JPS599160A - Electroless dispersion plating method - Google Patents
Electroless dispersion plating methodInfo
- Publication number
- JPS599160A JPS599160A JP11928582A JP11928582A JPS599160A JP S599160 A JPS599160 A JP S599160A JP 11928582 A JP11928582 A JP 11928582A JP 11928582 A JP11928582 A JP 11928582A JP S599160 A JPS599160 A JP S599160A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- dispersion
- fluororesin
- electroless
- plating bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】 本発明は、無電解分散メツギガ法に関する。[Detailed description of the invention] The present invention relates to an electroless dispersion method.
さらに詳しくは、フッ素樹脂を分散材とする分散メッキ
法の改良に関するものである。More specifically, the present invention relates to an improvement in a dispersion plating method using a fluororesin as a dispersion material.
一般に、フッ素樹脂を分散材として用いる分散メッキに
よって得られるメッキ被膜は、フッ素樹脂の特性をよく
示す被膜となる。すなわち、ニッケルあるいは銅等をマ
トリクスと１１、分散材としてフッ素樹脂（以下（ＣＦ
）ｎと略す）を用いた場合、得られるＮ１−（ＣＦ）ｎ
あるいはＣｕ −（ＣＦ’ル１等の分散メッキ被膜は、
耐熱性、潤滑性１寸たマ） ＩＪクス中に共析したフッ
素樹脂により、かじり、焼付の防止ができ、良好な離型
性を持１）などの特性を有する。Generally, a plated film obtained by dispersion plating using a fluororesin as a dispersion material exhibits characteristics of the fluororesin well. That is, nickel or copper is used as a matrix 11, and a fluororesin (hereinafter referred to as CF) is used as a dispersion material.
)n), the obtained N1-(CF)n
Alternatively, a dispersion plating film such as Cu-(CF'le 1) is
Heat resistance, lubrication properties (1) The fluororesin eutectoided in the IJ gas prevents galling and seizure, and has the following properties: 1) Good mold release properties.
ところが、マトリクスをニッケルとし、スルファミン酸
ニッケル浴を用い、分散相としてフッ素樹脂、たとえば
ＰＴＦ）（（ポリ四フッ化エチレン）を用いた分散メッ
キの場合、スルフアミノ酸ニッケル浴にＰ Ｔ’ Ｆ
Ｂを懸濁させ、７．１ｐ気攪拌しながらメッキを行う。However, in the case of dispersion plating in which the matrix is nickel, a nickel sulfamate bath is used, and a fluororesin, such as PTF) ((polytetrafluoroethylene), is used as the dispersed phase, P T'F is added to the nickel sulfamino acid bath.
B is suspended and plating is performed while stirring at 7.1p.
しかし、Ｐ’ｌｌ下Ｅの比重が小さく、メッキ液の比重
と差がないこと、Ｐ′ｒＦＥの非粘着性すなわち、その
表面張力が犬きく、表面がぬれ離いことなどが原因とな
って、メッキ浴に対するＰ ’Ｉ’ Ｆ Ｅのなじみが
悪く、メッキ浴を空気攪拌しながら、））Ｔ ｌ” Ｅ
を投入しても、１）Ｔ Ｆ Ｅの一部が気泡とともに浮
ヒし、メッキ液表面にクリーン・状の発泡層を形成する
。しだがって、被メッキ物を、メッキ浴に出し入れする
際、門１ ｌｉｔ Ｅが被メッキ物に付着して作業性を
悪くする。However, the specific gravity of P'll lower E is small and there is no difference with the specific gravity of the plating solution, and the non-adhesive property of P'rFE, that is, its surface tension is high and the surface becomes wet and separates. , P 'I' F E was not compatible with the plating bath, and while agitating the plating bath with air, )) T l” E
1) A part of TFE floats together with air bubbles, forming a clean foam layer on the surface of the plating solution. Therefore, when the objects to be plated are taken in and out of the plating bath, the gate 1 lit E adheres to the objects to be plated, which impairs work efficiency.
