JPS5915936A - Manufacture of substrate having through hole - Google Patents

Manufacture of substrate having through hole

Info

Publication number
JPS5915936A
JPS5915936A JP12531382A JP12531382A JPS5915936A JP S5915936 A JPS5915936 A JP S5915936A JP 12531382 A JP12531382 A JP 12531382A JP 12531382 A JP12531382 A JP 12531382A JP S5915936 A JPS5915936 A JP S5915936A
Authority
JP
Japan
Prior art keywords
substrate
photosensitive resin
liquid
flexible carrier
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12531382A
Other languages
Japanese (ja)
Other versions
JPH0423837B2 (en
Inventor
Shinichi Kawatsuji
川辻　真一
Takeshi Yamagata
武 山形
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Asahi Kasei Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd, Asahi Kasei Kogyo KK filed Critical Asahi Chemical Industry Co Ltd
Priority to JP12531382A priority Critical patent/JPS5915936A/en
Priority to EP82201679A priority patent/EP0099426B1/en
Priority to DE8282201679T priority patent/DE3276342D1/en
Publication of JPS5915936A publication Critical patent/JPS5915936A/en
Publication of JPH0423837B2 publication Critical patent/JPH0423837B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Silver Salt Photography Or Processing Solution Therefor (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

PURPOSE:To obtain a substrate having through holes and showing high reliability and resolving power by laminating a liq. photosensitive resin on both sides of a substrate having electrically conductive metallic layers, curing the resin by exposure, forming polymer images by washing-out, removing the unmasked parts of the metallic layers, and removing the images. CONSTITUTION:Transparent flexible carriers 3 are coated with a liq. photosensitive resin 2 in a uniform thickness, and the resin coated surfaces are placed as opposed to a substrate 1 having electrically conductive metallic layers 1b. The carriers 3 are pressed against the substrate 1 under uniform pressure to laminate the resin 2 in a uniform thickness. Mask films 11 are brought into contact with the surfaces of the carriers 3, and the resin 2 is exposed to active light to form polymer images. The carriers 3 are stripped from the substrate 1, the unpolymerized resin 2 is washed out, and the unmasked parts of the layers 1b are removed by etching using the polymer images 2a present on both sides of the substrate 1 at holes 1a for through holes and the necessary parts. The images 12a are then removed. Thus, a substrate having through holes is obtd.

Description

【発明の詳細な説明】 本発明は両側表面とスルーホール用孔の内周面とに導電
１生金属層が形成されている基板の表面に液体型感光性
樹脂を一定厚で効率良く均一に積層した後に、露光硬化
、ウォッシュアウトを行ない、基板上のスルーホール用
孔開口部及びその周囲と基板上の必要な部分とに重合体
画像を形成し、該重合体画像によりマスキングされてい
る部分以外の導電性金属層をエツチングにより除去し、
しかる後に重合体画像を除去して、スル−ホールを有す
る基板を製造することを特徴とするスルーホール基板の
製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for efficiently and uniformly applying a liquid photosensitive resin to a constant thickness on the surface of a substrate in which a conductive raw metal layer is formed on both surfaces and the inner peripheral surface of a through-hole hole. After lamination, exposure curing and washout are performed to form a polymer image on the through-hole opening and its surroundings on the substrate and necessary areas on the substrate, and the areas masked by the polymer image. Remove the conductive metal layer other than the
The present invention relates to a method for manufacturing a through-hole substrate, characterized in that the polymer image is then removed to manufacture a substrate having through-holes.

近年、感光性樹脂は印刷用レリーフに限らず種々の用途
に使用されるようになって来た。In recent years, photosensitive resins have come to be used not only for printing reliefs but also for various other purposes.

その−例を挙げると電子工業分野におけるブリ／、ト配
線基板製造時にレジスト材として使用されるプリント配
線基板製造用の感光性樹脂がある。このプリント配線基
板製造用感光性樹脂は、銅貼り積層板の如き導電性金属
貼り積層板より成る基板上にできるだけ一定厚になるよ
うに塗布又は積層され、その上にマスクフィルムを載置
してそのマスクフィルム側より活性光線を照射し、マス
クフィルムを通過した活性光線によってプリント配線基
板製造用感光性樹脂を部分的に感光硬化させてウォッシ
ュアウト液及びエツチング液に対して不溶化せ１．めで
後、透明画像担体を除去してから感光硬化した部分以外
の感光性樹脂をウオツンユアウト工程で除去し、次いで
感光硬化した部分がそのまま残っており且つウォッシュ
アウト工程で感光性樹脂を除去されて導電性金属が露出
した基板を直接エツチングして露出した導電性金属層を
溶解除去し、しかる後に残っている感光硬化した感光性
樹脂を剥離液で剥離してプリント配線基板とするもので
ある。An example of this is a photosensitive resin for producing printed wiring boards, which is used as a resist material during the production of printed wiring boards in the electronics industry. This photosensitive resin for manufacturing printed wiring boards is coated or laminated on a substrate made of a conductive metal laminated board such as a copper laminated laminated board so that the thickness is as constant as possible, and a mask film is placed on top of it. Actinic rays are irradiated from the mask film side, and the photosensitive resin for manufacturing printed wiring boards is partially photocured by the actinic rays that have passed through the mask film, making it insoluble in washout liquid and etching liquid.1. After the completion, the transparent image carrier is removed, and the photosensitive resin other than the photocured areas is removed in a washout process, and the photosensitive resin is removed in the washout process to make the photosensitive resin conductive. The exposed conductive metal layer is dissolved and removed by direct etching of the substrate, and the remaining photosensitive resin is then peeled off with a stripping solution to form a printed wiring board.

