JP2527673B2 - IC socket - Google Patents
IC socketInfo
- Publication number
- JP2527673B2 JP2527673B2 JP4307557A JP30755792A JP2527673B2 JP 2527673 B2 JP2527673 B2 JP 2527673B2 JP 4307557 A JP4307557 A JP 4307557A JP 30755792 A JP30755792 A JP 30755792A JP 2527673 B2 JP2527673 B2 JP 2527673B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- terminal
- terminal member
- pressing
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Connecting Device With Holders (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はソケット本体に具備させ
たコンタクトをＩＣパッケージの端子部材の上面に接触
するようにしたＩＣソケットに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket in which a contact provided on a socket body is in contact with an upper surface of a terminal member of an IC package.
【０００２】[0002]
【従来の技術】特開昭６３ー６２１７５号公報において
は、コンタクトの湾曲バネ片の上端から接触アームを延
設し、この接触アームをコンタクト開閉部材の下降によ
り後方擺動させてＩＣパッケージの端子部材との接触を
解除し、前方擺動時に端子部材と接触するＩＣソケット
を示している。2. Description of the Related Art In Japanese Patent Laid-Open No. 63-62175, a contact arm is extended from the upper end of a curved spring piece of a contact, and the contact arm is slid rearward by lowering a contact opening / closing member so as to be a terminal member of an IC package. 6 shows an IC socket which is released from contact with the terminal member and is brought into contact with the terminal member during forward movement.
【０００３】殊に２図においては、ＩＣパッケージを裏
返しにし、端子部材の先端部上面をソケット本体に支持
し、同先端部下面にコンタクトの接触アーム先端を押し
当てるようにしたＩＣソケットを示している。In particular, FIG. 2 shows an IC socket in which the IC package is turned upside down, the upper end of the terminal member is supported by the socket body, and the lower end of the contact arm is pressed against the lower end of the IC member. There is.
【０００４】[0004]
【発明が解決しようとする問題点】然るに、ＩＣパッケ
ージの端子部材の先端を水平に支持し、この支持部の下
方よりコンタクトを上方へ向け立上げ、（縦方向に立上
げ）このコンタクトの先端接点部を上記端子部材の上面
に加圧接触するタイプのソケットにおいては、コンタク
トのバネ部に側方圧を有効に生じさせることはできる
が、端子部材の上面に加圧接触するバネ力を充分に惹起
させることができず、従って端子部材とコンタクトとの
接触圧が充分得られず、その改善が課題となっている。However, the tip of the terminal member of the IC package is supported horizontally, and the contact is erected upward from the lower part of this support portion (elevated in the vertical direction) to form the tip of this contact. In a socket of the type in which the contact portion is in pressure contact with the upper surface of the terminal member, lateral pressure can be effectively generated in the spring portion of the contact, but the spring force in pressure contact with the upper surface of the terminal member is sufficient. Therefore, the contact pressure between the terminal member and the contact cannot be sufficiently obtained, and its improvement is a problem.
【０００５】上記先行例においても接触アームの先端を
端子部材の上面に単に押し付けるのみで、コンタクトの
バネ部の弾力が効率的に活用されておらず、上記問題点
を内在している。Also in the above-mentioned prior art example, the tip end of the contact arm is simply pressed against the upper surface of the terminal member, and the elastic force of the spring portion of the contact is not effectively utilized, and the above problems are inherent.
【０００６】又上記先行例はＩＣパッケージを配線基板
に実装する時に、ハンダ付け面となる端子部材の裏面が
コンタクトの接点部と加圧接触して表面のメッキが損傷
される恐れがあり、殊に先行例は接点部の加圧力を高め
信頼性を高めんとすると、逆に上記損傷が増長される技
術的矛盾を有している。Further, in the above-mentioned prior art, when the IC package is mounted on the wiring board, the back surface of the terminal member, which is a soldering surface, may come into pressure contact with the contact portion of the contact, and the plating on the surface may be damaged. On the other hand, the prior art has a technical contradiction in which the damage is increased if the pressure applied to the contact portion is increased and the reliability is increased.
【０００７】本発明は上記問題点を解決して、略水平に
置かれた端子部材の上面に下方から延ばされたコンタク
トの接点部を加圧接触する形式のＩＣソケットを健全に
実施できるようにしたものである。In order to solve the above problems, the present invention can properly implement an IC socket of a type in which a contact portion of a contact extended from below is pressure-contacted with an upper surface of a terminal member placed substantially horizontally. It is the one.
【０００８】[0008]
【問題点を解決するための手段】この発明は上記形式の
ソケットにおいて、ソケット本体にＩＣパッケージの端
子部材の下面を略水平に支持する端子支持座を備え、該
端子支持座に支持された端子部材の上面に自らの弾力に
て自己変位して加圧接触すべく配置されたコンタクトを
備えたＩＣソケットにおいて、該コンタクトは自らの弾
力にて上記端子支持座へ向け自己変位しその接触片部を
上記端子支持座に当接して弾力を蓄えた状態に設置し、
更に該接触片部が上記端子支持座に支持された端子部材
の厚みに相当する弾力を蓄えて上記弾力との和を以って
上記端子部材の上面に加圧接触する構成としたものであ
る。According to the present invention, in a socket of the above type, the socket body is provided with a terminal support seat for supporting the lower surface of the terminal member of the IC package substantially horizontally, and the terminal supported by the terminal support seat. In an IC socket provided with a contact arranged on the upper surface of a member so as to be self-displaced by its own elasticity to make a pressure contact, the contact is self-displaced toward the terminal support seat by its own elasticity and its contact piece portion. Is installed in a state in which it is in contact with the above-mentioned terminal support seat and has accumulated elasticity,
Further, the contact piece portion stores an elastic force corresponding to the thickness of the terminal member supported by the terminal support seat, and is brought into pressure contact with the upper surface of the terminal member by the sum of the elastic force. .
