JPS59155158A - Cooling structure of semiconductor device - Google Patents
Cooling structure of semiconductor deviceInfo
- Publication number
- JPS59155158A JPS59155158A JP58030006A JP3000683A JPS59155158A JP S59155158 A JPS59155158 A JP S59155158A JP 58030006 A JP58030006 A JP 58030006A JP 3000683 A JP3000683 A JP 3000683A JP S59155158 A JPS59155158 A JP S59155158A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- printed board
- semiconductor device
- heat
- devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
＋ａ） 発明の技術分野
本発明はプリント板に搭載した半導体装置の冷却構造に
係り、特に該プリント板に平行に配設した放熱板を共通
に使用して複数の半導体集積回路装置を冷却する冷却手
段の構造に関する。[Detailed Description of the Invention] +a) Technical Field of the Invention The present invention relates to a cooling structure for a semiconductor device mounted on a printed board, and in particular, a cooling structure for a semiconductor device mounted on a printed board, and in particular, a heat sink disposed parallel to the printed board is commonly used to cool a plurality of semiconductor devices. The present invention relates to a structure of a cooling means for cooling an integrated circuit device.
（ｂｌ 技術の背景
連年、電子機器の処理能力が増大するのに伴い当該プリ
ント板回路の発熱密度は上昇の一途を辿っている。特に
多数の半導体装置を使用する情報機器において顕著であ
る。プリント板上の発熱密度は１９７０年初頭は０．Ｉ
Ｍｃ＋ｌＩ以下であったが、 １９８０年初頭の現在で
はＩ Ｍｃｆｌｌを越えるものと推定される。前記の
半導体装置の素子１例えばトランジスタに例を採れば、
其の接合温度が上がると故障率が高（なり、また動作中
に接合温度がある幅以上に変動すると該トランジスタの
動作点が変化して出力レベルの変動が生じるので、当該
電子回路の誤動作を招く恐れがある等、電子機器の安定
動作を確保する観点からも、半導体装置の冷却の問題は
緊急の問題となっている。Background of the Technology Over the years, as the processing capacity of electronic devices has increased, the heat generation density of printed circuit boards has been increasing. This is particularly noticeable in information devices that use a large number of semiconductor devices. The heat generation density on printed boards was 0.I in the early 1970s.
It was less than Mc+lI, but as of the beginning of 1980, it is estimated to exceed IMcfl. Taking the element 1 of the semiconductor device described above, for example, a transistor, as an example,
If the junction temperature rises, the failure rate becomes high (and if the junction temperature fluctuates over a certain range during operation, the operating point of the transistor changes and the output level fluctuates, so it is important to prevent malfunction of the electronic circuit. The problem of cooling semiconductor devices has become an urgent issue from the viewpoint of ensuring stable operation of electronic devices.
（Ｃ） 従来技術と間１点
前述した半導体装置の冷却問題に関し、中程度の放熱だ
ついては、自然あるいは強制空冷方式が主流であゑが′
、当該半導体装置が発生する熱を効率よく取り出して大
面積の冷却面で空気流に伝達する手段として所謂ヒート
シンクが広く使用されていることは周知の通りである。(C) One point between conventional technology Regarding the problem of cooling semiconductor devices mentioned above, for moderate heat dissipation, natural or forced air cooling methods are mainstream.
It is well known that a so-called heat sink is widely used as a means for efficiently extracting heat generated by the semiconductor device and transmitting it to an air flow using a large cooling surface.
第１図はその゛典型的な例を示す断面図である。半導
体装置１の素子１ａで発生した熱はパッケージ２に密着
して設けられた銅を材料とする導熱板３を経てヒートシ
ンク４の基部４ａに伝わり、冷却翼４ｂに伝導されてそ
の表面から周辺の空気流に放熱されるのが一般である。FIG. 1 is a sectional view showing a typical example. The heat generated in the element 1a of the semiconductor device 1 is transmitted to the base 4a of the heat sink 4 via the heat conductive plate 3 made of copper provided in close contact with the package 2, and is conducted to the cooling blade 4b from its surface to the surrounding area. Generally, heat is dissipated through airflow.