このようにプリント配線基板製造用などに使用される感
光性樹脂としては、既にフィルム状又はシート状に製作
されている一′固体型と、使用直前に基板上に塗布され
る液体型とがある。かかる固体型と液体型との感光性樹
脂を比較すると、固体型の場合にはｔｌぼ均一な厚さに
予め製作されているので作業性においては優れているが
、露光されなかった感光性樹脂はウォッシュアウト工程
ですべてウォッシュアウト液によって除去されて再使用
されないために非常に不経済である欠点があると共に、
基板と感光性樹脂とを接着するために基板と感光性樹脂
とを加熱しなければならないので加熱装置を必要とする
から設備費が高価となり、更に基板と感光性樹脂とを接
着積層した直後において充分な接着強度を得るために接
着直後の状態を所定時間維持する停止時間を必要とする
ので連続的な効率良い作業を実施することができず、そ
の上基板の表面が粗面を成していると基板と感光性樹脂
とが充分密着し難く、また基板の表面にゴミが付着して
いるとそのゴミの周囲で感光性樹脂が浮き上がってしま
うなど種々の次点かあ・りた。There are two types of photosensitive resins used for manufacturing printed wiring boards: one is a solid type, which is already produced in the form of a film or sheet, and the other is a liquid type, which is coated onto the board immediately before use. . Comparing such solid type and liquid type photosensitive resins, it is found that the solid type has excellent workability because it is pre-fabricated to a nearly uniform thickness, but the photosensitive resin that has not been exposed to light has the disadvantage that it is very uneconomical because it is completely removed by the washout liquid in the washout process and is not reused.
In order to bond the substrate and the photosensitive resin, it is necessary to heat the substrate and the photosensitive resin, which requires a heating device, which increases equipment costs. In order to obtain sufficient adhesive strength, it is necessary to stop the process to maintain the state immediately after adhesion for a specified period of time, making it impossible to carry out continuous and efficient work, and in addition, the surface of the substrate is rough. If there is any dirt on the surface of the substrate, it is difficult to make sufficient contact between the substrate and the photosensitive resin, and if there is dust on the surface of the substrate, the photosensitive resin will rise around the dust, resulting in various problems.

一方、液体型の場合には現場で基板上に均一な厚さに塗
布することが困難ではあるが、液体状の感光性樹脂を基
板上に塗布して露光後にウォッシュアウト工程に移送せ
しめる工程で感光性樹脂の粘着力を利用して他の部材に
未露光の感光性樹脂を付着させて回収して再使用できる
ため高価な感光性樹脂をウオツンユアウト工程で除去す
る量が少なくて済み、且つウォッシュアウト液の使用量
も少なくて良いため老化したウオツンユアウト液の処理
も容易であるという非常に大きな長所を備えている反面
、均一厚さに液体型感光性樹脂を塗布するためには熟練
を必要とし、基板が変形していると均一厚さに液体型感
光性樹脂を塗布することができず、更に乾燥時間やキコ
ーアリング時間を必要とすると共にマスクフィル台を液
体型感光性樹脂に直接接触させて露光処理を実施するこ
とができない短所もある。On the other hand, in the case of a liquid type, it is difficult to apply it to a uniform thickness on the substrate on site, but there is a process in which liquid photosensitive resin is applied onto the substrate and transferred to a washout process after exposure. Utilizing the adhesive strength of photosensitive resin, unexposed photosensitive resin can be attached to other parts and then recovered and reused, reducing the amount of expensive photosensitive resin that needs to be removed in the wash-out process. Although it has the great advantage of requiring only a small amount of outflow solution and making it easy to dispose of aged outflow solution, it requires skill to apply liquid photosensitive resin to a uniform thickness. However, if the substrate is deformed, it is not possible to apply liquid photosensitive resin to a uniform thickness, which requires additional drying time and hardening time, and the mask fill table must be brought into direct contact with the liquid photosensitive resin. Another drawback is that exposure processing cannot be performed.

特にスルーホール基板を製造する場合には、スルーホー
ル用孔を有する基板に液体型感光性樹脂を塗布する際に
、スルーホール用孔の内部に捷で液体型感光性樹脂が流
れ込んだり、均一な厚みの液体型感光性樹脂層が得られ
なかったりしてエツチング時のレジスト材としての安定
した膜強度が得られず、不良品の発生が多くなって実用
に供することができなかった。更に近年、高密度プリン
ト基板への移行に伴い、信頼性及び解像力の高いプリン
ト基板製造方法が強く望まれている。In particular, when manufacturing through-hole substrates, when applying liquid photosensitive resin to a substrate with through-hole holes, the liquid photosensitive resin may flow into the through-hole holes or become uniform. Since a liquid type photosensitive resin layer of sufficient thickness could not be obtained, stable film strength as a resist material during etching could not be obtained, and many defective products were produced, making it impossible to put it into practical use. Furthermore, in recent years, with the shift to high-density printed circuit boards, there has been a strong desire for a printed circuit board manufacturing method with high reliability and resolution.

本発明者らは、上記の如き経済上及び作業上の利点を有
している液体型感光性樹脂の欠点を除去しスルーホール
を有する高密度なプリント基板を高信頼性で製造する方
法を開発すべく鋭意研究を行なった結果、活性光線を透
過する透明なフレキシブル担体に液体型感光性樹脂を均
一な厚さに塗布してなる層を、両側表面とスルーホール
用孔の内周面とに導電性金属層を形成した基板表面と液
体型感光性樹脂とが対向する如く積層し、フレキシブル
担体上からマスクフィルムを介して活性光線で露光せし
めて重合体画像を形成せしめ、フレキシブル担体を剥離
し、次いでウォッシュ−γウドを行ない、基板両面上の
スルーホール用孔開１コ部及びその周囲と基板両面上の
必要な部分とに存在している重合体画像をレジスト材と
して導電性金属層をエツチングすることによりスルーホ
ールを有する高密度なプリント基板を高信頼性で製造で
きることを究明し、本発明を完成した。The present inventors have developed a method for manufacturing high-density printed circuit boards with through holes with high reliability by eliminating the drawbacks of liquid photosensitive resin, which has the economical and operational advantages described above. As a result of extensive research, we developed a layer of liquid photosensitive resin coated to a uniform thickness on a transparent flexible carrier that transmits actinic rays, on both surfaces and the inner peripheral surface of the through-hole hole. The surface of the substrate on which the conductive metal layer is formed and the liquid photosensitive resin are laminated so as to face each other, and the flexible carrier is exposed to actinic rays through a mask film to form a polymer image, and the flexible carrier is peeled off. Next, a wash-gamma process is carried out to form a conductive metal layer using the polymer image existing in and around one hole for a through hole on both sides of the substrate and the necessary areas on both sides of the substrate as a resist material. It was discovered that a high-density printed circuit board with through holes can be manufactured with high reliability by etching, and the present invention was completed.

