JPS5979774A - Thermal head with plural heating element arrays - Google Patents
Thermal head with plural heating element arraysInfo
- Publication number
- JPS5979774A JPS5979774A JP19101182A JP19101182A JPS5979774A JP S5979774 A JPS5979774 A JP S5979774A JP 19101182 A JP19101182 A JP 19101182A JP 19101182 A JP19101182 A JP 19101182A JP S5979774 A JPS5979774 A JP S5979774A
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- thermal head
- substrates
- fitted
- recording paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明はファクシミリ等に適用する多色記録用の一す−
マルヘッド（特願昭５７−６２９５２号参照）の構成に
門するものである。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a multicolor recording device for facsimile, etc.
It is based on the structure of the Marhead (see Japanese Patent Application No. 57-62952).
第１図はサーマルヘッドを用いる多色記録方法の原理を
示すものである。１はサーマルヘッド、Ｉａは発熱体基
板、１ｂは発熱体幕板１ａを支持する支持基台、２は記
録紙、３は転写フィルム、３ａはベースフィルム、３ｂ
はインク層、４はプラテンローラである。第２図は前記
サーマルヘッド１の構成を示すものであり、５は発熱体
アレイ、６はダイオードチップである。FIG. 1 shows the principle of a multicolor recording method using a thermal head. 1 is a thermal head, Ia is a heating element substrate, 1b is a support base that supports the heating element curtain plate 1a, 2 is a recording paper, 3 is a transfer film, 3a is a base film, 3b
4 is an ink layer, and 4 is a platen roller. FIG. 2 shows the structure of the thermal head 1, in which 5 is a heating element array and 6 is a diode chip.
また第３図は発熱体５′とダイオード９の電気的な結線
図であり、７は発熱体駆動回路、８．〜８４は発熱体ア
レイ選択端子である。FIG. 3 is an electrical connection diagram of the heating element 5' and the diode 9, where 7 is a heating element drive circuit, 8. -84 are heating element array selection terminals.
次に、第１図（４色記録の例）のＱ１作原理を簡単に説
明する。転写フィルム３は、距離りの幅を単位として各
種の色のインク１ｍ、９１３．〜３ｂ。Next, the principle of Q1 operation shown in FIG. 1 (an example of four-color recording) will be briefly explained. The transfer film 3 is coated with ink of various colors in units of 1 m, 913. ~3b.
を有し、この例では４色である。またサーマルヘッド１
も４個具備しており、その距離はＬである。サーマルヘ
ッドに両信号が入力すると、所望の発熱体５′が発熱し
、ベースフィルム３ａを介して直下のインクを溶融し、
記録紙２にインクを転写する。ここで、転写フィルム３
の送行速度ｖ８は紙送り速度に比べ非常に遅いため、４
つのサーマルヘッド１は定められた３ｂ１〜３ｂ、の４
色のインクの記録紙２への転写を記録動作中に行なう。In this example, there are four colors. Also thermal head 1
There are also four of them, and the distance between them is L. When both signals are input to the thermal head, the desired heating element 5' generates heat, melting the ink directly below through the base film 3a,
Ink is transferred onto recording paper 2. Here, transfer film 3
Since the feeding speed v8 of is very slow compared to the paper feeding speed,
The thermal head 1 has a predetermined number of 4
The color ink is transferred to the recording paper 2 during the recording operation.
この結果記録紙２には、インク３１１ ！ ・−Ｊ ｂ
４の４色よシ］なる記録画像が得られる。As a result, ink 311!・-Jb
A recorded image with 4 colors can be obtained.
なお、■ラインの画信号中に４色分の信号が混在電ろ時
は、紙送り速度Ｖｐに応じて、各色の信号を遅延すれば
よい。また第１図は４色の例であり、サーマルヘッド１
の追加と転写フィルトの色追加により、これ以上の多色
も可能であると共に、混色による多色化も容易である。Incidentally, when signals for four colors are mixed in the image signal of the (2) line, the signals for each color may be delayed in accordance with the paper feed speed Vp. Also, Figure 1 shows an example of four colors, and the thermal head 1
It is possible to create more colors than this by adding the above color and the color of the transfer filter, and it is also easy to create multiple colors by mixing colors.
しかし第２図の様な構成では、第４図に示す様にダイオ
ードチップ６による突起のため、転写フィルＡ 、？及
び記録紙２の走行上好ましくない。またプラテンローラ
４とダイオードデツプ６の接触を避ける必要上発熱体基
板１ａの寸法４の短縮化が制限され、結局アレイ間の寸
法りが大きく、→ノ°−マルヘッド全体として大形であ
った。However, in the configuration shown in FIG. 2, the projections caused by the diode chip 6 as shown in FIG. 4 cause the transfer films A, ? This is also unfavorable for the running of the recording paper 2. In addition, the need to avoid contact between the platen roller 4 and the diode depth 6 limited the reduction in the dimension 4 of the heating element substrate 1a, resulting in a large dimension between the arrays, resulting in an overall large normal head. .
