JPS59218937A - Pattern detector - Google Patents

Pattern detector

Info

Publication number
JPS59218937A
JPS59218937A JP58092304A JP9230483A JPS59218937A JP S59218937 A JPS59218937 A JP S59218937A JP 58092304 A JP58092304 A JP 58092304A JP 9230483 A JP9230483 A JP 9230483A JP S59218937 A JPS59218937 A JP S59218937A
Authority
JP
Japan
Prior art keywords
wiring
light
filter
irradiation means
fluorescence
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58092304A
Other languages
Japanese (ja)
Other versions
JPH0436335B2 (en
Inventor
Yasuhiko Hara
靖彦 原
Koichi Tsukazaki
柄崎　晃一
Noriaki Ujiie
氏家　典明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58092304A priority Critical patent/JPS59218937A/en
Publication of JPS59218937A publication Critical patent/JPS59218937A/en
Publication of JPH0436335B2 publication Critical patent/JPH0436335B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence

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  • Health & Medical Sciences (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

PURPOSE:To shorten the time required for pattern detection by irradiating light also from the back of wiring surfaces in addition to the front of the wiring surfaces and detecting simultaneously wiring patterns by detectors fitted to both front and back sides of the wiring surfaces. CONSTITUTION:Light projected from luminance light sources 11, 11' are passed through condenser lenses 21, 21' and blue filters 22, 22', reflected by mirrors 26, 26' 27, 27' and irradiate the wiring surfaces 2, 2' on the front and back of a printed board 1 from their inclined directions, so that fluorescence is emitted from the board 1. The fluorescence emitted from the board 1 and reflected light from the wiring surfaces 2, 2' are made incident to filters 24, 24' and only the transmitted fluorescence forms negative patterns of the wiring on the photo-electric conversion surfaces of photodetectors 13, 13' by image formation lenses 25, 25'. Therefore, the time required for pattern formation is shortened.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は配線パターンを検出するパターン検出装置に係
り、特にプリント基板の光沢のある半田パターンの配線
パターンの欠陥を検出するための検出部として好適なパ
ターン検出装置に関するものである。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a pattern detection device for detecting wiring patterns, and is particularly suitable as a detection unit for detecting defects in wiring patterns of glossy solder patterns on printed circuit boards. This invention relates to a pattern detection device.

〔発明の背景〕[Background of the invention]

従来のパターン検出装置は、第３図に示すごとく、光６
１を発する高輝度光源１１と、コンデンサレンズ２１と
、光源からの光６１を、蛍光が発生しやすい波長に限定
するためのフィルタ２２と、ハーフミラ−２５と、配線
面２からの反射光をカットし、基材４から発生する蛍光
のみを透過するフィルタ２４と、該フィルタ２４を透過
した光４２を検出するための検出器１３と、該検出器１
５に配線パターン像を結像するための結像レンズ２５か
ら構成され、プリント基板１の基材４から発生する蛍光
を検出することによって、配線パターンのネガパターン
を検出するものであるが、基材４から発生する蛍光の光
量が非常に小さいため、第１図のＡ−Ａ線上の検出結果
を示す第４図に示すように基材４のレベルを示す電圧篤
と配線パターン３のレベルを示す電圧Ｍとの間に差がな
く、即ちＳハが悪く、両者を区別するためのシュレッシ
ョルドレペルｖＴの設定できる範囲が非常に狭いか、あ
るいは設定できないという問題があった。The conventional pattern detection device uses light 6 as shown in FIG.
1, a condenser lens 21, a filter 22 for limiting the light 61 from the light source to wavelengths where fluorescence is likely to occur, a half mirror 25, and a filter that cuts reflected light from the wiring surface 2. A filter 24 that transmits only the fluorescence generated from the base material 4, a detector 13 for detecting the light 42 that has passed through the filter 24, and the detector 1
It is composed of an imaging lens 25 for forming a wiring pattern image on the substrate 5, and detects a negative pattern of the wiring pattern by detecting fluorescence generated from the base material 4 of the printed circuit board 1. Since the amount of fluorescence emitted from the material 4 is very small, the voltage intensity indicating the level of the base material 4 and the level of the wiring pattern 3 can be compared as shown in FIG. 4, which shows the detection results on line A-A in FIG. There is a problem that there is no difference between the voltage M and the voltage S, that is, the threshold level vT for distinguishing between the two is very narrow or cannot be set.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、上記従来技術の問題点に鑑み、基材か
ら発生する蛍光の光量を増量し、Ｓハの改善された検出
信号を得ると同時に検出器を２台設け、表裏配線面の配
線パターンを一度に検出することによって、パターン検
出に要する時間を大巾に縮減することのできるパターン
検出装置を提供することにある。In view of the above-mentioned problems of the prior art, an object of the present invention is to increase the amount of fluorescent light generated from the base material, obtain an improved detection signal of S, and at the same time provide two detectors to detect the front and back wiring surfaces. An object of the present invention is to provide a pattern detection device that can greatly reduce the time required for pattern detection by detecting wiring patterns at once.

