JPS5941589Y2 - Contact holding mechanism in the connection mechanism of IC mounting board - Google Patents

Contact holding mechanism in the connection mechanism of IC mounting board

Info

Publication number
JPS5941589Y2
JPS5941589Y2 JP1981066074U JP6607481U JPS5941589Y2 JP S5941589 Y2 JPS5941589 Y2 JP S5941589Y2 JP 1981066074 U JP1981066074 U JP 1981066074U JP 6607481 U JP6607481 U JP 6607481U JP S5941589 Y2 JPS5941589 Y2 JP S5941589Y2
Authority
JP
Japan
Prior art keywords
cover
contact
hook
mounting board
terminal holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981066074U
Other languages
Japanese (ja)
Other versions
JPS57178390U (en
Inventor
秀晴 横山
Original Assignee
山一電機工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 山一電機工業株式会社 filed Critical 山一電機工業株式会社
Priority to JP1981066074U priority Critical patent/JPS5941589Y2/en
Publication of JPS57178390U publication Critical patent/JPS57178390U/ja
Application granted granted Critical
Publication of JPS5941589Y2 publication Critical patent/JPS5941589Y2/en
Expired legal-status Critical Current

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  • Connecting Device With Holders (AREA)

Description

【考案の詳細な説明】 本考案はIC実装盤とIC接続盤の接続機構における接
触押さえ機構に関し、殊にIC実装盤の側方へ突出させ
たIC外部端子と、IC接続盤のコンタクトとの接触部
へ両者の組付に伴ない適切な接触押さえ作用を与えて、
安定且つ高信頼の接続を図る機構に係る。
[Detailed description of the invention] The present invention relates to a contact holding mechanism in a connection mechanism between an IC mounting board and an IC connection board, and in particular, a contact holding mechanism for connecting an IC external terminal protruding to the side of the IC mounting board and a contact of the IC connection board. Applying appropriate contact pressing action to the contact part as the two are assembled,
It relates to a mechanism for achieving stable and highly reliable connections.

図面はその一実施例を示す。The drawings show one embodiment thereof.

図において、1はICをパッケージングして戊るIC実
装盤であり、左右側方へ櫛歯状に突設させた多数のIC
外部端子2を備える。
In the figure, 1 is an IC mounting board for packaging ICs, and it has a large number of ICs protruding from the left and right sides in a comb-like shape.
An external terminal 2 is provided.

3はIC接続盤であり、上記IC外部端子2が重なる面
に該IC外部端子2と接触する多数のコンタクト4を備
える。
Reference numeral 3 denotes an IC connection board, which is provided with a large number of contacts 4 that come into contact with the IC external terminals 2 on the surface where the IC external terminals 2 overlap.

該コンタクト4は図示するように、IC接続盤3に植込
貫通される接続柱4aと、該接続柱4aの上端へ横U字
曲部4bを介して連設された弾性接片4cとを備え、該
弾性接片4cをIC接続盤3の表面に穿けられたコンタ
クト収容溝5内に収容し、その横U字曲部4bをコンタ
クト収容溝5の下位底壁5aに支えさせると共に、弾性
接片4cを若干の抑角で前方に延ばしつつその自由端を
内側へ返し曲して成る支え片4dを上記コンタクト収容
溝5の上位底壁5bに支え、又は支え可能な状態にし、
各弾性接片4Cが上記IC外部端子2と並列対向状態と
なる如く配置する。
As shown in the figure, the contact 4 includes a connection post 4a that is implanted and penetrates the IC connection board 3, and an elastic contact piece 4c that is connected to the upper end of the connection post 4a via a horizontal U-shaped bent portion 4b. The elastic contact piece 4c is accommodated in the contact accommodation groove 5 drilled on the surface of the IC connection board 3, and the horizontal U-shaped bent portion 4b is supported by the lower bottom wall 5a of the contact accommodation groove 5. A supporting piece 4d formed by extending the contact piece 4c forward at a slight depression angle and bending its free end inward is supported or capable of being supported on the upper bottom wall 5b of the contact receiving groove 5,
Each elastic contact piece 4C is arranged so as to face the IC external terminal 2 in parallel.