本発明はヒ記欠点を解決するだめに、特定の構］告をも
つ界面活性剤を該メッキ浴に絵力ｕ ｌ−１で、フッ素
樹脂のメッキ液面への浮ト１発泡を無くし、作業性全改
善しようとするもので、その要旨は、フン素樹脂を分散
材上する分散メッキにおいて、β−ナフタリンスルポン
酸ナトリウムのホルム゛アルデピド縮合物（以下Ｎ５Ｆ
Ｎａと略す）（口け１以トの整数）
をメッキ浴に対］−７で００１〜１０重量％添加したメ
ッキ液を使用することを特徴とする無璽解分散メノキカ
法にある。In order to solve the above drawbacks, the present invention adds a surfactant having a specific structure to the plating bath to eliminate foaming of the fluororesin floating on the surface of the plating solution. The aim is to completely improve workability, and the gist of this is that in dispersion plating on a fluororesin dispersion material, formaldepide condensate of sodium β-naphthalene sulfonate (hereinafter N5F) is used.
This method is characterized by using a plating solution in which Na (abbreviated as an integer of 1 or more) is added to the plating bath in an amount of 0.01 to 10% by weight based on -7.
この分散材として使用されるフッ素樹脂には、ポリ四ツ
ノ化エチレン（ＰＴＦＢ ） 、四フッ化エチレンー六
フッ化プロピレン共重合体（ＦＥＰ）。Fluororesins used as the dispersion material include polytetrafluoroethylene (PTFB) and tetrafluoroethylene-hexafluoropropylene copolymer (FEP).
四フッ化エヂレンーバーフルオローアルキルビニルエー
テル共重合体（ＰＦＡ ） 、ポリ塩化三フッ化エチレ
ン（］’ＣＴＦＥ ） 、ポリフッ化ヒニル’（ＰＶＦ
ン、ポリフッ化ビニリデン（ＰＶｄＦ’）、エチレン四
ツノ化エチレン共重合体（ｇ’ｌｌ”Ｆ）［Ｊ 。Ethylene tetrafluoride-fluoroalkyl vinyl ether copolymer (PFA), polychlorinated trifluoroethylene (CTFE), polyhinyl fluoride (PVF)
polyvinylidene fluoride (PVdF'), ethylene tetraethylene copolymer (g'll''F) [J.
エチレン−塩化三フッ化エチレン共重合体（ｇｃＴＦＥ
）等がある。Ethylene-chlorotrifluoroethylene copolymer (gcTFE
) etc.
メッキ浴に対して界面活性剤と１−５てＮ５ＦＮ、＋０
．０１〜１０重針チをＮｉ −（ＣＦ ）、分散メッキ
浴に添７Ｊ［ｌすると、Ｐ Ｔ Ｆ Ｉｃ等のフン素樹
脂？１７頂の表面のめれ性が顕著に改善さねる。従って
、メッキ浴中へ、該粒子が極めて良好に分散し１、空気
攪拌を行−）ても、メッキ液表面にクリーン、状の層を
形成することがなく、また、泡立ちも生じるこ七がない
−さらに、形成される分散メッキ箕被膜の物性にも悪い
影響を及ぼさない。ヒ記Ｎ５ＦＮａを０．０１￥Ｌ量チ
以下添加しても、所期の効果を得ることができず、１０
重量係以ヒ添加すると形成される分散メッキ被膜の物性
を低ドさせるおそれがある。1-5 N5FN, +0 with surfactant for plating bath
．． 01 to 10 heavy needles are added to Ni-(CF) and dispersion plating bath for 7J[l], then fluorine resin such as PTF Ic? The surface irregularity of the 17 apex is not significantly improved. Therefore, the particles are very well dispersed in the plating bath, and even when air agitation is performed, a clean layer is not formed on the surface of the plating solution, and foaming does not occur. No - Furthermore, it does not adversely affect the physical properties of the dispersed plating film formed. Note: Even if N5FNa is added in an amount of 0.01￥L or less, the desired effect cannot be obtained;
If added in excess of weight, there is a risk of deteriorating the physical properties of the dispersion plating film formed.
マトリクスとしでは、ニッケル、銅等を使用することが
でへる。Nickel, copper, etc. can be used as the matrix.
実施例
スルフアミノ酸ニッケル浴１ｅに対して、ＰＴＩｉ”Ｅ
を３ｏｖの割合で投入１＝ 、メッキ浴を攪拌した七こ
ろ、一部はメッキ浴中に懸濁せず、浴表面にクリーム状
の発泡層を形成し７た。For example sulfamino acid nickel bath 1e, PTIi”E
When the plating bath was stirred, some of the plating solution was not suspended in the plating bath and a creamy foam layer was formed on the bath surface.
