JPS59193032A - Manufacturing device for semiconductor device - Google Patents
Manufacturing device for semiconductor deviceInfo
- Publication number
- JPS59193032A JPS59193032A JP58065450A JP6545083A JPS59193032A JP S59193032 A JPS59193032 A JP S59193032A JP 58065450 A JP58065450 A JP 58065450A JP 6545083 A JP6545083 A JP 6545083A JP S59193032 A JPS59193032 A JP S59193032A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- lead frame
- magazine
- bonding
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 claims description 8
- 239000011347 resin Substances 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 8
- 238000000465 moulding Methods 0.000 abstract description 7
- 238000005452 bending Methods 0.000 abstract 2
- 238000009826 distribution Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000012805 post-processing Methods 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は半導体装置の製造装置に関し、牲にワイヤボン
ディング後の半導体装置をワイヤショートが生ずること
なく次工程へ供給することができる学導体V造装置に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a semiconductor device manufacturing apparatus, and more particularly to a semiconductor V manufacturing apparatus that can supply semiconductor devices after wire bonding to the next process without causing wire shorts. It is something.
トランジスタ、IO,LSI等の半導体装置は、一般に
外部導出用のリードと一体的に形成したベース上に所要
の素子チップを固着し、次いで処のチップの電極バリド
と前述のリードとをワイヤボンディングしてti的な接
続を行なった上でこねにパッケージを施して完放する工
程が採られている。ところで、このパッケージはトラン
スファモールド法によるレジンモールドやセラミ、クキ
々、9プによる封止等種々の方法が行なわれているが、
いすねにしても工場設備の関係上パッケージ装置をワイ
ヤボンディング装置の近傍に設置することは難かしく、
したがってワイヤボンディングの完了した半導体装置を
適宜な搬送手段によってバ、。Semiconductor devices such as transistors, IOs, and LSIs are generally manufactured by fixing the required element chips on a base that is integrally formed with external leads, and then wire-bonding the electrode pads of the chips and the aforementioned leads. The process is to make a ti-like connection, package the dough, and release it completely. By the way, this package has been made using various methods such as resin molding using the transfer molding method, sealing with ceramic, nail, and 9-ply.
At Isune, it is difficult to install packaging equipment near wire bonding equipment due to factory equipment.
Therefore, the semiconductor device after wire bonding is transferred to a bar by an appropriate transportation means.
ケージ装置にまで搬送する必要がある。It is necessary to transport it to the cage device.
しかしながら、こねまでの搬送形態は、ワイヤボンディ
ングの完了された半導体装置をそのままの姿勢、つまり
アーク状に張設し反ワイヤが上方に向けられに姿勢でベ
ルト手段やエア等で搬送してい7:)りめ、搬送時に生
じる振動等によってワイヤが弛み、ワイヤ相互間あるい
はワイヤとリードやベース、チ、ツブ等が直接接対して
しまう所謂ワイヤショートが起るという問題が生じてい
る。竹に、近年の10.LSIの高集積化に伴なってワ
イヤ本数は益々多くなる傾向にあり、このような不具合
の発生率は憂いものに寿っている。このため、パリケー
ジ工程前にはワイヤショート検査等が必要とさね、ワイ
ヤボンディング工程からノ(、。However, in the transportation mode until kneading, the semiconductor device after wire bonding is stretched in the same position, that is, in an arc shape, and the anti-wire is directed upward, and the semiconductor device is transported by belt means, air, etc.7: ), the wires loosen due to vibrations generated during transportation, and a so-called wire short occurs, in which the wires come into direct contact with each other or with the leads, bases, chips, protrusions, etc. 10. Bamboo in recent years. As LSIs become more highly integrated, the number of wires tends to increase, and the incidence of such defects is worrying. For this reason, wire short inspection is required before the pari-cage process, and from the wire bonding process onwards.
ケージ工程に到る無人如理化が困難になり、かつ半導体
装置の組立工程の一貫自動化ラインの実現の障害になる
。This makes it difficult to unmanned the cage process and becomes an obstacle to realizing an integrated automated line for the assembly process of semiconductor devices.
