JPS59119791A - Method of forming conductor layer of through hole - Google Patents
Method of forming conductor layer of through holeInfo
- Publication number
- JPS59119791A JPS59119791A JP23261382A JP23261382A JPS59119791A JP S59119791 A JPS59119791 A JP S59119791A JP 23261382 A JP23261382 A JP 23261382A JP 23261382 A JP23261382 A JP 23261382A JP S59119791 A JPS59119791 A JP S59119791A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- paste
- conductor layer
- dispenser
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（ａ） 発明の技術分野
本発明はスルーホールの孔壁導体層を形成する方法の改
良に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to an improvement in a method of forming a hole wall conductor layer of a through hole.
（ｂ） 技術の背景
基板に形成した回路パターンの層間接続、及び前記パタ
ーンとそこに搭載する回路素子の端子との接続面積を基
板厚さ方向に確保するスルーホールは、接続の信頼性が
高く基板回路を高密度化する等利点を有するため、印刷
配線板や混成集積回路に広く使用されている。(b) Background of the technology Interlayer connections between circuit patterns formed on a board, and through holes that secure the connection area between the pattern and the terminals of circuit elements mounted therein in the thickness direction of the board, have high connection reliability. It is widely used in printed wiring boards and hybrid integrated circuits because it has advantages such as increasing the density of circuit boards.
（ｃ） 従来技術と問題点
第１図は混成集積回路用基板のスルーホール用透孔に導
体層を形成する従来方法を説明するための側断面図であ
る。(c) Prior Art and Problems FIG. 1 is a side cross-sectional view for explaining a conventional method of forming a conductor layer in a through-hole of a hybrid integrated circuit board.
ｉ１図において、スクリーン印刷を利用した従来方法は
、吸気用キャピテイグレート１の上面に基板搭載用プレ
ート２を固着し、プレート２の上面に基板３を密着させ
、基板３の上方に印刷用スクリーン４を張設する。そし
て、スクリーン４の一方の端部近傍に導電性ペーストの
塊を載置し、スキージ５を用いスクリーン４の上面へ押
付けるようにペースト塊６を移動させると、基板３の各
スルーホール用透孔７に対向する部分でスクリーン４の
下面に押出されたペースト６′は、その対向透孔７の上
部開口を塞ぐようになる。一方、プレート２は基板３の
透孔７それぞれに対向する吸気孔８が穿設されており、
各吸気孔８はキャビティグレート１のキャビティ９を介
して真空ボンダ（図示せず）に接続されている。In Figure i1, the conventional method using screen printing involves fixing a board mounting plate 2 on the top surface of the intake capitivity plate 1, sticking a board 3 on the top surface of the plate 2, and placing a printing screen above the board 3. 4. Then, by placing a lump of conductive paste near one end of the screen 4 and moving the paste lump 6 using a squeegee 5 so as to press it against the upper surface of the screen 4, each through hole of the substrate 3 is The paste 6' extruded onto the lower surface of the screen 4 at the portion facing the hole 7 closes the upper opening of the opposing through hole 7. On the other hand, the plate 2 is provided with intake holes 8 that are opposite to the respective through holes 7 of the substrate 3.
Each intake hole 8 is connected to a vacuum bonder (not shown) via a cavity 9 of the cavity grate 1.
従って、前記真空ボンダを動作させキャビティ９を減圧
させながら、ペースト塊６の前記移動を行なうと、ペー
スト６′は外気圧に押されて対向透孔７の孔壁に付着し
、ペースト層１ｏが形成される。このようにして、各透
孔７にペースト層１゜を形成したのち、グレート２から
取外した基板３を乾燥後所定条件で加熱すると、各ペー
ストＭ１゜が焼成されて導体層となり、スルーホールが
完成する。Therefore, when the paste mass 6 is moved while the vacuum bonder is operated to reduce the pressure in the cavity 9, the paste 6' is pushed by the external pressure and adheres to the hole wall of the opposing through hole 7, and the paste layer 1o is It is formed. After forming a paste layer of 1° in each through hole 7 in this way, when the substrate 3 removed from the grate 2 is dried and heated under predetermined conditions, each paste M1° is fired and becomes a conductive layer, and the through hole is formed. Complete.