【０００９】[0009]
【作用】上記のように端子支持座の下方から同支持座を
超えて縦方向に延在されたコンタクトは自らの弾力によ
る自己変位にてその接触片部が上記端子支持座に弾力を
蓄えた状態で当接され、待機状態に置かれる。そして上
記接触片部は上記端子支持座に支持された端子部材に接
触する時、該端子部材の厚みに相当する弾力を蓄え、こ
の弾力と上記予備弾力との和で上記加圧接触を図ること
ができ、コンタクトのバネ部の弾力を効率的に活用し薄
肉の端子部材の厚みの範囲内でも充分なる加圧力を以っ
て端子部材の上面に接触でき、信頼性を著しく向上す
る。As described above, the contact extending longitudinally from below the terminal support seat beyond the support seat is self-displaced by its own elastic force, and the contact piece stores elastic force in the terminal support seat. It is abutted in a state and put in a standby state. When the contact piece comes into contact with the terminal member supported by the terminal support seat, an elastic force corresponding to the thickness of the terminal member is stored, and the pressure contact is achieved by the sum of this elastic force and the preliminary elastic force. In addition, the elastic force of the spring portion of the contact can be efficiently utilized to make contact with the upper surface of the terminal member with sufficient pressing force even within the range of the thickness of the thin terminal member, thereby significantly improving reliability.
【００１０】又接触圧が増加されても配線基板とのハン
ダ実装に供される端子部材の下面を損傷する不具合を招
来せず、端子部材を保護しつつ、接触圧も向上できる利
点を有する。Further, even if the contact pressure is increased, there is an advantage that the lower surface of the terminal member used for solder mounting with the wiring board is not damaged, and the contact pressure can be improved while protecting the terminal member.
【００１１】[0011]
【実施例】以下本発明の実施例を図１乃至図８に基いて
詳述する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to FIGS.
【００１２】ソケット本体１はその上面中央部にＩＣ搭
載部１４を有すると共に、該ＩＣ搭載部１４に搭載され
たＩＣパッケ−ジ２の多数の端子部材３の下面を支持す
る端子支持座１６を有し、該端子支持座１６に支持され
た端子部材の上面と接触すべく配置された多数のコンタ
クト４を有する。The socket body 1 has an IC mounting portion 14 at the center of its upper surface, and a terminal support seat 16 for supporting the lower surfaces of the many terminal members 3 of the IC package 2 mounted on the IC mounting portion 14. And a large number of contacts 4 arranged to come into contact with the upper surface of the terminal member supported by the terminal support seat 16.
【００１３】上記ＩＣパッケ−ジ２の端子部材３は図５
に示すようにその対向する二側面より互いに平行して側
方へ突出され、二段曲げされて略水平にした先端を有し
ている。The terminal member 3 of the IC package 2 is shown in FIG.
As shown in (1), the two side surfaces facing each other are protruded to the side in parallel with each other, and are bent in two steps to have a substantially horizontal tip.
【００１４】又上記コンタクト４は図３、図７に示すよ
うにソケット本体１に植込された固定端７の下方へ延ば
されソケット本体下方へ突出された雄端子５を有し、固
定端７の上方へ連設された湾曲バネ片６を有する。該湾
曲バネ片６は前方（ＩＣパッケ−ジ２側）へ向け突出さ
れ、該湾曲バネ片６の上端に接触片部８を連設する。該
接触片部８は上記湾曲バネ片６の突出側（前方）へ突出
され、その先端に下向きの接触用突起９を形成してい
る。Further, as shown in FIGS. 3 and 7, the contact 4 has a male terminal 5 which extends below a fixed end 7 implanted in the socket body 1 and projects downward from the socket body. It has a curved spring piece 6 which is continuously provided above 7. The curved spring piece 6 is protruded forward (toward the IC package 2), and a contact piece 8 is connected to the upper end of the curved spring piece 6. The contact piece 8 protrudes toward the projecting side (forward) of the curved spring piece 6 and has a downward contact projection 9 formed at the tip thereof.
【００１５】上記コンタクトの上端、即ち接触片部８よ
り後方へ片持ア−ム１０を延出する。該片持ア−ム１０
は一端において上記接触片部８に連設され、他端が自由
端となされ、該自由端部に後記するコンタクト開閉部材
によって開閉される押圧受部１１が形成されている。該
押圧受部１１は上方へ向け突出された突片によって形成
する。A cantilever arm 10 extends rearward from the upper end of the contact, that is, the contact piece portion 8. The cantilever arm 10
Has a pressing receiving portion 11 which is connected to the contact piece portion 8 at one end and has a free end at the other end, and which is opened and closed by a contact opening / closing member described later. The pressure receiving portion 11 is formed by a protrusion protruding upward.
