JPS59193032A - Manufacturing device for semiconductor device - Google Patents
Manufacturing device for semiconductor deviceInfo
- Publication number
- JPS59193032A JPS59193032A JP58065450A JP6545083A JPS59193032A JP S59193032 A JPS59193032 A JP S59193032A JP 58065450 A JP58065450 A JP 58065450A JP 6545083 A JP6545083 A JP 6545083A JP S59193032 A JPS59193032 A JP S59193032A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- lead frame
- magazine
- bonding
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 claims description 8
- 239000011347 resin Substances 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 8
- 238000000465 moulding Methods 0.000 abstract description 7
- 238000005452 bending Methods 0.000 abstract 2
- 238000009826 distribution Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000012805 post-processing Methods 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は半導体装置の製造装置に関し、牲にワイヤボン
ディング後の半導体装置をワイヤショートが生ずること
なく次工程へ供給することができる学導体Ｖ造装置に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a semiconductor device manufacturing apparatus, and more particularly to a semiconductor V manufacturing apparatus that can supply semiconductor devices after wire bonding to the next process without causing wire shorts. It is something.
トランジスタ、ＩＯ，ＬＳＩ等の半導体装置は、一般に
外部導出用のリードと一体的に形成したベース上に所要
の素子チップを固着し、次いで処のチップの電極バリド
と前述のリードとをワイヤボンディングしてｔｉ的な接
続を行なった上でこねにパッケージを施して完放する工
程が採られている。ところで、このパッケージはトラン
スファモールド法によるレジンモールドやセラミ、クキ
々、９プによる封止等種々の方法が行なわれているが、
いすねにしても工場設備の関係上パッケージ装置をワイ
ヤボンディング装置の近傍に設置することは難かしく、
したがってワイヤボンディングの完了した半導体装置を
適宜な搬送手段によってバ、。Semiconductor devices such as transistors, IOs, and LSIs are generally manufactured by fixing the required element chips on a base that is integrally formed with external leads, and then wire-bonding the electrode pads of the chips and the aforementioned leads. The process is to make a ti-like connection, package the dough, and release it completely. By the way, this package has been made using various methods such as resin molding using the transfer molding method, sealing with ceramic, nail, and 9-ply.
At Isune, it is difficult to install packaging equipment near wire bonding equipment due to factory equipment.
Therefore, the semiconductor device after wire bonding is transferred to a bar by an appropriate transportation means.
ケージ装置にまで搬送する必要がある。It is necessary to transport it to the cage device.
しかしながら、こねまでの搬送形態は、ワイヤボンディ
ングの完了された半導体装置をそのままの姿勢、つまり
アーク状に張設し反ワイヤが上方に向けられに姿勢でベ
ルト手段やエア等で搬送してい７：）りめ、搬送時に生
じる振動等によってワイヤが弛み、ワイヤ相互間あるい
はワイヤとリードやベース、チ、ツブ等が直接接対して
しまう所謂ワイヤショートが起るという問題が生じてい
る。竹に、近年の１０．ＬＳＩの高集積化に伴なってワ
イヤ本数は益々多くなる傾向にあり、このような不具合
の発生率は憂いものに寿っている。このため、パリケー
ジ工程前にはワイヤショート検査等が必要とさね、ワイ
ヤボンディング工程からノ（、。However, in the transportation mode until kneading, the semiconductor device after wire bonding is stretched in the same position, that is, in an arc shape, and the anti-wire is directed upward, and the semiconductor device is transported by belt means, air, etc.7: ), the wires loosen due to vibrations generated during transportation, and a so-called wire short occurs, in which the wires come into direct contact with each other or with the leads, bases, chips, protrusions, etc. 10. Bamboo in recent years. As LSIs become more highly integrated, the number of wires tends to increase, and the incidence of such defects is worrying. For this reason, wire short inspection is required before the pari-cage process, and from the wire bonding process onwards.
ケージ工程に到る無人如理化が困難になり、かつ半導体
装置の組立工程の一貫自動化ラインの実現の障害になる
。This makes it difficult to unmanned the cage process and becomes an obstacle to realizing an integrated automated line for the assembly process of semiconductor devices.