しかし、このような従来方法ではスクリーン４から押出
されるペースト６′の量が、スクリーン４のメツシュサ
イズ及びスクリーン４の目潰し用エマ
Ｉルジョンの厚さＫより決められると共に、不安定要因
であるスキージ５の押圧力及びスキージ５の移動速度等
に影響されるため、調整及び一定化できないという欠点
があり、スルーホールの品位が損なわれるのみならず、
ペースト６′の量が多過ぎて吸気路を狭塞することがあ
った。However, in such a conventional method, the amount of paste 6' extruded from the screen 4 is determined by the mesh size of the screen 4 and the thickness K of the emulsion for closing the screen 4, and the amount of paste 6' extruded from the screen 4 is determined by the squeegee 5, which is an unstable factor. Since it is affected by the pressing force of the squeegee 5, the moving speed of the squeegee 5, etc., it has the disadvantage that it cannot be adjusted and stabilized, which not only impairs the quality of the through hole, but also
There were cases where the amount of paste 6' was too large and blocked the intake passage.
（ｄ） 発明の目的
本発明の目的は、上記問題点を除去してスルーホールの
導体層の厚さを、所望に設定可能とすることである。(d) Object of the Invention An object of the present invention is to eliminate the above-mentioned problems and enable the thickness of the conductor layer of the through hole to be set as desired.
（ｅ） 発明の構成
上記目的は、基板にスルーホール用の透孔を穿設し、所
定量の導電性ペーストをディスペンサから前記透孔の一
方の開口部に滴下し、前記透孔の他方の開口部から吸気
して、前記滴下ペーストを透孔壁に被着させることを特
徴とするスルーボールの導体層形成方法により達成され
る。(e) Structure of the Invention The above object is to drill a through hole in a substrate, drop a predetermined amount of conductive paste from a dispenser into one opening of the through hole, and apply it to the other opening of the through hole. This is achieved by a method for forming a conductor layer of a through-ball, which is characterized in that air is taken in through an opening and the dripped paste is applied to the through-hole wall.
（ｆ） 発明の実施例 以下、図面を用いて本発明の詳細な説明する。(f) Examples of the invention Hereinafter, the present invention will be explained in detail using the drawings.
第２図は本発明方法の一実施例に係わりスルーホール用
の透孔に導電性ペーストを被着する方法を説明するため
の側断面図である。なお、第１図と共通部分には同一符
号（１，２，３，７，８，９，１０）を用い、その説明
は省略する。FIG. 2 is a side sectional view for explaining a method of applying conductive paste to a through hole according to an embodiment of the method of the present invention. Note that the same reference numerals (1, 2, 3, 7, 8, 9, 10) are used for the parts common to those in FIG. 1, and the explanation thereof will be omitted.
第２図において、従来方法のスクリーン印刷を導電性ペ
ーストの所定量滴下に置換した本発明方法は、キャビテ
ィグレー）１の上面に固着したプレート２の上面に、基
板３を密着させて搭載し、基板３に穿設したスルーホー
ル用透孔７の上方に位置するディスペンサ１１から所定
量のペースト塊１２を滴下させる。In FIG. 2, the method of the present invention, which replaces the conventional method of screen printing with dropping a predetermined amount of conductive paste, includes mounting a substrate 3 in close contact with the upper surface of a plate 2 fixed to the upper surface of a cavity gray) 1; A predetermined amount of paste mass 12 is dropped from a dispenser 11 located above a through hole 7 formed in a substrate 3.
従って、真空ボンダを動作させてキャビティ９内を減圧
し前記滴下させると、透孔７を塞ぐペースト塊１２は外
気圧に押されて透孔７の孔壁に付着しペースト層１０が
形成され、ペースト層ｌＯを焼成してスルーホールが完
成する。Therefore, when the vacuum bonder is operated to reduce the pressure inside the cavity 9 and cause the droplet to drip, the paste mass 12 blocking the through hole 7 is pushed by the external pressure and adheres to the hole wall of the through hole 7, forming a paste layer 10. The paste layer IO is fired to complete the through hole.
なお、ディスペンサ１１は混成集積回路の回部素子搭載
用のもの、即ちポンディング樹脂やはんだペースト（ク
リームはんだ）を回路基板に供給するためのものを使用
し、ペースト塊１２の大きさくペースト量）はディスペ
ンサ１１の針１３の太さ、ディスペンサｌｌ内の導電性
ペーストを押す圧力、使用する導電性ペーストの粘度に
より調整することができる。また、基板３に穿設した複
数個の透孔７それぞれとディスペンサ１１とを自動的に
順次対向させるのに際し、ディスペンサ１１をステップ
アンドリピートさせる方式と、基板３を搭載するプレー
ト２等にてなる構成体をステップアンドリピートさせる
方式があるが、前者方式は後者方式に比べて移動体の重
量が軽くて済むため装置を簡易化する利庫がある。The dispenser 11 is used to mount the circuit elements of a hybrid integrated circuit, that is, to supply bonding resin or solder paste (cream solder) to the circuit board. can be adjusted by the thickness of the needle 13 of the dispenser 11, the pressure with which the conductive paste is pressed in the dispenser 11, and the viscosity of the conductive paste used. In addition, when the dispenser 11 is automatically and sequentially opposed to each of the plurality of through holes 7 drilled in the substrate 3, there is a method in which the dispenser 11 is step-and-repeat, and a plate 2 etc. on which the substrate 3 is mounted is used. There is a method of step-and-repeat the structure, but the former method has the benefit of simplifying the device because the weight of the moving body is lighter than the latter method.