すなわち本発明は、活性光線を透過する透明なフレキシ
ブル担体に液体型感光性樹脂を均一な厚さに塗布し、直
ちにそのフレキシブル担体を移動して液体型感光性樹脂
の塗布面を両側表面とスルーホール用孔の内周面とに導
電性金属層が形成されている基板の表面に対向させた状
態でフレキシブル担体を基板に一定圧で押圧することに
より基板上に液体型感光性樹脂を一定厚で均一に積層し
、次いでそのフレキシブル担体表面にマスクフィルムを
位置せしめ該マスクフィルムを介して液体型感光性樹脂
を活性光線で露光して重合体画像を形成せしめ、しかる
後にフレキシブル担体を基板上から剥離し、次いで基板
上の未重合の液体型感光性樹脂をウォッシュアウト液で
ウォッシュアウトし、基板両面上のスルーホール用孔開
１コ部及びその周囲と基板両面上の必要な部分とに存在
している重合体画像をレジスト材として重合体画像によ
りマスキングされている部分以外の導電性金属層をエツ
チング液でエツチングして除去し、しかる後に基板両面
に存在している重合体画像を除去することによりスルー
ホールを有する基板を製造することを特徴とするスルー
ホール基板の製造方法に関するものである。That is, the present invention applies a liquid photosensitive resin to a uniform thickness on a transparent flexible carrier that transmits actinic rays, and then immediately moves the flexible carrier so that the surface coated with the liquid photosensitive resin passes through both sides of the carrier. By pressing the flexible carrier against the substrate with a constant pressure while facing the surface of the substrate, which has a conductive metal layer formed on the inner peripheral surface of the hole, a liquid photosensitive resin is applied to the substrate to a constant thickness. Then, a mask film is placed on the surface of the flexible carrier, and the liquid photosensitive resin is exposed to actinic rays through the mask film to form a polymer image, and then the flexible carrier is laminated from above the substrate. After peeling off, the unpolymerized liquid photosensitive resin on the substrate is washed out with a washout liquid, and the unpolymerized liquid type photosensitive resin on the substrate is washed out with a washout liquid. Using the polymer image as a resist material, the conductive metal layer other than the portion masked by the polymer image is removed by etching with an etching solution, and then the polymer images present on both sides of the substrate are removed. The present invention relates to a method for manufacturing a through-hole substrate, which is characterized by manufacturing a substrate having through-holes.

以下、図面をもとに本発明にかかるスルーホール基板の
製造方法について更に説明する。　　′第１図はスルー
ホールのない一般の基材上に従来の方法により液体型感
光性樹脂を塗布している状態を示す断面図、第２図は第
１図の方法により液体型感光性樹脂が塗布された基材上
にマスクフィルムを介して活性光線を露光した際の感光
重合硬化した感光性樹脂の状態を示す断面図、第６図は
本発明方法によりスルーホール基板を製造する方法のう
ち基板上に重合体画像によるレジスト材を形成する工程
の一実施例を示す説明図、第４図（イ）・〜（ト）は他
の実施例により両面及びスルーホール用孔の内周面に導
電性金属層が形成されて一へる基板からスルーホール基
板が完成するまでの各工程における基板の変化を示す端
面説明図である。Hereinafter, the method for manufacturing a through-hole substrate according to the present invention will be further explained based on the drawings. 'Figure 1 is a cross-sectional view showing the state in which liquid type photosensitive resin is applied by the conventional method on a general base material without through holes, and Figure 2 is a cross-sectional view showing the state in which liquid type photosensitive resin is applied by the method shown in Figure 1. FIG. 6 is a cross-sectional view showing the state of photopolymerized and cured photosensitive resin when the substrate coated with actinic rays is exposed to actinic rays through a mask film. Among them, an explanatory diagram showing an example of the process of forming a resist material using a polymer image on a substrate, and FIGS. FIG. 3 is an explanatory end view showing changes in the substrate in each step from a substrate on which a conductive metal layer is formed until a through-hole substrate is completed.

図面中、Ａは基材、Ｂは基材Ａ上に塗布された液体型感
光性樹脂、Ｃは基材Ａ上に塗布される液体型感光性樹脂
の塗布厚を制御するドクターなどの塗布厚制御手段、Ｄ
はマスクフィルムである。In the drawing, A is the base material, B is the liquid photosensitive resin coated on the base material A, and C is the coating thickness of a doctor etc. that controls the coating thickness of the liquid photosensitive resin coated on the base material A. control means, D
is a mask film.

