JPS5988827A - Vapor drying device - Google Patents
Vapor drying deviceInfo
- Publication number
- JPS5988827A JPS5988827A JP19753482A JP19753482A JPS5988827A JP S5988827 A JPS5988827 A JP S5988827A JP 19753482 A JP19753482 A JP 19753482A JP 19753482 A JP19753482 A JP 19753482A JP S5988827 A JPS5988827 A JP S5988827A
- Authority
- JP
- Japan
- Prior art keywords
- drying
- container
- jig
- steam
- dried
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】 本発明は蒸気乾燥装置に関する。[Detailed description of the invention] The present invention relates to a steam drying apparatus.
一般の蒸気乾燥装置は、蒸気を発生させる媒体を入れた
容器を加熱させ、媒体を蒸発させて、その蒸気中に乾燥
すべき物体を保持し、物体の表面に媒体を凝縮させる構
造となっている。水分等は凝縮した媒体中に溶は込み、
水滴となって容器中に落下する。これをくりかえして物
体の水分等を取除くことによって乾燥させる。容器の上
部には蒸気が外に拡散しないよう冷却トラップがあり、
媒体を再び容器の中に落下させると同時に外の雰囲気の
状態を蒸気等で影響しないようにしている。A typical steam drying device heats a container containing a medium that generates steam, evaporates the medium, holds the object to be dried in the steam, and condenses the medium on the surface of the object. There is. Moisture etc. dissolves in the condensed medium,
Water droplets fall into the container. Repeat this process to remove moisture from the object and dry it. There is a cooling trap at the top of the container to prevent vapor from dispersing outside.
While the medium is dropped into the container again, the outside atmosphere is prevented from being affected by steam or the like.
ここで、従来の蒸気乾燥装置の一例を第１図に示す。こ
の装置は、ヒータ１上に容器２が設置され、その中に蒸
気媒体４が入っている。媒体４はヒータ１で加熱される
と、蒸気５となって物体（被乾燥物）７を乾燥させる。Here, an example of a conventional steam drying apparatus is shown in FIG. In this device, a container 2 is installed on a heater 1, and a vapor medium 4 is contained in the container 2. When the medium 4 is heated by the heater 1, it turns into steam 5 and dries the object (material to be dried) 7.
６の位置に達した蒸気５は冷却器３で再び液体にもどり
容器２底に向かって落下する。The steam 5 that has reached the position 6 turns back into liquid in the cooler 3 and falls toward the bottom of the container 2.
しかし、このような装置構造は乾燥容器中にウェハ等の
被乾燥物と蒸気の媒体があって、被乾燥物表面に凝縮し
た液が再び溶液にもどる。このため、溶液中の水分や塵
埃が再び蒸気と共に浮遊し、被乾燥物に付着するおそれ
がある。ｔ７たがって、被乾燥物の乾燥が不完全になっ
たり、塵埃が付着したりして悪影響を与えることが考え
られる。However, in such an apparatus structure, there is an object to be dried, such as a wafer, and a vapor medium in a drying container, and the liquid condensed on the surface of the object to be dried returns to a solution. For this reason, there is a possibility that moisture and dust in the solution will float together with the vapor again and adhere to the object to be dried. t7 Therefore, it is conceivable that the drying material may not be completely dried or that dust may adhere thereto, which may have an adverse effect.
本発明は以上のような欠点を解消しようとするものであ
って、その目的とするところは塵埃付着汚染の可能性が
ないクリーンな乾燥ができろ蒸気乾燥装置を提供するこ
とにある。The present invention aims to eliminate the above-mentioned drawbacks, and its purpose is to provide a steam drying apparatus that can perform clean drying without the possibility of dust adhesion and contamination.
以下、実施例により本発明を説明する。The present invention will be explained below with reference to Examples.
第２図は本発明の一実施例による蒸気乾燥装置の要部を
示す断面図である。この実施例の容器２はその容器底部
に蒸発媒体４を収容する。また、容器２の底部外壁には
ヒータ１が増り付けられていて、容器２内の媒体４を加
熱して蒸発させる。FIG. 2 is a sectional view showing essential parts of a steam drying apparatus according to an embodiment of the present invention. The container 2 in this embodiment contains the evaporative medium 4 at its bottom. Further, a heater 1 is additionally attached to the bottom outer wall of the container 2, and the medium 4 in the container 2 is heated and evaporated.