前記の半導体装置１は電気的には端子５を通じて外部に
接続されており、該端子５はプリント板６のスルーホー
ル７を通ってプリント板６の裏面に達し、そこで搭載さ
れたた他の電子部品とともにプリント板に半田付けされ
る。勿論前記端子５はヒートシンク基部４ａを貫通孔４
ｃを介して通過している。The semiconductor device 1 is electrically connected to the outside through a terminal 5, and the terminal 5 passes through a through hole 7 of a printed board 6 and reaches the back surface of the printed board 6, where it is connected to other electronic devices mounted thereon. It is soldered to the printed board along with the parts. Of course, the terminal 5 connects the heat sink base 4a to the through hole 4.
It passes through c.
このようなヒートシンクを多数１枚のプリント板上に搭
載するのは、プリント板上のスペースを多く占有し高密
度実装の観点からも得策でなく。Mounting a large number of such heat sinks on a single printed board occupies a large amount of space on the printed board, and is not a good idea from the standpoint of high-density mounting.
特に強制空気冷却をする場合には２通風路をわざわざ設
けることが必要になったり、自然空気冷却の場合でも効
率的な空気の自然対流を得るためには種々の設計上の制
約を受ける。In particular, in the case of forced air cooling, it is necessary to take the trouble to provide two ventilation channels, and even in the case of natural air cooling, there are various design restrictions in order to obtain efficient natural convection of air.
さらに製作上の観点からも・９部品点数や組立工数が増
加するので原価の昂騰を招いて好もしいことではない。Furthermore, from a manufacturing point of view, the number of parts and assembly man-hours increase, which is not a good thing as it causes the cost to skyrocket.
以上に述べたよ・うな問題点を少しでも軽減出来るよう
なプリント板搭載の半導体装置の冷却手段の出現が待望
されていた。The advent of a cooling means for semiconductor devices mounted on printed boards that can alleviate the problems described above has been long awaited.
（ｄｌ 発明の目的
本発明は前述の点に鑑みなされたもので、従来個別的に
ヒートシンク等の手段により冷却されていたプリント板
搭載の半導体集積回路装置の空気冷却を複数個をまとめ
て効率的に行うと共に、より冷却システムが簡単で且つ
プリント板の表面占有面積の小さい冷却構造を提供しよ
うとするものである。(dl Purpose of the Invention The present invention has been devised in view of the above-mentioned points. It is an object of the present invention to efficiently cool multiple semiconductor integrated circuit devices mounted on printed boards, which had conventionally been cooled individually using means such as heat sinks. In addition, the present invention aims to provide a cooling structure that has a simpler cooling system and occupies a smaller surface area of the printed board.
ｔｅ＋ 発明の構成
上記の発明の目的は、プリント板に平行に配設された放
熱板と、特に冷却を４・要とする所定の複数の半導体装
置と前記放熱板とを連結して前記半導体装置が発生する
熱を前記放熱板に伝導する複数の導熱部より構成された
ことを特徴とする半導体装置の冷却構造を装備すること
により容易に達成される。te+ Structure of the Invention It is an object of the above invention to connect a heat sink disposed parallel to a printed board, and a plurality of predetermined semiconductor devices particularly requiring cooling, to connect the heat sink to the semiconductor device. This can be easily achieved by equipping a semiconductor device cooling structure characterized by comprising a plurality of heat conductive parts that conduct the heat generated by the heat dissipation plate to the heat sink.
（ｆ） 発明の実施例
以下本発明の実施例につき図面を参照して説明する。第
２図は本発明に基づく半導体装置の冷却構造の一実施例
を示す半断面図を有する斜視図である。以下半導体装置
とは個別半導体装置と半導体集積回路装置とを合わせて
指すものとする。(f) Embodiments of the invention Examples of the invention will be described below with reference to the drawings. FIG. 2 is a perspective view with a half sectional view showing an embodiment of a cooling structure for a semiconductor device according to the present invention. Hereinafter, the term "semiconductor device" refers to both individual semiconductor devices and semiconductor integrated circuit devices.
半導体装置ｌやコネクタ等々の各種の電子部品を搭載し
たプリント板６に平行した形で、プリント板６上の冷却
を要するパワートランジスタ等の高電力の半導体装置ｌ
を冷却する冷却板８が設けられている。該冷却板８は熱
伝導率が高くて軽いアルミニウムを材料としており、必
要に応じその表面に複数の冷却翼８ａを有している。冷
却板８と前記の半導体装置１の導熱板３とは導熱部９で
熱抵抗が出来るだけ小さくなるようにして連結されてい
る。導熱部９もアルミニウムを材料とするのが熱抵抗を
下げる点から有利である。High-power semiconductor devices such as power transistors that require cooling are mounted on the printed board 6 in parallel with the printed board 6 on which various electronic components such as semiconductor devices and connectors are mounted.
