JPS5941889A - Device for mounting electronic part - Google Patents
Device for mounting electronic partInfo
- Publication number
- JPS5941889A JPS5941889A JP57152197A JP15219782A JPS5941889A JP S5941889 A JPS5941889 A JP S5941889A JP 57152197 A JP57152197 A JP 57152197A JP 15219782 A JP15219782 A JP 15219782A JP S5941889 A JPS5941889 A JP S5941889A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting
- printed circuit
- circuit board
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、各種電子回路への電子部品の自動組立を効率
良く行う電子部品の実装装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting apparatus that efficiently automatically assembles electronic components into various electronic circuits.
従来例の構成とその問題点
第１図に示すように電子回路を構成するプリント基板に
電子部品を実装する方法の一例として第１図（ａ）の如
くプリント基板１のパターン１−ａ上に第１図（ｂ）の
如くまず、接着剤又は半田ペースト１−ｂを印刷し、次
に第１図（Ｃ）の如く電子部品２を実装し、接着剤又は
半田ペーストを熱などで硬化接続している。Conventional Structure and Problems As shown in FIG. 1, an example of a method for mounting electronic components on a printed circuit board constituting an electronic circuit is to mount electronic components on a pattern 1-a of a printed circuit board 1 as shown in FIG. 1(a). First, adhesive or solder paste 1-b is printed as shown in Fig. 1(b), then electronic component 2 is mounted as shown in Fig. 1(C), and the adhesive or solder paste is cured with heat etc. for connection. are doing.
このような工法における従来の電子部品の実装装置は第
２図にその具体構成を示すように、電子部品２を実装す
るプリント基板１は、水平面内に移動可能なＸＹテーブ
ル３上に位置決めされており、ベース４に固定された実
装ヘッド部５の先端に取付けられた実装ロッド６は水平
軸上に移動自在な供給部７により定められた取出位置へ
きた電子部品２′を取出し、ＸＹテーブルｓ上のプリン
。As shown in FIG. 2, the specific configuration of a conventional electronic component mounting apparatus used in such a construction method is such that a printed circuit board 1 on which an electronic component 2 is mounted is positioned on an XY table 3 that is movable in a horizontal plane. The mounting rod 6 attached to the tip of the mounting head section 5 fixed to the base 4 takes out the electronic component 2' that has come to the pick-up position determined by the supply section 7 which is movable on the horizontal axis, and moves it to the XY table s. Pudding above.
基板１の任意の位置に実装する構成になっていた。The structure was such that it could be mounted at any position on the board 1.
しかしながら、上記のような構成ではフィルム状の柔ら
かいプリント基板等の場合には、ＸＹテーブル３上の位
置決め部８に自動的に供給、又は取出しを行う事が困難
であった。又、プリント基板１上に重量の大きい部品９
等が実装されている場合、プリント基板１を動かすと、
電子部品９も移動してしまい位置づれを起す、という欠
点を有していた。However, with the above configuration, it is difficult to automatically supply or take out a flexible printed circuit board in the form of a film to or from the positioning section 8 on the XY table 3. Also, a heavy component 9 is placed on the printed circuit board 1.
etc. are mounted, if you move the printed circuit board 1,
This has the disadvantage that the electronic component 9 also moves, causing misalignment.
また、いま１つの従来例の電子部品実装装置は第３図の
様に、インデックステーブル１ｏ上に固定位置決めされ
たプリント基板１１へ電子部品を実装する場合、パレッ
ト１２又は振動フィーダ１３等で供給された電子部品を
、水平面内を移動可能な移載ヘッド１４にて取り出し、
移動後プリント基板１１上に実装していたため、固定さ
れた部品供給部１２．１３よりプリント基板への移動距
離が長く、実装時間が非常に長くなり、生産効率が悪い
という欠点を有していた。In addition, as shown in FIG. 3, another conventional electronic component mounting apparatus is such that when electronic components are mounted on a printed circuit board 11 fixedly positioned on an index table 1o, electronic components are supplied by a pallet 12 or a vibrating feeder 13. The electronic components are taken out using a transfer head 14 that is movable in a horizontal plane.