容器の上側部には蒸気供給空間８が設けられ、隣接配置
される乾燥室９の上部と連通している。この乾燥室９は
下部が開口するとともに、下端周縁は内側に突出し側溝
１０を有している。この側溝１０の上方には冷却器３が
配設されている。このため、蒸気供給空間８から乾燥室
９に入り乾燥室９の内壁に付着する蒸気は壁面で凝固し
て内壁を伝わって側溝１０に入る。この側溝１０は容器
２と導孔１１を介して連通している。この結果、側溝１
０に入った媒体４は容器底に流れ込む。A steam supply space 8 is provided in the upper part of the container and communicates with the upper part of a drying chamber 9 arranged adjacently. The drying chamber 9 is open at the bottom, and has a side groove 10 that protrudes inward from the lower edge. A cooler 3 is disposed above this side gutter 10. Therefore, the steam that enters the drying chamber 9 from the steam supply space 8 and adheres to the inner wall of the drying chamber 9 solidifies on the wall surface, travels along the inner wall, and enters the side gutter 10. This side gutter 10 communicates with the container 2 via a guide hole 11. As a result, gutter 1
The medium 4 that has entered zero flows into the bottom of the container.
一方、乾燥室９の中央には被乾燥物である半導体ウェハ
７を収容した治具１２を載置する受皿１３が配設されて
いる。この受皿１３はその周縁に上方に突出する突堤１
４を有していて、半導体ウェハ７および治具１２から滴
り落ちる水滴を受けて収容するようになっている。、−
ｊＦ、た、受皿１３は排水管１５によって支持されてい
る。そして、受皿１３上の廃液はこの排水管１５から排
水されろ。On the other hand, in the center of the drying chamber 9, a tray 13 is provided on which a jig 12 containing a semiconductor wafer 7, which is an object to be dried, is placed. This saucer 13 has a jetty 1 projecting upward on its periphery.
4, and is adapted to receive and accommodate water droplets dripping from the semiconductor wafer 7 and the jig 12. ,−
The saucer 13 is supported by a drain pipe 15. Then, the waste liquid on the saucer 13 is drained from this drain pipe 15.
受皿１３および排水管１５はこのように廃液を排水する
排出機構を形作っている。The saucer 13 and the drain pipe 15 thus form a discharge mechanism for draining the waste liquid.
このような実施例では、半導体ウェハ７および治具１２
を乾燥するに供された蒸気は、半導体ウェハ７および治
具１２の表面で凝固し、水滴となって受皿１３上に載り
、排水管１５から排出される。このため、塵埃を含んだ
媒体４（廃液）が再び容器２内に流れ込むことはない。In such an embodiment, the semiconductor wafer 7 and the jig 12
The steam used to dry the semiconductor wafer 7 and the jig 12 solidify on the surfaces of the semiconductor wafer 7 and the jig 12, become water droplets, land on the saucer 13, and are discharged from the drain pipe 15. Therefore, the medium 4 (waste liquid) containing dust will not flow into the container 2 again.
したかつて、容器底からは常に清浄な蒸気が発生させら
れるため、乾燥室９での半導体ウェハ７および治具１２
は常圧塵埃に汚染されることなく乾燥されることになる
。Since clean steam is always generated from the bottom of the container, the semiconductor wafers 7 and the jig 12 in the drying chamber 9
will be dried without being contaminated by atmospheric dust.
なお、本発明は前記実施例に限定され１．「い。例えば
前述の蒸気乾燥装置に、乾燥油被処理物を冷却する機構
を付加すれば被処理物を冷却する前処理をほどこした後
乾燥することができ蒸気の伺着量を増加させ乾燥の効果
をより高めることが可能となる。It should be noted that the present invention is limited to the above-mentioned embodiments, and 1. For example, if a mechanism for cooling the dried oil to be processed is added to the steam drying equipment mentioned above, it is possible to perform pre-treatment to cool the processed material and then dry it, increasing the amount of steam that arrives and drying. It becomes possible to further enhance the effect of
以上のように、本発明の蒸気乾燥装置によれば、被乾燥
物（含治具）を乾燥するために供されてかつ被乾燥物に
触れて凝固した媒体は排出される。As described above, according to the steam drying apparatus of the present invention, the medium that is used for drying the object to be dried (including the jig) and that has solidified upon contact with the object to be dried is discharged.
このため、常に蒸気の清浄化が維持でき、被乾燥物のク
リーンな乾燥が可能となる。このような乾燥装置は微細
加工化が激しい半導体装Ｒ製造に使用すれば、製品歩留
の向上をもたらすことになる。Therefore, the cleanliness of the steam can be maintained at all times, making it possible to cleanly dry the material to be dried. If such a drying apparatus is used in the manufacture of semiconductor devices R where microfabrication is intensive, the product yield will be improved.