A cooling plate 8 is provided for cooling. The cooling plate 8 is made of aluminum, which has high thermal conductivity and is lightweight, and has a plurality of cooling blades 8a on its surface as required. The cooling plate 8 and the heat conductive plate 3 of the semiconductor device 1 are connected by a heat conductive portion 9 so that the thermal resistance is as small as possible. It is advantageous for the heat conducting portion 9 to be made of aluminum as well, since it lowers the thermal resistance.
第３図は第２図のＡ部の半導体装置１と冷却板８との連
結の模様を示す拡大断面図である。半導体装置１の導熱
板３の導熱面３ａと導熱部９との接続はこねじｌＯで締
め付けて行われているが、その接触面の空気の間隙の介
在を防止するため、導熱面３ａにシリコングリースある
いは導電性（即ち導熱性）コンパウンドを少量塗布する
と、該接触面の熱抵抗を減少させるのに効果がある。同
様に導熱部９と冷却板８とをこねじ１１で接続する。FIG. 3 is an enlarged sectional view showing the pattern of connection between the semiconductor device 1 and the cooling plate 8 in section A of FIG. 2. FIG. The connection between the heat conductive surface 3a of the heat conductive plate 3 of the semiconductor device 1 and the heat conductive portion 9 is made by tightening screws lO, but in order to prevent air gaps between the contact surfaces, silicon is applied to the heat conductive surface 3a. Applying a small amount of grease or a conductive (or thermally conductive) compound is effective in reducing the thermal resistance of the contact surface. Similarly, the heat conducting portion 9 and the cooling plate 8 are connected with screws 11.
実際のプリント板実装作業においては、前記半導体装置
１等を他の電子部品と共に、プリント板のスルーホール
７に挿入して半田付りディップ作業をする際に９本実施
例のように導熱部９に接続する半導体装置ｌに対しては
１図示してないスペーサ治具を用いて、導熱板３の導熱
面３ａとプリント板表面との所定の間隔Ｈを正確に出し
ておくことが肝要である。In actual printed board mounting work, when the semiconductor device 1 and other electronic components are inserted into the through holes 7 of the printed board and soldering dip work is performed, the heat conducting portion 9 is For the semiconductor device 1 to be connected to 1, it is important to use a spacer jig (not shown) to accurately set a predetermined distance H between the heat conductive surface 3a of the heat conductive plate 3 and the surface of the printed circuit board. .
本実施例の場合は冷却板８はプリント板６０部品実装面
の裏面に配置したが、搭載部品の高さが比較的に低くて
揃っている場合には、第４図の側面図に示すように、冷
却板８を部品搭載面に配置することが出来る。この場合
には実装作業において、予め冷却板８に装着すべき半導
体装置１を総てこねじ１１で導熱部９を介しないで直接
に取りつけておいてから、他の電子部品とともにプリン
ト板６に挿入した後、半田付けでプリント板６に実装固
定することが可能であるので、前実施例に述べた寸法Ｈ
を予め正確に出しておくという必要がなくなり、実装作
業が幾分容易になる。In the case of this embodiment, the cooling plate 8 is placed on the back side of the component mounting surface of the printed board 60, but if the heights of the mounted components are relatively low and are aligned, the cooling plate 8 may be placed as shown in the side view of FIG. Furthermore, the cooling plate 8 can be placed on the component mounting surface. In this case, in the mounting work, all the semiconductor devices 1 to be mounted on the cooling plate 8 are attached directly to the cooling plate 8 using the lever screws 11 without intervening the heat conducting part 9, and then inserted into the printed board 6 together with other electronic components. After that, it can be mounted and fixed to the printed board 6 by soldering, so the dimension H described in the previous embodiment can be fixed.
It is no longer necessary to accurately display the information in advance, making the mounting work somewhat easier.