Since the components were mounted on the printed circuit board 11 after being moved, the moving distance to the printed circuit board was longer than that of the fixed component supply section 12.13, which resulted in a very long mounting time, which had the disadvantage of poor production efficiency. .
発明の目的
本発明は、上記欠点を取り除くために、フィルム状基板
やセラミック基板の様に、自動供給、取のものが実装さ
れており、プリント基板を高速で移動させにくいものに
対し、部品供給部と実装ヘッド部が移動して、固定され
た基板に、高速で電子部品を実装する事を可能にさせた
一高速高性能な電子部品の実装装置を提供するものであ
る。Purpose of the Invention In order to eliminate the above-mentioned drawbacks, the present invention provides a component supply method for printed circuit boards that are mounted with automatic supply and removal, such as film substrates and ceramic substrates, and that are difficult to move at high speed. The present invention provides a high-speed, high-performance electronic component mounting apparatus in which the electronic component can be mounted on a fixed board at high speed by moving the mounting head section and the mounting head section.
又、実装ヘッド部と、接着剤等の塗布ヘッド部を同時に
移動させ、一方のプリント基板に接着剤を塗布し、他方
のプリント基板には、先に接着剤を塗布済みの上に、電
子部品を実装していく事により、安価で効率の良い電子
部品の実装装置を提供するものである。In addition, the mounting head and the adhesive application head are moved simultaneously to apply adhesive to one printed circuit board, and to apply adhesive to the other printed circuit board, place the electronic components on top of the adhesive. By mounting this, we provide an inexpensive and efficient electronic component mounting device.
発明の構成
本発明は水平面内に移動可能なＸＹテーブルと、前記Ｘ
Ｙテーブル上に固定されていて電子部品を取出す位置と
前記電子部品をプリント基板に実装する位置の２つの定
位置の間を往復動する電子部品実装ヘッド部と、前記電
子部品を取出す定位置に、任意の部品を持ち来たせる事
が可能な水平軸上に移動可能な前記ＸＹテーブル上に設
置された電子部品供給部から構成されており、プリント
ｓ板を固定させたまま高速で電子部品の実装が可能にな
るという特有の効果を有するものである。Structure of the Invention The present invention includes an XY table movable in a horizontal plane, and the
an electronic component mounting head fixed on a Y table and reciprocating between two fixed positions, a position for taking out the electronic component and a position for mounting the electronic component on a printed circuit board, and a fixed position for taking out the electronic component; It consists of an electronic component supply unit installed on the XY table that can be moved on the horizontal axis to which any component can be brought in, and electronic components can be delivered at high speed while the printed S board is fixed. This has the unique effect of making implementation possible.
又、前記構成に加えて、前記ＸＹテーブル上に接着剤ま
たは半田ペーストの塗布ヘッド部を構成する事によシ、
接着剤を塗布しながら、次のヘッドで電子部品を実装す
るというシステム的にすぐれ、かつ安価な実装装置を提
供するものである。In addition to the above configuration, by configuring an adhesive or solder paste application head on the XY table,
The purpose of the present invention is to provide an excellent system-wise and inexpensive mounting apparatus that mounts electronic components using the next head while applying adhesive.