〔発明の概要〕[Summary of the invention]

本発明は、上記目的を達成するために、一方の配線面か
ら光を照射するだけでなく裏面に相当する配線面からも
光を照射し、表裏配線面それぞれの側に検出器を設ける
ことによって、表裏配線面の配線パターンを一度に検出
することを特徴とするものである。In order to achieve the above object, the present invention not only irradiates light from one wiring surface but also irradiates light from the wiring surface corresponding to the back surface, and provides detectors on each side of the front and back wiring surfaces. , which is characterized by detecting the wiring patterns on both the front and back wiring surfaces at the same time.

また本発明は上記照明法として配線パターンの影の影響
をなくすために斜め方向から光を照射することにある。The present invention also provides the above-mentioned illumination method in which light is irradiated from an oblique direction in order to eliminate the influence of the shadow of the wiring pattern.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の一実施例を第５図を用いて詳細に説明す
る。Hereinafter, one embodiment of the present invention will be described in detail using FIG. 5.

第５図において、プリント基板１．高輝度光源１１．コ
ンデンサレンズ２１．フィルタ２２．ハーフミラ−２６
，フィルタ２４．結像レンズ２５．検出器１６の構成は
第６図に示した従来のパターン検出装置と同じであるが
、新たに第２の高輝度光ｉ１１’、コンデンサレンズ２
１′、フィルタ２２′、ミラー２６が設けである。第５
図において、高輝度光源１１から発した光３１はコンデ
ンサレンズ２１ヲ通り、フィルタ２２へ入り、一方第２
の高輝度光源１１′から発した光６１′はコンデンサレ
ンズ２１′を通り、フィルタ２２′へ入る。フィルタ２
２　、２２’はプリント基板１の基材から蛍光が発生し
やすいように高輝度光＃、１１から発した光３１０波長
を限定するためのフィルタで、例えば波長３００ｎｍが
ら４６０ｎｍまでの波長のみを透過させる一般にブルー
フィルタと呼称されているものである。フィルタ２２を
通過した光３２はノ・−フミラー２６で光路を９０度変
更されてプリント基板１の配線面２を照射し、またフィ
ルタ２２′を通過した光３２′はミラー２６で光路を９
０度変更されてプリント基板１の配線面２の裏面に相当
する配線面２′を照射し、両者とも基材４から蛍光を発
生させるための励起光として働らく。基材４から発生し
た蛍光と、配線面２で反射した反射光と、基材４を透過
した透過光と、スルーホール８を通過した通過光の合わ
さった光４６は再びハーフミラ−２３を通ってフィルタ
２４へ入る。フィルタ２４はプリント基板１０基材４か
ら発生した蛍光と、その他の反射光、透過光９通過光と
を分離するだめのもので、前記励起光３２の限定された
波長域以外の光を透過させるもので例えば波長５００ｎ
ｍ以下の光を反射し、波長５００ｎｍ以上の光を透過さ
せる、一般にイエローフィルタと呼称され、ているもの
である。フィルタ２４で配線面２からの反射光、配線面
２′に照射した元３２′が基材４を透過した透過光。In FIG. 5, printed circuit board 1. High brightness light source 11. Condenser lens 21. Filter 22. Half mirror 26
, filter 24. Imaging lens 25. The configuration of the detector 16 is the same as the conventional pattern detection device shown in FIG.
1', a filter 22', and a mirror 26 are provided. Fifth
In the figure, light 31 emitted from a high-intensity light source 11 passes through a condenser lens 21 and enters a filter 22;
Light 61' emitted from the high-intensity light source 11' passes through the condenser lens 21' and enters the filter 22'. filter 2
2 and 22' are filters for limiting the 310 wavelengths of light emitted from high-intensity light # and 11 so that fluorescence is easily generated from the base material of the printed circuit board 1. For example, only wavelengths from 300 nm to 460 nm are transmitted. This is generally called a blue filter. The light 32 that has passed through the filter 22 has its optical path changed by 90 degrees by the nof mirror 26 and illuminates the wiring surface 2 of the printed circuit board 1, and the light 32' that has passed through the filter 22' has its optical path changed by 90 degrees by the mirror 26.
The wiring surface 2' corresponding to the back surface of the wiring surface 2 of the printed circuit board 1 is irradiated by changing the angle by 0 degrees, and both serve as excitation light for generating fluorescence from the base material 4. Light 46, which is a combination of the fluorescence generated from the base material 4, the reflected light reflected from the wiring surface 2, the transmitted light transmitted through the base material 4, and the transmitted light transmitted through the through hole 8, passes through the half mirror 23 again. Enter the filter 24. The filter 24 is for separating fluorescence generated from the printed circuit board 10 base material 4, other reflected light, and transmitted light 9 passing light, and transmits light other than the limited wavelength range of the excitation light 32. For example, the wavelength is 500n.
It is generally called a yellow filter, and reflects light with a wavelength of 500 nm or less and transmits light with a wavelength of 500 nm or more. Light reflected from the wiring surface 2 by the filter 24, and transmitted light transmitted through the base material 4 by the source 32' irradiated onto the wiring surface 2'.

