JPS59149093A - Silicon steel plate base copper-lined laminated board - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔技術分野〕 本発明は珪素鋼板上ベースとした珪素鋼板ベース鋼張積
層板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a silicon steel plate-based steel clad laminate based on a silicon steel plate.

〔背景技術〕[Background technology]

珪素糊板ｔベースとして銅張積層板ｋＷ造するにあたっ
ては、第１図に示すように珪素鋼板１１）の表向に佇成
榛脂材等で形成さｎた電気絶縁層（３）を介して＠箔（
４）會貼看することにより銅張積層板（５）塗製造する
ものであるが、従来例では珪素鋼板Ｉｌ＋は板厚が０．
６５鰭程度のものを通常用いて製造しており、このよう
に板厚の厚い珪素鋼板＋１１を用いて銅張積層板（５）
を製造した場合には、銅張積層板（５）に市、／ｆ、を
流した際に鉄損が大きいという欠点を有してい友。従っ
て、鉄損を小さくするためには珪素＠＆　Ｉｌｌの板厚
を薄くするのが良いものであるが、板厚の薄い珪素鋼板
をプリント回路基板に使用した場合には機械的強度が弱
く、板折ｎ１反り等が生じ易いという問題を准していた
。図中（６）は珪素鋼板Ｉｌｌの表裏面にコーティング
された照機質施である。When manufacturing a copper-clad laminate (kW) using a silicon glue plate as a base, as shown in Fig. 1, an electrically insulating layer (3) formed of a material such as cypress wood is placed on the surface of a silicon steel plate (11). Te @ foil (
4) Copper-clad laminates (5) are manufactured by coating, but in the conventional example, the silicon steel plate Il+ has a thickness of 0.
It is usually manufactured using a material with about 65 fins, and copper-clad laminates (5) are made using thick silicon steel plates + 11 fins.
However, when manufacturing copper-clad laminates (5), there is a drawback that iron loss is large when iron is poured into the copper-clad laminate (5). Therefore, in order to reduce iron loss, it is better to reduce the thickness of silicon@&Ill, but if a thin silicon steel plate is used for a printed circuit board, the mechanical strength will be weak. The problem of easy occurrence of board folding and warpage was addressed. In the figure, (6) is a luminous material coated on the front and back surfaces of the silicon steel plate Ill.

〔発明の目的〕[Purpose of the invention]

本発明は上記の点に鑑みて成さｎたｔのであって、鉄損
を大きくすることなく機械的強度を上げることができる
珪素鋼板ベース銅張積層板を提供することを目的とする
ｔのである。The present invention was made in view of the above points, and an object of the present invention is to provide a silicon steel plate-based copper-clad laminate that can increase mechanical strength without increasing core loss. be.

〔発明の開示〕[Disclosure of the invention]

すなわち、本発明は珪素鋼板Ｉｌｌ　Ｉｌｌ　＋１１を
ａ故枚重ね合せ、この珪素鋼板目１の表向に電気絶縁層
（３）をブトして錯消（４）を重ね、銅箔（４）と珪素
鋼板＋１１とをボルト・ナツト等の緊結具（２）で積層
一体化して成ることを特徴とする珪素鋼板ベース銅張積
層板により上記目的を達成したものである。That is, in the present invention, silicon steel plates Ill Ill +11 are stacked one on top of the other, an electrical insulating layer (3) is placed on the surface of the first silicon steel plate, a dielectric layer (4) is placed on top of the silicon steel plate (4), and a copper foil (4) is layered. The above object has been achieved by a silicon steel plate-based copper-clad laminate characterized in that it is formed by laminating and integrating silicon steel plates +11 with fasteners (2) such as bolts and nuts.