図示のように本実施例の場合には冷却板８とプリント板
６との間に数個のスペーサ１２を介在させて全体の構造
を強化することが出来る。As shown in the figure, in this embodiment, several spacers 12 are interposed between the cooling plate 8 and the printed board 6 to strengthen the overall structure.
第５図は冷却板８の構造の別の実施例を示す斜視図であ
る。導熱部９と共に組み立てたところを示したものであ
るが１図から明らかなように、第２図の冷却板８のよう
に冷却翼８ａを有しない代わりに、より簡単軽量で廉価
なアルミニウム板を３枚使用して冷却面積を補った構造
である。さらに図には示していないが、３枚の冷却板８
の一方向の側面を金属板で覆えば冷却用の通風路を簡単
に形成出来るという利点もある。FIG. 5 is a perspective view showing another embodiment of the structure of the cooling plate 8. As shown in FIG. It is shown assembled together with the heat conduction part 9, but as is clear from Fig. 1, instead of having cooling blades 8a like the cooling plate 8 in Fig. 2, a simpler, lighter and cheaper aluminum plate is used. The structure uses three sheets to compensate for the cooling area. Furthermore, although not shown in the figure, three cooling plates 8
There is also the advantage that a cooling ventilation path can be easily formed by covering one side surface with a metal plate.
以上の説明から明らかなように１本発明によるプリント
板搭載の半導体装置の冷却用に空気を送風する場合には
、冷却板８を専ら冷却すれば足りるので、送風システム
は簡単になり、無用の送風抵抗も排除出来るので、送風
設備費も節約することが出来る。As is clear from the above description, when blowing air to cool the semiconductor device mounted on a printed board according to the present invention, it is sufficient to exclusively cool the cooling plate 8, so the blowing system becomes simple and unnecessary Since ventilation resistance can also be eliminated, the cost of ventilation equipment can also be saved.
（ｇ） 発明の効果
以上の説明から明らかなように１本発明によるプリント
板搭載の半導体装置の冷却構造を採用すれば、プリント
板の表面の部品実装面を冷却用のヒートシンクで無闇に
占有することがなく高密度実装に寄与するとともに、其
の空気冷却システムを簡素化して当該設備費やその運転
費用を削減する上、さらに複数の半導体装置を個々に冷
却するのでなく、まとめて１枚の冷却板で冷却出来るの
で部品点数や組立工数を低減出来るという効果がある。(g) Effects of the Invention As is clear from the above explanation, if the cooling structure for a semiconductor device mounted on a printed board according to the present invention is adopted, the component mounting surface on the surface of the printed board will be occupied by a cooling heat sink. In addition to contributing to high-density packaging without having to cool the air cooling system, it also simplifies the air cooling system and reduces equipment and operating costs. Since it can be cooled with a cooling plate, it has the effect of reducing the number of parts and assembly man-hours.
第１図はプリント板に搭載した半導体装置を冷却する従
来の構造を示す断面図、第２図は本発明に基づく改良さ
れた上記冷却構造の一実施例を示す部分断面図を含む斜
視図、第３図は第２図のＡ部の拡大断面図、第４図は本
発明に基づ（改良された上記冷却構造の別の変形例を示
す側面図、第５図は冷却板の構造のより廉価な変形例を
示す斜視図である。
図において、１は半導体装置、 ｌａは半導体素子。
２はパッケージ、３は導熱板、４はヒートシンク、４ｂ
はヒートシンクの冷却翼、５は端子、６はプリント板。
７はスルーホール、８は冷却板、９は導熱部、 １０．
１１はこねじをそれぞれ示す。
第４図
ｓ ５ 図FIG. 1 is a sectional view showing a conventional structure for cooling a semiconductor device mounted on a printed board, and FIG. 2 is a perspective view including a partial sectional view showing an embodiment of the above-mentioned improved cooling structure based on the present invention. 3 is an enlarged sectional view of part A in FIG. 2, FIG. 4 is a side view showing another modified example of the above-mentioned improved cooling structure based on the present invention, and FIG. 5 is a side view of the structure of the cooling plate. It is a perspective view showing a cheaper modification. In the figure, 1 is a semiconductor device, la is a semiconductor element, 2 is a package, 3 is a heat conductive plate, 4 is a heat sink, 4b
is the cooling blade of the heat sink, 5 is the terminal, and 6 is the printed board. 7 is a through hole, 8 is a cooling plate, 9 is a heat conduction part, 10.
