JPS5951530A - Xy transfer apparatus - Google Patents
Xy transfer apparatusInfo
- Publication number
- JPS5951530A JPS5951530A JP58150147A JP15014783A JPS5951530A JP S5951530 A JPS5951530 A JP S5951530A JP 58150147 A JP58150147 A JP 58150147A JP 15014783 A JP15014783 A JP 15014783A JP S5951530 A JPS5951530 A JP S5951530A
- Authority
- JP
- Japan
- Prior art keywords
- axis
- sliding
- sample table
- base
- transfer member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000642 polymer Polymers 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012840 feeding operation Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Machine Tool Units (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Control Of Position Or Direction (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、半導体製造装置などにおいて用いられるＸＹ
移動装置に関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to an XY
Relating to mobile devices.
半導体装置、たとえｌ、Ｙステップアンドリピータや縮
小投影露光装置などは、通常、ホ１−レジス１〜を塗布
したマスク基板またはウェハ上に梁積回路パターンを光
学写真的に投影焼イ・１けするものであるが、投影焼伺
はレンズの結像範囲の制約から前記のようなマスク基板
やウェハの全面を一度に焼イ）１けすることは不ＩＩｒ
能である。そのため、上記のような装置てｔＪ°精密Ｘ
Ｙ移動台を備え、この−１−に前記マスクＪ、を板また
はウェハ髪装着してｘ、■方向の二次元の間欠送り動作
を行ないながら、集積回路パターンを前記マスク基板ま
たはウェハ上の全面に配列焼付けしている。Semiconductor devices, such as L and Y step-and-repeater and reduction projection exposure equipment, are usually manufactured by optically photographically projecting and baking a beam laminated circuit pattern onto a mask substrate or wafer coated with Hole 1-Resist 1. However, in projection burning, it is impossible to burn the entire surface of the mask substrate or wafer at once due to the limitations of the imaging range of the lens.
It is Noh. Therefore, the above-mentioned equipment is tJ° precision
A Y moving table is provided, and the mask J is attached to the plate or wafer on this -1-, and the integrated circuit pattern is transferred over the entire surface of the mask substrate or wafer while performing intermittent two-dimensional feeding operations in the x and ■ directions. The array is burned in.
このようなＸＹ移動台には、スルーグツ１−向上のため
その高速化が強く望まれている。−１−記装置のように
１回の送り距１１７１１が１． ＯｎＩｎ以下と短かい
場合、位置決めの高速化をはかるには可動部質量を小さ
くして加減速特性を良くすると共に、位置決め後の振動
を早く整定することが有効である。There is a strong demand for such an XY moving table to be faster in order to improve its throughput. -1- As in the device described above, one feed distance 11711 is 1. When the distance is shorter than OnIn, in order to increase the speed of positioning, it is effective to reduce the mass of the movable part to improve acceleration/deceleration characteristics and to quickly settle vibrations after positioning.
本発明は、上記の点に着ＥＩ してなされたものであり
、」１記の要求を？ｉｇｔ足できる、小型で製作容易か
つ高速位置決めが可能なＸＶ移動装置を提供することを
目的とする。The present invention has been made in consideration of the above points, and meets the requirements set forth in ``1''. The purpose of the present invention is to provide an XV moving device that is compact, easy to manufacture, and capable of high-speed positioning.
上記目的を達成するために、本発明では、基盤１−にＸ
方向に形成しに溝内を、活動可能に形成された部分を右
するＸ移動部材と、該Ｘ移動部月の」二側にあってこれ
と一体にかつＸ軸方向と直交する如く敷設されたＹ軸ガ
イド手段と、該Ｙ軸ガイド手段と組み合ってＹ軸方向の
案内をする溝をその下面に形成した試料テーブルを具備
する如く構成したものである。In order to achieve the above object, the present invention provides X on the substrate 1-.
an X-moving member with a movably formed part on the right side of the groove formed in the direction; The sample table is provided with a Y-axis guide means and a sample table having a groove formed on its lower surface for guiding in the Y-axis direction in combination with the Y-axis guide means.
以下、本発明を実施例を参照して説明する。 Hereinafter, the present invention will be explained with reference to Examples.
図は、本発明の一実施例を示す図である。The figure is a diagram showing an embodiment of the present invention.
ベース１には溝２が形成されており、図中Ｘ軸方向と垂
直な面内の断面形状が′１゛字形をしたＸ移動部材３が
この溝内を摺動する。Ｘ移動部材３のベース１と接触す
る部分４，５．６には高分子摺動材料が接着さ九ており
、円滑な摺動をなさしめる。慴動部４を溝２の側壁に密
着させるため、ローラ７と板バネ８からなる荷重機構が
Ｘ移動部材３に設けられており、前記側壁と対向する壁
を押している。このＸ移動部材３の１−面にはＸ軸と直
交してＹ軸ガイド９が敷設さオしている。Ｘ、Ｙ軸の両
方向に移動すべき試料テーブル】０の下面中央部にはＩ
ＩＩＩＩが形成されており、前記Ｙ軸ガイド９と組み合
一ってこの試料テーブル１０をＹ軸方向に案内する。Ｘ
軸回様、お互いが摺動する部分１２には摺動材が接、ｎ
されており、荷重機構１３によりＹ １ｌｉｌｌｌガイ
ド９との接触を保証する。試料テーブル１０の西端には
摺動部１４が形成されており、ベース１の、（、平面の
上をＸ、Ｙ軸内方向に摺動する。A groove 2 is formed in the base 1, and an X-moving member 3 having a '1''-shaped cross section in a plane perpendicular to the X-axis direction in the figure slides within this groove. A polymeric sliding material is bonded to the portions 4, 5.6 of the X-moving member 3 that come into contact with the base 1, allowing smooth sliding. In order to bring the sliding part 4 into close contact with the side wall of the groove 2, a loading mechanism consisting of a roller 7 and a leaf spring 8 is provided on the X-moving member 3, and pushes the wall opposite to the side wall. A Y-axis guide 9 is laid on the first plane of the X-moving member 3 so as to be perpendicular to the X-axis. [Sample table that should be moved in both directions of the X and Y axes] I
III is formed, and in combination with the Y-axis guide 9 guides this sample table 10 in the Y-axis direction. X
Like the shaft, the sliding material is in contact with the parts 12 that slide each other, n
The load mechanism 13 ensures contact with the Y 1lill guide 9. A sliding portion 14 is formed at the west end of the sample table 10, and slides on the plane of the base 1 in the X and Y axes.