〔発明の目的〕
本発明の目的はワイヤボンディング後における半導体装
置の搬送に際してのワイヤの弛みを防止し、こわによシ
ワイヤボンディング工程からノく、ツケージ工程への半
導体装置の自動搬送を可能とし、更に半導体装置の組立
工程の一貫自動ライン化を可能にする半導体装置の製造
装置を揚供することにある。[Object of the Invention] The object of the present invention is to prevent the wire from becoming loose during the transportation of the semiconductor device after wire bonding, and to enable automatic transportation of the semiconductor device from the stiff wire bonding process to the cage process. Another object of the present invention is to provide semiconductor device manufacturing equipment that enables integrated automatic line assembly of semiconductor device assembly processes.
本発明の前記ならびにそのほかの目的と新規な特徴は、
本明細言の記述および添付図面からあきらかに彦るであ
ろう。The above and other objects and novel features of the present invention include:
It will be clear from the description of the present specification and the accompanying drawings.
本願において開示される発明のうち代表的なものの概要
を簡彬に説明す第１ば、下肥のとおりである。The first part, which briefly explains the outline of the typical inventions disclosed in this application, is as follows.
７なわち、ワイヤボンディング装置と、パリケージ装置
等の後工程装置との間の搬送手段の上、下流位置に夫々
被組立物としての半導体装置の上下姿勢を反転させる反
転装置を設けることにより、搬送手段による半導体装置
の搬送時に半導体装置を土工逆向きに保ち、これにより
ワイヤの弛みを防止してワイヤショートの発生を防」ト
シ、組立工程の自動化を達成するものである。7. In other words, by providing a reversing device for reversing the vertical posture of the semiconductor device as an assembly object at a position above and downstream of the transport means between the wire bonding equipment and the post-processing equipment such as the parikage equipment, the transport When the semiconductor device is transported by the device, the semiconductor device is held in the opposite direction of the earthwork, thereby preventing the wire from loosening and causing a wire short, thereby achieving automation of the assembly process.
第１図は本発明の一実旅例の構成図であり、所謂リード
フレーム上に素子チップを固着しかつこれにワイヤボン
ディングを旋しπ上でレシンモールドによりバ、ッケー
ジを旅ス実旋例を示している。FIG. 1 is a block diagram of an example of the present invention, in which an element chip is fixed on a so-called lead frame, wire bonding is applied to this, and a package is formed by resin molding on π. It shows.
図において、１は素子チ、Ｖプ２をリードフレーム３に
固！−ｊるチップボンディング装置、４．５はこのチッ
プボンディング装置１から搬送ベルト６により搬送され
てきたチ、ツブを固着し２ ｌ］−ドフレーム（リード
フレームｍＡ）７にワイヤ７ｙンデイングを施工ワイヤ
ポンディング装置であり、２台の装置を直列に配設して
いる。また、８はワイヤボンディングさワタリードフレ
ーム構体７をレジンモールドする後工程装置としてのツ
ク、ソケージ装置、そして９はこのワイヤボンディング
装置４．５とパッケージ装置８の間に延設してリードフ
レーム構体７を搬送する搬送手段である。In the figure, the element 1 is fixed to the lead frame 3, and the V plate 2 is fixed to the lead frame 3. A chip bonding device 4.5 fixes the chips and tabs conveyed from the chip bonding device 1 by a conveyor belt 6, and attaches a wire 7y to a lead frame (lead frame mA) 7. This is a pounding device, and two devices are arranged in series. Further, 8 is a post-processing device for resin molding the wire-bonded lead frame structure 7, and 9 is a device extending between the wire bonding device 4.5 and the packaging device 8 to assemble the lead frame structure. This is a conveying means for conveying 7.
前記チップボンディング装置１は、公知の送り機構によ
ってローダ１０からレール１１上を移動さねて来るリー
ドフレーム３上に、ストヴ力１２に貯えられた素子チッ
プ２をチ、ツブ７Ｒンダ１３によって固着する。そして
、チップ２か固着され、たリードフレーム３、即ちリー
ドフレーム構体７は搬送ベルト６によりワイヤボンディ
ング装置４．５に搬送される。The chip bonding apparatus 1 fixes the element chips 2 stored in the Stov force 12 onto the lead frame 3, which is moved on the rails 11 from the loader 10 by means of a well-known feeding mechanism, using the tabs 7R and 13. . Then, the lead frame 3 to which the chip 2 is fixed, that is, the lead frame structure 7, is conveyed by the conveyor belt 6 to the wire bonding device 4.5.