〔発明の目的〕
本発明の目的はワイヤボンディング後における半導体装
置の搬送に際してのワイヤの弛みを防止し、こわによシ
ワイヤボンディング工程からノく、ツケージ工程への半
導体装置の自動搬送を可能とし、更に半導体装置の組立
工程の一貫自動ライン化を可能にする半導体装置の製造
装置を揚供することにある。[Object of the Invention] The object of the present invention is to prevent the wire from becoming loose during the transportation of the semiconductor device after wire bonding, and to enable automatic transportation of the semiconductor device from the stiff wire bonding process to the cage process. Another object of the present invention is to provide semiconductor device manufacturing equipment that enables integrated automatic line assembly of semiconductor device assembly processes.
本発明の前記ならびにそのほかの目的と新規な特徴は、
本明細言の記述および添付図面からあきらかに彦るであ
ろう。The above and other objects and novel features of the present invention include:
It will be clear from the description of the present specification and the accompanying drawings.
本願において開示される発明のうち代表的なものの概要
を簡彬に説明す第1ば、下肥のとおりである。The first part, which briefly explains the outline of the typical inventions disclosed in this application, is as follows.
7なわち、ワイヤボンディング装置と、パリケージ装置
等の後工程装置との間の搬送手段の上、下流位置に夫々
被組立物としての半導体装置の上下姿勢を反転させる反
転装置を設けることにより、搬送手段による半導体装置
の搬送時に半導体装置を土工逆向きに保ち、これにより
ワイヤの弛みを防止してワイヤショートの発生を防」ト
シ、組立工程の自動化を達成するものである。7. In other words, by providing a reversing device for reversing the vertical posture of the semiconductor device as an assembly object at a position above and downstream of the transport means between the wire bonding equipment and the post-processing equipment such as the parikage equipment, the transport When the semiconductor device is transported by the device, the semiconductor device is held in the opposite direction of the earthwork, thereby preventing the wire from loosening and causing a wire short, thereby achieving automation of the assembly process.
第1図は本発明の一実旅例の構成図であり、所謂リード
フレーム上に素子チップを固着しかつこれにワイヤボン
ディングを旋しπ上でレシンモールドによりバ、ッケー
ジを旅ス実旋例を示している。FIG. 1 is a block diagram of an example of the present invention, in which an element chip is fixed on a so-called lead frame, wire bonding is applied to this, and a package is formed by resin molding on π. It shows.
図において、1は素子チ、Vプ2をリードフレーム3に
固!−jるチップボンディング装置、4.5はこのチッ
プボンディング装置1から搬送ベルト6により搬送され
てきたチ、ツブを固着し2 l]−ドフレーム(リード
フレームmA)7にワイヤ7yンデイングを施工ワイヤ
ポンディング装置であり、2台の装置を直列に配設して
いる。また、8はワイヤボンディングさワタリードフレ
ーム構体7をレジンモールドする後工程装置としてのツ
ク、ソケージ装置、そして9はこのワイヤボンディング
装置4.5とパッケージ装置8の間に延設してリードフ
レーム構体7を搬送する搬送手段である。In the figure, the element 1 is fixed to the lead frame 3, and the V plate 2 is fixed to the lead frame 3. A chip bonding device 4.5 fixes the chips and tabs conveyed from the chip bonding device 1 by a conveyor belt 6, and attaches a wire 7y to a lead frame (lead frame mA) 7. This is a pounding device, and two devices are arranged in series. Further, 8 is a post-processing device for resin molding the wire-bonded lead frame structure 7, and 9 is a device extending between the wire bonding device 4.5 and the packaging device 8 to assemble the lead frame structure. This is a conveying means for conveying 7.
前記チップボンディング装置1は、公知の送り機構によ
ってローダ10からレール11上を移動さねて来るリー
ドフレーム3上に、ストヴ力12に貯えられた素子チッ
プ2をチ、ツブ7Rンダ13によって固着する。そして
、チップ2か固着され、たリードフレーム3、即ちリー
ドフレーム構体7は搬送ベルト6によりワイヤボンディ
ング装置4.5に搬送される。The chip bonding apparatus 1 fixes the element chips 2 stored in the Stov force 12 onto the lead frame 3, which is moved on the rails 11 from the loader 10 by means of a well-known feeding mechanism, using the tabs 7R and 13. . Then, the lead frame 3 to which the chip 2 is fixed, that is, the lead frame structure 7, is conveyed by the conveyor belt 6 to the wire bonding device 4.5.