実施例の説明
以下本発明の一実施例について、図面を参照しながら説
明する。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
第４図はプリント基板１５上に電子部品１６を実装する
装置の側面図であり、第５図はその平面図である。ベー
ス１７上に水平方向に固定されたＸスライド軸１８と前
記スライド軸１８にガイドされて移動可能なＸテーブル
１９及びＸ軸駆動部２０とＸテーブル１９上に固定され
たＸスライド軸１８と直角方向に固定されたＹスライド
軸２１と前記Ｙスライド軸２１にガイドされて移動可能
なＹテーブル２２及びＹ軸駆動部２３とからなるＸＹテ
ーブル部２４があり、水平面内における任意の位置に移
動可能である。前記ＸＹテーブル部２４には水平軸方向
に固定されたＸスライド軸２５及び前記Ｘスライド軸２
５上を移動可能な部品供給部２６と、その駆動部２７と
が積載されており、部品供給部２６は第６図に示す如く
、テーピングされた部品２８を１個ずつ順次送りする部
品送り部２９を有し、第６図（ａ）に示す如く前記部品
送り部２９で、順次供給された電子部品２８をカム軸３
ｏにより駆動され上下に動作し、前記電子部品２８を吸
着する吸着部３１は、第６図Φ）の如く吸着された部品
を位置決めする位置決め爪３２をもち、第６図（Ｃ）の
如く吸着位置決めされた部品２８′を前記プリント基板
１５上に実装させる。前記吸着部３１は回転軸３３０回
りに前記吸着部３１を回転移動させる回転レバー３４に
よりある角度の回転が可能となシ、又カム軸３０により
同期して動く上下レバー３６の上下動により、前記位置
決め爪３２の開閉動作をさせると共に、プリント基板１
５上まで電子部品を持ちきたせ、又前記カム軸３０によ
り同期して動くレバー３６の上下動により、フィードロ
ッド３７を上下動させ部品送り部２９についていて、電
子部品の順次送りをさせるレバー３８をたたき、順次１
コ送りを行う。又ロッド３９は前記回転レバー３４０回
転駆動をおこなっている。FIG. 4 is a side view of an apparatus for mounting electronic components 16 on printed circuit board 15, and FIG. 5 is a plan view thereof. An X-slide shaft 18 fixed horizontally on the base 17, an X-table 19 movable guided by the slide shaft 18, an X-axis drive section 20, and a right angle to the X-slide shaft 18 fixed on the X-table 19. There is an XY table section 24 consisting of a Y slide shaft 21 fixed in the direction, a Y table 22 that is movable guided by the Y slide shaft 21, and a Y axis drive section 23, and can be moved to any position in a horizontal plane. It is. The XY table section 24 has an X slide shaft 25 fixed in the horizontal axis direction and the X slide shaft 2.
5, and a driving section 27 thereof is loaded thereon, and as shown in FIG. 29, as shown in FIG.
The suction unit 31, which is driven by a motor and moves up and down to suction the electronic component 28, has a positioning claw 32 that positions the suctioned component as shown in FIG. The positioned component 28' is mounted on the printed circuit board 15. The suction part 31 can be rotated through a certain angle by a rotary lever 34 that rotates the suction part 31 around a rotation axis 330, and can be rotated up and down by a vertical lever 36 that is synchronously moved by a camshaft 30. While opening and closing the positioning claw 32, the printed circuit board 1
5. A lever 38 attached to the component feeding section 29 moves the feed rod 37 up and down by the vertical movement of the lever 36, which is synchronously moved by the camshaft 30, and sequentially feeds the electronic components. Tap 1 in order.
Perform co-feeding. Further, the rod 39 drives the rotary lever 340 to rotate.
以上のような構成により、吸着物３１、位置決め爪３２
によりなる実装ヘッド部４０は、電子部品を取り出す位
置Ｓ位置と、プリント基板１６に電子部品を実装する位
置Ｍ位置との間を往復動する事が出来、部品供給部２６
上の多連の部品送９部２９は任意の部品送り部２９を部
品供給部２６の水平移動により、電子部品を取り出す位
置Ｓ位置に持ち来たせる事が可能となり、前記実装ヘッ
ド部４０と、部品供給部２６を前記ＸＹテーブル２４上
に積載する事により、固定位置決めされたプリント基板
１５上の任意の位置に電子部品を実装する事が可能にな
る。With the above configuration, the attracting object 31 and the positioning claw 32
The mounting head section 40 is capable of reciprocating between a position S for taking out electronic components and a position M for mounting electronic components on the printed circuit board 16.
The above multiple component feeder 9 parts 29 can bring any component feeder 29 to the electronic component takeout position S by horizontal movement of the component feeder 26, and the mounting head part 40 and By loading the component supply unit 26 on the XY table 24, it becomes possible to mount electronic components at any position on the fixedly positioned printed circuit board 15.