スルーホール８を通過した通過光と分離された蛍光４４
は、結像レンズ２５で検出器１６の光電変換面に結像さ
れるためプリント基板１の配線パターンのネガパターン
が得られる。従がって、第５図における本発明の一実施
例ではプリント基板やセラミック基板の基材４が、配線
面２を照射する光３２と配線面２の裏面に相当する配線
面２′を照射する光３２′の両方の光で励起されるため
、発生する蛍光が増量し、検出器１３で検出される検出
信号のＳ／Ｎが改善される。従来のパターン検出装置の
検出結果を示す第４図と比較して、本発明の一実施例で
あるパターン検出装置の検出結果を示す第６図を用いて
詳細に説明する。Passing light passing through the through hole 8 and separated fluorescence 44
is imaged on the photoelectric conversion surface of the detector 16 by the imaging lens 25, so that a negative pattern of the wiring pattern of the printed circuit board 1 is obtained. Therefore, in one embodiment of the present invention shown in FIG. 5, the base material 4 of a printed circuit board or a ceramic substrate is illuminated with light 32 that irradiates the wiring surface 2 and a wiring surface 2' corresponding to the back surface of the wiring surface 2. Since the light 32' is excited by both of the lights 32' and 32', the amount of fluorescence generated increases, and the S/N ratio of the detection signal detected by the detector 13 is improved. This will be explained in detail using FIG. 6, which shows the detection results of a pattern detection device according to an embodiment of the present invention, in comparison with FIG. 4, which shows the detection results of a conventional pattern detection device.

第６図は第４図と同様、横軸は位置を示し、・縦軸は検
出器１３で光電変換された電圧を示す。配線パターン３
のレベルを示す電圧■は第６図。In FIG. 6, like FIG. 4, the horizontal axis shows the position, and the vertical axis shows the voltage photoelectrically converted by the detector 13. Wiring pattern 3
The voltage ■ indicating the level of is shown in Figure 6.

第４図とも同じであるが、基材４のレベルを示す第６図
における電圧−は第４図における電圧ηに比べかなシ高
い電圧レベルを示し、シュレッショルドレベルを示す電
圧ＶＴの設定可能範囲は第６図の方が第４図よりも広く
、即ちＳハが改善される。Although it is the same as FIG. 4, the voltage - in FIG. 6, which indicates the level of the base material 4, is a much higher voltage level than the voltage η in FIG. 4, and the settable range of the voltage VT, which indicates the threshold level. is wider in FIG. 6 than in FIG. 4, that is, S is improved.