従来の液体型感光性樹脂の塗布方法においては、基拐Ａ
にその製作上の問題などによって多少の厚さの変化があ
っても液体型感光性樹脂Ｂは第１図に示す如くその表面
が平面状になるように塗布厚制御手段Ｃによって塗布さ
れるため、基材Ａ上に塗布された液体型感光性樹脂Ｂの
厚さは一定とはならない。このように一定厚に塗布され
ない液体型感光性樹脂ＢをマスクフィルムＤを介して活
性光線によって露光すると、同じ面積だけ露光しても液
体型感光性樹脂Ｂの厚さにバラツキがあると露光のエネ
ルギーが同一であるので第２図に示す如く液体型感光性
樹脂Ｂの厚さが薄いと基材Ａ側が太く感光重合硬化し、
また液体型感光性樹脂Ｂの厚さが厚いと基＄１Ａ側が細
く感光重合硬化してしまう現象が生じて良好な露光を実
施したことにならない現象が生じてしまうのであり、レ
ジスト材として使用するには膜強度が不安定であると共
にマスクフィルムＤに形成されている太さ通りの重合硬
化画像が形成されない欠点があったのである。In the conventional coating method of liquid type photosensitive resin, base material A
Even if there is a slight change in thickness due to manufacturing problems, the liquid photosensitive resin B is coated by the coating thickness control means C so that the surface becomes flat as shown in FIG. , the thickness of the liquid photosensitive resin B applied onto the substrate A is not constant. When liquid photosensitive resin B, which is not coated to a constant thickness, is exposed to actinic rays through mask film D, even if the same area is exposed, if the thickness of liquid photosensitive resin B varies, the exposure will be affected. Since the energy is the same, as shown in Figure 2, if the liquid photosensitive resin B is thin, the substrate A side will be thicker and photopolymerized and cured.
In addition, if the liquid type photosensitive resin B is thick, a phenomenon occurs in which the base $1A side becomes thinner and photopolymerized and hardens, resulting in a phenomenon in which good exposure is not performed. This had the disadvantage that the film strength was unstable and a polymerized and cured image having the same thickness as that formed on the mask film D was not formed.

かかる現象の発生は基材Ａ上に塗布される液体型感光性
樹脂Ｂの塗布厚さを一定に制御できなかったことに起因
しているのであり、これを改良した液体型感光性樹脂の
塗布方法を利用して完成したのが、第３図及び第４図に
よりその一実施例を示した本発明に係るスルーホール基
板の製造方法である。第６図及び第４図中、１はスルー
ホール用孔１ａを有し両側表面及びスルーホール用孔１
ａの内周面に導電性金属層１ｂが形成された基板であり
、２は液体型感光性樹脂、６は可撓性を有し且つ露光硬
化せしめられた液体型感光性樹脂２からの剥離性が良く
しかも活性光線を透過する透明なフレキシブル担体、４
はフレキシブル担体６を平面状になるように保持する剛
体基盤、５は剛体基盤４上に位置せしめられたフレキシ
ブル担体ろ上に供給された液体型感光性樹脂２の塗布厚
を一定に制御するドクターやロールコータ−などの塗布
厚制御手段、６は液体型感光性樹脂２を一定厚に塗布さ
れたフレキシブル担体６を基板１への押圧部へ移送せし
めるためのガイトローラ、７は基板１を移送せしめるた
めのコンベア、８は液体型感光性樹脂２を一定厚に塗布
されたフレキシブル担体６の液体型感光性樹脂２の塗布
面を基板１に対向せしめられた押圧部でフレキシブル担
体６を基板１に一定圧で押圧する抑圧体であり、との押
圧体８としては図示した実施例の如くフレキシブル担体
６の移動方向を小さな曲率半径部を経て変向させる剛体
状のものや、実質的に弾性の表面を有するロール状のも
のや、通常の金属製ロールなどが使用できる。９は液体
型感光性樹脂２が一定厚に塗布されたフレキシブル担体
６を基板１に一定圧で押圧体８により押圧せしめるため
のスプリング、１０は抑圧体８によって一定圧で押圧さ
れて基板１上に一定厚の液体型感光性樹脂２が更にその
上にフレキシブル担体６が積層された積層体のフレキ／
プル担体６上にマスクフィルム１１を位置せしめて基板
１上のスルーホール用孔１ａの開１コ部及びその周囲と
基板１上の必要な部分との液体型感光性樹脂２に活性光
線を照射して液体型感光性樹脂２に重合体画像２ａを形
成する露光装置、１２は露光後の積層体からフレキシブ
ル担体６を剥離させるための剥離ロール、１３は剥離ロ
ール１２番経て巻取ロール１４に至るフレキシブル担体
ろからそのフレキシブル担体６に付着している未重合の
液体型感光性樹脂２を回収する主回収装置、１５はフレ
キ／プル担体６が剥離ロール１２によって剥離され重合
体画像２ａと未重合のわずかな液体型感光性樹脂２とが
残留している状態の基板１の感光性樹脂面に圧接されて
未重合の液体型感光性樹脂２をその表面に付着させる弾
性体ロールやブラシロールなどの樹脂回収ロールとその
樹脂回収ロールが回転する過程でそのロールに付着して
いる未重合の液体型感光性樹脂２を掻き取るドクターと
より成る補助回収装置であり、１６は補助回収装置１５
によっても回収されなかった未重合の液体型感光性樹脂
２をウオツンユアウトするためにウォッシュアウトａを
噴射するノズル１７を備えたウオツンユアウト装置であ
る。The occurrence of this phenomenon is due to the fact that the coating thickness of the liquid photosensitive resin B coated on the substrate A could not be controlled to a constant level, and the coating of the liquid photosensitive resin that improved this problem A method for manufacturing a through-hole board according to the present invention, an embodiment of which is shown in FIGS. 3 and 4, was completed using this method. In FIG. 6 and FIG. 4, 1 has a through-hole hole 1a on both sides and a through-hole hole 1.
A is a substrate on which a conductive metal layer 1b is formed on the inner peripheral surface, 2 is a liquid photosensitive resin, and 6 is a flexible liquid photosensitive resin 2 that has been cured by exposure. Transparent flexible carrier with good properties and transmitting actinic rays, 4
5 is a rigid base that holds the flexible carrier 6 in a planar shape, and 5 is a doctor that controls the coating thickness of the liquid photosensitive resin 2 supplied onto the flexible carrier filter placed on the rigid base 4 to a constant value. 6 is a guide roller for transferring the flexible carrier 6 coated with the liquid photosensitive resin 2 to a constant thickness to a pressing part for the substrate 1; 7 is a guide roller for transferring the substrate 1; A conveyor 8 is used to transfer the flexible carrier 6 onto the substrate 1 using a pressing unit which is configured to make the liquid-type photosensitive resin 2-coated surface of the flexible carrier 6 coated with the liquid-type photosensitive resin 2 to a constant thickness face the substrate 1. This is a pressing body that presses with a constant pressure, and the pressing body 8 may be a rigid body that changes the moving direction of the flexible carrier 6 through a small radius of curvature, as in the illustrated embodiment, or a substantially elastic body. A roll with a surface or a normal metal roll can be used. Reference numeral 9 denotes a spring for causing the flexible carrier 6 coated with the liquid type photosensitive resin 2 to be applied to a constant thickness to be pressed against the substrate 1 with a constant pressure by the pressing member 8; A flexible/laminated body in which a liquid type photosensitive resin 2 of a certain thickness is further laminated on top of a flexible carrier 6.
The mask film 11 is placed on the pull carrier 6, and the liquid photosensitive resin 2 at the opening 1 of the through-hole hole 1a on the substrate 1, its surroundings, and the necessary parts on the substrate 1 is irradiated with actinic rays. 12 is a peeling roll for peeling off the flexible carrier 6 from the exposed laminate; 13 is a peeling roll No. 12 and then a take-up roll 14; A main recovery device 15 collects the unpolymerized liquid photosensitive resin 2 adhering to the flexible carrier 6 from the flexible carrier filter 15, where the flexible/pull carrier 6 is peeled off by a peeling roll 12 to form a polymer image 2a and an unpolymerized photosensitive resin 2. An elastic roll or a brush roll that is pressed against the photosensitive resin surface of the substrate 1 on which a slightly polymerized liquid photosensitive resin 2 remains to adhere the unpolymerized liquid photosensitive resin 2 to the surface. 16 is an auxiliary recovery device consisting of a resin recovery roll and a doctor that scrapes off unpolymerized liquid type photosensitive resin 2 adhering to the roll while the resin recovery roll rotates;
This is a washing-out device equipped with a nozzle 17 that sprays washout a to wash out the unpolymerized liquid photosensitive resin 2 that has not been recovered.