前記各ワイヤボンディング装置４．５は夫々送すヘルト
１４．１５と、この送りベルト１４．１５上のリードフ
レーム構体７を横方向に移動してレール１６．１７上に
移載させる移載機構１Ｂ、１９と、ワイヤボンダ２０．
２１を夫々備えており、レール１６．１７上を図外の送
り機構によ仄移動されるリードフレーム構体７のチップ
２とリードフレーム３との間にワイヤ２２（第３図参照
）を接続する。また、各ワイヤボンディング装置４．５
のレール１６．１７延長位置には横送りベルト２３．２
４の一端部を配設し、かつ各横送シベルト２３．２４は
その他端部を排出ベルト２５に連設している。Each of the wire bonding devices 4.5 has a conveying belt 14.15 and a transfer mechanism 1B that laterally moves the lead frame structure 7 on the conveying belt 14.15 and transfers it onto the rail 16.17. , 19, and a wire bonder 20.
A wire 22 (see FIG. 3) is connected between the chip 2 of the lead frame structure 7 and the lead frame 3, which are moved on rails 16 and 17 by a feeding mechanism not shown. . In addition, each wire bonding device 4.5
In the extended position of the rail 16.17, there is a transverse belt 23.2.
4, and the other end of each transverse belt 23, 24 is connected to the discharge belt 25.
前記搬送手段９は複数個のマガジン２６を収納するマガ
ジン収納部２７をその上流位置に配設する一方、下流位
置にはマガジン分配部２８を配設し、かつこれらマガジ
ン収納部２７とマガジン分起部２８とを搬送ライン２９
で連絡している。前記マガジン収納部２７け前記排出ベ
ルト２５から搬送されて来たリードフレーム構体７を複
数枚部位で１個のマガジン内に内挿するが、この内挿を
行なう部位には後述する反転装置３０を設けている。搬
送ライン２９はリードフレーム構体を内挿したマガジン
２６を複数個（本例では４個）単位で搬送し、分配部２
Ｂにおいて各マガジン２６を１個づつ分ける。前記マガ
ジン分配部２８はパッケージ装部８の各レジンモールド
ライン（本例では４ライン）に対応して設けており、各
マガジン２６はリードフレーム構体７を１枚づつ取り出
して各レジンモールドラインに供給するっそして、この
取り出部位にも後述するような反転装置３１を夫々（計
４個）設けている。The conveyance means 9 has a magazine storage section 27 for storing a plurality of magazines 26 disposed at an upstream position, and a magazine distribution section 28 at a downstream position, and has a magazine storage section 27 and a magazine distributing section 28 disposed at a downstream position. section 28 and conveyance line 29
I am in touch with you. The lead frame structure 7 transported from the magazine storage section 27 to the ejection belt 25 is inserted into one magazine at a plurality of parts, and a reversing device 30, which will be described later, is installed at the part where this insertion is performed. It is set up. The conveyance line 29 conveys magazines 26 in which lead frame structures are inserted in units of a plurality (four in this example), and transfers them to the distribution section 2.
At B, each magazine 26 is divided into one piece. The magazine distribution section 28 is provided corresponding to each resin mold line (four lines in this example) of the package mounting section 8, and each magazine 26 takes out one lead frame structure 7 and supplies it to each resin mold line. Also, reversing devices 31 (total of 4) as described later are provided at each of these extraction sites.
前記各反転装置３０．３１は、第２図および第３図に示
すように、内周面にリードフレーム構体７のガイド溝３
２．３２を有しかつリードフレーム構体７より若干長寸
法の円筒部３３を有し、この円筒部３３をその両端外周
の溝３４．３４に１設する夫々３個のローラ３５にて軸
転可能に支持している。才女、円筒部３３の中央にはモ
ータ３６との間に掛装した回転ベルト３７を設け、モー
タ３６の回転によって１８０度軸転されるようになって
いる。図中、３８．３９は円筒部３３内へリードフレー
ム構体７を図の左側から導入し、或は右側から引き出−
ｒｉめの送り爪であり、夫々前記マガジン収納部２７或
いは分配部２８に関係づけてｊＩＲ５ｙさねている。As shown in FIGS. 2 and 3, each of the reversing devices 30, 31 has a guide groove 3 of the lead frame structure 7 on its inner peripheral surface.