第７図は本発明の他の実施例を示す図で、プリント基板
１．高輝度光源１１　、１１’　、コンデンサレンズ２
１　、２１’　、フィルタ２２　、２２’　、ハーフミ
ラ−２３、フィルタ２４．結像レンズ２５．検出器１３
の構成は第５図に示した実施例と同じであるが、配線面
２′に対して斜め方向から光３２′を照射するため、第
５図におけるミラー２６に代わりミラー２６′と凹爾鏡
あるいは平面鏡２７′が新しく設けである点が異なシ、
その動作は第６図と同じであるため省略する。光３２′
を配線面２′に対して斜め方向から照射する理由は、配
線面２′の配線バ°ターンの影の影響を受けないように
配慮したことによる。FIG. 7 is a diagram showing another embodiment of the present invention, in which the printed circuit board 1. High brightness light source 11, 11', condenser lens 2
1, 21', filters 22, 22', half mirror 23, filter 24. Imaging lens 25. Detector 13
The configuration is the same as the embodiment shown in FIG. 5, but in order to irradiate the wiring surface 2' with light 32' from an oblique direction, a mirror 26' and a concave mirror are used instead of the mirror 26 in FIG. Alternatively, a model differs in that the plane mirror 27' is newly provided.
The operation is the same as that in FIG. 6, so a description thereof will be omitted. light 32'
The reason for irradiating the wiring surface 2' from an oblique direction is to avoid being affected by the shadow of the wiring patterns on the wiring surface 2'.

次に第８図において本発明の他の実施例を示す。第８図
において、プリント基板１．高輝度光源１１．１１’、
コンデンサレンズ２１　、２１’　、　フィルタ２２　
、２２’　、ミラー２６′、凹面鏡あるいは平面鏡２／
。Next, FIG. 8 shows another embodiment of the present invention. In FIG. 8, printed circuit board 1. High brightness light source 11.11',
Condenser lenses 21, 21', filter 22
, 22', mirror 26', concave mirror or plane mirror 2/
.

フィルタ２４．結像レンズ２５．検出器１３の構成は第
７図に示した実施例と同じであるが、第７図におけるハ
ーフミラ−２３の代わシにミラー２６゜凹面鏡あるいは
平面鏡２７を新しく設け、更に配線面２′の配線パター
ンを検出するためフィルタ２４′、結像レンズ２５′、
検出器１３′が追加された構成となっている。第８図に
おいて、検出器１３の光電変換面にプリント基板１の配
線面２の配線パターンのネガパターンが、結像されるま
での動作は第５図と同じであるため説明は省略する。ま
た検出器１３′の光電変換面にプリント基板１の配線面
２の裏面に相当する配−面２′の配線パターンのネガパ
ターンが結像されるまでの動作は、検出器１６の光電変
換面にプリント基板１の配線面２の配線パターンのネガ
ノミターンが結像され−るまでの動作説明において、ダ
ッシュを付した構成は、ダッシュを付さない構成に、ダ
ッシュを付さない構成は、ダッシュを付した構成に代わ
るのみで、類似しているため説明は省略する。Filter 24. Imaging lens 25. The configuration of the detector 13 is the same as the embodiment shown in FIG. 7, but a new mirror 26° concave mirror or a flat mirror 27 is provided in place of the half mirror 23 in FIG. 7, and the wiring pattern on the wiring surface 2' is A filter 24', an imaging lens 25',
The configuration includes an additional detector 13'. In FIG. 8, the operation until the negative pattern of the wiring pattern on the wiring surface 2 of the printed circuit board 1 is imaged on the photoelectric conversion surface of the detector 13 is the same as that in FIG. 5, and therefore a description thereof will be omitted. The operation until the negative pattern of the wiring pattern on the wiring surface 2' corresponding to the back surface of the wiring surface 2 of the printed circuit board 1 is imaged on the photoelectric conversion surface of the detector 13' is performed on the photoelectric conversion surface of the detector 16. In the explanation of the operation until the negative pattern of the wiring pattern on the wiring surface 2 of the printed circuit board 1 is imaged, the configuration with a dash is the configuration without a dash, and the configuration without a dash is the configuration with a dash. The explanation is omitted because it is similar and only replaces the attached structure.

