JPS59155743U - Mounting structure of molded transistor - Google Patents
Mounting structure of molded transistorInfo
- Publication number
- JPS59155743U JPS59155743U JP4825183U JP4825183U JPS59155743U JP S59155743 U JPS59155743 U JP S59155743U JP 4825183 U JP4825183 U JP 4825183U JP 4825183 U JP4825183 U JP 4825183U JP S59155743 U JPS59155743 U JP S59155743U
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- mounting structure
- molded
- heat sink
- protrusions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のモールド型トランジスタの取り付は構造
を示す図、第２図は本考案のモールド型トランジスタの
取り付は構造を示す図である。
１・・・放熱板、２・・・絶縁板、３・・・モールド型
トランジスタ、６′・・・取り付は部品（ビス）、？、
７． “８．８・・・取り付は孔、１２・・・取り付
は金具、１４・・・他方の端部、１６・・・一方の端部
、１７・・・圧着部、１９・・・孔、２０．２０・・・
突起部。FIG. 1 is a diagram showing the mounting structure of a conventional molded transistor, and FIG. 2 is a diagram showing the mounting structure of the molded transistor of the present invention. 1... Heat sink, 2... Insulating plate, 3... Molded transistor, 6'... Mounting parts (screws)? ,
7. "8.8... Mounting is through hole, 12... Mounting is with metal fittings, 14... Other end, 16... One end, 17... crimping part, 19... Hole, 20.20...
protrusion.
Claims (1)
スタと、前記複数の取り付は孔に挿入され前記トラン
ジスタを位置決めする複数の突起部を備えた放熱板と、
前記トランジスタと前記放熱板部に挿着され前記突起部
が挿通される複数の取り付は孔を備えた絶縁板と、一方
の端部が前記放熱板に設けられた孔に係合し他方の端部
が取り付は部品によって前記放熱板に固定され前記端部
間の圧着部で前記トランジスタを圧着固定する帯状の取
り付は金具とより成ることを特徴とするモールド型トラ
ンジスタの取り付は構造。Multiple mounting options include molded transistors with holes.
a heat dissipation plate having a plurality of protrusions inserted into the holes and positioning the transistor;
The plurality of attachments that are inserted into the transistor and the heat sink part and through which the protrusions are inserted include an insulating plate having a hole, one end of which is engaged with a hole provided in the heat sink, and the other end of the insulating plate that is inserted into the transistor and the heat sink part and through which the projection part is inserted. The mounting structure of a molded transistor is characterized in that the end portions are fixed to the heat dissipation plate by parts, and the strip-shaped mounting for crimping and fixing the transistor at the crimping portion between the end portions is comprised of metal fittings. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4825183U JPS59155743U (en) | 1983-03-31 | 1983-03-31 | Mounting structure of molded transistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4825183U JPS59155743U (en) | 1983-03-31 | 1983-03-31 | Mounting structure of molded transistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59155743U true JPS59155743U (en) | 1984-10-19 |
Family
ID=30178790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4825183U Pending JPS59155743U (en) | 1983-03-31 | 1983-03-31 | Mounting structure of molded transistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59155743U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011187563A (en) * | 2010-03-05 | 2011-09-22 | Keihin Corp | Semiconductor device |
| JP2014067902A (en) * | 2012-09-26 | 2014-04-17 | Toyota Industries Corp | Semiconductor device |
-
1983
- 1983-03-31 JP JP4825183U patent/JPS59155743U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011187563A (en) * | 2010-03-05 | 2011-09-22 | Keihin Corp | Semiconductor device |
| JP2014067902A (en) * | 2012-09-26 | 2014-04-17 | Toyota Industries Corp | Semiconductor device |
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