【００１６】上記押圧受部１１たる上向き突片の上端を
コンタクト開閉部材による押圧点Ｐ2とし、又上記接触
片部８の接触用突起９の下端をＩＣパッケ−ジ２の端子
部材３の上面との接触点Ｐ1とし、該接触点Ｐ1を通る水
平線より上位に上記押圧点Ｐ2が位置するように設定す
る。The upper end of the upward projecting piece serving as the pressure receiving portion 11 is the pressing point P 2 by the contact opening / closing member, and the lower end of the contacting projection 9 of the contact piece portion 8 is the upper surface of the terminal member 3 of the IC package 2. The contact point P 1 with the contact point P 1 is set so that the pressing point P 2 is located above the horizontal line passing through the contact point P 1 .
【００１７】又上記接触片部８を連設せる湾曲バネ片６
の上端Ｐ3を上記接触点Ｐ1より上位に配し、該湾曲バネ
片６の上端Ｐ3より上位に上記押圧点Ｐ2を配する。この
接触点Ｐ1と湾曲バネ片の上端Ｐ3と押圧点Ｐ2の関係は
図７に明示する。A curved spring piece 6 for connecting the contact piece portions 8 in series.
Upper P 3 a disposed to the upper than the contact point P 1, to distribution of the pressing point P 2 to the upper than the upper end P 3 of the curved spring piece 6. The relationship between the contact point P 1 , the upper end P 3 of the curved spring piece and the pressing point P 2 is clearly shown in FIG.
【００１８】接触点Ｐ1を下位にし、押圧点Ｐ2を上位に
する相対関係は、上記片持ア−ム１０の延出方向と、接
触受部１１の突出寸法によって定められる。The relative relationship in which the contact point P 1 is lower and the pressing point P 2 is higher is determined by the extending direction of the cantilever arm 10 and the projecting dimension of the contact receiving portion 11.
【００１９】図示の片持ア−ム１０は接触片部８から一
旦接触点Ｐ1以下へ延ばされ、更にフック状に曲げ、上
記上向き突片（押圧受部１１）を形成している。The cantilever arm 10 shown in the drawing is once extended from the contact piece portion 8 to the contact point P 1 or less and is further bent into a hook shape to form the upward projecting piece (press receiving portion 11).
【００２０】好ましくは上記押圧受部１１の押圧点Ｐ2
を上記湾曲バネ片６より後方に配置するように上記片持
ア−ム１０の延出寸法を選択する。Preferably, the pressure point P 2 of the pressure receiving portion 11 is
The extension dimension of the cantilever arm 10 is selected so as to be arranged rearward of the curved spring piece 6.
【００２１】図３乃至５図は上記コンタクト４が片面接
触形である場合を示し、上記接触片部８の接触用突起９
が端子支持座１６に当接して上記湾曲バネ片６、即ちコ
ンタクト４が自己弾力（補圧）を蓄えた状態において、
この端子支持座１６に支持された端子部材３の先端部上
面に図７矢印Ｗ3で示すように斜め上方より加圧接触し
ている。即ち、上記補圧に加え端子部材３の厚みに相当
する弾力を以って接触用突起９が端子部材３の先端部上
面に加圧接触している。3 to 5 show the case where the contact 4 is of a single-sided contact type, and the contacting projection 9 of the contacting piece 8 is shown.
Is in contact with the terminal support seat 16 and the curved spring piece 6, that is, the contact 4 stores self-elasticity (compensation pressure),
As shown by an arrow W 3 in FIG. 7, pressure contact is made with the upper surface of the tip end portion of the terminal member 3 supported by the terminal support seat 16 from diagonally above. That is, in addition to the above-mentioned supplementary pressure, the contact projections 9 are in pressure contact with the upper surface of the tip end portion of the terminal member 3 with an elastic force corresponding to the thickness of the terminal member 3.
【００２２】又図６は上記コンタクト４が両面接触形
（挟接形）である場合を示し、図示のように前記固定端
７に接片２２を立上げ、その先端部において上記ＩＣパ
ッケ−ジ２の端子部材３の先端部下面を支持し、同先端
部上面に接触片部８が湾曲バネ部６の自己弾力にて加圧
接触し、よって端子部材３の先端部下面を支持し、同先
端部上面に接触片部８が加圧接触して端子部材３の先端
部上下面を挟持し接触を果すようにする。１２は上記コ
ンタクト４の押圧受部１１に押下力を与えるコンタクト
開閉部材であり、上記ソケット本体１に上下動可に被装
される。FIG. 6 shows a case where the contact 4 is of a double-sided contact type (sandwich type). As shown in the drawing, a contact piece 22 is erected on the fixed end 7, and the IC package is provided at the tip thereof. 2 supports the lower surface of the tip portion of the terminal member 3, and the contact piece portion 8 makes pressure contact with the upper surface of the distal portion of the terminal member 3 by the self-elasticity of the bending spring portion 6, thus supporting the lower surface of the tip portion of the terminal member 3. The contact piece portion 8 is brought into pressure contact with the upper surface of the tip portion so as to sandwich and contact the upper and lower surfaces of the tip portion of the terminal member 3. Reference numeral 12 denotes a contact opening / closing member that applies a pressing force to the pressure receiving portion 11 of the contact 4, and is mounted on the socket body 1 so as to be vertically movable.