本発明の実施例によれば、配線面２の配線パターンのネ
ガパターンを検出器１３で、かつ、配線面２′の配線パ
ターンのネガパターンを検出器１６′で一度に検出する
ことができるため、配線パターンの検出に要する時間を
大巾に短縮することができる。更にプリント基板１０基
材４は、配線面２を照射する光３２と、配線面２の裏面
に相当する配線面２′を照射する光６２′の両方の光で
励起されるため、発生する蛍光の光量は第５図と同様増
量し、検出器１３および１３′で検出される検出信号の
Ｓハは改善されたものであることはもち論である。第９
図は第８図に示した本発明の実施例であるパターン検出
装置で検出した第１図のＡ−Ａ線上の検出結果を示すも
ので、（ａ）は配線面２における検出結果を示し、（ｂ
）は配線面２の裏面に相当する配線面２′の検出結果を
示す。According to the embodiment of the present invention, the negative pattern of the wiring pattern on the wiring surface 2 can be detected by the detector 13, and the negative pattern of the wiring pattern on the wiring surface 2' can be detected by the detector 16' at the same time. , the time required to detect a wiring pattern can be significantly shortened. Furthermore, the printed circuit board 10 base material 4 is excited by both the light 32 that irradiates the wiring surface 2 and the light 62' that irradiates the wiring surface 2' corresponding to the back surface of the wiring surface 2, so that the generated fluorescence It is a matter of course that the amount of light increases as in FIG. 5, and that the S of the detection signal detected by the detectors 13 and 13' is improved. 9th
The figure shows the detection results on line A-A in FIG. 1 detected by the pattern detection device according to the embodiment of the present invention shown in FIG. 8, and (a) shows the detection results on the wiring surface 2; (b
) shows the detection results for the wiring surface 2' corresponding to the back surface of the wiring surface 2.

第９図（ａ）は当然のことながら第６図と同じ結果を示
す。FIG. 9(a) naturally shows the same results as FIG. 6.

以上の説明はもっばら配線基板の基材から発する蛍光を
検出する場合を例示したが、本発明は、例えば蛍光を発
しない基材のうえに蛍光を発する材料で描いた回路パタ
ーンの例えば、エツチング用レジストパターンに対して
も有効であることは言うまでもない。具体的例としては
印刷回路板用レジストパターン、半導体回路用レジスト
パターンの検査に適用できる。Although the above explanation has mainly exemplified the case of detecting fluorescence emitted from the base material of a wiring board, the present invention is also applicable to, for example, etching of a circuit pattern drawn with a material that emits fluorescence on a base material that does not emit fluorescence. Needless to say, it is also effective for resist patterns used for commercial purposes. As a specific example, it can be applied to inspecting resist patterns for printed circuit boards and resist patterns for semiconductor circuits.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明によれば、以下に述べるごと
き効果を得ることができる０１、　プリント基板の表裏
配線面を同時に照射するようにしたため、基材から発生
する蛍光の光量が増量できるので、検出信号の８／Ｎを
改善できる効果がある。As explained above, according to the present invention, the following effects can be obtained.01.Since the front and back wiring surfaces of the printed circuit board are simultaneously irradiated, the amount of fluorescent light generated from the base material can be increased. This has the effect of improving 8/N of the detection signal.

