JPS59177972U - Printed wiring board equipment - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図および第２図は従来例の印刷配線基板装置の断面
図、第３図Ａ、　Ｂ、　Ｃ，Ｄは本考案の一実施例にお
ける印刷配線基板装置に用いる印刷配線基板の平面図、
断面図および下面図、第４図Ａ、−Ｂは同装置の断面図
である。 １・・・・・・硬質基板、２・・・・・・フレキシブル
印刷配線板、３・・・・・・孔、５・・・・・・端子、
６・・・・・・半田、７・・・・・・銅箔、９・・・・
・・ベースフィルム、１２・・・・・・・孔、１３・・
・・・・孔。1 and 2 are cross-sectional views of a conventional printed wiring board device, and FIGS. 3A, B, C, and D are plan views of a printed wiring board used in a printed wiring board device according to an embodiment of the present invention,
A sectional view and a bottom view, and FIGS. 4A and 4-B are sectional views of the same device. 1... Hard substrate, 2... Flexible printed wiring board, 3... Hole, 5... Terminal,
6...Solder, 7...Copper foil, 9...
...Base film, 12...hole, 13...
...hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 硬質基板の一面にフレキシブル印刷配線板を貼着した印
刷配線基板を備え、上記硬質基板には端子の径より大き
い径の第１の孔を設け、上記フレキシブル印刷配線板に
は上記第１の孔のほぼ中央部分に上記端子の径より小さ
い径の第２の孔を設け、上記端子を上記硬質基板の側か
ら上記第１の孔を介して上記第２の孔に圧入した状態で
上記端子と上記フレキシブル印刷配線板の銅箔とを半田
付けしてなる印刷配線基板装置。A printed wiring board is provided with a flexible printed wiring board attached to one surface of the hard board, the hard board is provided with a first hole having a diameter larger than the diameter of the terminal, and the flexible printed wiring board is provided with a first hole having a diameter larger than the diameter of the terminal. A second hole having a diameter smaller than the diameter of the terminal is provided approximately at the center of the terminal, and the terminal is pressed into the second hole from the hard substrate side through the first hole. A printed wiring board device formed by soldering the above-mentioned flexible printed wiring board to the copper foil.