そこで、このメッキ浴に界面活性剤Ｎ５ＦＮａを０３重
隈チ投入１−だところ、１０分後に、メッキ液表面のク
リーン・状の発泡層は消失し、Ｐ ｉ’ Ｆ Ｅはその
全量が完全に懸濁状態となった。Therefore, when the surfactant N5FNa was added to this plating bath in 0.3 layers, the clean foam layer on the surface of the plating solution disappeared after 10 minutes, and the entire amount of P i' F E was completely lost. It became a suspended state.
−ｊだ、このＮ５ＦＮａを投入しても、得られたメッキ
被膜の内部応力は低く、密着性も良好で、該メッキ被膜
のヒビ割れ、あるいは剥離は生じなかった。Even when this N5FNa was added, the internal stress of the resulting plating film was low, the adhesion was good, and the plating film did not crack or peel.
さらに、液表面にり＋） −１，状の発泡層が発生しな
いので、該メッキ作業が極めて容易となった。Furthermore, since no foam layer of +)-1 was formed on the liquid surface, the plating work became extremely easy.
手続補正書（自発）
昭和５７年８月２５日
昭和 ５７年 特お願 第 １１９２８５ 号２、
発明の名称
分散メッキ方法
３、補正をする者
事件との関係 特許出願人
住所
４、代 理 人〒１０７
ほか ２ 名
補正の内容
（１、発明の名称［無電解分散メッキ方法１を「分散メ
ッキ方法」と訂正する。Procedural amendment (voluntary) August 25, 1980 Special Request No. 119285 2,
Name of the invention Dispersion plating method 3, Relationship with the case of the person making the amendment Patent applicant address 4 Agent address 〒107 and 2 others Contents of the amendment (1. Name of the invention [Electroless dispersion plating method 1] corrected as "method".
（２）明細書の特許請求の範囲を別紙のと粒り訂正する
。(2) The scope of claims in the specification must be corrected in accordance with the attached document.
（Ｘ３） 同書第２頁第２行［無電解分散メッキ方法
１を「分散メッキ方法」と訂ＩＦするう
１４）同書第４自下から第１０行の「無電解」を特徴す
る
特許請求の範囲
フッ素樹脂を分散材とする分散メッキにおいて、β−ナ
フタリンスルホン酸ナトリウムのホルムアルデヒド縮合
物
（ｎは１以上の整数）(X3) Ibid., page 2, line 2 [Electroless dispersion plating method 1 is revised to "dispersion plating method"] 14) Patent claims featuring "electroless" in lines 4 to 10 of the same document Range For dispersion plating using fluororesin as a dispersion material, formaldehyde condensate of sodium β-naphthalene sulfonate (n is an integer of 1 or more)
Claims (1)
フタリンスルホン酸ナトリウノ・のホルノ、アルデヒド
縮金物 （ｎは１以ヒの整数） を０．０１〜１０重量％添加したメッキ液を使用するこ
とを特徴とする無電解分散メッキ方法。[Scope of Claims] Dispersion plating using fluororesin as a dispersing material, plating in which 0.01 to 10% by weight of β-naphthalene sulfonic acid sodium forno, aldehyde condensate (n is an integer of 1 or more) is added. An electroless dispersion plating method characterized by the use of a liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11928582A JPS599160A (en) | 1982-07-09 | 1982-07-09 | Electroless dispersion plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11928582A JPS599160A (en) | 1982-07-09 | 1982-07-09 | Electroless dispersion plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS599160A true JPS599160A (en) | 1984-01-18 |
Family
ID=14757604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11928582A Pending JPS599160A (en) | 1982-07-09 | 1982-07-09 | Electroless dispersion plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS599160A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2233982A (en) * | 1989-05-08 | 1991-01-23 | Wear Cote Int | Co-deposition of fluorinated carbon with electroless nickel |
| JPH0620497U (en) * | 1992-06-25 | 1994-03-18 | 石川島播磨重工業株式会社 | Press roll |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55164066A (en) * | 1979-06-08 | 1980-12-20 | Suzuki Motor Co Ltd | Method for composite plating |
-
1982
- 1982-07-09 JP JP11928582A patent/JPS599160A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55164066A (en) * | 1979-06-08 | 1980-12-20 | Suzuki Motor Co Ltd | Method for composite plating |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2233982A (en) * | 1989-05-08 | 1991-01-23 | Wear Cote Int | Co-deposition of fluorinated carbon with electroless nickel |
| JPH0620497U (en) * | 1992-06-25 | 1994-03-18 | 石川島播磨重工業株式会社 | Press roll |
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