【００２３】上記コンタクト開閉部材１２は図１、図２
に示すように、中央部にＩＣ収容窓１３を有し、該ＩＣ
収容窓１３の直下にソケット本体１のＩＣ搭載部１４を
形成する。該ＩＣ搭載部１４は端子支持座１６の上面よ
り上方へ突出して上記ＩＣパッケ−ジ２の端子部材３の
基部を支える突条１５を有し、該突条１５にて端子部材
３の基部を支持しつつ、ＩＣパッケ−ジ２本体の側面又
は端子部材３の曲げ段部を規制し位置決を図る。この
時、図３乃至図５に示す実施例においては、端子部材３
の先端部は突条１５外側の端子支持座１６に支持して定
位置に設置され、又図６に示す実施例においては端子部
材３の先端は接片２２を支持座として支持される。上記
位置決用突条１５は端子部材３を支持せず、ＩＣパッケ
−ジ２本体の側面のみを規制する手段として供しても良
い。The contact opening / closing member 12 is shown in FIGS.
As shown in the figure, the IC housing window 13 is
The IC mounting portion 14 of the socket body 1 is formed directly below the housing window 13. The IC mounting portion 14 has a ridge 15 which projects upward from the upper surface of the terminal support seat 16 and supports the base portion of the terminal member 3 of the IC package 2, and the ridge 15 forms the base portion of the terminal member 3. While supporting, the side surface of the main body of the IC package 2 or the bent step portion of the terminal member 3 is regulated for positioning. At this time, in the embodiment shown in FIGS. 3 to 5, the terminal member 3
The tip end of the terminal is supported by the terminal support seat 16 outside the ridge 15 and installed at a fixed position, and in the embodiment shown in FIG. 6, the tip of the terminal member 3 is supported by the contact piece 22 as the support seat. The positioning projections 15 may not serve to support the terminal member 3 and may serve as a means for restricting only the side surface of the main body of the IC package 2.
【００２４】上記二段曲げされた端子部材３を有するＩ
Ｃパッケージ２は既知であり、端子部材３はＩＣパッケ
ージ本体から側方へ略水平に突出する基部と、該基部か
ら下方へ折曲された中間延在部と、該中間延在部から水
平に折曲された先端部とを有している。この発明におい
ては上記端子部材３の先端部下面を端子支持座１６に支
持し、同時に上記突条１５を曲げ段部内側へ入れ込みつ
つ、その上端で端子部材３の基部を支持する。又は突条
１５にてＩＣパッケージ２本体の側面を規制するもので
ある。I having the above-mentioned two-stage bent terminal member 3
The C package 2 is known, and the terminal member 3 includes a base portion that projects substantially horizontally from the IC package body, an intermediate extending portion that is bent downward from the base portion, and a horizontal portion that extends horizontally from the intermediate extending portion. And a bent tip portion. In the present invention, the lower surface of the tip end portion of the terminal member 3 is supported by the terminal support seat 16, and at the same time, the ridge 15 is inserted inside the bent step portion, while the upper end thereof supports the base portion of the terminal member 3. Alternatively, the protrusion 15 regulates the side surface of the main body of the IC package 2.
【００２５】上記コンタクト４は上記ＩＣ搭載部１４の
対向する辺に沿い並設され、該コンタクト４の接触片部
８は上記端子支持座１６の外側方に形成した開口部１７
内へ収容され、図３乃至図５に示す実施例においてはそ
の接触用突起９を上記端子支持座１６へ向けコンタクト
４の自らの弾力にて自己変位して該上記端子支持座１６
の表面に湾曲バネ片６による弾力で当接し、又図６に示
す実施例においては接片２２に湾曲バネ片６による弾力
で当接し夫々弾力を蓄えた状態、所謂プリロ−ドをかけ
た状態に置かれる。The contacts 4 are juxtaposed along opposite sides of the IC mounting portion 14, and the contact piece portion 8 of the contact 4 is an opening 17 formed outside the terminal support seat 16.
3 to 5, in the embodiment shown in FIGS. 3 to 5, the contact projection 9 is directed toward the terminal support seat 16 and is self-displaced by the resilience of the contact 4 to allow the terminal support seat 16 to be displaced.
6 is abutted by the elastic force of the curved spring piece 6 or, in the embodiment shown in FIG. 6, the abutting piece 22 is abutted by the elastic force of the curved spring piece 6 to store the respective elastic forces, that is, a so-called preload state. Placed in.