又各コンタクト4は図示のように交互に向きを変えて植
込まれ、隣り合うコンタクトの植込位置が同一線上に位
置しないように配置されている。
Further, as shown in the figure, the contacts 4 are implanted in alternating directions, and are arranged so that the implantation positions of adjacent contacts are not located on the same line.

第1図は接続柱4aと横U字曲部4bとをセンターを一
致させて連設した場合を示すが、第2図は接続柱4aを
コンタクト収容溝5間の隔壁6側へピッチをずらして延
設した場合を示す。
Fig. 1 shows a case in which the connecting post 4a and the horizontal U-shaped bent portion 4b are arranged in series with their centers aligned, but Fig. 2 shows a case in which the connecting post 4a is shifted in pitch toward the partition wall 6 between the contact housing grooves 5. This shows the case where the construction is extended.

7はIC接続盤3に搭載させたIC実装盤1の上面へ閉
合されてIC接続盤3へ取付けられるカバーである。
Reference numeral 7 denotes a cover that is closed onto the top surface of the IC mounting board 1 mounted on the IC connection board 3 and is attached to the IC connection board 3.

カバー7は金属板加工され、天板7a周囲から縁板7b
を折曲して、該縁板7bをIC接続盤3の表面縁部に支
持状態にして両者間に空間を形成しつつ抱合させる。
The cover 7 is made of a metal plate, and extends from around the top plate 7a to the edge plate 7b.
The edge plate 7b is supported on the edge of the surface of the IC connection board 3, and a space is formed between the two to fit together.

カバー7にはその対向する一対の左右縁板7bからIC
接続盤3へ向かう複数の鉤形係止片8を立下げ、接続盤
3の左右側面には該鉤形係止片8を抜差する係合溝9を
設け、該保合溝9を上記鉤形係止片8が該係合溝9内で
コンタクト植込列方向へ横移動できる寸法とし、以って
カバー7の同方向への移動を許容する構成とすると共に
、該係合溝9の一端に該カバー7の横移動にて上記係止
片8の係止爪片8aを受は入れ係合する鉤形段部10が
形成され、カバー7は上記によって接続盤3の上面に沿
い開き止め位置と開き止め解除位置とに横移動され、開
き止め位置への横移動にてのロック状態(係止爪片8a
と鉤形段部1oの係合状態)が形成され、開き止め解除
位置への横移動にてロック解除となり、取外し可能とな
る。
The IC is attached to the cover 7 from a pair of opposing left and right edge plates 7b.
A plurality of hook-shaped locking pieces 8 facing the connection board 3 are lowered, and engagement grooves 9 for inserting and removing the hook-shaped locking pieces 8 are provided on the left and right side surfaces of the connection board 3, and the retaining grooves 9 are arranged as described above. The hook-shaped locking piece 8 is dimensioned so that it can move laterally in the direction of the contact implantation row within the engagement groove 9, thereby allowing the cover 7 to move in the same direction, and the engagement groove 9 A hook-shaped stepped portion 10 is formed at one end of the cover 7 to receive and engage the locking claw piece 8a of the locking piece 8 when the cover 7 is moved laterally. It is moved laterally between the opening stop position and the opening stop release position, and when it is moved laterally to the opening stop position, it is in the locked state (locking claw piece 8a
and the hook-shaped stepped portion 1o are formed, and the lock is released by lateral movement to the opening stop release position, and removal becomes possible.

11は上記カバー7の天板7a内面側へ取付けられた端
子押さえバットである。
Reference numeral 11 denotes a terminal holding bat attached to the inner surface of the top plate 7a of the cover 7.

該端子押さえパッド11は合成樹脂の如き細長の絶縁材
で構成され各IC外部端子2の列と対応して間隔的に配
置される。
The terminal holding pads 11 are made of an elongated insulating material such as synthetic resin, and are arranged at intervals corresponding to the rows of each IC external terminal 2.