又、い捷１つの実施例として、前記ＸＹテーブル２４上
に塗布ヘッド部４１を実装ヘッド部４０と共に積載する
例として、その平面図を第７図、塗布ヘッド部４１の側
面図を第８図に示す。Further, as an example of loading the coating head section 41 together with the mounting head section 40 on the XY table 24, a plan view thereof is shown in FIG. 7, and a side view of the coating head section 41 is shown in FIG. Shown below.
この様に実装ヘッド部４０とある定距離りだけ離して塗
布ヘッド部４１を固定する事により、第１図に示したパ
ターン１−ａ上に接着剤または半田ペース）１−ｂを塗
布し、次工程で電子部品をその接着剤又は半田ペースト
上に実装する２つの工程が同時に行う事が可能となる。By fixing the coating head part 41 at a certain distance from the mounting head part 40 in this way, the adhesive or solder paste) 1-b is applied onto the pattern 1-a shown in FIG. In the next step, the two steps of mounting electronic components on the adhesive or solder paste can be performed simultaneously.
発明の効果
このように本発明は、フィルム状基板やセラミック基板
の様に、自動供給、取出して困難で、かつ、基板上に重
々量の電子部品を実装しでおり、プリント基板を高速で
移動させにくいものに対しＸＹテーブル上にて、部品供
給部を移動させ、実装ヘッド部にて固定されたプリント
基板へ高速に電子部品を実装することを可能にしている
。Effects of the Invention As described above, the present invention mounts heavy electronic components on a board that is difficult to automatically supply and take out, such as a film board or a ceramic board, and the printed board can be moved at high speed. By moving the component supply section on the XY table for difficult-to-mount electronic components, it is possible to quickly mount electronic components onto printed circuit boards fixed by the mounting head.
又実装ヘッド部と接着剤等の塗付ヘッド部を同時に移動
させ、一方のプリント基板に接着剤を塗付し、他方のプ
リント基板には、先に接着剤を塗付済みの上に電子部品
を実装していく事によシ、安価で効率の良い電子部品の
実装を可能にしている。In addition, the mounting head and adhesive application head are moved simultaneously to apply adhesive to one printed circuit board, and to apply adhesive to the other printed circuit board, place electronic components on top of the adhesive. By implementing this, it is possible to implement electronic components at low cost and with high efficiency.
の電子部品実装装置の側面図、第３図は従来の別の実装
装置斜視図、第４図は本発明の一実施例の側面図、第５
図は同実施例の平面図、第６図ａ。FIG. 3 is a perspective view of another conventional mounting device, FIG. 4 is a side view of an embodiment of the present invention, and FIG.
The figure is a plan view of the same embodiment, FIG. 6a.
ｂ、ｃは同実施例による実装工程図、第７図は本発明の
他の実施例の平面図、第８図は同側面図である。b and c are mounting process diagrams according to the same embodiment, FIG. 7 is a plan view of another embodiment of the present invention, and FIG. 8 is a side view of the same.
１６・・・・・・プリント基板、１６・・・・・・電子
部品、２４・・・・・・ｘＹテーブル部、２６・・・・
・・部品供給部、４０・・・・・・実装ヘッド部、４１
・・・・・・塗付ヘッド部。16...Printed circuit board, 16...Electronic component, 24...xY table section, 26...
...Component supply section, 40...Mounting head section, 41
・・・・・・Application head part.
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
叫 ｂ
Ｃ第２図
第 ３ 図
第 ４ 図
５
１５図
（（スノ’ ｃｂン
（Ｃン第７図
２４
第８図
４２１−Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Illustration b
CFigure 2 Figure 3 Figure 4 Figure 5 Figure 15 ((Snow' cbn
(Fig. 7 24 Fig. 8 421-
Claims (2)
設備において、水平面内に移動可能なＸＹテーブルと、
前記ＸＹテーブル上に固定されていて電子部品を取出す
位置と前−配電子部品をプリント基板に実装する位置の
２つの定位置の間を往復動する電子部品実装ヘッド部と
、前記電子部品を取出す定位置に、任意の部品を持ち来
たせる事が可能な水平軸上に移動可能な前記ＸＹテーブ
ル上に設置された電子部品供給部とからなる電子部品の
実装装置。(1) In equipment for mounting electronic components on printed circuit board patterns, an XY table movable in a horizontal plane;
An electronic component mounting head fixed on the XY table and reciprocating between two fixed positions, a position for taking out the electronic component and a position for mounting the front electronic component on the printed circuit board, and taking out the electronic component. An electronic component mounting device comprising an electronic component supply unit installed on the XY table which is movable on a horizontal axis and can bring any component to a fixed position.