かかる構造の装置を使用してエツチングする際のレジス
ト材となる重合体画像２ａを基板１両面上のスルーホー
ル用孔１ａ開口部及びその周囲と基板１両面上の必要部
分とに形成せしめるには、先ずフレキンプル担体３を剛
体基盤４上、ガイトローラ６、抑圧体８．露光装置１０
．剥離ロール１２を経て巻取ロール１４して供給してお
き、次いで剛体基盤４に対向した位置に液体型感光性樹
脂２を供給すると共にコンベア７上に基板１を供１翁（
７、フレキシブル担体６と基板１とを同速で駆動する。To form a polymer image 2a, which will serve as a resist material during etching using an apparatus having such a structure, at the opening of the through-hole hole 1a on both sides of the substrate 1, its surroundings, and necessary parts on both sides of the substrate 1. First, the flexible carrier 3 is placed on the rigid base 4, the guide roller 6, the suppressor 8, and so on. Exposure device 10
．． The liquid photosensitive resin 2 is supplied through a peeling roll 12 and a take-up roll 14, and then the liquid photosensitive resin 2 is supplied to a position facing the rigid substrate 4, and the substrate 1 is placed on a conveyor 7 (1).
7. Drive the flexible carrier 6 and the substrate 1 at the same speed.

かくしてフレキシブル担体６上に塗布厚制御手段５によ
・つて一定厚に塗布された液体型感光性樹脂２は、ガイ
トローラ６を経て抑圧体８の直下に移動せしめられるが
、液体型感光性樹脂２は通常１０・〜２００，０００ｃ
ｐの範囲内にある高粘１生物質であるのでフレキシブル
担体３上でその厚さが大幅に変更することはないが、中
でも１００〜５０．０００ｃｐの粘性を有するものが本
発明方法の実施に適している。このようにして押圧体８
の直ドに液体型感光性樹脂２が一定厚に塗布されたフレ
キ／プル担体３と基板１とが同時に移動せしめられて来
てフレキシブル担体６の液体型感光性樹脂塗布面を基板
１に対向させた状態でフレキシブル担体６が抑圧体８に
よって基板１に一定圧で押圧部しめられるととにより、
基板１の液体型感光□性淘脂塗布面に多少の凹凸があっ
たり平面状を成していなかったりしても、液体型感光性
樹脂２の厚さは一定になるのである。The liquid photosensitive resin 2 coated onto the flexible carrier 6 to a constant thickness by the coating thickness control means 5 is moved directly below the suppressor 8 via the guide roller 6, but the liquid photosensitive resin 2 Usually 10.~200,000c
Since the material has a high viscosity within the range of p, its thickness will not change significantly on the flexible carrier 3, but among them, those having a viscosity of 100 to 50,000 cp are suitable for carrying out the method of the present invention. Are suitable. In this way, the pressing body 8
The flexible/pull carrier 3 on which liquid photosensitive resin 2 is applied to a constant thickness and the substrate 1 are simultaneously moved so that the surface of the flexible carrier 6 coated with the liquid photosensitive resin faces the substrate 1. In this state, the flexible carrier 6 is pressed against the substrate 1 with a constant pressure by the suppressor 8.
Even if the surface of the substrate 1 coated with the liquid photosensitive resin 2 has some irregularities or is not flat, the thickness of the liquid photosensitive resin 2 remains constant.