２　プリント基板の表裏配線面の配線ノくターンを別々
に設けた検出器で検出するようにしたため表裏配線面の
配線パターンを一度に検出することができるので、配線
パターンの検出に要する時間を大ｒｊコに短縮すること
のできるノくターン検出装置を得ることのできる効果が
ある。2 Since the wiring patterns on the front and back wiring surfaces of the printed circuit board are detected using separate detectors, the wiring patterns on the front and back wiring surfaces can be detected at once, which greatly reduces the time required to detect wiring patterns. This has the effect of providing a turn detection device that can be shortened to rj.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はプリント基板の平面図、第２図は第１図のＡ−
Ａ線断面図、第６図は従来のノくターン検出装置を示す
側面図、第４図は従来のノくターン検出装置による第１
図のＡ−Ａ線上の検出結果を示す図、第５図は本発明の
一実施例のパターン検出装置を示す側面図、第６図は本
発明の一実施例のパターン検出装置による第１図のＡ−
Ａ線上の検出結果を示す図、第７図は本発明の他の一実
施例のパターン検出装置を示す側面図、第８図は本発明
の他の一実施例のパターン検出装置を示す側面図、第９
図は本発明の他の一実施例のパターン検出装置による第
１図Ａ−Ａ線上の検出結果を示す図で（ａ）は配線面２
における検・出結果を示す図で（ｂ）は配線面２の裏面
である配線面２′における検出結果を示す図。 １・・・プリント基板、　　２，２′・・配線面、６．
６′・・・配線パターン、４・・基材、１１．１１’・
・・高輝度光源、１３．１３’・・・検出器、　　２１
　、２１’・　コンデンサレンズ、−。 ２２　、２２’・・フィルタ、　　　２３　　ハーフミ
ラ−１２４、２４’・・フィルタ、　　　２５　、２５
’　　結像レンズ、２６　、２６’　　・ミラー、　２
７　、２７’　　凹面鏡あるいは平面鏡、３１．３１’
・・・光源の光、３２　、５２’　　励起光、４２　、
４４　、４６　、４６’・・蛍光。 窮１図 ２／ 第２図 第３図 第４図 １５図 第６図 第　７図 第　３図 、３′ノFigure 1 is a plan view of the printed circuit board, Figure 2 is A- in Figure 1.
6 is a side view showing a conventional notch turn detection device, and FIG.
FIG. 5 is a side view showing a pattern detection device according to an embodiment of the present invention, and FIG. 6 is a diagram showing the detection results along the line A-A in the figure. FIG. A-
FIG. 7 is a side view showing a pattern detection device according to another embodiment of the present invention; FIG. 8 is a side view showing a pattern detection device according to another embodiment of the present invention. , No. 9
The figure shows the detection results on line A-A in Figure 1 by a pattern detection device according to another embodiment of the present invention, and (a) shows the wiring surface 2.
(b) is a diagram showing the detection results on the wiring surface 2' which is the back surface of the wiring surface 2. 1...Printed circuit board, 2,2'...wiring surface, 6.
6'...Wiring pattern, 4...Base material, 11.11'...
...High-intensity light source, 13.13'...Detector, 21
, 21'・Condenser lens, -. 22, 22'... Filter, 23 Half mirror 124, 24'... Filter, 25, 25
'Imaging lens, 26, 26' Mirror, 2
7, 27' Concave mirror or plane mirror, 31.31'
...light of light source, 32, 52' excitation light, 42,
44, 46, 46'...Fluorescence. Fig. 1 Fig. 2/ Fig. 2 Fig. 3 Fig. 4 Fig. 15 Fig. 6 Fig. 7 Fig. 3, 3'

Claims (1)

