。但し、本
実施の形態の基本構成は実施の形態１と共通であり、共
通する部分については同一の符号を付して説明は省略す
る。(Embodiment 3) FIGS. 3A and 3B show a third embodiment of the present invention, wherein FIG. 3A is a perspective view, and FIG. FIG.
In the figure, arrow A indicates the direction of extrusion. However, the basic configuration of the present embodiment is the same as that of the first embodiment, and the common components are denoted by the same reference numerals and description thereof is omitted.
【００１８】熱良導体３は銅の小片４を用いる。 （実施の形態４）図４は本発明の請求項６における放熱
器Ａの製造方法に関する概略図である。本実施の形態４
においては、実施の形態１に対して、熱良導体３の形状
及び製造方法のみが違うので、それ以外の説明は省略す
る。As the thermal conductor 3, small copper pieces 4 are used. (Embodiment 4) FIG. 4 is a schematic view showing a method of manufacturing a radiator A according to claim 6 of the present invention. Embodiment 4
In this embodiment, only the shape and manufacturing method of the good thermal conductor 3 are different from those of the first embodiment, and the other description is omitted.
【００１９】熱良導体３は銅の小片４を用いる。フィン
基台部２は分割され、その分割基台２ａ，２ａ間に熱良
導体３を均一に散布する。その後、分割基台２ａ，２ａ
の分割面を再び合わせた状態で、上下型７，８及び受型
９間に保持し、ダイス６を矢印ロ方向に圧入して、放熱
器Ａを成形するのである。この場合、フィン基台部２間
に熱良導体３の小片４…が埋設され、板状の熱良導体に
比べて、熱良導体３自体が一体化されていなく、膨張・
収縮時の反りを軽減でき、フィン基台部２と熱良導体３
との剥離を回避できるものである。図４においては、主
としてフィン基台部２を示したが、フィン基台部２には
放熱フィン（図示せず）が一連に形成されているもので
ある。As the thermal conductor 3, small copper pieces 4 are used. The fin base portion 2 is divided, and the good thermal conductor 3 is uniformly spread between the divided bases 2a. Then, the divided bases 2a, 2a
The radiator A is formed by holding the space between the upper and lower dies 7, 8 and the receiving die 9 in a state where the divided surfaces are aligned again, and press-fitting the die 6 in the direction of arrow B. In this case, the small pieces 4 of the good heat conductor 3 are embedded between the fin bases 2, and the good heat conductor 3 itself is not integrated as compared with the plate-like good heat conductor.
The warpage during shrinkage can be reduced, and the fin base 2 and the thermal conductor 3
Can be avoided. FIG. 4 mainly shows the fin base 2, but the fin base 2 is formed with a series of radiation fins (not shown).
【００２０】[0020]
【発明の効果】請求項１の発明においては、放熱フィン
を設けたフィン基台部にフィン基台部よりも熱伝導性の
良い熱良導体を埋設した放熱器であって、フィン基台部
は分割されていないから、フィン基台部は埋設された熱
良導体の表裏において分割することがなく、フィン基台
部は一体化されていて、膨張・収縮が繰り返されてもフ
ィン基台部と熱良導体が剥離することがなく、結果とし
て、フィン基台部の熱伝導性を長期にわたって向上させ
ることができるという利点がある。According to the first aspect of the present invention, there is provided a radiator in which a good heat conductor having better heat conductivity than a fin base is embedded in a fin base provided with a radiation fin. Since the fin base is not divided, the fin base does not divide on the front and back of the buried thermal conductor, and the fin base is integrated. There is an advantage that the good conductor does not peel off, and as a result, the thermal conductivity of the fin base can be improved over a long period of time.
【００２１】請求項２の発明においては、請求項１に加
えて、熱良導体は板状のものであるから、熱良導体は市
販されているような銅板でよく、特別に製作する必要が
なく、結果として、放熱器を安価に製造できるという利
点がある。請求項３の発明においては、請求項１に加え
て、熱良導体は線状のものであるから、板状のものと比
べて使用量が少なく、一層、安価に製造できるという利
点がある。According to the second aspect of the present invention, in addition to the first aspect, since the thermal conductor is a plate-like material, the thermal conductor may be a commercially available copper plate and does not need to be specially manufactured. As a result, there is an advantage that the radiator can be manufactured at low cost. According to the third aspect of the present invention, in addition to the first aspect, since the thermal conductor is a wire, it has an advantage that it can be used in a smaller amount than a plate-like conductor and can be manufactured more inexpensively.
