JPS5939492A - Laser working method - Google Patents
Laser working methodInfo
- Publication number
- JPS5939492A JPS5939492A JP57149811A JP14981182A JPS5939492A JP S5939492 A JPS5939492 A JP S5939492A JP 57149811 A JP57149811 A JP 57149811A JP 14981182 A JP14981182 A JP 14981182A JP S5939492 A JPS5939492 A JP S5939492A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- working
- power source
- laser beam
- stopped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、レーザによる溶融を施す加工において終了
時に発生するクレータを防止するレーザ加工方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser processing method that prevents craters from occurring at the end of laser melting processing.
第1図は、従来のレーザ加工装置である。図において(
1)はレーザ出力を制御するため゛のコントローラ、(
2)は電源、(3)はレーザ発振器、(4)はレーザビ
ーム、(5)はレーザビーム(4)の方向を変える全反
射[、(6)は集光レンズ、(7)は加工ヘッド、(8
)は被加工物、(9)は被加工物(8)を支持し移動さ
せる加工台である。FIG. 1 shows a conventional laser processing device. In the figure (
1) is a controller for controlling the laser output, (
2) is the power supply, (3) is the laser oscillator, (4) is the laser beam, (5) is the total internal reflection that changes the direction of the laser beam (4), (6) is the condensing lens, and (7) is the processing head. , (8
) is a workpiece, and (9) is a processing table that supports and moves the workpiece (8).
次に動作について説明する。レーザ発振器(3)から放
出されたレーザビーム(4)は全反射炉(5)により曲
げられ、集光レンズ(6)に垂直に入射する。集光レン
ズ(6)で集光されたビームは加工ヘッド(7)を通過
して被加工物(8)の表面に照射される。同時に、加工
ヘッド(7)にはシールドガスが導入されておりビーム
と同軸状に放出され加工が行なオ)れる。レーザビーム
(4)の照射終了時、つまりレーザによる溶融を施す加
工の終了時には、コントローラ(11による電源(2)
の制御によりレーザ出力を徐々に下げていく。これはク
レータが残るのをある程度おさえる働きをもつが、発振
闇値付近ではレーザ出力が安定しなくなり、クレータが
完全にはなくならない欠点をもっていた。Next, the operation will be explained. A laser beam (4) emitted from a laser oscillator (3) is bent by a total internal reflection furnace (5) and is perpendicularly incident on a condenser lens (6). The beam focused by the condenser lens (6) passes through the processing head (7) and is irradiated onto the surface of the workpiece (8). At the same time, a shielding gas is introduced into the processing head (7) and is emitted coaxially with the beam to perform processing. At the end of the irradiation with the laser beam (4), that is, at the end of the laser melting process, the power supply (2) by the controller (11) is activated.
The laser output is gradually lowered by control. Although this has the effect of suppressing the remaining craters to some extent, it has the disadvantage that the laser output becomes unstable near the oscillation darkness value and the craters cannot be completely eliminated.
この発明は上記のものの欠点を除去するため、加工終了
時に被加工物表面におけるビームをデフォーカスしてい
き、徐々に安定にビーム出力を下げることのできるレー
ザ加工装置を提供することを目的としている。In order to eliminate the drawbacks of the above, the present invention aims to provide a laser processing device that can gradually and stably lower the beam output by defocusing the beam on the surface of the workpiece at the end of processing. .
以下、この発明の一実施例を図について説明する。第2
図において01は、集光レンズ(6)を内蔵した加工ヘ
ッド(7)を、被加工物(8)及び加工台(9)に垂直
な軸(Z軸)で駆動させる駆動機構である。パルスモー
タにより、0υのコントローラからの制御信号で加工ヘ
ッド及び集光レンズは駆動される構造になっている。溶
融を施す加工が終了する際、コントローラOpからの指
示によりこの駆動機構が働き、レーザビームの焦点位置
と被加工物表面の間隔が徐々に変えられ、十分パワー密
度が下がった時点で最後にレーザビームが電源(2)の
操作により止められる。An embodiment of the present invention will be described below with reference to the drawings. Second
In the figure, 01 is a drive mechanism that drives a processing head (7) containing a condensing lens (6) along an axis (Z-axis) perpendicular to the workpiece (8) and the processing table (9). The processing head and condensing lens are driven by a pulse motor using a control signal from a 0υ controller. When the melting process is completed, this drive mechanism operates according to instructions from the controller Op, and the distance between the focal position of the laser beam and the surface of the workpiece is gradually changed, and when the power density has decreased sufficiently, the laser beam is finally turned off. The beam is stopped by operating the power source (2).
上記実施例では、ビームをデフォーカスすることだけで
パワー強度を下げ、クレータを処理しているが、同時に
ビーム断面積も広くなることから被加工物(8)への熱
影響部も広くなることがある。In the above example, the power intensity is lowered by simply defocusing the beam to treat the crater, but at the same time, the beam cross-sectional area also becomes wider, so the heat-affected zone on the workpiece (8) also becomes wider. There is.
これを防ぐには、ビームのデフォーカス量を少なくし、
同時に電源制御により、ビーム出力を安定化領域で連続
的に減少させるとよい。To prevent this, reduce the amount of beam defocus,
At the same time, it is preferable to continuously reduce the beam output in the stabilization region by controlling the power source.
