JPS5914975A - Thermal printer head - Google Patents
Thermal printer headInfo
- Publication number
- JPS5914975A JPS5914975A JP57124403A JP12440382A JPS5914975A JP S5914975 A JPS5914975 A JP S5914975A JP 57124403 A JP57124403 A JP 57124403A JP 12440382 A JP12440382 A JP 12440382A JP S5914975 A JPS5914975 A JP S5914975A
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- ceramic substrate
- common electrode
- printer head
- thermal printer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の技術分野］
本発明は電気抵抗が小さく、かつ放熱性に優れたサーマ
ルプリンターヘッドに関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a thermal printer head that has low electrical resistance and excellent heat dissipation.
［発明の技術的背景とその問題点１
電気信号として送られてくる情報を、感熱記録紙上に文
字、記号または画像として記録するサーマルプリンター
ヘッドの発熱体部は、例えばセラミック基板上に発熱抵
抗体や共通電極をスクリーン印刷により印刷、焼成する
厚膜方式や蒸着やスパッタリングにより発熱抵抗体や共
通電極を形成する薄膜方式により製造されている。[Technical background of the invention and its problems 1 The heating element of a thermal printer head that records information sent as an electric signal as characters, symbols, or images on thermal recording paper is a heating element formed by a heating resistor on a ceramic substrate, for example. They are manufactured using a thick film method in which the heat generating resistor and common electrode are formed by screen printing and baking, and a thin film method in which the heating resistor and common electrode are formed by vapor deposition or sputtering.
しかしながらこれらの方法では共通電極の厚さは、例え
ば厚膜方式で１０〜３０μｍ１薄膜方式で数μｍと薄く
、電流を多く流すことができないという欠点があった。However, in these methods, the thickness of the common electrode is as thin as, for example, 10 to 30 .mu.m in the thick film method and several .mu.m in the thin film method, so that a large amount of current cannot be passed through the common electrode.
また近年、サーマルプリンターヘッドの印字速度の増加
に伴い発熱抵抗体で発生する熱量が大幅に増加している
ため、セラミック基板を薄くし熱を放散し易くすること
も行われているが、セラミック基板を薄くした場合には
発熱抵抗体に発生する熱により使用中にセラミック基板
が変形するという問題があった。そのためセラミック基
板の裏面に金属板を熱伝導性のよい接着剤により接合し
で放熱し易くしたものも検討されているが、密着の点で
不充分であるという問題があった。In addition, in recent years, the amount of heat generated by the heating resistor has increased significantly as the printing speed of thermal printer heads has increased, so ceramic substrates have been made thinner to facilitate heat dissipation. When the ceramic substrate is made thinner, there is a problem in that the ceramic substrate is deformed during use due to the heat generated in the heating resistor. For this reason, attempts have been made to bond a metal plate to the back surface of a ceramic substrate using an adhesive with good thermal conductivity to facilitate heat dissipation, but there has been a problem in that the adhesion is insufficient.
［発明の目的コ
本発明は共通電極の厚さを厚くして電気抵抗を小さくす
るとともに、セラミック基板の裏面に金属板を接合させ
て密着性と放熱性を改良したサーマルプリンターヘッド
を提供することを目的とする。[Purpose of the Invention] The present invention provides a thermal printer head in which the thickness of the common electrode is increased to reduce the electrical resistance, and a metal plate is bonded to the back surface of the ceramic substrate to improve adhesion and heat dissipation. With the goal.
［発明の概要１
すなわち本発明のサーマルプリンターヘッドは発熱抵抗
体を有するごラミック基板の面に、金属板を加熱により
直接接合して共通電極を形成するとともに、セラミック
基板の裏面に金属板を加熱により接合したことを特徴と
する。[Summary of the invention 1] That is, the thermal printer head of the present invention has a metal plate directly bonded to the surface of a ceramic substrate having a heating resistor by heating to form a common electrode, and a metal plate is heated to the back surface of the ceramic substrate. It is characterized by being joined by.
［発明の実施例］ 次に本発明の実施例について説明する。[Embodiments of the invention] Next, examples of the present invention will be described.
第１図は本発明の一実施例の平面図であり、第２図は第
１図のＩ−Ｉ 切断面図である。FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a sectional view taken along line II in FIG.
図において符号１は厚さ約０．８〜２．０都のアルミナ
等のセラミック基板であり、そのセラミック基板１の一
部分には厚さ０．０７ｍｍの銅、アルミニウム等の金属
板２ａが口字状に集中して配置され、加熱により接合さ
れて共通電極が形成されている。共通電極以外の而には
、例えばＴａ２Ｎからなる発熱抵抗体３がグレーズ（図
示を省略）を介してスパッタリング等により形成されて
いる。In the figure, reference numeral 1 is a ceramic substrate made of alumina or the like with a thickness of about 0.8 to 2.0 mm, and a metal plate 2a of copper, aluminum, etc. with a thickness of 0.07 mm is attached to a part of the ceramic substrate 1. The electrodes are arranged in a concentrated manner and joined together by heating to form a common electrode. In addition to the common electrode, a heating resistor 3 made of, for example, Ta2N is formed by sputtering or the like through a glaze (not shown).
また、このセラミック基板１の裏面の全面または共通電
極に対応する部分には厚さ０．０７〜２゜０ｍｍの金属
板２ｂが接合されている。セラミック基板１と金属板２
ａおよび２ｂとの接合は、例えば次のようにして行なう
。Further, a metal plate 2b having a thickness of 0.07 to 2.0 mm is bonded to the entire back surface of the ceramic substrate 1 or to a portion corresponding to the common electrode. Ceramic substrate 1 and metal plate 2
The bonding with a and 2b is performed, for example, as follows.