本発明はこれらの欠点を除去するため、ダイオードチッ
プ等の半導体チップを発熱体基板の間隙に配；戊し、→
１−マルヘッド記録面の凸部を無くしたもので、以下図
面について詳細に説明する。In order to eliminate these drawbacks, the present invention disposes a semiconductor chip such as a diode chip in the gap between the heating element substrate;
This is a 1-maru head without a convex portion on the recording surface, and the drawings will be described in detail below.
第５図は本発明の実施例であり、１ｏは個別側リード、
１ノは共通側リードである。同図より明らかな様に、半
導体チップすなわちダイオードチップ６は支持基台１ｂ
に搭載されるとともに、発熱体基板１ａの端部１２はな
なめにカットされており、このななめにカットされた端
部１２にリード１ｏのポンディングパッドが形成され、
ダイオードチップ６とボンディングにより結線される。FIG. 5 shows an embodiment of the present invention, in which 1o is an individual side lead;
1 is the common side lead. As is clear from the figure, the semiconductor chip, that is, the diode chip 6 is mounted on the support base 1b.
The end portion 12 of the heating element substrate 1a is cut diagonally, and the bonding pad of the lead 1o is formed on the diagonally cut end portion 12.
It is connected to the diode chip 6 by bonding.
第６図は第５図の断面図であり、１３は絶縁性樹脂によ
る保護材である。発熱体基板１ａは通常セラミックスで
あり、その厚みは１〜２朋であるのに対し、ダイオード
チップ６の厚みは０．４〜０．６ｍｙｓ程度である。従
って第６図の如くダイオードチップ６は発熱体５より低
く設置できる。なお、鉄、アルミニウム等の支持基台１
ｂには絶縁膜を介して、発熱体駆動回路への配線パター
ンが形成されている。FIG. 6 is a sectional view of FIG. 5, and 13 is a protective material made of insulating resin. The heating element substrate 1a is usually made of ceramics and has a thickness of 1 to 2 mm, whereas the thickness of the diode chip 6 is about 0.4 to 0.6 mys. Therefore, the diode chip 6 can be installed lower than the heating element 5 as shown in FIG. In addition, support base 1 made of iron, aluminum, etc.
A wiring pattern to a heating element drive circuit is formed on b through an insulating film.
（図示はぜず）。またななめカットされた発熱体基１１
＊ Ｊ 、ｌの端部１２にり−１−” １０を形成する
際、西宮の光学的なパターン露光ではボケが生じろが、
ｌｌｉ、７−ビーム等を利用することにより、ななめの
端部１２に精度良くパターンを形成することフ＋（ｒ＋
ｆ ｉｊ目である。さらに突起物によるプラテンローラ
４との接触が無いので、発熱体基板１ａの寸法ｅを小さ
くでき、全体として小形なサーマルヘッドが実現できる
。(Not shown). Also diagonally cut heating element group 11
*When forming the edge 12 of J, l, Nishinomiya's optical pattern exposure may cause blurring, but
It is possible to form a pattern with high precision on the diagonal end 12 by using a 7-beam, etc.
It is the f ijth one. Furthermore, since there is no contact with the platen roller 4 due to protrusions, the dimension e of the heating element substrate 1a can be reduced, and an overall compact thermal head can be realized.
第７図゛は本発明の全体図であり、第４図の場合と異な
り、転写フィルム３及び記録紙２の走行面への突起物）
＋（ないので、走行がスムーズである。FIG. 7 is an overall view of the present invention, and unlike the case in FIG. 4, projections on the running surface of the transfer film 3 and the recording paper 2)
+ (There is no such thing, so the running is smooth.
以上説明したように、本発明によればダイオードチップ
を発熱体面より低く設置できるので、転写フィルム及び
記録紙の走行／バスノ、−スになる利点がある。また発
熱体基板を小さく形成できるので、サーマルヘッド全体
を小形化できるとともに、発熱体基板が小さい分量産性
が良く、製造コストを低減できる利点がある。As explained above, according to the present invention, since the diode chip can be installed lower than the surface of the heating element, there is an advantage that the transfer film and the recording paper can be moved/bussed. Furthermore, since the heating element substrate can be formed small, the entire thermal head can be made smaller, and the heating element substrate is also advantageous in that it can be mass-produced in small quantities and manufacturing costs can be reduced.
ところで本発明の実施例においては、？′ａ３図に示し
た様なダイオードマトリックスにより、発熱体アレイ間
のまわり込み電流を防止しているが、シフトレジスク、
ラッチ、ゲート／バッファ等を内蔵する集積回路（特願
昭５４−１３８４８２号参照）等の半導体チップをダイ
オードチップ６と置き換えても良い。By the way, in the embodiment of the present invention? A diode matrix as shown in Figure 'a3 prevents the current from flowing between the heating element arrays, but the shift resistor,
The diode chip 6 may be replaced with a semiconductor chip such as an integrated circuit (see Japanese Patent Application No. 138482/1982) containing a latch, gate/buffer, etc.