【特許請求の範囲】 １、　基板の配線面、及び該配線の裏面に相当する配線
面に光を照射する照射手段と、該照射手段の光を蛍光が
発生しやすい波長に限定するだめの第１のフィルタと、
前記基板の配線面からの反射光およびスルホールからの
通過光をカットして基材から発生する蛍光のみを透過す
る第２のフィルタと、該第２のフィルタを透過した蛍光
を検出するための検出器と、該検出器に配線パターン像
を結像するための結像レンズとを備え付けたことを特徴
とするパターン検出装置。 ２、　上記照射手段は、配線面の裏面に相当する配線面
に斜め方向から照射することを特徴とする特許請求の範
囲第１項記載のパターン検出装置。 ６、上記照射手段は、基板の配線面に照射する第１の照
射手段と、上記配線面の裏面に相当する配線面に光を照
射する第２の照射手段とによって構成したことを特徴と
する特許請求の範囲第１項記載のパターン検査装置。 ４゜　上記第１のフィルタは、第１の照射手段と第２の
照射手段とに対応させて複数のフィルタによって構成し
たことを特徴とする特許請求の範囲第６項記載のパター
ン検出装置。 ５、基板の配線面、及び該配線面の裏面に相当する配線
面に光を斜め方向から照射する照射手段と、該照射手段
の光を蛍光が発生しやすい波長に限定する第１のフィル
タと、前記配線面からの反射光およびスルホールからの
通過光をカットし、基材から発生する蛍光のみを透過す
る第２のフィルタと、該第２のフィルタを透過した蛍光
を検出するだめの第１の検出器と、該第１の検出器に配
線ノくターンの像を結像するだめの第１の結像レンズと
、更に上記配線面の裏面に相当する配線面からの反射光
およびスルホールからの通過光をカットし、基材あるい
は配線材料から発生する蛍光のみを透過する第３のフィ
ルタと、該第３のフィルタを通過した蛍光を検出するた
めの第２の検出器と、該第２の検出器に配線パターンの
像を結像させるための第２の結像レンズとを備えたこと
を特徴とするパターン検出装置。 ６、上記照射手段は、基板の配線面に照射する第１の照
射手段と、上記配線面の裏面に相当する配線面に光を照
射する第２の照射手段とによって構成したことを特徴と
する特許請求の範囲第５項記載のパターン検査装置。 Ｚ　上記第１のフィルタは、第１の照射手段と第２の照
射手段とに対応させて複数のフィルタによって構成した
ことを特徴とする特許請求の範囲第６項記載のパターン
検査装置。[Scope of Claims] 1. An irradiation means for irradiating light onto the wiring surface of the board and the wiring surface corresponding to the back surface of the wiring, and a third element for limiting the light from the irradiation means to a wavelength at which fluorescence is likely to occur. 1 filter and
a second filter that cuts reflected light from the wiring surface of the board and transmitted light from the through holes and transmits only fluorescence generated from the base material; and a detection device for detecting the fluorescence that has passed through the second filter. What is claimed is: 1. A pattern detection device comprising: a detector; and an imaging lens for forming a wiring pattern image on the detector. 2. The pattern detection device according to claim 1, wherein the irradiation means irradiates the wiring surface corresponding to the back side of the wiring surface from an oblique direction. 6. The irradiation means is characterized by comprising a first irradiation means that irradiates the wiring surface of the board, and a second irradiation means that irradiates light onto the wiring surface corresponding to the back surface of the wiring surface. A pattern inspection device according to claim 1. 4. The pattern detection device according to claim 6, wherein the first filter is constituted by a plurality of filters corresponding to the first irradiation means and the second irradiation means. 5. An irradiation means for irradiating light from an oblique direction onto the wiring surface of the board and the wiring surface corresponding to the back surface of the wiring surface, and a first filter that limits the light from the irradiation means to a wavelength at which fluorescence is likely to occur. , a second filter that cuts reflected light from the wiring surface and transmitted light from the through hole and transmits only fluorescence generated from the base material; and a first filter that detects the fluorescence that has passed through the second filter. a first imaging lens for forming an image of the wiring nozzle on the first detector; and a first imaging lens for forming an image of the wiring nozzle on the first detector; a third filter that cuts the passing light and transmits only the fluorescence generated from the base material or the wiring material; a second detector for detecting the fluorescence that has passed through the third filter; A pattern detection device comprising: a second imaging lens for forming an image of the wiring pattern on the detector. 6. The irradiation means is characterized by comprising a first irradiation means that irradiates the wiring surface of the board, and a second irradiation means that irradiates light onto the wiring surface corresponding to the back surface of the wiring surface. A pattern inspection device according to claim 5. Z. The pattern inspection apparatus according to claim 6, wherein the first filter is constituted by a plurality of filters corresponding to the first irradiation means and the second irradiation means.
JP58092304A 1983-05-27 1983-05-27 Pattern detector Granted JPS59218937A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58092304A JPS59218937A (en) 1983-05-27 1983-05-27 Pattern detector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58092304A JPS59218937A (en) 1983-05-27 1983-05-27 Pattern detector

Publications (2)

Publication Number Publication Date
JPS59218937A true JPS59218937A (en) 1984-12-10
JPH0436335B2 JPH0436335B2 (en) 1992-06-15

Family

ID=14050667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58092304A Granted JPS59218937A (en) 1983-05-27 1983-05-27 Pattern detector

Country Status (1)

Country Link
JP (1) JPS59218937A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61278737A (en) * 1985-06-03 1986-12-09 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Method of detecting defect in thin-film on fluorescent substrate
KR100880858B1 (en) 2007-08-09 2009-01-30 한기수 Light source sturcture for pcb light exposition apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61278737A (en) * 1985-06-03 1986-12-09 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Method of detecting defect in thin-film on fluorescent substrate
EP0204071A2 (en) * 1985-06-03 1986-12-10 International Business Machines Corporation Defect detection in films on ceramic substrates
KR100880858B1 (en) 2007-08-09 2009-01-30 한기수 Light source sturcture for pcb light exposition apparatus

Also Published As

Publication number Publication date
JPH0436335B2 (en) 1992-06-15

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