ブル上に接着剤または半田ペーストの塗布ヘッド部を備
えた電子部品の実装装置。(2) The electronic component mounting apparatus according to claim 1, comprising an adhesive or solder paste application head on a mosquito xY table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57152197A JPS5941889A (en) | 1982-08-31 | 1982-08-31 | Device for mounting electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57152197A JPS5941889A (en) | 1982-08-31 | 1982-08-31 | Device for mounting electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5941889A true JPS5941889A (en) | 1984-03-08 |
| JPH0432560B2 JPH0432560B2 (en) | 1992-05-29 |
Family
ID=15535175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57152197A Granted JPS5941889A (en) | 1982-08-31 | 1982-08-31 | Device for mounting electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5941889A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6171693A (en) * | 1984-09-17 | 1986-04-12 | ティーディーケイ株式会社 | Method of mounting chip part |
| JPS61264788A (en) * | 1985-05-20 | 1986-11-22 | ティーディーケイ株式会社 | Chip part mounting machine |
| JPS63163181U (en) * | 1987-04-14 | 1988-10-25 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51149562A (en) * | 1975-06-17 | 1976-12-22 | Matsushita Electric Ind Co Ltd | Machine for inserting electronic parts automatically |
| JPS53106466A (en) * | 1977-02-28 | 1978-09-16 | Matsushita Electric Ind Co Ltd | Electronic part inserting machine |
| JPS54106870A (en) * | 1978-02-10 | 1979-08-22 | Nippon Electric Co | Automatic hybrid ic producing machine |
| JPS55151393A (en) * | 1979-05-16 | 1980-11-25 | Nippon Electric Co | Device for automatically carrying component |
| JPS5626493A (en) * | 1980-03-17 | 1981-03-14 | Matsushita Electric Ind Co Ltd | Device for inserting electric part |
| JPS5748672U (en) * | 1980-09-03 | 1982-03-18 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52155247A (en) * | 1976-06-16 | 1977-12-23 | Ashimori Ind Co Ltd | Manufacture of ropeelike substance with variable size |
-
1982
- 1982-08-31 JP JP57152197A patent/JPS5941889A/en active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51149562A (en) * | 1975-06-17 | 1976-12-22 | Matsushita Electric Ind Co Ltd | Machine for inserting electronic parts automatically |
| JPS53106466A (en) * | 1977-02-28 | 1978-09-16 | Matsushita Electric Ind Co Ltd | Electronic part inserting machine |
| JPS54106870A (en) * | 1978-02-10 | 1979-08-22 | Nippon Electric Co | Automatic hybrid ic producing machine |
| JPS55151393A (en) * | 1979-05-16 | 1980-11-25 | Nippon Electric Co | Device for automatically carrying component |
| JPS5626493A (en) * | 1980-03-17 | 1981-03-14 | Matsushita Electric Ind Co Ltd | Device for inserting electric part |
| JPS5748672U (en) * | 1980-09-03 | 1982-03-18 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6171693A (en) * | 1984-09-17 | 1986-04-12 | ティーディーケイ株式会社 | Method of mounting chip part |
| JPH0369200B2 (en) * | 1984-09-17 | 1991-10-31 | Tdk Electronics Co Ltd | |
| JPS61264788A (en) * | 1985-05-20 | 1986-11-22 | ティーディーケイ株式会社 | Chip part mounting machine |
| JPH0370920B2 (en) * | 1985-05-20 | 1991-11-11 | Tdk Electronics Co Ltd | |
| JPS63163181U (en) * | 1987-04-14 | 1988-10-25 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0432560B2 (en) | 1992-05-29 |
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