前記各ワイヤボンディング装置4.5は夫々送すヘルト
14.15と、この送りベルト14.15上のリードフ
レーム構体7を横方向に移動してレール16.17上に
移載させる移載機構1B、19と、ワイヤボンダ20.
21を夫々備えており、レール16.17上を図外の送
り機構によ仄移動されるリードフレーム構体7のチップ
2とリードフレーム3との間にワイヤ22(第3図参照
)を接続する。また、各ワイヤボンディング装置4.5
のレール16.17延長位置には横送りベルト23.2
4の一端部を配設し、かつ各横送シベルト23.24は
その他端部を排出ベルト25に連設している。Each of the wire bonding devices 4.5 has a conveying belt 14.15 and a transfer mechanism 1B that laterally moves the lead frame structure 7 on the conveying belt 14.15 and transfers it onto the rail 16.17. , 19, and a wire bonder 20.
A wire 22 (see FIG. 3) is connected between the chip 2 of the lead frame structure 7 and the lead frame 3, which are moved on rails 16 and 17 by a feeding mechanism not shown. . In addition, each wire bonding device 4.5
In the extended position of the rail 16.17, there is a transverse belt 23.2.
4, and the other end of each transverse belt 23, 24 is connected to the discharge belt 25.
前記搬送手段9は複数個のマガジン26を収納するマガ
ジン収納部27をその上流位置に配設する一方、下流位
置にはマガジン分配部28を配設し、かつこれらマガジ
ン収納部27とマガジン分起部28とを搬送ライン29
で連絡している。前記マガジン収納部27け前記排出ベ
ルト25から搬送されて来たリードフレーム構体7を複
数枚部位で1個のマガジン内に内挿するが、この内挿を
行なう部位には後述する反転装置30を設けている。搬
送ライン29はリードフレーム構体を内挿したマガジン
26を複数個(本例では4個)単位で搬送し、分配部2
Bにおいて各マガジン26を1個づつ分ける。前記マガ
ジン分配部28はパッケージ装部8の各レジンモールド
ライン(本例では4ライン)に対応して設けており、各
マガジン26はリードフレーム構体7を1枚づつ取り出
して各レジンモールドラインに供給するっそして、この
取り出部位にも後述するような反転装置31を夫々(計
4個)設けている。The conveyance means 9 has a magazine storage section 27 for storing a plurality of magazines 26 disposed at an upstream position, and a magazine distribution section 28 at a downstream position, and has a magazine storage section 27 and a magazine distributing section 28 disposed at a downstream position. section 28 and conveyance line 29
I am in touch with you. The lead frame structure 7 transported from the magazine storage section 27 to the ejection belt 25 is inserted into one magazine at a plurality of parts, and a reversing device 30, which will be described later, is installed at the part where this insertion is performed. It is set up. The conveyance line 29 conveys magazines 26 in which lead frame structures are inserted in units of a plurality (four in this example), and transfers them to the distribution section 2.
At B, each magazine 26 is divided into one piece. The magazine distribution section 28 is provided corresponding to each resin mold line (four lines in this example) of the package mounting section 8, and each magazine 26 takes out one lead frame structure 7 and supplies it to each resin mold line. Also, reversing devices 31 (total of 4) as described later are provided at each of these extraction sites.
前記各反転装置30.31は、第2図および第3図に示
すように、内周面にリードフレーム構体7のガイド溝3
2.32を有しかつリードフレーム構体7より若干長寸
法の円筒部33を有し、この円筒部33をその両端外周
の溝34.34に1設する夫々3個のローラ35にて軸
転可能に支持している。才女、円筒部33の中央にはモ
ータ36との間に掛装した回転ベルト37を設け、モー
タ36の回転によって180度軸転されるようになって
いる。図中、38.39は円筒部33内へリードフレー
ム構体7を図の左側から導入し、或は右側から引き出−
riめの送り爪であり、夫々前記マガジン収納部27或
いは分配部28に関係づけてjIR5yさねている。As shown in FIGS. 2 and 3, each of the reversing devices 30, 31 has a guide groove 3 of the lead frame structure 7 on its inner peripheral surface.