2.32 and has a slightly longer dimension than the lead frame structure 7, this cylindrical part 33 is rotated by three rollers 35 provided in grooves 34 and 34 on the outer periphery of both ends of the cylindrical part 33. supported as possible. A rotary belt 37 is provided at the center of the cylindrical portion 33 and is hung between the rotary belt 37 and the motor 36, so that the rotary belt 37 is rotated 180 degrees by the rotation of the motor 36. In the figure, 38 and 39 are for introducing the lead frame structure 7 into the cylindrical part 33 from the left side of the figure or pulling it out from the right side.
It is a second feeding claw, and is bent in relation to the magazine storage section 27 or the distribution section 28, respectively.
以上の構成によれば、第１図に矢印で示すように、ロー
ダ１０からレール１１上に移動されたリードフレーム３
は、チップボンダ１３によって素子チップ２を固着され
、搬送ベルト６によってワイヤポンディング装置４．５
に移動される。チップが固着さ力てなるリードフレーム
構体７は送りベルト１４により図示右方へ移動されるが
、その中の一部（本しリでは半分）は移載機構１８によ
ってレール１６土へ移載され、レール１６上を移動さｈ
ながらワイヤボンダ２０によりワイヤ２２が接続される
。残りのリードフレーム構体は送シベルト１５に移つ次
後に同様に移載機構１９によってレール１７上へ移載さ
れ、レール１７上を移動されながらワイヤボンダ２１に
よりワイヤ２２が接続される。そしてワイヤボンディン
グされたリードフレーム構体７は夫々横送りベル）２３
．２４から排量ベルト２５を通してマガジン収納部２７
に移動され、ここで順序的にイガジン２６内に内挿さね
る。According to the above configuration, the lead frame 3 is moved from the loader 10 onto the rail 11 as shown by the arrow in FIG.
The element chip 2 is fixed by a chip bonder 13, and a wire bonding device 4.5 is attached by a conveyor belt 6.
will be moved to The lead frame structure 7 to which the chip is fixed is moved to the right in the figure by the feed belt 14, but a part of it (half in this case) is transferred to the rail 16 by the transfer mechanism 18. , moved on the rail 16 h
At the same time, the wire 22 is connected by the wire bonder 20. The remaining lead frame structure is transferred to the transport belt 15, and then similarly transferred onto the rail 17 by the transfer mechanism 19, and wire 22 is connected by the wire bonder 21 while being moved on the rail 17. The wire-bonded lead frame structures 7 are each transversely moved by a bell) 23.
．． 24 to the magazine storage section 27 through the ejection belt 25.
, and is then sequentially interpolated into the image generator 26.
このとき、内挿されるリードフレーム構体７は、第２図
の送り爪３Ｂによって反転装置３００円筒部３３内にカ
イト溝３２．３２を用いて導入される。このとき、リー
ドフレーム構体７は第３図のようにワイヤボンディング
された時の姿勢を保っており、ワイヤ２２は上方に向か
ってアーチを形原する状態となっている。しかし、モー
タ３６を駆動して円筒部３３を１８０度回転ｊｔはリー
ドフレーム構体７も上下に１８０度回転し、第４図に示
すようにワイヤ２２が下方に向かってアーチを形成する
ように反転した状態とされる。したがって、前記イガジ
ン２６内にはこの反転し穴状態でリードフレーム構体７
が内挿さねる。そし２て、この姿勢のま号マガジン２６
により搬送ライン２９上を移動され分配部２８において
マガジンが分配される。At this time, the lead frame structure 7 to be inserted is introduced into the cylindrical portion 33 of the reversing device 300 using the kite grooves 32 and 32 by the feeding claw 3B of FIG. At this time, the lead frame structure 7 maintains the posture when wire bonded as shown in FIG. 3, and the wire 22 is in a state in which it forms an arch upward. However, when the motor 36 is driven to rotate the cylindrical portion 33 by 180 degrees, the lead frame structure 7 is also rotated 180 degrees up and down, and the wire 22 is reversed so as to form an arch downward as shown in FIG. It is said to be in a state of Therefore, the lead frame structure 7 is placed inside the ignition 26 in this inverted hole state.
is interpolated. And 2, this posture's magazine issue 26
The magazines are moved on the conveyance line 29 and distributed at the distribution section 28.