以上のように、この発明によれば、レーザ及びそれ以外
の溶融を施す加工の終了時にビーム強度を連続的に、か
つ安定に下げていくことができ、クレータの発生しない
良質な加工ができるという効果がある。As described above, according to the present invention, the beam intensity can be continuously and stably lowered at the end of laser or other melting processing, and high-quality processing without craters can be achieved. effective.
第1図は、従来のレーザ加工装置を示す構成図第2図は
、この発明の一実施例によるレーザ加工装置のブロック
系統図である。図において、(1)はレーザ出力をコン
トロールするコントローラ、(2)は電源、(3)はレ
ーザ発振器、(4)はレーザビーム、(5)は全反射鏡
、(6)は集光レンズ、(7)は加工ヘッド(8)は被
加工物、(9)は加工台、Of)は加工ヘッド又はレン
ズの駆動機構(パルスモータ内蔵)、0υはレーザ出力
及び加工ヘッド等の駆動機構をコントロールするコント
ローラである。
なお、図中、同一符号は、同−又は相当部分を示す。
代理人 葛野信−
図面の浄書(内容に変更なし)
第1図
第2図
手続補正書(方式)
特許庁長官殿
■、事r’i ノ表示 持19iil17457
−149811号2、発明の名称 レーザ加工方
法3.1山i「をすると
事件との関係 特許出願人
注 所 東京都T−代111区丸の内〕1土1
2WF35′j名 (ろ、(601):、菱電機株式会
社代表者片111仁八部
4、代理人
11 所 東京都T−代111区丸の内−1’
l+2釣3シ〕5、 補正命令の日付 昭和57年1
1月80日6、補正の対象
願ν1、明細書、図面。
7、 補正の内容
′−願吉、明細書、図面を別紙のとおり浄書する。
(内容に変更なし)
以 上FIG. 1 is a block diagram showing a conventional laser processing apparatus. FIG. 2 is a block system diagram of a laser processing apparatus according to an embodiment of the present invention. In the figure, (1) is a controller that controls laser output, (2) is a power supply, (3) is a laser oscillator, (4) is a laser beam, (5) is a total reflection mirror, (6) is a condenser lens, (7) is the processing head (8) is the workpiece, (9) is the processing table, Of) is the drive mechanism of the processing head or lens (built-in pulse motor), and 0υ is the control for the drive mechanism of the laser output and processing head, etc. It is a controller that In addition, in the figures, the same reference numerals indicate the same or equivalent parts. Agent Makoto Kuzuno - Engraving of the drawings (no changes to the contents) Figure 1 Figure 2 Procedural amendment (method) Mr. Commissioner of the Japan Patent Office ■, Indication of fact r'i No. 19iil 17457
-149811 No. 2, Title of the invention Laser processing method 3.1 Relationship to the case when doing the mountain
2WF35'j Name (ro, (601):, Ryodenki Co., Ltd. Representative Kata 111 Jinhachibe 4, Agent 11 Address Tokyo, T-dai 111-ku Marunouchi-1'
l + 2 fishing 3 shi] 5. Date of amendment order: 1981
January 80th 6, application subject to amendment ν1, specification, drawings. 7. Contents of the amendment' - Gankichi, specification, and drawings shall be inscribed as attached. (No change in content) That's all
Claims (2)
加工において、前記レーザビーム照射停止時に前記レー
ザビームの焦点位置と前記被加工物表面の相対的位置を
連続に移動させることを特徴とするレーザ加工方法。(1) In processing in which a workpiece is irradiated with a laser beam and melted, the relative position of the focus position of the laser beam and the surface of the workpiece is continuously moved when the laser beam irradiation is stopped. Laser processing method.
的に減少させることを特徴とする特許請求の範囲第1項
記載のレーザ加工方法。(2) The laser processing method according to claim 1, wherein the laser output is continuously decreased when laser beam irradiation is stopped.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57149811A JPS5939492A (en) | 1982-08-27 | 1982-08-27 | Laser working method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57149811A JPS5939492A (en) | 1982-08-27 | 1982-08-27 | Laser working method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5939492A true JPS5939492A (en) | 1984-03-03 |
JPS6128437B2 JPS6128437B2 (en) | 1986-06-30 |
Family
ID=15483222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57149811A Granted JPS5939492A (en) | 1982-08-27 | 1982-08-27 | Laser working method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5939492A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63140788A (en) * | 1986-12-03 | 1988-06-13 | Japan Nuclear Fuel Co Ltd<Jnf> | Crater treating method for co2 laser welding |
US7699178B2 (en) | 2004-04-23 | 2010-04-20 | Tsukasa Industry Co., Ltd. | Particulate sifter |
JP2013235915A (en) * | 2012-05-08 | 2013-11-21 | Japan Steel Works Ltd:The | Laser annealing device with sheet resistivity measuring mechanism |
-
1982
- 1982-08-27 JP JP57149811A patent/JPS5939492A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63140788A (en) * | 1986-12-03 | 1988-06-13 | Japan Nuclear Fuel Co Ltd<Jnf> | Crater treating method for co2 laser welding |
US7699178B2 (en) | 2004-04-23 | 2010-04-20 | Tsukasa Industry Co., Ltd. | Particulate sifter |
JP4771943B2 (en) * | 2004-04-23 | 2011-09-14 | ツカサ工業株式会社 | Powder sorting device |
JP2013235915A (en) * | 2012-05-08 | 2013-11-21 | Japan Steel Works Ltd:The | Laser annealing device with sheet resistivity measuring mechanism |
Also Published As
Publication number | Publication date |
---|---|
JPS6128437B2 (en) | 1986-06-30 |
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