以下余白 このようにして、基板１上に一定厚の液体型感光性樹脂
２が積層され更にその上にフレキシブル担体６が積層さ
れた積層体は露光装置１０において基板１の位置に一致
させてフレキシブル担体６上にマスクフィルム１１ヲ位
置せしめ、マスクフィルム１１ヲ介して活性光線を露光
せしめて液体型感光性樹脂２０所定部分を感光重合硬化
せしめて基板１上に重合体画像２ａを形成せしめるので
ある。In this way, the laminate in which the liquid type photosensitive resin 2 of a constant thickness is laminated on the substrate 1 and the flexible carrier 6 is further laminated on top of the substrate 1 is flexibly aligned with the position of the substrate 1 in the exposure apparatus 10. A mask film 11 is placed on the carrier 6, and actinic light is exposed through the mask film 11 to photopolymerize and harden a predetermined portion of the liquid photosensitive resin 20, thereby forming a polymer image 2a on the substrate 1. .

更に、移動せしめられる過程で未重合の液体型感光性樹
脂２の大部分が未だ付層しているフレキシブル担体ろが
感光重合硬化した液体型感光性樹脂２の付層している基
板１から剥離ロール１２によって剥離され、フレキシブ
ル担体ろはＩｎロール１２を経て巻取ロール１４に至る
過程で主回収装置１３により液体型感光性樹脂２を回収
される。Furthermore, in the process of being moved, most of the unpolymerized liquid photosensitive resin 2 is peeled off from the substrate 1 on which the photopolymerized and cured liquid photosensitive resin 2 is still attached. The liquid photosensitive resin 2 is peeled off by the roll 12 and is recovered by the main recovery device 13 during the process of passing through the flexible carrier filter, the In roll 12, and the take-up roll 14.

また剥離ロール１２によってフレキシブル担体６會剥離
された後の基板１上に付層している未取合の液体型感光
性樹脂２は、基材６が更に移動する過程で補助回収装置
１５にエリ回収されるのである。Further, the unresolved liquid photosensitive resin 2 layered on the substrate 1 after the flexible carrier 6 has been peeled off by the peeling roll 12 is collected by the auxiliary recovery device 15 while the substrate 6 is further moved. It will be collected.

かくして補助回収装置１５により大部分の未重合の液体
型感光性樹脂２が回収され、活性光線の露光により感光
重合硬化した重合体画像２ａが付着している基板１はウ
ォッシュアウト装置１６に移動せしめられ、ノズル１７
．ｃり噴射されたウォッシュアウト液により未重合の液
体型感光性樹脂２のウォッシュアウトが行なわれて、後
述するエツチングの際のレジスト材となる重合体画像２
ａのみが基板１表面に形成された基板１が得られるので
ある。なお、上述の実施例では基板１の片面ずつしか重
合体画像２ａを形成できないが、押圧体８、露光装＋ｆ
ＩＯ等＝ｉそれぞれ対向して位置せしめれば、第４図の
（伺に示す如く両側表面及びスルーホール用孔１ａの内
周面に導電性金属層が形成されている基板１の両面に同
時に、第４図の（ロフに示す叩く液体型感光性樹脂２を
一定厚で均一に積ノーせしめ、第４図の（ハＪに示す如
くマスクフィルム１１ヲフレキシブル担体６上に位置せ
しめ活性光線全露光せしめて液体型感光性樹脂２の所望
部分を感光重合硬化せしめて重合体面ｒ象２ａｔ形成せ
しめ、第４図の（ニ）に示す如くフレキシブル担体ろを
剥離し、第４図の（ホ）に示す如く未重合の液体型感光
性樹。脂２をウォッシュアラ）Ｌ４合体画像２ａのみを
存在せしめることができるのである。In this way, most of the unpolymerized liquid photosensitive resin 2 is recovered by the auxiliary recovery device 15, and the substrate 1, on which the polymer image 2a photopolymerized and cured by exposure to actinic rays is attached, is moved to the washout device 16. and nozzle 17
．． The unpolymerized liquid-type photosensitive resin 2 is washed out by the washout liquid sprayed, resulting in a polymer image 2 that becomes a resist material during etching, which will be described later.
A substrate 1 in which only a is formed on the surface of the substrate 1 is obtained. In the above embodiment, the polymer image 2a can be formed on only one side of the substrate 1, but the pressing body 8 and the exposure device +f
If IO, etc.=i are placed facing each other, as shown in FIG. , the liquid type photosensitive resin 2 shown in FIG. A desired portion of the liquid type photosensitive resin 2 is photopolymerized and cured by exposure to light to form a polymer surface r pattern 2at, and the flexible carrier filter is peeled off as shown in (d) of FIG. 4. As shown in FIG. 2, by washing the unpolymerized liquid type photosensitive resin (resin 2), only the L4 combined image 2a can be made to exist.

このようにして第４図の（ホ〕に示す９口く基板１両面
上のスルーホール用孔は開口部及びその周囲と基板１両
面上の必要な部分とにのみ重合体画像２ａが形成された
基板１を酸又はアルカリ等のエツチング液でエツチング
して重合体画像２ａによりマスキングされていない導電
性金属層１ｂ’に除去し、更に＃！＋１離材により重合
体画像２ａを剥離することにより第４図の（ト）に示す
如きスルーホールる基板を得ることができるのである。In this way, the polymer images 2a are formed only in the openings of the nine through-hole holes on both sides of the substrate 1 shown in (E) of FIG. The conductive metal layer 1b' which is not masked by the polymer image 2a is removed by etching the etched substrate 1 with an etching liquid such as acid or alkali, and the polymer image 2a is further peeled off using a #!+1 release material. A substrate with through holes as shown in FIG. 4(g) can be obtained.

上述の如き本発明にかかるスルーホール基板の製造方法
全便用すｎは以Ｆに列挙する檎々の利点が発揮されるの
である。By using the method for manufacturing a through-hole substrate according to the present invention as described above, the advantages listed below are exhibited.