【００２６】又上記コンタクト開閉部材１２は上記ＩＣ
収容窓１３の左右外側方に一対の押下操作部１８を備え
る。該押下操作部１８の対向する側壁から係合指１９を
立下げ、該係合指１９をソケット本体１の対向する側壁
に形成した案内溝２０に滑入し、該案内溝２０に従い上
下動可とし、係合指１９の先端に設けた係合爪をコンタ
クト開閉部材１２が一定量上昇した時案内溝上端に設け
た段部に係合させ同開閉部材１２の上昇死点を定める。The contact opening / closing member 12 is the IC
A pair of push-down operation portions 18 are provided on the left and right outer sides of the accommodation window 13. The engaging fingers 19 are erected from the opposing side walls of the push-down operation portion 18, the engaging fingers 19 are slid into the guide grooves 20 formed in the opposing side walls of the socket body 1, and can be moved up and down in accordance with the guide grooves 20. The engaging claw provided at the tip of the engaging finger 19 is engaged with the stepped portion provided at the upper end of the guide groove when the contact opening / closing member 12 is lifted by a certain amount, and the ascending dead center of the opening / closing member 12 is determined.
【００２７】上記コンタクト開閉部材１２は上記例示の
如き結合手段、即ち係合指１９によってソケット本体１
に上下動可に装着され、該装着状態において、ＩＣ収容
窓１３とソケット本体１のＩＣ搭載部１４との対応状態
を形成し、以下に述べるコンタクト４の押圧受部１１と
押圧部２１との対応状態を形成し、更に上記押下操作部
１８をコンタクト４の押圧受部１１の上位に対向配置状
態とする。The contact opening / closing member 12 is connected to the socket body 1 by the connecting means as described above, that is, the engaging fingers 19.
Is mounted so that it can move up and down, and in the mounted state, a corresponding state between the IC housing window 13 and the IC mounting portion 14 of the socket body 1 is formed, and the pressing receiving portion 11 and the pressing portion 21 of the contact 4 described below are formed. A corresponding state is formed, and the pressing operation portion 18 is placed above the pressing receiving portion 11 of the contact 4 so as to face it.
【００２８】上記押下操作部１８から上記各コンタクト
４の押圧受部１１間に介入する隔壁２７を下方へ向け突
設すると共に、該各隔壁２７間の谷部にて上記コンタク
ト４の押圧受部１１に押圧力を付与する押圧部２１を形
成する。A partition wall 27 that intervenes between the pressing operation portion 18 and the pressure receiving portion 11 of each contact 4 is provided so as to project downward, and the pressure receiving portion of the contact 4 is formed at a valley between the partition walls 27. A pressing portion 21 that applies a pressing force to 11 is formed.
【００２９】上記押圧部２１はコンタクト後方へ向け上
り勾配となる下向きの傾斜面とし、コンタクト開閉部材
１２の押下操作部１８に押下力が与えられ押圧部２１が
垂直方向に下降する時、上記押圧受部１１の押圧点Ｐ2
は押圧部２１を形成する傾斜面を滑りながらその下端
側（図３）から上端側（図４）へ移動する。The pressing portion 21 is a downward slope having an upward slope toward the rear of the contact, and when the pressing force is applied to the pressing operation portion 18 of the contact opening / closing member 12 and the pressing portion 21 descends in the vertical direction, the pressing portion 21 is pressed. Pressing point P 2 of the receiving portion 11
Moves from the lower end side (FIG. 3) to the upper end side (FIG. 4) while sliding on the inclined surface forming the pressing portion 21.
【００３０】詳述すれば、図７、図８に示すように押圧
受部１１に押圧力が与えられると、押圧点Ｐ2は湾曲バ
ネ片６を弾性に抗し変位させつつ、片持ア−ムを変位さ
せ上記接触点Ｐ1を中心とする円の上死点を過ぎた上位
位置（押圧始点）から、同側死点後方へ向かう軌跡を以
って矢印Ｗ1の方向へ後方擺動すると共に、コンタクト
接触片部８を端子部材３から確実に離間させる。好まし
くは片持ア−ム１０及び接触片部８は押圧に対し剛体と
する。More specifically, when a pressing force is applied to the pressure receiving portion 11 as shown in FIGS. 7 and 8, the pressing point P 2 displaces the bending spring piece 6 against the elasticity, and also the cantilever movement. - backward from displacing the arm upper position past the top dead center of a circle centered on the said contact point P 1 (pressing start point), a trajectory toward the same side dead center rear I than in the direction of arrow W 1擺動At the same time, the contact contact piece portion 8 is reliably separated from the terminal member 3. Preferably, the cantilever arm 10 and the contact piece portion 8 are rigid against pressing.
【００３１】この時押圧点Ｐ2は矢印Ｗ2で示す垂直方向
の押下力が与えられるが、この押圧力は接触点Ｐ1を垂
直方向へ押下げる力としては作用せず、むしろ上記接触
点Ｐ1の上位に湾曲バネ片６の上端Ｐ3を、該湾曲バネ片
上端Ｐ3の上位に押圧点Ｐ2を夫々配した構成から押圧点
Ｐ2を矢印Ｗ1方向へ後方擺動させ且つ接触点Ｐ1を斜上
方へ離間させつつ後方擺動させる分力として有効に寄与
する。At this time, the pressing point P 2 is given a pressing force in the vertical direction indicated by the arrow W 2 , but this pressing force does not act as a force to press down the contact point P 1 in the vertical direction, but rather the above contact point. the upper end P 3 of curved upper P 1 spring piece 6, and the pressing point P 2 is the rear擺動the arrow W 1 direction from a configuration in which the pressing point P 2 respectively disposed on top of the curved spring piece upper P 3 contacts It effectively contributes as a component force that causes the point P 1 to oscillate backward while separating the point P 1 obliquely upward.
