JPS5944067U - IC card - Google Patents

IC card

Info

Publication number
JPS5944067U
JPS5944067U JP14037182U JP14037182U JPS5944067U JP S5944067 U JPS5944067 U JP S5944067U JP 14037182 U JP14037182 U JP 14037182U JP 14037182 U JP14037182 U JP 14037182U JP S5944067 U JPS5944067 U JP S5944067U
Authority
JP
Japan
Prior art keywords
card
module
base material
substrate
card base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14037182U
Other languages
Japanese (ja)
Other versions
JPH0324383Y2 (en
Inventor
誠一 西川
勇次 渡辺
寺田　庸輔
Original Assignee
大日本印刷株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大日本印刷株式会社 filed Critical 大日本印刷株式会社
Priority to JP14037182U priority Critical patent/JPS5944067U/en
Publication of JPS5944067U publication Critical patent/JPS5944067U/en
Application granted granted Critical
Publication of JPH0324383Y2 publication Critical patent/JPH0324383Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Credit Cards Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの考案に用いるＩＣモジュールの一例を示す
断面構造図、第２図はこの考案のＩＣカードの一例を示
す外観図、第３図は第２図■−■の断面図、第４図はこ
の考案の他の実施例を第３図に対応させて示す断面図で
ある。 １・・・ガラスエポキシフィルム基板、２・・・Ｗパタ
ーン、３・・・回路パターン、４・・・スルーホール、
５・・・ＩＣチップ、６・・・電極、７・・・導体、８
・・・ポツティング枠、９・・・エポキシ樹脂、１０・
・・ＩＣモジュール、１１．１２ａ〜１２ｆ・・・硬質
塩化ビニール−シート、１３・・・埋設基板、１４・・
・印刷パターン（絵柄）、１８・・・カード基材。Fig. 1 is a cross-sectional structural diagram showing an example of an IC module used in this invention, Fig. 2 is an external view showing an example of an IC card of this invention, Fig. 3 is a sectional view taken from Fig. 2 - ■, and Fig. 4 This figure is a sectional view showing another embodiment of this invention corresponding to FIG. 3. DESCRIPTION OF SYMBOLS 1...Glass epoxy film board, 2...W pattern, 3...Circuit pattern, 4...Through hole,
5... IC chip, 6... Electrode, 7... Conductor, 8
...Potting frame, 9...Epoxy resin, 10.
...IC module, 11.12a-12f...hard vinyl chloride sheet, 13...embedded board, 14...
・Print pattern (picture), 18...Card base material.

Claims (1)

【実用新案登録請求の範囲】 ｌ　　ＩＣモジュールをカード基材内に埋設して成るカ
ードにおいて、前記カード基材内に前記カード基材と異
なる材質で成り、かつ前記ＩＣモジュールよりも大きな
面積を持つ板状の埋設基板を前記ＩＣモジュールの埋設
位置底部に設け、前記カード基材と前記埋設基板及びＩ
Ｃモジュールとを接着剤を介さず又は介して接着するよ
うにしたことを特徴とするＩＣカード。 ２　前記埋設基板として、未硬化又は半硬化エポキシ樹
脂含浸シートを用いた実用新案登録請求の範囲第１項記
載のＩＣカード。　　　　　　−３前記埋設基板として
、硬化エポキシ板又はその他の金属板の両面に未硬化エ
ポキシフィルムをラミネートしたものを用いた実用新案
登録請求の範囲第１項記載のＩＣカード。[Claims for Utility Model Registration] l In a card comprising an IC module embedded in a card base material, the card base material is made of a different material from the card base material and has a larger area than the IC module. A plate-shaped buried substrate is provided at the bottom of the buried position of the IC module, and the card base material, the buried substrate and the I
An IC card characterized in that the C module is bonded to the C module without or through an adhesive. 2. The IC card according to claim 1, wherein an uncured or semi-cured epoxy resin-impregnated sheet is used as the embedded substrate. -3 The IC card according to claim 1, wherein the embedded substrate is a cured epoxy plate or other metal plate with uncured epoxy films laminated on both sides.
JP14037182U 1982-09-16 1982-09-16 IC card Granted JPS5944067U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14037182U JPS5944067U (en) 1982-09-16 1982-09-16 IC card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14037182U JPS5944067U (en) 1982-09-16 1982-09-16 IC card

Publications (2)

Publication Number Publication Date
JPS5944067U true JPS5944067U (en) 1984-03-23
JPH0324383Y2 JPH0324383Y2 (en) 1991-05-28

Family

ID=30314308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14037182U Granted JPS5944067U (en) 1982-09-16 1982-09-16 IC card

Country Status (1)

Country Link
JP (1) JPS5944067U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6227195A (en) * 1985-07-27 1987-02-05 大日本印刷株式会社 Integrated circuit card
JPS62202796A (en) * 1986-03-04 1987-09-07 大日本印刷株式会社 Integrated circuit card
JPS62290590A (en) * 1986-06-11 1987-12-17 大日本印刷株式会社 Ic card and ic module for ic card

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5283132A (en) * 1975-12-31 1977-07-11 Cii Portable card for electric signal processor and method of fabricating same
JPS5748175A (en) * 1980-07-09 1982-03-19 Philips Nv Portable identifying structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5283132A (en) * 1975-12-31 1977-07-11 Cii Portable card for electric signal processor and method of fabricating same
JPS5748175A (en) * 1980-07-09 1982-03-19 Philips Nv Portable identifying structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6227195A (en) * 1985-07-27 1987-02-05 大日本印刷株式会社 Integrated circuit card
JPS62202796A (en) * 1986-03-04 1987-09-07 大日本印刷株式会社 Integrated circuit card
JPS62290590A (en) * 1986-06-11 1987-12-17 大日本印刷株式会社 Ic card and ic module for ic card

Also Published As

Publication number Publication date
JPH0324383Y2 (en) 1991-05-28

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