すなわちセラミック基板１の両面に金属板、特に酸素を
１００〜２０００ ｐｐｍ含有する銅板あるいは表面が
酸化処理された銅板を配回し、不活性ガス雰囲気例えば
窒素ガス中で１０６５〜１０８３°Ｃで加熱させる。あ
るいは酸素を含有しないあるいは酸化処理されていない
銅板を使用する場合は、酸素を０．０３〜Ｑ、１ｖｏ１
％を含むガス雰囲気中ひ加熱させることにより行なう。That is, a metal plate, particularly a copper plate containing 100 to 2000 ppm of oxygen or a copper plate whose surface has been oxidized, is arranged on both sides of the ceramic substrate 1, and heated at 1065 to 1083°C in an inert gas atmosphere, such as nitrogen gas. Alternatively, when using a copper plate that does not contain oxygen or has not been oxidized, add oxygen to 0.03 to Q, 1 vol.
This is done by heating in a gas atmosphere containing %.
［発明の効果］
このように形成されたサーマルプリンターヘッドは、共
通電極の厚さを０．０２〜１．０ｍｍと厚くしたので電
気抵抗を小さくｒき、また発熱抵抗値のＩＪらつきを小
さくすることができる。しかも共通電極を銅板で形成し
た場合は半田付けが容易となり、外部への取出しが簡単
に行える。また、セラミック基板の裏面に金属板が密着
し−Ｃ形成されＣいるので放熱性が向上し、ヒートシン
クへの接合が容易になる。[Effects of the Invention] The thermal printer head formed in this manner has a thick common electrode of 0.02 to 1.0 mm, which reduces electrical resistance and reduces IJ fluctuations in heating resistance. can do. Moreover, when the common electrode is formed of a copper plate, soldering is easy and it can be easily taken out to the outside. In addition, since the metal plate is closely attached to the back surface of the ceramic substrate, heat dissipation is improved and bonding to a heat sink is facilitated.
さらにセラミック基板の表面と対応する部分に金属板が
接合されているので、セラミック基板の反りを抑えるこ
とができる。Furthermore, since the metal plate is bonded to a portion corresponding to the surface of the ceramic substrate, warping of the ceramic substrate can be suppressed.
第１図は本発明の一実施例を示す平面図、第２図は第１
図のＩ−Ｉ 切断面図である。
１・・・・・・・・・・・・・・・・・・セラミック基
板２ａ 、 ２ｂ・・・・・・金属板
３・・・・・・・・・・・・・・・・・・発熱抵抗体（
７３１７） 代理人弁理士 則近憲佑（ほか１名）Fig. 1 is a plan view showing one embodiment of the present invention, and Fig. 2 is a plan view showing an embodiment of the present invention.
It is a sectional view taken along line II in the figure. 1... Ceramic substrates 2a, 2b... Metal plate 3...・Heating resistor (
7317) Representative Patent Attorney Kensuke Norichika (and 1 other person)
Claims (1)
板を加熱により直接接合して共通電極を形成するととも
に、前記セラミック基板の裏面に金属板を加熱により接
合したことを特徴とするサーマルプリンターヘッド。 （２）共通電極はセラミック基板の一部分に集中して形
成される特許請求の範囲第１項記載のサーマルプリンタ
ーヘッド。 （３）金属板は銅板である特許請求の範囲第１項または
第２項記載のサーマルプリンターヘッド。 （／Ｉ）銅板は酸素を含有するものである特許請求の範
囲第３項記載のサーマルプリンターヘッド。 （５）銅板は表面が酸化処理されているものである特許
請求の範囲第３項記載のす〜マルプリンターヘッド。 （６）加熱温度は１０６５〜１０８３℃である特許請求
の範囲第１項〜第５項のいずれか１項記載のサーマルプ
リンターヘッド。 （７）加熱は不活性ガス雰囲気中で行なわれる特許請求
の範囲第１項〜第６項のいずれか１項記載のサーマルプ
リンターヘッド。[Scope of Claims] (1) A common electrode is formed by directly bonding a metal plate to the surface of a ceramic substrate having a heating resistor by heating, and a metal plate is bonded to the back surface of the ceramic substrate by heating. A thermal printer head featuring: (2) The thermal printer head according to claim 1, wherein the common electrode is formed in a concentrated manner on a portion of the ceramic substrate. (3) The thermal printer head according to claim 1 or 2, wherein the metal plate is a copper plate. (/I) The thermal printer head according to claim 3, wherein the copper plate contains oxygen. (5) The multi-printer head according to claim 3, wherein the surface of the copper plate is oxidized. (6) The thermal printer head according to any one of claims 1 to 5, wherein the heating temperature is 1065 to 1083°C. (7) The thermal printer head according to any one of claims 1 to 6, wherein the heating is performed in an inert gas atmosphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57124403A JPS5914975A (en) | 1982-07-19 | 1982-07-19 | Thermal printer head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57124403A JPS5914975A (en) | 1982-07-19 | 1982-07-19 | Thermal printer head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5914975A true JPS5914975A (en) | 1984-01-25 |
Family
ID=14884580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57124403A Pending JPS5914975A (en) | 1982-07-19 | 1982-07-19 | Thermal printer head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5914975A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60253823A (en) * | 1984-05-30 | 1985-12-14 | Toshiba Corp | Thermopile |
-
1982
- 1982-07-19 JP JP57124403A patent/JPS5914975A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60253823A (en) * | 1984-05-30 | 1985-12-14 | Toshiba Corp | Thermopile |
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