【００３２】上記実施例においては、押圧部２１を傾斜
面とすることによって上記の後方擺動作用を助長してい
るが、押圧部２１を略水平面とし、押圧受部１１に押圧
力を与える構造として上記の後方擺動作用を得るように
しても良い。In the above embodiment, the pressing portion 21 is formed as an inclined surface to facilitate the rearward tilting operation. However, the pressing portion 21 is formed into a substantially horizontal surface, and a pressing force is applied to the pressing receiving portion 11. It is also possible to obtain the above-mentioned backward tilting operation.
【００３３】斯くして図４に示す如く接触片部８をＩＣ
パッケ−ジ２と干渉しない位置へ充分に離間した状態が
形成され、同状態においてＩＣパッケ−ジ２をＩＣ収容
窓１３を通してＩＣ収容部１４へ搭載し、二段曲げ形状
の端子部材３の先端部を端子支持座１６に支持すると共
に、突条１５を曲げ段部内側へ介入しつつ、端子部材３
の基部を支持するか、ＩＣパッケージ２本体の側面を規
制する状態を形成し、次で、コンタクト開閉部材１２の
押下操作部１８への押下力を解除すると、同開閉部材１
２はコンタクト４の湾曲バネ片６及び片持ア−ム１０の
復元力にて上方へ一定量上昇して再び押下待機状態を形
成すると共に、コンタクト４は上記復元にてその接触片
部８を前方擺動させ、その接触用突起９を上記端子支持
座１６に支持された端子部材３（図５）、又は接片２２
に下面を支持された端子部材３（図６）の先端部上面に
矢印Ｗ3で示す斜上方から一定の接圧を以って夫々接触
するに至る。この接圧は上記接触用突起９を湾曲バネ片
６の弾力にて端子支持座１６に当接させて予め蓄えられ
た弾力と端子部材３の厚みに相当して生ずる弾力の和と
なる。Thus, as shown in FIG.
A state in which the IC package 2 is sufficiently separated to a position where it does not interfere with the package 2, the IC package 2 is mounted in the IC accommodating portion 14 through the IC accommodating window 13 in this condition, and the tip of the terminal member 3 having a two-step bend shape is formed. The terminal member 3 is supported by the terminal support seat 16 and the ridge 15 is inserted inside the bending step.
When the base of the contact opening / closing member 12 is released and the pressing force of the contact opening / closing member 12 to the pressing operation unit 18 is released, the opening / closing member 1 of the IC package 2 is released.
The reference numeral 2 raises a certain amount upward by the restoring force of the curved spring piece 6 of the contact 4 and the cantilever arm 10 to form a pressing standby state again, and the contact 4 restores its contact piece portion 8 by the above restoration. The terminal member 3 (FIG. 5) supported by the terminal support seat 16 or the contact piece 22 is swung forward and the contact projection 9 is supported.
The upper surface of the tip of the terminal member 3 (FIG. 6) whose lower surface is supported by each of them comes into contact with each other with a constant contact pressure from obliquely above as shown by an arrow W 3 . This contact pressure is the sum of the elastic force stored in advance by contacting the contact projection 9 with the terminal support seat 16 by the elastic force of the curved spring piece 6 and the elastic force corresponding to the thickness of the terminal member 3.
【００３４】上記によってＩＣパッケ−ジ２は上記端子
支持座１６又は接片２２と接触片部８の接触用突起９と
の間に挟持され、ソケット本体１に保持される。As described above, the IC package 2 is sandwiched between the terminal support seat 16 or the contact piece 22 and the contact projection 9 of the contact piece portion 8 and held by the socket body 1.
【００３５】上記接触状態から再びコンタクト開閉部材
１２の押下操作部１８を押下げるとコンタクト４は前記
と同様後方擺動し、ＩＣパッケ−ジ２との接触を解除し
非干渉状態となり、この状態でＩＣパッケ−ジ２の着脱
を行なう。When the push-down operation portion 18 of the contact opening / closing member 12 is pushed down again from the contact state, the contact 4 is slid backward as described above, releasing the contact with the IC package 2 and becoming the non-interference state. Attach and detach the IC package 2.
【００３６】上記コンタクト開閉部材１２の押下操作は
ロボットのマニプレ−タ−の最も単純な垂直運動によっ
て行なわせることができる。The pressing operation of the contact opening / closing member 12 can be performed by the simplest vertical movement of the robot manipulator.
【００３７】図１に示すようにマニプレ−タ−は、押下
操作部１８への押下力付与部２３及び該押下力付与部２
３の中間にＩＣ吸着部２４を夫々具備し、上記押下力付
与部２３にて押下操作部１８の上面を押下げつつ、ＩＣ
吸着部２４にてＩＣパッケ−ジ２本体の上面を吸着し、
前記ＩＣ搭載部１４への搭載又は取出しを行なうように
する。更に上記マニプレ−タ−には上記ＩＣ吸着部２４
の両側方に位置して位置決ピン２５を具備させ、上記コ
ンタクト開閉部材１２のＩＣ収容窓１３を画成する壁、
例えば上記押下操作部１８を連結する壁に上記位置決ピ
ン２５に対応する位置決孔２６を設ける。ＩＣパッケ−
ジ２の着脱に際してはマニプレ−タ−の下降により上記
位置決ピン２５が位置決孔２６内に整合され、ソケット
に対するＩＣパッケ−ジ２の搭載位置が設定される。然
る後ＩＣ吸着部２４の吸着を解除することによりＩＣパ
ッケ−ジ２をＩＣ搭載部１４の所定位置に搭載し前記コ
ンタクト４と端子部材３の対応が得られるものである。As shown in FIG. 1, the manipulator includes a pressing force applying section 23 for the pressing operation section 18 and the pressing force applying section 2.