以下本発明を実施例により詳述する。珪素鋼板Ｉｌｌは
板厚０．６５藺以下好ましくは０．５　ｍｓ程度に形成
してあり、板厚を薄くすることで鉄損を小さくしである
。すなわち、電流を流した場合珪素鋼板Ｉｌ＋には磁界
が生じるが、板厚が厚い場合には磁界が強くなって磁界
から飛び出す電気エネルギーが大となるものである。ま
た珪素鋼板ｉｌｌの表裏面には耐融性等を上げるために
亜鉛メツ＋等の無機質層（６）が形成しである。この珪
素鋼板ｆｉ＋をベースとして銅張積層板（５）を製造す
るにあたっては、第２図に示すように複数枚の珪素鋼板
＋１１　ｆｌ目）を上下に積層し、積層され之珪素鋼板
Ｉｌ＋の片面又は両面に電気絶縁層（３）を介して＠箔
（４）を重ね、次いで銅箔（４）及び各珪素ｗ４根川の
適宜位置に押通孔（７）を穿孔し、この押通孔（７）に
ボルト・ナツト、ねじ、鋏等の緊結具（２）を通して銅
箔（４）と珪素ｌ１ｌｌ＆ｌｌ＋とを緊結し、積層一体
化するものである。ここで、電気？！、縁ｆｉ＋３１と
してけエホ士シ樹ｎ旨、フェノ−」し樹月旨、不飽和ポ
リエステル樹脂等の合成樹脂液を塗布、硬化させて形成
しても良く、あるいはそｎらの合成樹脂液をガラス、テ
トロン、紙等の繊維基材に含反させて形成したつりづレ
タを載置硬化させて形成しても良い。その際、ｍｌ箔（
４）と珪素鋼板Ｉｌ＋との接着性を上げるために珪素１
１Ｎ＆ｉｌ＋表向の無機質層（６）を機械的に研摩して
除去するのが好ましい。また、緊結具ｉ２１は銅箔（４
）と接啼しないように緊締するもので、緊結具（２）と
銅箔（４）との間に絶縁性に優ｎた合成樹脂液を塗布し
て硬化させたｖｌあるいは樹脂成形品、樹脂シート１パ
ツ牛ンジ等の電気絶縁材（８）を弁在させるか、又は締
結共（２）のまわりの＠箔（４）をエツチングして除去
するものである。The present invention will be explained in detail below with reference to Examples. The silicon steel plate Ill is formed to have a thickness of 0.65 mm or less, preferably about 0.5 ms, and by reducing the thickness, iron loss can be reduced. That is, when a current is passed through the silicon steel plate Il+, a magnetic field is generated, but if the plate is thick, the magnetic field becomes stronger and the electric energy that jumps out from the magnetic field becomes large. Moreover, an inorganic layer (6) such as zinc oxide+ is formed on the front and back surfaces of the silicon steel plate ILL in order to improve the melting resistance and the like. In manufacturing a copper-clad laminate (5) based on this silicon steel plate fi+, as shown in Fig. 2, a plurality of silicon steel plates +11th fl) are laminated vertically, and one side of the laminated silicon steel plate Il+ is Alternatively, layer the @ foil (4) on both sides with the electrical insulating layer (3) interposed therebetween, then punch through holes (7) at appropriate positions in the copper foil (4) and each silicon w4 root; 7), the copper foil (4) and the silicon l1ll&ll+ are tightly connected through fasteners (2) such as bolts, nuts, screws, scissors, etc., and are laminated into one piece. Electricity here? ! It may be formed by applying and curing a synthetic resin liquid such as an unsaturated polyester resin, or by applying and curing a synthetic resin liquid such as an unsaturated polyester resin. It may also be formed by placing and curing a droplet formed by impregnating a fiber base material such as glass, Tetoron, or paper. At that time, ml foil (
4) and the silicon steel plate Il+, silicon 1
Preferably, the inorganic layer (6) on the 1N&il+ surface is removed by mechanical polishing. In addition, the fastening tool i21 is made of copper foil (4
) is tightened to prevent contact between the fastening tool (2) and the copper foil (4), and is made by applying a synthetic resin liquid with excellent insulation properties between the fastening tool (2) and the copper foil (4) and curing it, or a resin molded product. Either an electrically insulating material (8) such as a foil is placed on the sheet, or the foil (4) around the fastener (2) is removed by etching.

このようにして、Ｍ＠枚の珪素鋼板＋ｔ＋　ＩＩＩ　Ｉ
ＩＩが積層さｎ、さらにこの表面に電気絶縁層（３）を
介して銅箔（４）が積層一体化さｎｆＣ，珪素鋼板ベー
ス銅張積層板を得ることができるものである。In this way, M @ silicon steel plates + t + III I
In this case, a silicon steel plate-based copper-clad laminate can be obtained by laminating nfC, in which a copper foil (4) is further laminated and integrated on this surface via an electrically insulating layer (3).

し刀為して、積層さｎている各珪素鋼板＋１１の板厚は
０．６５　ｍｓ以下と薄いために珪素鋼板Ｉｌ＋によっ
て生じる鉄損は小さいものである。また、薄い珪素鋼板
１！）１枚をベースとして製造した従来の銅張積層板（
５）はプリント回路基板に使用するには機械的強度が弱
く、板折ｎや反り等が生じ易いものであるが、複数枚の
珪素鋼板Ｉｌｌ　Ｉｌｌ　ＩＩＩを緊結具（２）で緊結
して積層することにより、鉄損を大きくすることなく強
機的強度を同上することかできるものである。However, since the thickness of each of the laminated silicon steel plates +11 is as thin as 0.65 ms or less, the iron loss caused by the silicon steel plates I1+ is small. Also, thin silicon steel plate 1! ) Conventional copper-clad laminate manufactured based on one sheet (
5) has a weak mechanical strength to be used in printed circuit boards and is prone to plate folds and warping, but it is a material that can be laminated by binding multiple silicon steel plates Ill Ill III with a fastener (2). By doing so, the mechanical strength can be increased without increasing iron loss.

以下本発明を実施例により詳述する。The present invention will be explained in detail below with reference to Examples.