分配さ消穴マガジン２６からは１枚づつリードフレーム
構体７が引き出されるが、引き出されたリードフレーム
構体は直ちに反転装部３１内に入りここで前述と逆の反
転作用によって上下が反転される。この結果、リードフ
レーム構体７はワイヤが上方に向けらｈｉ初期の位置に
戻り、・く、ｖケージ装簡８においてレジンモールドが
行なわわることになる。The lead frame structures 7 are pulled out one by one from the distributed blanking magazine 26, but the pulled out lead frame structures immediately enter the reversing unit 31, where they are turned upside down by a reversing action opposite to that described above. As a result, the lead frame structure 7 returns to the initial position with the wire directed upward, and resin molding is performed in the V-cage mounting 8.
したがって、このようなワイヤボンデインク後における
リードフレーム′ｊｆｓ体の搬送によりは、リードフレ
ーム構体７は上下反転した姿勢で搬送芒れるので、搬送
時にリードフレーム構体が振動される等してもワイヤ２
２は下方に向けられてチ、ツブ２側に変形されることが
なく、ｑｊ訃ワイヤショートが発生するおそｔは全くな
い。こわにより、パッケージ工程の前に一々検査を行々
う必要もカく、ワイヤボンディング工程からパッケージ
装置に到る間およびこれらの工程を含む全組立工程の一
貫自動化ラインを達成できるのである。Therefore, when transporting the lead frame 'jfs body after wire bonding ink, the lead frame structure 7 is transported in an upside-down position, so even if the lead frame structure is vibrated during transport, the wire 2
2 is directed downward and is not deformed to the protrusion 2 side, so there is no possibility that a short wire will occur. Due to the stiffness, there is no need to perform inspections before the packaging process, and it is possible to achieve an integrated automation line for the entire assembly process from the wire bonding process to the packaging device and including these processes.
（１） ワイヤボンディング装置と、バ、ノケージ装
置等の後工程装置の間に設けた搬送手段の土、下流位置
に夫々リードフレーム構体の上下を反転させる反転装置
を設けているので、ワイヤボンディング装置や後工程装
置では通常の姿勢を保つ一方で搬送時にはリードフレー
ム構体を反転状態に保つことができ、搬送時における振
動等によってもワイヤがチップ側に変形することはなく
、これによりワイヤショートを確実に防止することがで
きる。(1) The wire bonding equipment The lead frame structure can be kept in an inverted state during transportation while maintaining the normal posture in the lead frame and post-process equipment, and the wire will not be deformed toward the chip even due to vibrations during transportation, thereby ensuring wire short-circuits. can be prevented.
（２） ワイヤショートを防止することにより、後工
程の前にワイヤショートの検査を行なう必要がなくなり
、これにより搬送の自動化、更には組立工程（装置）全
体の一貫自動化を達成でき、半導体装置の製造効率の向
上や省人化に伴なう低コスト化を達成できる。(2) By preventing wire shorts, there is no need to inspect for wire shorts before post-processing, which makes it possible to automate transportation and even achieve integrated automation of the entire assembly process (equipment), which improves the efficiency of semiconductor devices. Cost reductions can be achieved through improved manufacturing efficiency and labor savings.
（３）搬送手段の上、１滝位置に設ける反転装置は、同
−構成のものを用いることができるので、設（ｔｔｆｉ
の設計が容易にでき、かつメンテナンスも容易となる。(3) The reversing device installed at the first waterfall position on the conveying means can be of the same configuration.
It is easy to design and easy to maintain.
（４）反転装置は円筒部をモータ等によって１８０度軸
転させる構防でよいので、構造が簡単であると共に低価
格に構図でき、既存の組立装置に直ちに付設することが
できる。(4) Since the reversing device may have a structure in which the cylindrical portion is rotated 180 degrees by a motor or the like, the structure is simple and can be constructed at low cost, and can be immediately attached to an existing assembly device.