（１）使用する感光性樹脂が液体型感光性樹脂であるた
めに基板の表面が粗面全成していても感光性樹脂が粗面
の凹部寸で充分に行きわたるため感光性樹脂と基材との
密着性が良好であり、その結果解像力の高いスルーホー
ル基板を安定して得ることができる。(1) Since the photosensitive resin used is a liquid type photosensitive resin, even if the surface of the substrate is completely rough, the photosensitive resin is sufficiently distributed in the recesses of the rough surface. It has good adhesion to the material, and as a result, a through-hole substrate with high resolution can be stably obtained.

（２）基板にゴミ等が付着していても、使用する感光性
樹脂が液体型感光性樹脂であるので、フィルム状などの
固体型感光性圏脂の場合のエラに感光性樹脂と基板との
接着が不充分となって感光性樹脂が基板から浮き上がる
現象が発生しないので、断線やブリッジなどの欠陥がな
い信頼性の高いスルーホール基板を得ることができる。(2) Even if there is dust etc. attached to the substrate, the photosensitive resin used is a liquid type photosensitive resin, so the photosensitive resin and the substrate will be separated from each other in the case of a solid type photosensitive resin such as a film. Since the phenomenon in which the photosensitive resin is lifted from the substrate due to insufficient adhesion does not occur, a highly reliable through-hole substrate without defects such as disconnections or bridges can be obtained.

（３）Ｉｉ２用する感光性樹脂が液体型感光性樹脂であ
るために感光性１４脂をその１１基板上に積層せしめる
ことができるから、フィルム状などの固体型感光性樹脂
の如く基板と感光性ー力旨と金接着するために基板と感
光性樹脂と全加熱する必要がないと共に感光性樹脂全基
板に積層後に感光性樹脂と基板との充分な接層強度？得
るために接着直後の状態全所定時間維持する停止時間全
必要としないのであり、その結果感光性樹脂を基板に積
層後に連続して直ちに重合体画像を形成する露光を行な
うことができるため、作業効率が優れている。(3) Since the photosensitive resin used for Ii2 is a liquid type photosensitive resin, the photosensitive 14 resin can be laminated on the 11 substrate, so the substrate and the photosensitive resin can be laminated like a solid type photosensitive resin such as a film. In addition, there is no need to fully heat the substrate and photosensitive resin to bond the gold, and there is sufficient bonding strength between the photosensitive resin and the substrate after laminating the photosensitive resin on the entire substrate. It is not necessary to maintain the state immediately after adhesion for a predetermined period of time in order to obtain a photosensitive resin, and as a result, exposure to form a polymer image can be carried out immediately after laminating the photosensitive resin on the substrate. Excellent efficiency.

（４）　　使用する感光性樹脂が液体型感光性樹脂であ
るために、重合体画像を形成する感光性樹脂以外の未重
合の感光性１１Ｍ脂の回収及び再使用が可能であり、更
に基板の大きさに合わせて必要な部分に選択して感光性
樹脂を配置積層することができるから、経済的に安価に
プリント配線基板に４ることができる。(4) Since the photosensitive resin used is a liquid type photosensitive resin, it is possible to recover and reuse unpolymerized photosensitive 11M resin other than the photosensitive resin that forms the polymer image, and also Since the photosensitive resin can be selectively arranged and laminated in the necessary areas according to the size, it can be economically and inexpensively installed on the printed wiring board.

（５）　　液体型感光性１脂全フレキシブル担体に均一
な厚さに塗布したものを基板表面に積層する方法を採用
しているために、基板に設けられているスルーホール用
孔の内部に液体型感光性１４脂が流れ込むことがなく、
液体型感光性樹脂を一定厚で均一に積層できると共に、
スルーホール用孔の内部で液体型感光性１１１脂が感光
重合硬化することがなく、重合体画像の剥離時にスルー
ホール内に重合体画像が残存することがない。(5) Since a method is adopted in which a liquid-type photosensitive 1-fat fully flexible carrier is coated to a uniform thickness and laminated on the substrate surface, the liquid does not enter the through holes provided in the substrate. The mold photosensitive 14 resin does not flow in,
In addition to being able to layer liquid photosensitive resin uniformly with a constant thickness,
The liquid type photosensitive 111 resin is not photopolymerized and hardened inside the through hole, and the polymer image does not remain inside the through hole when the polymer image is peeled off.

（６）基板上に積層さ扛た液体型感″ｊｔ、性樹脂の上
面がフレキシブル担体で覆われているのでマスクフィル
ムをその上に直接載置できるため作業性が良い。(6) Since the upper surface of the liquid resin laminated on the substrate is covered with a flexible carrier, the mask film can be placed directly on it, resulting in good workability.