Each of the IC suction parts 24 is provided in the middle of 3, and while the pressing force applying part 23 pushes down the upper surface of the pressing operation part 18,
The suction part 24 sucks the upper surface of the IC package 2 main body,
The IC mounting portion 14 is mounted or taken out. Further, the IC adsorption part 24 is provided on the manipulator.
Walls which are provided on both sides of the contact opening / closing member 12 and define the IC housing window 13 of the contact opening / closing member 12;
For example, a positioning hole 26 corresponding to the positioning pin 25 is provided on the wall connecting the pressing operation unit 18. IC package
When mounting and dismounting the plug 2, the positioning pin 25 is aligned in the positioning hole 26 by lowering the manipulator, and the mounting position of the IC package 2 with respect to the socket is set. After that, by releasing the suction of the IC suction portion 24, the IC package 2 is mounted at a predetermined position of the IC mounting portion 14, and the correspondence between the contact 4 and the terminal member 3 can be obtained.
【００３８】上記実施例においては、コンタクト４をソ
ケット本体１のＩＣ搭載部１４の左右対向する二辺に並
設した場合を示したが、本発明はコンタクト４を左右及
び前後の四辺に並設する場合にも実施可能である。この
場合、上記コンタクト開閉部材１２の押下操作部１８は
これに対応しＩＣ収容窓１３の左右，前後に設け、上記
位置決孔２６はＩＣ収容窓１３の対角線を含めた画成壁
の任意の位置に設ければ良い。In the above embodiment, the contact 4 is arranged side by side on the left and right sides of the IC mounting portion 14 of the socket body 1, but in the present invention, the contacts 4 are arranged side by side and on the four sides on the left and right. It is also possible to carry out. In this case, the pressing operation portion 18 of the contact opening / closing member 12 is provided on the left, right, front and back of the IC housing window 13 correspondingly, and the positioning hole 26 is an arbitrary partition wall including the diagonal line of the IC housing window 13. It should be provided at the position.
【００３９】[0039]
【発明の効果】上記のようにコンタクトは端子支持座を
超えて延出された接触片部がコンタクト自らの弾力にて
上記端子支持座へ向け自己変位して該端子支持座に当接
されて整列されると同時に、弾力を蓄えた状態に置か
れ、そして上記接触片部が上記端子支持座に支持された
端子部材の厚みに相当する弾力を蓄え、この弾力と上記
予備弾力との和で上記加圧接触を図ることができ、コン
タクトのバネ部の弾力を効率的に活用し薄肉の端子部材
の厚みの範囲内の変位でも充分なる加圧力を以って端子
部材の上面に接触でき、信頼性を著しく向上する。又留
意すべきは接触片部が製造誤差や組立誤差によってその
存在位置にバラツキがあっても、この発明によれば有効
必要接触圧のバラッキを可及的に減少し上記接触の信頼
性向上に寄与する。As described above, in the contact, the contact piece portion extended beyond the terminal supporting seat is displaced toward the terminal supporting seat by the elastic force of the contact and abuts on the terminal supporting seat. At the same time as being aligned, the contact piece is placed in a state in which the elastic force is stored, and the contact piece portion stores the elastic force corresponding to the thickness of the terminal member supported by the terminal support seat, and the elastic force is added to the preliminary elastic force. The above pressure contact can be achieved, the elastic force of the spring portion of the contact can be efficiently utilized, and the upper surface of the terminal member can be contacted with sufficient pressing force even if the displacement is within the range of the thickness of the thin terminal member, Improves reliability significantly. It should be noted that even if the contact piece portion has a variation in the existing position due to a manufacturing error or an assembly error, according to the present invention, the variation of the effective necessary contact pressure is reduced as much as possible to improve the reliability of the contact. Contribute.
【００４０】又コンタクトの端子接触片部を端子支持座
の上面に揃えて一列に整列させることができる。Further, the terminal contact piece portion of the contact can be aligned with the upper surface of the terminal support seat and arranged in a line.
【００４１】又接触圧が増加されても配線基板とのハン
ダ実装に供される端子部材の下面をこの接触圧で損傷す
る不具合を招来せず、端子部材を保護しつつ接触圧も向
上できる利点を有する。Further, even if the contact pressure is increased, the lower surface of the terminal member used for solder mounting with the wiring board is not damaged by this contact pressure, and the contact pressure can be improved while protecting the terminal member. Have.
【００４２】よって前記接触形式のＩＣソケットの瑕疵
を改善し、これを健全に実施させることができる。Therefore, the flaws of the contact type IC socket can be improved, and this can be carried out soundly.
