JPS5919362A - Coating method for resin on electronic parts - Google Patents

Coating method for resin on electronic parts

Info

Publication number
JPS5919362A
JPS5919362A JP12939682A JP12939682A JPS5919362A JP S5919362 A JPS5919362 A JP S5919362A JP 12939682 A JP12939682 A JP 12939682A JP 12939682 A JP12939682 A JP 12939682A JP S5919362 A JPS5919362 A JP S5919362A
Authority
JP
Japan
Prior art keywords
resin
resist material
film
coating
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12939682A
Other languages
Japanese (ja)
Inventor
Kazunao Kinugawa
衣川　一尚
Kazuma Ito
伊藤　一馬
Mitsuru Matsuda
松田　満
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seikosha KK
Original Assignee
Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seikosha KK filed Critical Seikosha KK
Priority to JP12939682A priority Critical patent/JPS5919362A/en
Publication of JPS5919362A publication Critical patent/JPS5919362A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To eliminate the necessity of operating to prevent diffusion of resin in a coating work of resin on an electronic part by coating in advance a film with a resist material having water and oil repelling properties on a circuit substrate. CONSTITUTION:A film 4 is formed with a resist material having water and oil repelling properties on a substrate 1 on the part except an electron part mounting part 3 and the ends 2a of lead wirings 2. After the film 4 is formed, an electronic part 5 such as IC or the like is mounted, necessary wire bonding is performed, and the electronic part is covered with epoxy resin or the like. Then, the resin for coating is not externally flowed out from the mount 3 by the film 4.

Description

【発明の詳細な説明】 この発明はＩＣなどの電子部品への樹脂被後処理法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resin post-treatment method for electronic components such as ICs.

ＩＣなどの電子部品全回路基板に取付けた場合、その保
護のためエポキシ樹脂などで被覆することが多い。その
際、樹脂でその電子部品を完全に覆うために流動性のあ
る樹脂を使う。しかしその流動性に工す樹脂が基板の他
の部分まで流れ、あるいは拡散していくと不都合が生じ
る。その防止策として現在とられている措置の一つとし
て、ノンスチツク製のシート状のものなどで枠をつくり
、これを基板に接着し、この枠を流れ止めに用いる手段
が知られている。しかしこの方法はグラスチックの枠を
基板に接着する手間がかがるという欠点がある。When all electronic components such as ICs are attached to a circuit board, they are often covered with epoxy resin or the like to protect them. At that time, a fluid resin is used to completely cover the electronic components. However, problems arise when the fluidity resin flows or diffuses to other parts of the substrate. One of the measures currently being taken to prevent this is to make a frame out of a non-stick sheet, adhere it to a substrate, and use this frame to stop the flow. However, this method has the disadvantage that it takes time and effort to adhere the glass frame to the substrate.

仙の防止策として知られているのは、基板上に撥水・撥
油性樹脂を枠状に塗布することにより拡散を防止する手
段である。しがしこの場合も撥水・撥油性樹脂の塗布量
が徴緩なのでその管理が難しく、また塗布するものが溶
剤型のインク・塗料であれば溶剤濃度管理の必要があり
、加熱硬化型あるいは元硬化型ならそれぞれ硬化する工
程が必要であるなどの欠点がある。A known method for preventing the spread of dust is to apply a frame-shaped water-repellent/oil-repellent resin onto the substrate. However, in this case, it is difficult to control the amount of water- and oil-repellent resin applied because it is gradual, and if the material to be applied is a solvent-based ink or paint, it is necessary to control the concentration of the solvent. The original hardening type has drawbacks such as the need for a separate hardening process.

この発明けこうした問題点を解決するものである。This invention solves these problems.

つぎに実施列について説明する。Next, the implementation sequence will be explained.

回路基板１にはリード線２が印刷されている。Lead wires 2 are printed on the circuit board 1.

この基板１にはメッキ、自動ハンダ槽への浸漬などを行
なうことが多く、そのため基板には予めレジスト材で被
膜を塗布しておく。そこでこのレジスト材に撥水・撥油
性をもったものを用いれば、ＩＣなどの電子部品被援用
の樹脂の拡散防止が図られ、別に作業が不要となる。こ
の発明はこの点に着眼したもので、基板１上に電子部品
取付部６とリード線２の端部２ａの部分とを除き撥水・
撥油性を有するレジスト材で被膜４を設ける。レジスト
材に撥水・撥油性を付与する方法としては、レジスト材
自体を撥水・頒油性にする方法と、レジスト材に撥水・
撥油性をもった物体を添加する方法とがある。レジスト
材自体を撥水・撥油性にする方法としては、エポキシ樹
脂などのレジスト材に硅素またはフン累などを導入する
方法がある。This substrate 1 is often subjected to plating, immersion in an automatic solder tank, etc., and for this purpose the substrate is coated with a film of resist material in advance. Therefore, if a water- and oil-repellent resist material is used, the resin for supporting electronic components such as ICs can be prevented from spreading, and no additional work is required. The present invention has focused on this point, and has a water repellent and
A coating 4 is provided using a resist material having oil repellency. There are two ways to impart water and oil repellency to the resist material: one is to make the resist material itself water and oil repellent, and the other is to make the resist material water and oil repellent.
There is a method of adding an oil-repellent substance. As a method of making the resist material itself water- and oil-repellent, there is a method of introducing silicon or dung into the resist material such as epoxy resin.