前述のようにIC接続盤3へIC実装盤1を抱合させる
ことによって、IC外部端子2とコンタクト4の弾性接
片4cとが上下に重なって接触又は接触可能な状態が形
成される。
By fitting the IC mounting board 1 to the IC connection board 3 as described above, a state is formed in which the IC external terminals 2 and the elastic contact pieces 4c of the contacts 4 overlap vertically and are in contact or capable of contact.

更にこれに上記カバー7を被せることによって上記端子
押さえパッド11はIC外部端子2へ上から押圧力を与
え、該押圧力にて弾性接片4cを撓ませ、これを支え片
4dにて上位底壁5bに支えつつその復元力にて両者の
確実な弾装を図る。
Furthermore, by covering this with the cover 7, the terminal holding pad 11 applies a pressing force to the IC external terminal 2 from above, the pressing force causes the elastic contact piece 4c to bend, and the supporting piece 4d is used to hold the elastic contact piece 4c at the upper bottom. While being supported by the wall 5b, its restoring force ensures reliable ammunition loading for both.

該IC外部端子2とコンタクト4との接触は上記カバー
7を上記開き止め解除位置から開き止め位置へ横移動さ
せて、鉤形係止片8と鉤形段部10との係合右招来する
ことによって保持される。
The contact between the IC external terminal 2 and the contact 4 causes the cover 7 to move laterally from the opening stop release position to the opening stop position, causing the hook-shaped locking piece 8 to engage with the hook-shaped stepped portion 10. It is maintained by

上記弾性押えさパッド11は好ましくは図示の例に示す
如く、カバー天板7aへの取付面に複数の取付子11a
を一体に設け、該取付子11aを天板7aに穿けた長孔
12の縁部に滑合させる等して、カバー7単独の横移動
を許容する如く取付けする。
The elastic presser pad 11 preferably has a plurality of mounts 11a on its mounting surface to the cover top plate 7a, as shown in the illustrated example.
The cover 7 is mounted in such a way as to allow the cover 7 to move laterally by itself, such as by sliding the mount 11a onto the edge of a long hole 12 drilled in the top plate 7a.

これによってカバー7は単独で上記開き止め解除位置か
ら開き止め位置へ横移動され、この間端子押さえパッド
11は横移動せず前記接触押さえを保持する。
As a result, the cover 7 is independently moved laterally from the opening stop release position to the opening stop position, and during this time, the terminal holding pad 11 does not move laterally and holds the contact holding down.

又端子押さえパッド11は好ましくはその端子押さえ面
中央に逃げ溝11bをその長平に亘って形成して二条の
端子押さえ突条11c、11cを形成し、IC外部端子
2とコンタクト4の弾性接片4cとの各接触部を上記端
子押さえ突条11c、 llc間の溝部に位置させると
共に、端子押さえ突条11c。
Preferably, the terminal holding pad 11 has an escape groove 11b formed in the center of the terminal holding surface over its long plane, and two terminal holding protrusions 11c, 11c are formed to form elastic contact pieces between the IC external terminals 2 and the contacts 4. 4c are located in the grooves between the terminal presser protrusions 11c and llc, and the terminal presser protrusions 11c.

11cにより上記接触部の左右を押圧して接触押さえを
図るようにする。
11c to press the left and right sides of the contact portion to maintain contact.

これによってIC外部端子2は突条11c、 llc
間で溝11b方向への若干の撓み弾性が許容され、これ
とコンタクト4の弾性接片4cの復元弾力にて良好な加
圧接触が得られる。
As a result, the IC external terminal 2 is connected to the protrusion 11c, llc.
A slight bending elasticity in the direction of the groove 11b is allowed between the contacts 4 and the restoring elasticity of the elastic contact piece 4c of the contact 4 to obtain good pressure contact.

又本考案によれば、カバー7を被せ、開き止め位置へ横
移動させるのみで端子押さえパッド11により、IC外
部端子2とコンタクト4との接触が良好に保持され、安
定且つ高信頼の接続が果される。
Further, according to the present invention, the contact between the IC external terminal 2 and the contact 4 can be maintained well by the terminal holding pad 11 by simply covering the cover 7 and moving it laterally to the opening stop position, thereby achieving a stable and highly reliable connection. fulfilled.