以−にのような構造とすることにより、試料テーブル］
０のｒＲ■ｊ：はベース１により支えられ、Ｘ移動部材
３に加えられることはない。そのためＸ移動部材３には
ＸＹ両軸を含む面内の強度および剛性が要求されろのみ
であり、１−ラス構造とすることも可能とな−）で非常
に軽量化することができる。By having the structure as shown below, the sample table]
0 rR■j: is supported by the base 1 and is not applied to the X moving member 3. Therefore, the X-moving member 3 is only required to have in-plane strength and rigidity including both the X and Y axes, and can be made into a one-lath structure, making it extremely lightweight.
駆動系（図には示されていない。）はＸ、Ｙ軸ともベー
ス１ど同じ静１１−座標系に固定され、ｘＩＩｌｌ目よ
駆動ロット１５夕介し、Ｙ軸は矩形穴を右する！ψ動栓
枠１６ベアリング１７を介して駆動する。The drive system (not shown in the figure) has both the X and Y axes fixed to the same static 11-coordinate system on the base 1, and the Y axis has a rectangular hole. The ψ movable stopper frame 16 is driven via a bearing 17.
〔発明のく１ノジ１！、〕
以」―説明したような構造とすることにより、Ｘ移動部
材３の質・量は一般的なで一段重ね（１シフ’ＪＳｌｊ
のものに比にｌ／；）〜１１５程度にまで小さくするこ
とができ、高速化が果たせる。またこのような構造によ
り４ノ（料テーブル′１０の高さが小さくでき、急激な
加減速時にもピッチングをイ１；しることがない。他の
長所は、Ｘ移動部材３および試料テーブル１０ともベー
スｌの」一平面を共通に摺動するため、精度を有する摺
動面の数が１つで済み、この摺動面も単純な形状をして
いるため、容易に高精度で研削加コ、により製作するこ
とができる。[Invention 1 noji 1! , ] - By having the structure as explained, the quality and quantity of the
It can be made as small as 1/;) to about 115, and high speed can be achieved. In addition, this structure allows the height of the sample table 10 to be reduced by 4 mm, and pitching does not occur even during rapid acceleration/deceleration.Another advantage is that the height of the sample table 10 can be reduced by Because both slide on the same flat surface of the base l, only one precision sliding surface is required, and this sliding surface also has a simple shape, making it easy to grind with high precision. It can be manufactured by
図面の１ｌｔｉ電）１か説明 図は、本発明の一実施例を示す図である。1lti electric) 1 explanation of the drawing The figure is a diagram showing an embodiment of the present invention.
Claims (1)
された部分を有するＸ移動部月と、該Ｘ移動部材のＬ側
にあってこれと一体にかっＸ軸方向と直交する如く敷設
されたＹ軸ガイド手段と、該Ｙ軸ガイド手段と絹み合っ
てＹ軸方向の案内をする溝をその下面に形成した試料テ
ーブルを具備してなることを特徴とするＸＹ移動装置。1. An X-moving part having a part formed to be able to slide in a groove formed in the X-direction in the base 1-, and an X-moving part that is located on the L side of the X-moving member and is integrally connected thereto and perpendicular to the X-axis direction. An XY moving device comprising a Y-axis guide means laid in such a way that the Y-axis guide means and a sample table have a groove formed on the lower surface thereof to guide the Y-axis direction by interlocking with the Y-axis guide means. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58150147A JPS5951530A (en) | 1983-08-19 | 1983-08-19 | Xy transfer apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58150147A JPS5951530A (en) | 1983-08-19 | 1983-08-19 | Xy transfer apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5951530A true JPS5951530A (en) | 1984-03-26 |
Family
ID=15490518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58150147A Pending JPS5951530A (en) | 1983-08-19 | 1983-08-19 | Xy transfer apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5951530A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106238796A (en) * | 2016-08-18 | 2016-12-21 | 陈泳东 | A kind of Novel planer for building labor and materials processing |
-
1983
- 1983-08-19 JP JP58150147A patent/JPS5951530A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106238796A (en) * | 2016-08-18 | 2016-12-21 | 陈泳东 | A kind of Novel planer for building labor and materials processing |
| CN106238796B (en) * | 2016-08-18 | 2018-12-11 | 林勇翔 | A kind of Novel planer processed for building labor and materials |
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