【図１】本発明の実施例を示すＩＣソケットの斜視図。FIG. 1 is a perspective view of an IC socket showing an embodiment of the present invention.
【図２】同平面図。FIG. 2 is a plan view of the same.
【図３】押下操作前の同部分断面図。FIG. 3 is a partial sectional view of the same before a pressing operation.
【図４】押下操作後の同断面図。FIG. 4 is a sectional view of the same after a pressing operation.
【図５】押下操作解除しＩＣパッケージとの接触状態を
示す同断面図。FIG. 5 is a cross-sectional view showing a contact state with the IC package after the pressing operation is released.
【図６】他例であり、ＩＣパッケージとの接触状態を示
す同断面図。FIG. 6 is a cross-sectional view showing another example of a contact state with an IC package.
【図７】コンタクトの側面図。FIG. 7 is a side view of the contact.
【図８】コンタクトの後方擺動状態を示す側面図。FIG. 8 is a side view showing a rearward swinging state of the contact.
１ ＩＣソケット本体 ２ ＩＣパッケージ ３ 端子部材 ４ コンタクト ５ 雄端子 ６ 湾曲バネ片 ７ 固定端 ８ 接触片部 ９ 接触用突起 １０ 片持アーム １１ 押圧受部 １２ コンタクト開閉部材 １３ 収容窓 １４ ＩＣ搭載部 １５ 突条 １６ 端子支持座 １８ 押下操作部 １９ 係合指 ２０ 案内溝 ２１ 押圧部 ２２ 接片 Ｐ1 接触点 Ｐ2 押圧点DESCRIPTION OF SYMBOLS 1 IC socket main body 2 IC package 3 Terminal member 4 Contact 5 Male terminal 6 Curved spring piece 7 Fixed end 8 Contact piece part 9 Contact protrusion 10 Cantilever arm 11 Press receiving part 12 Contact opening / closing member 13 Storage window 14 IC mounting part 15 Protrusion 16 Terminal support seat 18 Depressing operation part 19 Engaging finger 20 Guide groove 21 Pressing part 22 Contact piece P 1 Contact point P 2 Pressing point
Claims (1)
端子部材の下面を支持する端子支持座を備え、該端子支
持座に支持された端子部材の上面に自らの弾力にて自己
変位して加圧接触すべく配置されたコンタクトを備えた
ＩＣソケットにおいて、該コンタクトは自らの弾力にて
上記端子支持座へ向け自己変位しその接触片部を該端子
支持座に当接して弾力を蓄えた状態に設置され、更に該
接触片部は上記端子支持座に支持された端子部材の厚み
に相当する弾力を蓄えて上記弾力との和を以って上記端
子部材の上面に加圧接触する構成としたことを特徴とす
るＩＣソケット。1. A terminal supporting seat for supporting a lower surface of a terminal member of an IC package mounted on an IC mounting portion, wherein the terminal supporting seat is self-displaced by an elastic force on an upper surface of the terminal member supported by the terminal supporting seat. In an IC socket provided with a contact arranged to make a pressure contact, the contact self-displaces toward the terminal support seat by its own elasticity, and its contact piece portion abuts the terminal support seat to store the elasticity. The contact piece portion stores an elastic force corresponding to the thickness of the terminal member supported by the terminal support seat and press-contacts with the upper surface of the terminal member by the sum of the elastic force. The IC socket characterized in that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4307557A JP2527673B2 (en) | 1992-10-20 | 1992-10-20 | IC socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4307557A JP2527673B2 (en) | 1992-10-20 | 1992-10-20 | IC socket |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63248614A Division JPH0810615B2 (en) | 1988-09-30 | 1988-09-30 | Contact opening / closing device for IC socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0620753A JPH0620753A (en) | 1994-01-28 |
| JP2527673B2 true JP2527673B2 (en) | 1996-08-28 |
Family
ID=17970526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4307557A Expired - Lifetime JP2527673B2 (en) | 1992-10-20 | 1992-10-20 | IC socket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2527673B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3803099B2 (en) | 2002-12-17 | 2006-08-02 | 山一電機株式会社 | Socket for semiconductor device |
| JP4073439B2 (en) | 2004-04-16 | 2008-04-09 | 山一電機株式会社 | Socket for semiconductor device |
| JP4312685B2 (en) | 2004-08-31 | 2009-08-12 | 山一電機株式会社 | Semiconductor device attaching / detaching method, semiconductor device attaching / detaching device using the same, and semiconductor device socket |
| JP4471941B2 (en) | 2005-03-10 | 2010-06-02 | 山一電機株式会社 | Socket for semiconductor device |
| JP4495200B2 (en) | 2007-09-28 | 2010-06-30 | 山一電機株式会社 | Socket for semiconductor device |
| JP2010118275A (en) | 2008-11-13 | 2010-05-27 | Yamaichi Electronics Co Ltd | Socket for semiconductor device |
| KR102106137B1 (en) * | 2019-06-14 | 2020-04-29 | 주식회사 마이크로컨텍솔루션 | Contact pin and socket |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0775182B2 (en) * | 1986-09-02 | 1995-08-09 | 日本テキサス・インスツルメンツ株式会社 | Socket |
-
1992
- 1992-10-20 JP JP4307557A patent/JP2527673B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0620753A (en) | 1994-01-28 |
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