【００２２】請求項４の発明においては、請求項１乃至
請求項３のいずれかに記載の発明に加えて、放熱フィン
及びフィン基台部は押出し成形され、熱良導体は押出し
成形方向に伸びているから、押出し部材をどのような位
置で切断し、どのような長さで製品にしても熱良導体３
を略均一に含有していて、熱伝導のばらつきが生じるこ
とがなく、製品の機能を安定化させることができるとい
う利点がある。According to a fourth aspect of the present invention, in addition to any one of the first to third aspects, the radiating fins and the fin base are extruded, and the thermal conductor extends in the extrusion molding direction. Therefore, the extruded member can be cut at any position and the product can be made at any length.
Is substantially uniformly contained, and there is an advantage that the function of the product can be stabilized without causing variation in heat conduction.
【００２３】請求項５の発明においては、請求項１に加
えて、熱良導体は、小片状のものであるから、板状や線
材のものと比べて使用量が少なく、一層、安価に製造で
きるという利点がある。請求項６の発明においては、放
熱フィンを設けたフィン基台部の内部にフィン基台部よ
りも熱伝導性の良い熱良導体を埋設させた放熱器の製造
方法であって、フィン基台部を分割し、分割された分割
基台間に熱良導体の小片を混入させて押出し成形するか
ら、板状の熱良導体に比べて、熱良導体自体が一体化さ
れていなく、膨張・収縮時の反りを軽減でき、フィン基
台部と熱良導体との剥離を回避でき、それでいて、押出
し部材をどのような位置で切断し、どのような長さで製
品にしても熱良導体を略均一に含有していて、熱伝導の
ばらつきが生じることがなく、製品の機能を安定化させ
ることができるという利点がある。According to the fifth aspect of the present invention, in addition to the first aspect, since the good thermal conductor is in the form of small pieces, it is used in a smaller amount as compared with a plate-like or wire material, and is manufactured at a lower cost. There is an advantage that you can. According to a sixth aspect of the present invention, there is provided a method for manufacturing a radiator in which a good heat conductor having higher thermal conductivity than a fin base is embedded in a fin base provided with a radiation fin. Is extruded by mixing small pieces of a good heat conductor between the divided bases and extruding.Therefore, the good heat conductor itself is not integrated compared to a plate-like heat conductor, and warpage during expansion and contraction. The extruded member can be cut at any position, and the product can be cut at any length. Therefore, there is an advantage that the function of the product can be stabilized without causing variation in heat conduction.
【図１】本発明の実施の形態１を示し、（ａ）は斜視
図、（ｂ）は熱良導体の埋設部分の断面図である。FIGS. 1A and 1B show a first embodiment of the present invention, in which FIG. 1A is a perspective view, and FIG. 1B is a cross-sectional view of a buried portion of a good heat conductor.
【図２】実施の形態２を示し、（ａ）は斜視図、（ｂ）
は熱良導体の埋設部分の断面図である。FIGS. 2A and 2B show a second embodiment, in which FIG. 2A is a perspective view and FIG.
3 is a cross-sectional view of a buried portion of a good thermal conductor.
【図３】実施の形態３を示し、（ａ）は斜視図、（ｂ）
は熱良導体の埋設部分の断面図である。3A and 3B show a third embodiment, wherein FIG. 3A is a perspective view and FIG.
FIG. 3 is a cross-sectional view of a buried portion of a thermal conductor.
【図４】製造方法を示す概略断面図である。FIG. 4 is a schematic sectional view showing a manufacturing method.
【図５】従来例の斜視図である。FIG. 5 is a perspective view of a conventional example.
１ 放熱フィン ２ フィン基台部 ３ 熱良導体 ４ 小片 Ａ 放熱器 DESCRIPTION OF SYMBOLS 1 Heat radiation fin 2 Fin base part 3 Good conductor 4 Small piece A Heat sink
Claims (6)
ン基台部よりも熱伝導性の良い熱良導体を埋設した放熱
器であって、フィン基台部は埋設された熱良導体の表裏
において分割されていないことを特徴とする放熱器。1. A radiator in which a heat conductor having better heat conductivity than a fin base portion is embedded in a fin base portion provided with a radiation fin, wherein the fin base portion is provided on both sides of the embedded heat good conductor. A radiator characterized by being not divided.