2.32 and has a slightly longer dimension than the lead frame structure 7, this cylindrical part 33 is rotated by three rollers 35 provided in grooves 34 and 34 on the outer periphery of both ends of the cylindrical part 33. supported as possible. A rotary belt 37 is provided at the center of the cylindrical portion 33 and is hung between the rotary belt 37 and the motor 36, so that the rotary belt 37 is rotated 180 degrees by the rotation of the motor 36. In the figure, 38 and 39 are for introducing the lead frame structure 7 into the cylindrical part 33 from the left side of the figure or pulling it out from the right side.
It is a second feeding claw, and is bent in relation to the magazine storage section 27 or the distribution section 28, respectively.
以上の構成によれば、第1図に矢印で示すように、ロー
ダ10からレール11上に移動されたリードフレーム3
は、チップボンダ13によって素子チップ2を固着され
、搬送ベルト6によってワイヤポンディング装置4.5
に移動される。チップが固着さ力てなるリードフレーム
構体7は送りベルト14により図示右方へ移動されるが
、その中の一部(本しリでは半分)は移載機構18によ
ってレール16土へ移載され、レール16上を移動さh
ながらワイヤボンダ20によりワイヤ22が接続される
。残りのリードフレーム構体は送シベルト15に移つ次
後に同様に移載機構19によってレール17上へ移載さ
れ、レール17上を移動されながらワイヤボンダ21に
よりワイヤ22が接続される。そしてワイヤボンディン
グされたリードフレーム構体7は夫々横送りベル)23
.24から排量ベルト25を通してマガジン収納部27
に移動され、ここで順序的にイガジン26内に内挿さね
る。According to the above configuration, the lead frame 3 is moved from the loader 10 onto the rail 11 as shown by the arrow in FIG.
The element chip 2 is fixed by a chip bonder 13, and a wire bonding device 4.5 is attached by a conveyor belt 6.
will be moved to The lead frame structure 7 to which the chip is fixed is moved to the right in the figure by the feed belt 14, but a part of it (half in this case) is transferred to the rail 16 by the transfer mechanism 18. , moved on the rail 16 h
At the same time, the wire 22 is connected by the wire bonder 20. The remaining lead frame structure is transferred to the transport belt 15, and then similarly transferred onto the rail 17 by the transfer mechanism 19, and wire 22 is connected by the wire bonder 21 while being moved on the rail 17. The wire-bonded lead frame structures 7 are each transversely moved by a bell) 23.
.. 24 to the magazine storage section 27 through the ejection belt 25.
, and is then sequentially interpolated into the image generator 26.
このとき、内挿されるリードフレーム構体7は、第2図
の送り爪3Bによって反転装置300円筒部33内にカ
イト溝32.32を用いて導入される。このとき、リー
ドフレーム構体7は第3図のようにワイヤボンディング
された時の姿勢を保っており、ワイヤ22は上方に向か
ってアーチを形原する状態となっている。しかし、モー
タ36を駆動して円筒部33を180度回転jtはリー
ドフレーム構体7も上下に180度回転し、第4図に示
すようにワイヤ22が下方に向かってアーチを形成する
ように反転した状態とされる。したがって、前記イガジ
ン26内にはこの反転し穴状態でリードフレーム構体7
が内挿さねる。そし2て、この姿勢のま号マガジン26
により搬送ライン29上を移動され分配部28において
マガジンが分配される。At this time, the lead frame structure 7 to be inserted is introduced into the cylindrical portion 33 of the reversing device 300 using the kite grooves 32 and 32 by the feeding claw 3B of FIG. At this time, the lead frame structure 7 maintains the posture when wire bonded as shown in FIG. 3, and the wire 22 is in a state in which it forms an arch upward. However, when the motor 36 is driven to rotate the cylindrical portion 33 by 180 degrees, the lead frame structure 7 is also rotated 180 degrees up and down, and the wire 22 is reversed so as to form an arch downward as shown in FIG. It is said to be in a state of Therefore, the lead frame structure 7 is placed inside the ignition 26 in this inverted hole state.
is interpolated. And 2, this posture's magazine issue 26
The magazines are moved on the conveyance line 29 and distributed at the distribution section 28.