第１図はサーマルヘッドを用いた多色記録の原理説明図
、第２図は従来の複数の発熱体アレイヲ有するサーマル
ヘッドの構成斜視図、第３図は第２図の電気的結線図、
第４図は第２図の断面図、第５図は本発明の一実施例の
一部切欠斜視図、第６図、第７図は第５図の断面図であ
る。
１・・・サーマルヘッド、１ａ・・・発熱体基板、１ｂ
・・・支持基台、２・・・記録紙、３・・・転写フィル
ム、４・・・プラテンローラ、５・・・発熱体アレイ、
６・、・ダイオードチップ、７・・・発熱体駆動回路、
８、〜８４・・・発熱体アレイ選択螺子、９・・・ダイ
オード、１０．１１・・・リード、１２・・・ななめに
カッＩ−され、た発７．．＋ｈｔ体基板の端部、１３・
・・保護材。
出１・、１６人代哩人 弁理士 鈴 江 武 彦第３
図
第４図Fig. 1 is an explanatory diagram of the principle of multicolor recording using a thermal head, Fig. 2 is a perspective view of the structure of a conventional thermal head having a plurality of heating element arrays, Fig. 3 is an electrical connection diagram of Fig. 2,
4 is a sectional view of FIG. 2, FIG. 5 is a partially cutaway perspective view of an embodiment of the present invention, and FIGS. 6 and 7 are sectional views of FIG. 5. 1...Thermal head, 1a...Heating element board, 1b
...Support base, 2...Recording paper, 3...Transfer film, 4...Platen roller, 5...Heating element array,
6. Diode chip, 7. Heating element drive circuit,
8, to 84...Heating element array selection screw, 9...Diode, 10.11...Lead, 12...Diagonally cut I-, emitted 7. ．． +ht body board end, 13.
··Protective layer. Part 1, 16th Patent Attorney Suzue Takehiko 3rd
Figure 4
Claims (1)
熱体基板を複数個支持基台に装着したサーマルヘッドに
おいて、前記複数個の発熱体基板の基板間に半導体デツ
プを装着したことを特徴とする複数の発熱体アレイを有
するサーマルヘッド。A thermal head in which a plurality of heating element substrates on which a heating element array consisting of a large number of heating elements is formed is attached to a support base, characterized in that a semiconductor dip is attached between the substrates of the plurality of heating element substrates. A thermal head with a plurality of heating element arrays.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19101182A JPS5979774A (en) | 1982-10-30 | 1982-10-30 | Thermal head with plural heating element arrays |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19101182A JPS5979774A (en) | 1982-10-30 | 1982-10-30 | Thermal head with plural heating element arrays |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5979774A true JPS5979774A (en) | 1984-05-09 |
| JPS6322990B2 JPS6322990B2 (en) | 1988-05-13 |
Family
ID=16267386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19101182A Granted JPS5979774A (en) | 1982-10-30 | 1982-10-30 | Thermal head with plural heating element arrays |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5979774A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61130066A (en) * | 1984-11-29 | 1986-06-17 | Rohm Co Ltd | Line type thermal head |
| US4969127A (en) * | 1988-02-25 | 1990-11-06 | Alcatel Business Systems Limited | Thermal printing apparatus |
| EP0544607A2 (en) * | 1991-11-26 | 1993-06-02 | TDK Corporation | Thermal recording head and method of manufacturing the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55103981A (en) * | 1979-02-06 | 1980-08-08 | Matsushita Electric Ind Co Ltd | Thermal head for thermo-recording |
| JPS5628872A (en) * | 1979-08-17 | 1981-03-23 | Nec Corp | Transfer-type polychrome thermal recorder |
| JPS56161178A (en) * | 1980-05-15 | 1981-12-11 | Toshiba Corp | Thermal head |
-
1982
- 1982-10-30 JP JP19101182A patent/JPS5979774A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55103981A (en) * | 1979-02-06 | 1980-08-08 | Matsushita Electric Ind Co Ltd | Thermal head for thermo-recording |
| JPS5628872A (en) * | 1979-08-17 | 1981-03-23 | Nec Corp | Transfer-type polychrome thermal recorder |
| JPS56161178A (en) * | 1980-05-15 | 1981-12-11 | Toshiba Corp | Thermal head |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61130066A (en) * | 1984-11-29 | 1986-06-17 | Rohm Co Ltd | Line type thermal head |
| US4969127A (en) * | 1988-02-25 | 1990-11-06 | Alcatel Business Systems Limited | Thermal printing apparatus |
| EP0544607A2 (en) * | 1991-11-26 | 1993-06-02 | TDK Corporation | Thermal recording head and method of manufacturing the same |
| EP0544607A3 (en) * | 1991-11-26 | 1993-08-11 | Tdk Corporation | Thermal recording head and method of manufacturing the same |
| US5428373A (en) * | 1991-11-26 | 1995-06-27 | Tdk Corporation | Thermal head for thermal recording or thermal transfer recording and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6322990B2 (en) | 1988-05-13 |
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