カバー7は端子押さえパッド11と端子2の接触抵抗の
影響を受けず円滑に開き止め位置へ横移動させることに
よって、IC接続盤3と一体に組付けられ、端子押さえ
パッド11の浮上りを防止し端子押さえ面の密着を保持
することができる。
The cover 7 is assembled integrally with the IC connection board 3 by smoothly moving laterally to the opening stop position without being affected by the contact resistance between the terminal holding pad 11 and the terminal 2, thereby preventing the terminal holding pad 11 from floating up. It is possible to maintain close contact with the terminal holding surface.

カバー7は回動可に取付けて、開閉させる方式と異なり
、開閉のためのデッドスペースを要せず、IC外部端子
2の面と平行且つ均一な接触圧で接触させることができ
る。
Unlike a method in which the cover 7 is rotatably attached and opened and closed, no dead space is required for opening and closing, and the cover 7 can be brought into contact with the surface of the IC external terminal 2 parallel to and with uniform contact pressure.

前記の如くカバー7はパッド11を追随動させず、単独
で開き止め位置と同解除位置に横移動できる。
As described above, the cover 7 can independently move laterally to the opening stop position and the release position without causing the pad 11 to follow the movement.

従ってカバー7の横移動にてパッド11がIC外部端子
2をこすり同端子2を横方向へ偏位させピッチに不揃い
を招来したり、又コンタクト4を引掛けて偏位又は変形
させたりする恐れがなく、接触部を上から押さえ込んだ
静的状態を確保し接触を正常に保持する。
Therefore, when the cover 7 moves laterally, the pad 11 may rub against the IC external terminal 2, causing the terminal 2 to be displaced laterally, resulting in uneven pitch, or may catch the contact 4, causing it to become displaced or deformed. This ensures a static state where the contact part is pressed down from above and maintains normal contact.