レジスト材に撥水・撥油性をもった物質を添加する方法
としては、たとえば撥水・撥油性を有するオルガノポリ
シロキサン順や含フツ素高分子またはこれらの中・低分
子化合物をエポキシ樹脂などのレジスト材に除却する方
法がある。この工うなレジスト材で被膜４を設けた後、
ＩＣなどの電子部品５を取付け、必要なワイヤボンディ
ングなどを施した後、電子部品をエポキシ樹脂などで被
覆する。その際レジスト材の被膜４によってこの被覆用
の樹脂が電子部品取付部３がら外へ流出することはない
。Examples of methods for adding water- and oil-repellent substances to resist materials include adding water- and oil-repellent organopolysiloxane, fluorine-containing polymers, or medium- to low-molecular-weight compounds thereof to epoxy resins, etc. There is a method to remove resist material. After forming the coating 4 with this resist material,
After mounting the electronic component 5 such as an IC and performing necessary wire bonding, the electronic component is coated with an epoxy resin or the like. At this time, the coating 4 of the resist material prevents this coating resin from flowing out from the electronic component mounting portion 3.

なお上述の実施的では電子部品が一つの場合を示してい
るが、複数個の電子部品全被覆する場合にも全く同様に
実施できることは言うまでもない。Note that although the above-mentioned implementation shows the case where there is only one electronic component, it goes without saying that the implementation can be carried out in exactly the same way even when a plurality of electronic components are all covered.

上述の構成よりなる本発明による電子部品への樹脂被覆
処理法によれば、電子部品への樹脂による被覆作業にお
いて、拡散防止のための作業が不要であり、作業能率の
向上を図ることができる。According to the method for coating electronic components with resin according to the present invention having the above-described configuration, work for preventing diffusion is not required in the work of coating electronic parts with resin, and work efficiency can be improved. .

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明の処理方法を説明するための回路基板の平
面図である。 １・・・・・・回路基板　　　　３・・・・・・電子部
品取付部４・・・・・・被　模　　　　　５・・・・・
・電子部品以　　　上 出願人　株式会社　精　　工　　舎 代理人　弁理士　　最　上　　　務 −コ １　［汗Ｈ七１The drawing is a plan view of a circuit board for explaining the processing method of the present invention. 1... Circuit board 3... Electronic component mounting part 4... Cover 5...
・Electronic parts and above Applicant Seikosha Co., Ltd. Agent Patent attorney Mogami Tsumugi-ko 1 [Sweat H71

Claims (1)

【特許請求の範囲】[Claims] 回路基板にｍ子部品取付部を除き炭水・撥油性を有する
レジスト材で被膜を設け、電子部品全上記回路基板に取
例けた後上記軍子部品を樹脂で被覆することを特徴とす
る電子部品への樹脂被覆処理法。An electronic device characterized in that the circuit board is coated with a resist material having hydrophobic and oil-repellent properties except for the mounting portions of the m-child parts, and after all the electronic parts are mounted on the circuit board, the m-child parts are coated with a resin. Resin coating treatment method for parts.
JP12939682A 1982-07-23 1982-07-23 Coating method for resin on electronic parts Pending JPS5919362A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12939682A JPS5919362A (en) 1982-07-23 1982-07-23 Coating method for resin on electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12939682A JPS5919362A (en) 1982-07-23 1982-07-23 Coating method for resin on electronic parts

Publications (1)

Publication Number Publication Date
JPS5919362A true JPS5919362A (en) 1984-01-31

Family

ID=15008527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12939682A Pending JPS5919362A (en) 1982-07-23 1982-07-23 Coating method for resin on electronic parts

Country Status (1)

Country Link
JP (1) JPS5919362A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6223301U (en) * 1985-07-22 1987-02-12
JPS63145335U (en) * 1987-03-16 1988-09-26
JPS6468804A (en) * 1987-09-10 1989-03-14 Meiki Seisakusho Kk Process controller

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS532078A (en) * 1976-06-28 1978-01-10 Citizen Watch Co Ltd Sealing structure for semiconductor device
JPS53124760A (en) * 1977-04-06 1978-10-31 Citizen Watch Co Ltd Construction of circuit substrate
JPS5525381B2 (en) * 1975-11-21 1980-07-05
JPS5718768U (en) * 1980-07-04 1982-01-30

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5525381B2 (en) * 1975-11-21 1980-07-05
JPS532078A (en) * 1976-06-28 1978-01-10 Citizen Watch Co Ltd Sealing structure for semiconductor device
JPS53124760A (en) * 1977-04-06 1978-10-31 Citizen Watch Co Ltd Construction of circuit substrate
JPS5718768U (en) * 1980-07-04 1982-01-30

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6223301U (en) * 1985-07-22 1987-02-12
JPS63145335U (en) * 1987-03-16 1988-09-26
JPS6468804A (en) * 1987-09-10 1989-03-14 Meiki Seisakusho Kk Process controller

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