JPS594098A - Method of protecting printed circuit board - Google Patents
Method of protecting printed circuit boardInfo
- Publication number
- JPS594098A JPS594098A JP11300882A JP11300882A JPS594098A JP S594098 A JPS594098 A JP S594098A JP 11300882 A JP11300882 A JP 11300882A JP 11300882 A JP11300882 A JP 11300882A JP S594098 A JPS594098 A JP S594098A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- conductors
- parts
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、プリント回路基板の保護方法、特には、ベー
ス材上に設けた回路導体の保護及び該導体とこれに接続
した電気部品との間の部分における腐蝕或いは短絡等の
防止をするためのプリント回路基板の保護方法に関する
〇
一般に、プリント回路基板は、ベース材上に回路導体を
形成した後に、電子部品等を実装する隙に必要とされる
個所及び例えばコネクターと接続される端子を除く部分
等を、絶縁フィルム又は絶縁塗料により破線して、回路
導体の保護及び短絡の防止を図っている。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for protecting a printed circuit board, and in particular, a method for protecting a circuit conductor provided on a base material and preventing corrosion or short circuits between the conductor and electrical components connected thereto. 〇In general, after forming circuit conductors on a base material, a printed circuit board is designed to protect the parts where electronic components are mounted, such as connectors, etc. The parts other than the terminals to be connected are lined with broken lines using insulating film or insulating paint to protect the circuit conductors and prevent short circuits.
しふし、回路導体部分に上記の如き絶縁処理を施しても
、電気、電子部品を実装した端子部からの腐蝕、または
同部分における短絡等が発生し易く、従って、そのよう
なプリント回路基板は、全体としての信頼性特に電子。However, even if the circuit conductor parts are insulated as described above, corrosion from the terminal parts where electrical and electronic components are mounted, or short circuits in these parts are likely to occur, so such printed circuit boards are , overall reliability especially electronics.
電気機器に組込んで長期ｉＪＪにわたって使用する場合
の信頼性が低いという問題かあった。There was a problem of low reliability when incorporated into electrical equipment and used over a long period of time.
本発明の目的は、ベース材上に設けた回路導体及び該導
体に接続した電気。電子部品の双方を絶縁物質により被
臘することにより、回路導体の保護及び短絡の防止を児
全に行ない得るプリント回路基板の保護方法を提供する
ことにある。The object of the present invention is to provide a circuit conductor provided on a base material and electricity connected to the conductor. It is an object of the present invention to provide a method for protecting a printed circuit board that can completely protect circuit conductors and prevent short circuits by covering both electronic components with an insulating material.
第１図は、本発明の第１の実施例を示すもノテ、ベース
材ｌ上に所定の回路パターンを構成する導体２，２を設
け、そのうちの所定の個所に例えばスクリーン印刷法を
使用して絶縁物質、絶縁塗料を付急させて、被一層３゜
３を形成する。次いで、電気、電子部品ｌのリード＆ｉ
＋Ａ 、＆、Ｂをそれぞれ導体、２．２にハンダ付は等
により接続し、更に、絶縁物質Ｅよる被ＰＡ全必要とし
ない部分にはマスキング素拐を仮り着けし、その後ベー
ス材ｌの図中上面側、即ち上記導体２．λ及び部品ｔを
設けた側の面を絶縁物質浴、例えば、絶縁塗料浴等に浸
漬することにより、導体、２．２及び部品≠の双方？１
１−縫う絶縁塗料の被覆４！を形成する。そして、前記
マスキング素材を除失し、前記絶縁塗料３の乾燥及び／
又は同化を行なう。FIG. 1 shows a first embodiment of the present invention, in which conductors 2, 2 constituting a predetermined circuit pattern are provided on a base material l, and predetermined portions of the conductors 2, 2 are printed using, for example, a screen printing method. Then, an insulating material and an insulating paint are applied quickly to form a layer 3.3. Next, electrical and electronic parts l leads &i
Connect +A, &, and B with conductors, and 2.2 with soldering, etc., and then temporarily attach masking strips to the parts that do not need to be covered with insulating material E, and then attach the diagram of base material L. The middle upper surface side, that is, the conductor 2. By immersing the side on which λ and the part t are provided in an insulating substance bath, for example, an insulating paint bath, both the conductor, 2.2 and the part ≠? 1
1- Sew insulation paint coating 4! form. Then, the masking material is removed, and the insulating paint 3 is dried and/or
Or assimilate.
上記方法によって、導体２，２の所定の部分は、絶縁塗
料３及び左によって二重にシールされて外気、外部から
の衝撃その他に対し十分に保枯される。従って、部品を
自体及び部品μと導体２，２との間の接続部分は、絶縁
塗料！によって同じく外気、特に湿気等の影響を受けず
、腐蝕する恐れもなく、また、短絡等の事故も発生しな
い。By the above method, the predetermined portions of the conductors 2, 2 are double sealed with the insulating paint 3 and the left side, and are sufficiently preserved against outside air, external shocks, and the like. Therefore, the parts themselves and the connection parts between the parts μ and the conductors 2, 2 are coated with insulating paint! Similarly, it is not affected by outside air, especially humidity, and there is no fear of corrosion, and accidents such as short circuits do not occur.