上記工夫によってカバー7を横移動方式として適切なる
接触押さえを図る機構の実用が支障なく果せ、薄形化等
に寄与する。
With the above-mentioned device, it is possible to put the cover 7 into practical use without any hindrance in order to achieve proper contact and pressure by moving the cover 7 laterally, and this contributes to a reduction in the thickness of the cover.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の実施例を示し、第1図Aは図IC実装盤
の接続機構を構成する各部分を分解して示す斜面図、同
B図は端子押さえパッドを一部切欠して示す斜面図、第
2図はIC接続盤へカバーを取付けた状態をカバーを一
部切欠して示す平面図、第3図はコンタクト配列方向か
ら見たカバーを一部切欠せる同側面図、第4図は同正面
図、第5図A図は端子押さえパッドによる接触押さえ部
を拡大して示す同断面図、同B図は端子押さえパッドに
よるIC実装盤のIC外部端子とIC接続盤のコンタク
トとの接触保持状態を拡大して示す同断面図である。 1・・・・・・IC実装盤、2・・・・・・IC外部端
子、3・・・・・・IC接続盤、4・・・・・・コンタ
クト、7・・・・・・カバー8・・・・・・鉤形係止片
、8a・・・・・・係止爪片、9・・・・・・係合溝、
10・・・・・・鉤形段部、11・・・・・・端子押さ
えパッド、11a・・・・・・取付子、12・・・・・
・長孔。
The drawings show an embodiment of the present invention, and FIG. 1A is an exploded perspective view of each part constituting the connection mechanism of the IC mounting board, and FIG. Figure 2 is a plan view with the cover partially cut away showing the state in which the cover is attached to the IC connection board, Figure 3 is a side view of the same with the cover partially cut away as seen from the contact arrangement direction, and Figure 4. 5A is a front view of the same, FIG. 5A is an enlarged cross-sectional view showing the contact holding part by the terminal holding pad, and FIG. FIG. 3 is an enlarged cross-sectional view of the contact holding state. 1...IC mounting board, 2...IC external terminal, 3...IC connection board, 4...contact, 7...cover 8...Hook-shaped locking piece, 8a...Latching claw piece, 9...Engagement groove,
10...Hook-shaped stepped portion, 11...Terminal holding pad, 11a...Mounter, 12...
・Long hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] IC実装盤のIC外部端子が載接される多数のコンタク
トを備えるIC接続盤と、該IC接続盤上に搭載された
IC実装盤上へ閉合されるカバーとから戊り、該カバー
から上記IC接続盤の左右側面へ向は延びる鉤形係止片
を設けると共に、IC接続盤の左右側面に該鉤形係止片
を抜差可に受は入れてコンタクト植込列方向への横移動
を許容する係合溝を設け、更に該係合溝の一端に上記カ
バーの一方のへ横移動にて上記鉤形係止片の係止爪片を
受は入れ係合状態となる鉤形段部を連設し、上記カバー
の他方への横移動にて上記係止爪片と鉤形段部との係合
を解除しカバー取外しを可となし、更に上記カバー天板
の内面側に上記IC外部端子の列と対応する端子押さえ
パッドを取付け、該端子押さえパッドを細長の絶縁材で
形威し、該端子押さえパッドにて上記IC外部端子をコ
ンタクトへ向は押圧する構成とすると共に、該端子押さ
えパッドに設けた取付子をカバー天板に穿けた長孔に滑
合させ、該滑合部をガイドとして上記カバー単独の横移
動を許容する構成としたことを特徴とするIC実装盤の
接続機構における接触押さえ機構。
An IC connection board having a large number of contacts on which IC external terminals of the IC mounting board are mounted, and a cover that is closed onto the IC mounting board mounted on the IC connection board, and the IC mounting board is removed from the cover. Hook-shaped locking pieces extending toward the left and right sides of the IC connection board are provided, and the hook-shaped locking pieces are removably received on the left and right sides of the IC connection board to facilitate lateral movement in the direction of the contact implant row. A hook-shaped step portion is provided at one end of the engagement groove to receive a locking claw piece of the hook-shaped locking piece by moving laterally to one side of the cover to enter an engaged state. When the cover is moved laterally to the other side, the engagement between the locking claw piece and the hook-shaped stepped portion is released, allowing the cover to be removed. A terminal holding pad corresponding to a row of external terminals is attached, the terminal holding pad is made of an elongated insulating material, and the terminal holding pad is configured to press the IC external terminal toward the contact. An IC mounting board characterized in that a mounting element provided on a terminal holding pad is slidably fitted into a long hole drilled in a top plate of the cover, and the sliding part is used as a guide to allow lateral movement of the cover alone. Contact holding mechanism in connection mechanism.
JP1981066074U 1981-05-07 1981-05-07 Contact holding mechanism in the connection mechanism of IC mounting board Expired JPS5941589Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981066074U JPS5941589Y2 (en) 1981-05-07 1981-05-07 Contact holding mechanism in the connection mechanism of IC mounting board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981066074U JPS5941589Y2 (en) 1981-05-07 1981-05-07 Contact holding mechanism in the connection mechanism of IC mounting board

Publications (2)

Publication Number Publication Date
JPS57178390U JPS57178390U (en) 1982-11-11
JPS5941589Y2 true JPS5941589Y2 (en) 1984-11-30

Family

ID=29862110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981066074U Expired JPS5941589Y2 (en) 1981-05-07 1981-05-07 Contact holding mechanism in the connection mechanism of IC mounting board

Country Status (1)

Country Link
JP (1) JPS5941589Y2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60181878U (en) * 1984-05-14 1985-12-03 ヒロセ電機株式会社 Chip carrier connector
JPH0747827Y2 (en) * 1987-06-22 1995-11-01 第一精工株式会社 IC socket
JP2585788Y2 (en) * 1993-06-22 1998-11-25 ミツミ電機株式会社 connector

Also Published As

Publication number Publication date
JPS57178390U (en) 1982-11-11

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