以上本発明者によってなさｆ′ｌ；／を発明を実施例に
もとづき具体的に説明したが、本発明は上記実施例に限
定されるものではなく、その要旨を逸脱しない範囲で種
々変更可能であることはいう壕でもない。たとえは、パ
ッケージ装置はレジンモールド以外のパッケージを行な
うものでもよく、またパッケージ装置以外の後工程との
間の搬送手段に適用してもよい。更に反転装置の具体的
な構成は種々に設計変更でき、その配設位置も適宜に変
更できる。The invention made by the inventor has been specifically explained above based on the examples, but the present invention is not limited to the above examples and can be modified in various ways without departing from the gist of the invention. It's not even a moat. For example, the packaging device may perform packaging other than resin molding, or may be applied to a means for transporting the packaging device to a post-process other than the packaging device. Furthermore, the specific configuration of the reversing device can be modified in various ways, and the location thereof can also be changed as appropriate.
以上の説明では主として本発明者によってなさｆ′また
発明をその背景となった利用分野である半導体装置のワ
イヤボンディング後の搬送手段に適用した場合について
説明したが、そわに限定されるものではなく、他の工程
においても同様に適用することができる。In the above explanation, the invention was mainly applied to a transportation means after wire bonding of a semiconductor device, which is the field of application made by the present inventor, but the present invention is not limited to that. , can be similarly applied to other processes.
第１図は本発明の一実施例の平面構成図、第２図は反転
装置の正面図、
第３図はその仙１面図、
第４図は作用を曲間するための第３図と同様の側面図で
ある。Fig. 1 is a plan configuration diagram of an embodiment of the present invention, Fig. 2 is a front view of the reversing device, Fig. 3 is a side view thereof, and Fig. 4 is a third drawing for changing the action. It is a similar side view.
Claims (1)
ケージ装置等の後工程装置との間の搬送手段の上、下流
位置に夫々反転装置？設け、こｔら反転装置によってリ
ードフレーム構体等の被組立物ケ上下方向に姿勢？反転
できるようにしたことゲ峙徴とする半導体装置の製造装
置。 ２ 反転装置は被組立物を導入支持てる円筒部と、この
円筒台Ｖを１８０度軸転させるモータとを備えてなる特
許請求の範囲第１項記載の半導体装置の製造装置。 ３ 搬送手段はマガジンを搬送でき、このマガジンへ被
組立物を内挿する部位とイガジンから被組立物を取り出
す部位に夫々反転装置を設けてなる特許請求の範囲第１
項又は第２項記載の半導体装置の製造装置。[Scope of Claims] (1) Reversing devices located above and downstream of the conveying means between the front-process equipment such as wire bonding equipment and the post-process equipment such as packaging equipment, respectively? The reversing device is used to change the posture of the lead frame structure and other objects to be assembled in the vertical direction. Semiconductor device manufacturing equipment that features the ability to be reversed. 2. The semiconductor device manufacturing apparatus according to claim 1, wherein the reversing device includes a cylindrical portion for introducing and supporting the object to be assembled, and a motor for rotating the cylindrical table V by 180 degrees. 3. The conveying means is capable of conveying a magazine, and is provided with a reversing device at a portion where the object to be assembled is inserted into the magazine and a portion where the object to be assembled is taken out from the magazine, respectively.
An apparatus for manufacturing a semiconductor device according to item 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58065450A JPS59193032A (en) | 1983-04-15 | 1983-04-15 | Manufacturing device for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58065450A JPS59193032A (en) | 1983-04-15 | 1983-04-15 | Manufacturing device for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59193032A true JPS59193032A (en) | 1984-11-01 |
Family
ID=13287486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58065450A Pending JPS59193032A (en) | 1983-04-15 | 1983-04-15 | Manufacturing device for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59193032A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10756771B2 (en) | 2018-01-05 | 2020-08-25 | Omron Corporation | Wireless switch |
-
1983
- 1983-04-15 JP JP58065450A patent/JPS59193032A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10756771B2 (en) | 2018-01-05 | 2020-08-25 | Omron Corporation | Wireless switch |
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