第２図は本発明の第２の実施例を示すもので、前記第１
の実施例の場合と同様に、ペース材／上に回路パターン
を構成する導体、２゜コを形成し、該導体ａ２．２の所
定の個所と部品グのリード線ｌＩＡ、４Ｂとの接続を行
がい、絶縁被覆を必要としない部分にマスキング素材を
仮り着けした後、スプレーにより絶縁物質、例えば絶縁
塗料を導体コ２．２及び部品ｌの双方に吹付けて、被覆
１乙を形成する。そして、前記マスキング素材を除去し
、被覆層ｔの乾燥及び／又は固化を行なう。FIG. 2 shows a second embodiment of the present invention.
As in the case of the embodiment, a 2° conductor constituting the circuit pattern is formed on the paste material, and connections are made between predetermined locations of the conductor a2.2 and the lead wires lIA and 4B of the component group. After temporarily applying a masking material to the parts that do not require an insulating coating, an insulating material such as an insulating paint is sprayed onto both the conductor 2.2 and the component 1 to form a coating 1B. Then, the masking material is removed, and the coating layer t is dried and/or solidified.
この実施例においても導体２，２、部品ｌ及び部品ヶと
導体−２，２との接続部分は、絶縁塗料から成る被稜層
乙によって外気と辿断され、前述したような腐蝕、短絡
等の問題を防止できる。In this embodiment as well, the conductors 2, 2, parts 1, and the connection parts between parts 1 and conductors 2, 2 are separated from the outside air by the ridge layer 2 made of insulating paint, which prevents corrosion, short circuits, etc. as described above. problems can be prevented.
本発明によれば、プリント回路基板のベース材上に設け
た回路導体及び該４体に接続された電気、電子部品の双
方を絶縁物質により被覆することにより、これら導体及
び部品並びに導体と部品との接続部分を外部から絶つこ
とができ、従ってこれらの閥蝕を防止できる一方、両者
との接続部分における短絡等の発生も阻止可能となり、
プリント回路基板全体としての信頼性を確保するもので
ある。According to the present invention, by coating both the circuit conductors provided on the base material of the printed circuit board and the electrical and electronic components connected to the four bodies with an insulating material, these conductors and components as well as the conductors and components can be separated. It is possible to disconnect the connection between the two from the outside, thereby preventing these corrosion, while also preventing the occurrence of short circuits at the connection between the two.
This ensures the reliability of the printed circuit board as a whole.
第１図及び第一図は、それぞれ本発明に係るプリント回
路基板の保設方法の両実施例を示す断面図である
／ 、、、、、、 ベース材
λ ０１１０９．導 体
３、！；、ｔ 、、、、、、被覆層
ｌ ・・・・・・部 品
出願人 日本メクトロン株式会社
第１図
第２図1 and 1 are cross-sectional views showing both embodiments of the printed circuit board storage method according to the present invention, respectively. Base material λ 01109. Conductor 3! ;, t , , , , coating layer l ・・・・・・ Part applicant Nippon Mectron Co., Ltd. Figure 1 Figure 2
Claims (1)
部品を絶縁物質により被覆することを特徴とするプリン
ト回路基板の保護方法。1. A method for protecting a printed circuit board, which comprises covering a circuit conductor provided on a base material and an electrical component connected to the conductor with an insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11300882A JPS594098A (en) | 1982-06-30 | 1982-06-30 | Method of protecting printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11300882A JPS594098A (en) | 1982-06-30 | 1982-06-30 | Method of protecting printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS594098A true JPS594098A (en) | 1984-01-10 |
Family
ID=14601120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11300882A Pending JPS594098A (en) | 1982-06-30 | 1982-06-30 | Method of protecting printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS594098A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62179343A (en) * | 1986-02-03 | 1987-08-06 | Miyamura Tekkosho:Kk | Firing device for green tea or the like |
| JPS646883U (en) * | 1987-07-03 | 1989-01-13 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5225264A (en) * | 1975-08-21 | 1977-02-25 | Matsushita Electric Ind Co Ltd | Hybrid miniature parts |
| JPS54142577A (en) * | 1978-04-27 | 1979-11-06 | Yaskawa Denki Seisakusho Kk | Printed circuit |
| JPS5630788A (en) * | 1979-08-22 | 1981-03-27 | Tokyo Shibaura Electric Co | Device for mounting chip element |
-
1982
- 1982-06-30 JP JP11300882A patent/JPS594098A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5225264A (en) * | 1975-08-21 | 1977-02-25 | Matsushita Electric Ind Co Ltd | Hybrid miniature parts |
| JPS54142577A (en) * | 1978-04-27 | 1979-11-06 | Yaskawa Denki Seisakusho Kk | Printed circuit |
| JPS5630788A (en) * | 1979-08-22 | 1981-03-27 | Tokyo Shibaura Electric Co | Device for mounting chip element |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62179343A (en) * | 1986-02-03 | 1987-08-06 | Miyamura Tekkosho:Kk | Firing device for green tea or the like |
| JPS646883U (en) * | 1987-07-03 | 1989-01-13 | ||
| JPH0420226Y2 (en) * | 1987-07-03 | 1992-05-08 |
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