〈実施例〉 板厚０．５０の珪素６ｉ１１１１＆（ＲＭ−１８）を６
枚積載すると共にこの積載された珪素鋼板の表面にエポ
＋シｓｌ脂を介して銅箔を重ね、その状崗で銅箔及び珪
素鋼板に挿通孔を穿孔し、銅箔と接触しないように電気
絶縁材を介して押通孔内にボルトを挿通し、ナツトで締
付けて片面に銅箔が積層一体化され九珪素鋼板ベース片
面銅張積層板を４に４几く従来例１〉 珪素鋼板を１枚だけ用いて珪素銅板の表面にエボ＋シ欅
脂を介して銅箔を結石した他は実施１例１と同様にして
珪累鋼板ベース片曲＠張槙層板な得た。<Example> Silicon 6i1111&(RM-18) with a plate thickness of 0.50
At the same time, copper foil is layered on the surface of the stacked silicon steel plates via epoxy resin and silicone resin, and through-holes are drilled in the copper foil and silicon steel plates using this layer to prevent electrical contact with the copper foil. A bolt is inserted into a push-through hole through an insulating material, and then tightened with a nut to form a single-sided copper-clad laminate with a nine silicon steel plate base, with a copper foil laminated and integrated on one side.Conventional example 1> Silicon steel plate A silicon laminate steel plate base with a single curved laminate was obtained in the same manner as in Example 1, except that only one silicon copper plate was used and copper foil was deposited on the surface of the silicon copper plate via evo + zelkova resin.

く従来例２〉 板厚０．６５１１３の珪素−板（ＲＭ−１８）を１枚だ
け用いて珪素鋼板の表面にエホ＋シ梱脂を弁して銅箔を
結石した他は夫弛例１と同様にして珪素鋼板ベース片面
鋼張積層板を得た。Conventional Example 2> Example 1 except that only one silicon plate (RM-18) with a thickness of 0.65113 was used, and copper foil was placed on the surface of the silicon steel plate by applying silicone buffing fat. A single-sided steel clad laminate based on a silicon steel plate was obtained in the same manner as above.

次に、実施例、従来例１．２で得られた銅張上表のよう
に、板厚の厚い珪素鋼板を用いた従来例２のものにあっ
てＩ／′ｉ鉄損が大きく、一方板厚の薄い珪素鋼板を用
いた従来例１のものけ耐板折れ性に劣っているものであ
るが、本実施例の珪素鋼板ベース鋼張積層板にあっては
、鉄損を大きくすることなく耐板折ｎ性が改良さｆ′し
たことが確認さｎた。Next, as shown in the copper clad table obtained in Examples and Conventional Example 1.2, in Conventional Example 2, which uses a thick silicon steel plate, the I/'i iron loss is large; Conventional Example 1, which uses a thin silicon steel plate, is inferior in plate breakage resistance, but the silicon steel plate-based steel clad laminate of this example has high durability without increasing iron loss. It was confirmed that the plate bendability was improved.

〔発明の効果〕〔Effect of the invention〕

上記のように本発明は、珪素鋼板を複数枚重ね台せ、こ
の珪素鋼板の表面に電気絶縁層を介して鋼箔を重ね、鋼
箔と珪素鋼板とをボルト・ナツト等の緊結具で積層一体
化したので、珪素鋼板の板厚が薄いものを使用すること
により鉄損を小さくすることができる上に、機械的強度
を強くしてプリント回路基板等に使用する際に板折ｎや
反ジ等が生じるのを防ぐことができるものである。As described above, the present invention involves stacking a plurality of silicon steel plates, stacking steel foil on the surface of the silicon steel plate with an electrically insulating layer in between, and laminating the steel foil and the silicon steel plate with fasteners such as bolts and nuts. Since it is integrated, it is possible to reduce iron loss by using a thinner silicon steel plate, and it also has stronger mechanical strength to prevent plate bending and warping when used in printed circuit boards, etc. It is possible to prevent the occurrence of problems such as discoloration.

【図面の簡単な説明】[Brief explanation of drawings]

１１）け珪素鋼板、（２）は緊結共、（３）は電気絶縁
層、（４）は銅箔である。 代理人　弁理士　　石　１）長　上 第１図 第２図11) Silicon steel plate, (2) is a bonding material, (3) is an electrical insulation layer, and (4) is a copper foil. Agent Patent Attorney Ishi 1) Chief Figure 1 Figure 2

Claims (1)

【特許請求の範囲】[Claims] Ｉｌｌ　　珪素鋼板を複数枚重ね合せ、この珪素鋼板の
表面に電気絶縁層を介して鉋箔會重ね、鋼箔と珪素鋼板
とｔボルト・ナツト等の緊結共で積層一体化して成るこ
とｔ特徴とする珪素鋼板ベース銅張積層板。Features: A plurality of silicon steel plates are stacked one on top of the other, and the surface of the silicon steel plates is laminated with a planer foil via an electrical insulating layer, and the steel foil, silicon steel plate, and T-bolts, nuts, etc. are used to tighten the lamination. Copper-clad laminate based on silicon steel plate.