とする請求項１記載の放熱器。2. The radiator according to claim 1, wherein the thermal conductor has a plate shape.
とする請求項１記載の放熱器。3. The radiator according to claim 1, wherein the thermal conductor is linear.
形され、熱良導体は押出し成形方向に伸びていることを
特徴とする請求項１乃至請求項３のいずれかに記載の放
熱器。4. The radiator according to claim 1, wherein the radiating fin and the fin base are extruded, and the thermal conductor extends in the extruding direction.
特徴とする請求項１記載の放熱器。5. The radiator according to claim 1, wherein the thermal conductor is a small piece.
にフィン基台部よりも熱伝導性の良い熱良導体を埋設さ
せた放熱器の製造方法であって、フィン基台部を分割
し、分割された分割基台間に熱良導体の小片を混入させ
て押出し成形することを特徴とする放熱器の製造方法。6. A method of manufacturing a radiator in which a heat conductor having better thermal conductivity than a fin base is embedded in a fin base provided with a radiation fin, wherein the fin base is divided. A method of manufacturing a radiator, comprising mixing a small piece of a good heat conductor between the divided bases and extruding the mixture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21883497A JPH1168359A (en) | 1997-08-13 | 1997-08-13 | Heat radiator and manufacture therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21883497A JPH1168359A (en) | 1997-08-13 | 1997-08-13 | Heat radiator and manufacture therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1168359A true JPH1168359A (en) | 1999-03-09 |
Family
ID=16726080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21883497A Withdrawn JPH1168359A (en) | 1997-08-13 | 1997-08-13 | Heat radiator and manufacture therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1168359A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001168247A (en) * | 1999-12-09 | 2001-06-22 | Mitsubishi Electric Corp | Heat sink |
| DE10053240A1 (en) * | 2000-08-28 | 2002-04-04 | Alusuisse Tech & Man Ag | Heat sinks for semiconductor elements, processes for their production and molds therefor |
| WO2002078417A1 (en) * | 2001-03-26 | 2002-10-03 | Jong-Mahn Lee | Heat sink and method for manufacturing the same |
| KR20040019150A (en) * | 2002-08-26 | 2004-03-05 | (주) 대홍기업 | flat type heat pipe and heat sink |
| US20140083671A1 (en) * | 2012-09-27 | 2014-03-27 | Dowa Metaltech Co., Ltd. | Heat radiating plate and method for producing same |
| CN110662924A (en) * | 2017-12-14 | 2020-01-07 | 周兆泰 | Semiconductor refrigerating and heating air conditioner |
-
1997
- 1997-08-13 JP JP21883497A patent/JPH1168359A/en not_active Withdrawn
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001168247A (en) * | 1999-12-09 | 2001-06-22 | Mitsubishi Electric Corp | Heat sink |
| DE10053240A1 (en) * | 2000-08-28 | 2002-04-04 | Alusuisse Tech & Man Ag | Heat sinks for semiconductor elements, processes for their production and molds therefor |
| WO2002078417A1 (en) * | 2001-03-26 | 2002-10-03 | Jong-Mahn Lee | Heat sink and method for manufacturing the same |
| KR20040019150A (en) * | 2002-08-26 | 2004-03-05 | (주) 대홍기업 | flat type heat pipe and heat sink |
| US20140083671A1 (en) * | 2012-09-27 | 2014-03-27 | Dowa Metaltech Co., Ltd. | Heat radiating plate and method for producing same |
| KR20140041364A (en) * | 2012-09-27 | 2014-04-04 | 도와 메탈테크 가부시키가이샤 | Heat radiating plate and method for producing same |
| EP2713391A3 (en) * | 2012-09-27 | 2017-11-08 | Dowa Metaltech Co., Ltd. | Heat radiating plate and method for producing same |
| US10619948B2 (en) | 2012-09-27 | 2020-04-14 | Dowa Metaltech Co., Ltd. | Heat radiating plate with supporting members and protrusion members |
| US11162745B2 (en) | 2012-09-27 | 2021-11-02 | Dowa Metaltech Co., Ltd. | Heat radiating plate and method for producing same |
| CN110662924A (en) * | 2017-12-14 | 2020-01-07 | 周兆泰 | Semiconductor refrigerating and heating air conditioner |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20041102 |