以上、詳述した如く本発明に係るスルーホール基板の製
造方法ｆ′ｉ種々の利点を有しているものでちり工業的
価値の非常に高い方法である。As described above in detail, the method f'i for manufacturing a through-hole board according to the present invention has various advantages and is a method of very high industrial value.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はスルーホールのない一般の基材上に従来の方法
により液体型感光性樹脂全塗布している状態を示す断面
図、第２図は第１図の方法にＬり液体型感光性樹脂が塗
布された基材上にマスクフィルムを介して活性光線を露
光した際の感光重合硬化した感光性樹脂の状態を示す断
面図、第６図は本発明方法によりスルーホール基板を製
造する方法のうち基板上に重合体画像によるレジスト材
を形成する工程の一実施例を示す説明図、第４図の（イ
ノ〜（ト］は他の実施例にエリ両面及びスル−ホール用
孔の内周面に導電性金属層が形成されている基板からス
ルーホール基板が完成するまでの各工程における基板の
変化を示す端面説明図でおる。 Ａ・・基材 Ｂ・・液体型感光性樹脂 Ｃ・・塗布厚制御手段 Ｄψ−マスクフィルム ト・基板 １ａ・・スルーホール用孔 １ｂ・・導電性金属層 ２・・液体型感光性樹脂 ２ａ・・重合体画像 ろ、・フレキシブル担体 ４・・剛体基盤 ５・・塗布厚制御手段 ６・　・ガイドローラ ７・・コンベア ８・・抑圧体 ？・・スプリング １０・・露光装置 １１−・マスクフィルム １２・・剥離ロール １６・・主回収装置 １４・・巻取ロール １５・・補助回収装置 １６・・ウォッシュアウト装置３ １７・・ノズルFigure 1 is a cross-sectional view showing the state in which liquid type photosensitive resin is completely coated by the conventional method on a general base material without through holes. A cross-sectional view showing the state of the photosensitive resin cured by photopolymerization when the base material coated with the resin is exposed to actinic rays through a mask film, and FIG. 6 shows a method for manufacturing a through-hole substrate by the method of the present invention. This is an explanatory diagram showing an example of the process of forming a resist material using a polymer image on a substrate. This is an explanatory end view showing the changes in the substrate in each process from a substrate with a conductive metal layer formed on the circumferential surface until a through-hole substrate is completed. A. Base material B. Liquid type photosensitive resin C.・・Coating thickness control means Dψ-mask film・Substrate 1a・・Through hole 1b・・Conductive metal layer 2・・Liquid type photosensitive resin 2a・・Polymer image filter・・Flexible carrier 4・・Rigid body Base 5... Coating thickness control means 6... Guide roller 7... Conveyor 8... Suppression body?... Spring 10... Exposure device 11-- Mask film 12... Peeling roll 16... Main collection device 14... Take-up roll 15...Auxiliary recovery device 16...Washout device 3 17...Nozzle

Claims (1)

【特許請求の範囲】[Claims] １　活性光線を透過する透明なフレキシブル担体に液体
型感光性樹脂を均一な厚さに塗布し、直ちにそのフレキ
シブル担体を移動して液体型感光性樹脂の塗布面を両側
表面とスル−ホール用孔の内周面とに導電性金属層が形
成されている基板の表面に対向させた状態でフレキシブ
ル担体を基板に一定圧で押圧することにより基板上に液
体型感光性樹脂を一定厚で均一に積層し、次いでそのフ
レキシブル担体表面にマスクフィルムを位置せしめ該マ
スクフィルムを介して液体型感光性樹脂を活性光線で露
光して重合体画像を形成せしめ、しかる後にフレキシブ
ル担体を基板上から剥離し、次いで基板上の未重合の液
体型感光性樹脂をウォッシュアウト液でウォッシュアウ
トし、基板両面上のスル−ホール用孔開口面とその周囲
と基板両面上の必要な部分とに存在している重合体画像
をレジスト材として重合体画像によりマスキングされて
いる部分以外の導電性金属層をエツチング液でエツチン
グして除去し、しかる後に基板両面に存在している重合
体画像を除去するととによりスルーホールを有する基板
を製造することを特徴とするスルーホール基板の製造方
法。1. Apply a liquid photosensitive resin to a uniform thickness on a transparent flexible carrier that transmits actinic rays, and immediately move the flexible carrier so that the surface coated with the liquid photosensitive resin is aligned with both surfaces and the holes for through-holes. By pressing the flexible carrier against the substrate with a constant pressure while facing the surface of the substrate, which has a conductive metal layer formed on the inner peripheral surface of the substrate, the liquid photosensitive resin is uniformly applied to the substrate with a constant thickness. laminating, then positioning a mask film on the surface of the flexible carrier, exposing the liquid photosensitive resin to actinic rays through the mask film to form a polymer image, and then peeling off the flexible carrier from the substrate, Next, the unpolymerized liquid-type photosensitive resin on the substrate is washed out with a washout liquid to remove the polymer existing on the opening surface of the through-hole on both sides of the substrate, its surroundings, and the necessary parts on both sides of the substrate. Using the combined image as a resist material, the conductive metal layer other than the portion masked by the polymer image is removed by etching with an etching solution, and then the polymer images present on both sides of the substrate are removed, thereby creating a through hole. 1. A method for manufacturing a through-hole board, the method comprising manufacturing a board having the following.
JP12531382A 1982-07-19 1982-07-19 Manufacture of substrate having through hole Granted JPS5915936A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP12531382A JPS5915936A (en) 1982-07-19 1982-07-19 Manufacture of substrate having through hole
EP82201679A EP0099426B1 (en) 1982-07-19 1982-12-30 A process for coating a liquid photopolymerizable composition and a process for producing a printed circuit board thereby
DE8282201679T DE3276342D1 (en) 1982-07-19 1982-12-30 A process for coating a liquid photopolymerizable composition and a process for producing a printed circuit board thereby

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12531382A JPS5915936A (en) 1982-07-19 1982-07-19 Manufacture of substrate having through hole

Publications (2)

Publication Number Publication Date
JPS5915936A true JPS5915936A (en) 1984-01-27
JPH0423837B2 JPH0423837B2 (en) 1992-04-23

Family

ID=14907009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12531382A Granted JPS5915936A (en) 1982-07-19 1982-07-19 Manufacture of substrate having through hole

Country Status (1)

Country Link
JP (1) JPS5915936A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279274A (en) * 1975-12-26 1977-07-04 Fujitsu Ltd Method of producing printed circuit substrate
JPS5615095A (en) * 1979-07-18 1981-02-13 Nippon Electric Co Method of manufacturing printed circuit board
JPS56155473A (en) * 1980-05-02 1981-12-01 Fujitsu Ltd Detection for signal light

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279274A (en) * 1975-12-26 1977-07-04 Fujitsu Ltd Method of producing printed circuit substrate
JPS5615095A (en) * 1979-07-18 1981-02-13 Nippon Electric Co Method of manufacturing printed circuit board
JPS56155473A (en) * 1980-05-02 1981-12-01 Fujitsu Ltd Detection for signal light

Also Published As

Publication number Publication date
JPH0423837B2 (en) 1992-04-23

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