分配さ消穴マガジン26からは1枚づつリードフレーム
構体7が引き出されるが、引き出されたリードフレーム
構体は直ちに反転装部31内に入りここで前述と逆の反
転作用によって上下が反転される。この結果、リードフ
レーム構体7はワイヤが上方に向けらhi初期の位置に
戻り、・く、vケージ装簡8においてレジンモールドが
行なわわることになる。The lead frame structures 7 are pulled out one by one from the distributed blanking magazine 26, but the pulled out lead frame structures immediately enter the reversing unit 31, where they are turned upside down by a reversing action opposite to that described above. As a result, the lead frame structure 7 returns to the initial position with the wire directed upward, and resin molding is performed in the V-cage mounting 8.
したがって、このようなワイヤボンデインク後における
リードフレーム′jfs体の搬送によりは、リードフレ
ーム構体7は上下反転した姿勢で搬送芒れるので、搬送
時にリードフレーム構体が振動される等してもワイヤ2
2は下方に向けられてチ、ツブ2側に変形されることが
なく、qj訃ワイヤショートが発生するおそtは全くな
い。こわにより、パッケージ工程の前に一々検査を行々
う必要もカく、ワイヤボンディング工程からパッケージ
装置に到る間およびこれらの工程を含む全組立工程の一
貫自動化ラインを達成できるのである。Therefore, when transporting the lead frame 'jfs body after wire bonding ink, the lead frame structure 7 is transported in an upside-down position, so even if the lead frame structure is vibrated during transport, the wire 2
2 is directed downward and is not deformed to the protrusion 2 side, so there is no possibility that a short wire will occur. Due to the stiffness, there is no need to perform inspections before the packaging process, and it is possible to achieve an integrated automation line for the entire assembly process from the wire bonding process to the packaging device and including these processes.
(1) ワイヤボンディング装置と、バ、ノケージ装
置等の後工程装置の間に設けた搬送手段の土、下流位置
に夫々リードフレーム構体の上下を反転させる反転装置
を設けているので、ワイヤボンディング装置や後工程装
置では通常の姿勢を保つ一方で搬送時にはリードフレー
ム構体を反転状態に保つことができ、搬送時における振
動等によってもワイヤがチップ側に変形することはなく
、これによりワイヤショートを確実に防止することがで
きる。(1) The wire bonding equipment The lead frame structure can be kept in an inverted state during transportation while maintaining the normal posture in the lead frame and post-process equipment, and the wire will not be deformed toward the chip even due to vibrations during transportation, thereby ensuring wire short-circuits. can be prevented.
(2) ワイヤショートを防止することにより、後工
程の前にワイヤショートの検査を行なう必要がなくなり
、これにより搬送の自動化、更には組立工程(装置)全
体の一貫自動化を達成でき、半導体装置の製造効率の向
上や省人化に伴なう低コスト化を達成できる。(2) By preventing wire shorts, there is no need to inspect for wire shorts before post-processing, which makes it possible to automate transportation and even achieve integrated automation of the entire assembly process (equipment), which improves the efficiency of semiconductor devices. Cost reductions can be achieved through improved manufacturing efficiency and labor savings.
(3)搬送手段の上、1滝位置に設ける反転装置は、同
−構成のものを用いることができるので、設(ttfi
の設計が容易にでき、かつメンテナンスも容易となる。(3) The reversing device installed at the first waterfall position on the conveying means can be of the same configuration.
It is easy to design and easy to maintain.
(4)反転装置は円筒部をモータ等によって180度軸
転させる構防でよいので、構造が簡単であると共に低価
格に構図でき、既存の組立装置に直ちに付設することが
できる。(4) Since the reversing device may have a structure in which the cylindrical portion is rotated 180 degrees by a motor or the like, the structure is simple and can be constructed at low cost, and can be immediately attached to an existing assembly device.