第１図は従来の蒸気乾燥装置の要部を示す断面図、
第２図は本発明の一実施例による蒸気乾燥装置の要部を
示す断面図である。
１・・・ヒータ、２・・・容器、３・・・冷却器、４・
・・媒体、５・・・蒸気、７・・・半導体ウエノ・、９
・・・乾燥室、１０・・・側溝、１２・・・治具、１３
・・・受皿、１５・・・排水管。
第 １ 図
第 ２ 図FIG. 1 is a sectional view showing the main parts of a conventional steam drying apparatus, and FIG. 2 is a sectional view showing the main parts of a steam drying apparatus according to an embodiment of the present invention. 1... Heater, 2... Container, 3... Cooler, 4...
...Medium, 5...Steam, 7...Semiconductor Ueno...9
...Drying room, 10...Gutter, 12...Jig, 13
...Saucer, 15...Drain pipe. Figure 1 Figure 2
Claims (1)
した蒸気乾燥装置において、前記蒸気室内には被乾燥物
または被乾燥物を収容する治具から滴り落ちる水滴を受
けかつ排出する排出機構が設けられていることを特徴と
する蒸気乾燥装置。 ２、被乾燥物または被乾燥物を収容する治具を乾燥前に
冷却する機構を有していることを特徴とする特許請求の
範囲第１項記載の蒸気乾燥装置。[Claims] 1. In a steam drying apparatus having a drying chamber filled with steam in which a material to be dried is stored, the steam chamber contains drippings from the material to be dried or a jig containing the material to be dried. A steam drying device characterized by being provided with a discharge mechanism for receiving and discharging water droplets. 2. The steam drying apparatus according to claim 1, further comprising a mechanism for cooling the object to be dried or a jig for accommodating the object to be dried before drying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19753482A JPS5988827A (en) | 1982-11-12 | 1982-11-12 | Vapor drying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19753482A JPS5988827A (en) | 1982-11-12 | 1982-11-12 | Vapor drying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5988827A true JPS5988827A (en) | 1984-05-22 |
Family
ID=16376059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19753482A Pending JPS5988827A (en) | 1982-11-12 | 1982-11-12 | Vapor drying device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5988827A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6166937U (en) * | 1984-10-08 | 1986-05-08 | ||
| KR100648166B1 (en) | 2004-12-28 | 2006-11-28 | 동부일렉트로닉스 주식회사 | Process chamber with particle collector |
-
1982
- 1982-11-12 JP JP19753482A patent/JPS5988827A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6166937U (en) * | 1984-10-08 | 1986-05-08 | ||
| KR100648166B1 (en) | 2004-12-28 | 2006-11-28 | 동부일렉트로닉스 주식회사 | Process chamber with particle collector |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100452542B1 (en) | Method and apparatus for driving washed objects | |
| KR940004739A (en) | Substrate Drying Equipment | |
| US5535525A (en) | Vapor/liquid phase separator for an open tank IPA-dryer | |
| US4745690A (en) | Method of replenishing and/or preparing treating liquids | |
| US4307518A (en) | Process for removing water from surfaces of articles and water removing bath for use in the process | |
| JPS5988827A (en) | Vapor drying device | |
| US4078974A (en) | Vapor generating and recovering apparatus including vapor condenser control means | |
| JPS63182818A (en) | Drying device | |
| JP3040306B2 (en) | Steam cleaning equipment | |
| US2801958A (en) | Sludge cleaner | |
| JPH0629276A (en) | Drier and washer | |
| JPH0622225B2 (en) | Surface treatment equipment | |
| JPS59117126A (en) | Vapor dryer | |
| US4510053A (en) | Vapor degreaser apparatus | |
| JPS6311175Y2 (en) | ||
| JPH058676Y2 (en) | ||
| JP3477994B2 (en) | Semiconductor wafer drying equipment | |
| JP2880549B2 (en) | Work drying method and apparatus | |
| JPS62245639A (en) | Vapor drying device | |
| SU889044A1 (en) | Method of regenerating filtering elements | |
| KR960013498B1 (en) | Ipa vapor dryer | |
| JPS58207638A (en) | Vapor drying device | |
| JPS595326B2 (en) | Steam drying tank using fluorinated chlorinated hydrocarbons | |
| JP3273282B2 (en) | Processing equipment | |
| JPH08181100A (en) | Vapor drying device |