Reference numeral 11 indicates a screw. Figure 4 s 5
Claims (1)
前記プリント板に平行に配設された放熱板と、特に冷却
を必要とする所定の複数の前記半導体装置と前記放熱板
とを連結して前記半導体装置が発生する熱を前記放熱板
に伝導する複数の導熱部より構成されたことを特徴とす
る半導体装置の冷却構造。A cooling structure for a semiconductor device mounted on a printed board,
A heat sink arranged parallel to the printed board and a predetermined plurality of semiconductor devices that particularly require cooling are connected to the heat sink to conduct heat generated by the semiconductor device to the heat sink. A cooling structure for a semiconductor device comprising a plurality of heat conducting parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58030006A JPS59155158A (en) | 1983-02-23 | 1983-02-23 | Cooling structure of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58030006A JPS59155158A (en) | 1983-02-23 | 1983-02-23 | Cooling structure of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59155158A true JPS59155158A (en) | 1984-09-04 |
Family
ID=12291796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58030006A Pending JPS59155158A (en) | 1983-02-23 | 1983-02-23 | Cooling structure of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59155158A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0681422A2 (en) * | 1994-05-05 | 1995-11-08 | Ford Motor Company | A printed wire board assembly |
| CN113194666A (en) * | 2020-01-29 | 2021-07-30 | 三菱电机株式会社 | Semiconductor device with a plurality of semiconductor chips |
| JP2021112002A (en) * | 2020-01-08 | 2021-08-02 | 三菱電機株式会社 | Power conversion device |
-
1983
- 1983-02-23 JP JP58030006A patent/JPS59155158A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0681422A2 (en) * | 1994-05-05 | 1995-11-08 | Ford Motor Company | A printed wire board assembly |
| EP0681422A3 (en) * | 1994-05-05 | 1997-02-26 | Ford Motor Co | A printed wire board assembly. |
| JP2021112002A (en) * | 2020-01-08 | 2021-08-02 | 三菱電機株式会社 | Power conversion device |
| CN113194666A (en) * | 2020-01-29 | 2021-07-30 | 三菱电机株式会社 | Semiconductor device with a plurality of semiconductor chips |
| JP2021118657A (en) * | 2020-01-29 | 2021-08-10 | 三菱電機株式会社 | Semiconductor device |
| US11557528B2 (en) | 2020-01-29 | 2023-01-17 | Mitsubishi Electric Corporation | Semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5920458A (en) | Enhanced cooling of a heat dissipating circuit element | |
| US5513070A (en) | Dissipation of heat through keyboard using a heat pipe | |
| US6922340B2 (en) | Stack up assembly | |
| US20040037044A1 (en) | Heat sink for surface mounted power devices | |
| JP2001119181A (en) | Cooling unit for electronic component and electronic apparatus | |
| US6101094A (en) | Printed circuit board with integrated cooling mechanism | |
| JPS5893264A (en) | Cooler for device | |
| JPH06163758A (en) | Heat-dissipating structure by ic socket using spring made of shape memory alloy | |
| JPH11163476A (en) | Heat-radiation structure of circuit board and power source control device | |
| JPS59155158A (en) | Cooling structure of semiconductor device | |
| US20050199377A1 (en) | Heat dissipation module with heat pipes | |
| US6173883B1 (en) | Method and apparatus for increasing heat transfer that is restricted in thermally isolated pockets of a medium | |
| JPH0322554A (en) | Heat dissipation device for electronic component | |
| EP3996480B1 (en) | Conductive thermal management architecture for electronic devices | |
| JPH0563053U (en) | Hybrid integrated circuit board | |
| JP4153241B2 (en) | Electronic component mounting structure | |
| JPH06334374A (en) | Cooling mechanism for electronic equipment | |
| JPH0322951Y2 (en) | ||
| JP2006514429A (en) | Heat dissipation device for electronic equipment | |
| CN118158968A (en) | Graphene high-heat-conductivity module and electronic equipment using same | |
| JPS6271300A (en) | Heat sink structure for electronic device | |
| JPH06181395A (en) | Heat dissipation printed-wiring board | |
| JPH11289036A (en) | Electronic device | |
| JPH04259246A (en) | Cooling mechanism for integrated circuit | |
| JPH11145656A (en) | Method for heat radiation for circuit board and circuit board |