以上本発明者によってなさf′l;/を発明を実施例に
もとづき具体的に説明したが、本発明は上記実施例に限
定されるものではなく、その要旨を逸脱しない範囲で種
々変更可能であることはいう壕でもない。たとえは、パ
ッケージ装置はレジンモールド以外のパッケージを行な
うものでもよく、またパッケージ装置以外の後工程との
間の搬送手段に適用してもよい。更に反転装置の具体的
な構成は種々に設計変更でき、その配設位置も適宜に変
更できる。The invention made by the inventor has been specifically explained above based on the examples, but the present invention is not limited to the above examples and can be modified in various ways without departing from the gist of the invention. It's not even a moat. For example, the packaging device may perform packaging other than resin molding, or may be applied to a means for transporting the packaging device to a post-process other than the packaging device. Furthermore, the specific configuration of the reversing device can be modified in various ways, and the location thereof can also be changed as appropriate.
以上の説明では主として本発明者によってなさf′また
発明をその背景となった利用分野である半導体装置のワ
イヤボンディング後の搬送手段に適用した場合について
説明したが、そわに限定されるものではなく、他の工程
においても同様に適用することができる。In the above explanation, the invention was mainly applied to a transportation means after wire bonding of a semiconductor device, which is the field of application made by the present inventor, but the present invention is not limited to that. , can be similarly applied to other processes.
第1図は本発明の一実施例の平面構成図、第2図は反転
装置の正面図、
第3図はその仙1面図、
第4図は作用を曲間するための第3図と同様の側面図で
ある。Fig. 1 is a plan configuration diagram of an embodiment of the present invention, Fig. 2 is a front view of the reversing device, Fig. 3 is a side view thereof, and Fig. 4 is a third drawing for changing the action. It is a similar side view.
Claims (1)
ケージ装置等の後工程装置との間の搬送手段の上、下流
位置に夫々反転装置?設け、こtら反転装置によってリ
ードフレーム構体等の被組立物ケ上下方向に姿勢?反転
できるようにしたことゲ峙徴とする半導体装置の製造装
置。 2 反転装置は被組立物を導入支持てる円筒部と、この
円筒台Vを180度軸転させるモータとを備えてなる特
許請求の範囲第1項記載の半導体装置の製造装置。 3 搬送手段はマガジンを搬送でき、このマガジンへ被
組立物を内挿する部位とイガジンから被組立物を取り出
す部位に夫々反転装置を設けてなる特許請求の範囲第1
項又は第2項記載の半導体装置の製造装置。[Scope of Claims] (1) Reversing devices located above and downstream of the conveying means between the front-process equipment such as wire bonding equipment and the post-process equipment such as packaging equipment, respectively? The reversing device is used to change the posture of the lead frame structure and other objects to be assembled in the vertical direction. Semiconductor device manufacturing equipment that features the ability to be reversed. 2. The semiconductor device manufacturing apparatus according to claim 1, wherein the reversing device includes a cylindrical portion for introducing and supporting the object to be assembled, and a motor for rotating the cylindrical table V by 180 degrees. 3. The conveying means is capable of conveying a magazine, and is provided with a reversing device at a portion where the object to be assembled is inserted into the magazine and a portion where the object to be assembled is taken out from the magazine, respectively.
An apparatus for manufacturing a semiconductor device according to item 1 or 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58065450A JPS59193032A (en) | 1983-04-15 | 1983-04-15 | Manufacturing device for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58065450A JPS59193032A (en) | 1983-04-15 | 1983-04-15 | Manufacturing device for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59193032A true JPS59193032A (en) | 1984-11-01 |
Family
ID=13287486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58065450A Pending JPS59193032A (en) | 1983-04-15 | 1983-04-15 | Manufacturing device for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59193032A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10756771B2 (en) | 2018-01-05 | 2020-08-25 | Omron Corporation | Wireless switch |
-
1983
- 1983-04-15 JP JP58065450A patent/JPS59193032A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10756771B2 (en) | 2018-01-05 | 2020-08-25 | Omron Corporation | Wireless switch |
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