（ｇ） 発明の詳細
な説明した如く本発明方法によれば、スルーホールの導
体層を形成する導体性ペーストの供給が定量化し、かつ
その供給量を容易に調整できるため、所望厚さでばらつ
きの少ない導体層を具えたスルーホールが得られると共
に、導電性ペーストをスルーホール用透孔の側壁に被着
させる吸気路が不測に狭塞されることがなくなった。そ
してさらに、ディスペンサをステップアンドリピートさ
せることにより、簡易構成の装置を提供可能にした効果
は大きい。(g) As described in detail, according to the method of the present invention, the supply of the conductive paste forming the conductor layer of the through-hole can be quantified and the supply amount can be easily adjusted, so that variations in the desired thickness can be avoided. A through hole having a conductive layer with a small amount of conductive layer is obtained, and the air intake path through which the conductive paste is applied to the side wall of the through hole is prevented from being accidentally blocked. Furthermore, by step-and-repeat the dispenser, it is possible to provide a device with a simple configuration, which has a great effect.
第１図は混成集積回路用基板のスルーホール用透孔に導
電性ペーストを被着する従来方法を説明するための側断
面図、第２図は本発明の一実施例に係わり前記透孔に導
電性ペーストを被着する方法を説明するための側断面図
である。
なお図中において、ｌは吸気用キャピテイプレート、２
は基板搭載用プレート、３はセラミックス基板、７はス
ルー六−ル用透孔、８は吸気用透孔、９は吸気用キャビ
ティ、１０は導電性ペースト層、１１はディスペンサ、
１２は導電性ペーストの定量塊を示す。FIG. 1 is a side cross-sectional view for explaining a conventional method of applying conductive paste to a through-hole of a hybrid integrated circuit board, and FIG. 2 is a side sectional view showing an embodiment of the present invention. FIG. 3 is a side sectional view for explaining a method of applying a conductive paste. In the figure, l is the intake capity plate, 2
1 is a board mounting plate, 3 is a ceramic substrate, 7 is a through hole for a through hole, 8 is an intake hole, 9 is an intake cavity, 10 is a conductive paste layer, 11 is a dispenser,
12 indicates a quantitative mass of conductive paste.
Claims (2)
導電性ペーストをディスペンサから前記透孔の一方の開
口部に滴下し、前記透孔の他方の開口部から吸気して、
前記滴下ペーストを透孔壁に被着させることを特徴とす
るスルーホールの導体層形成方法。(1) A through hole is drilled in the substrate, a predetermined amount of conductive paste is dropped from a dispenser into one opening of the through hole, and air is sucked from the other opening of the through hole,
A method for forming a conductor layer in a through-hole, the method comprising applying the dripped paste to the wall of the through-hole.
、複数個のスルーホール用透孔に定量の前記ペーストを
順次滴下させることを特徴とする特許導体層形成方法。(2) A patented method for forming a conductor layer, characterized in that the dispenser is operated in a step-and-repeat manner to sequentially drop a fixed amount of the paste into a plurality of through-holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23261382A JPS59119791A (en) | 1982-12-25 | 1982-12-25 | Method of forming conductor layer of through hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23261382A JPS59119791A (en) | 1982-12-25 | 1982-12-25 | Method of forming conductor layer of through hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59119791A true JPS59119791A (en) | 1984-07-11 |
Family
ID=16942081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23261382A Pending JPS59119791A (en) | 1982-12-25 | 1982-12-25 | Method of forming conductor layer of through hole |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59119791A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6410697A (en) * | 1987-07-03 | 1989-01-13 | Juki Kk | Method and apparatus for forming through hole in substrate |
| JPH0555428U (en) * | 1991-12-25 | 1993-07-23 | 株式会社ゼクセル | Operation panel unit with push button |
| US5746868A (en) * | 1994-07-21 | 1998-05-05 | Fujitsu Limited | Method of manufacturing multilayer circuit substrate |
-
1982
- 1982-12-25 JP JP23261382A patent/JPS59119791A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6410697A (en) * | 1987-07-03 | 1989-01-13 | Juki Kk | Method and apparatus for forming through hole in substrate |
| JPH0463559B2 (en) * | 1987-07-03 | 1992-10-12 | Juki Kk | |
| JPH0555428U (en) * | 1991-12-25 | 1993-07-23 | 株式会社ゼクセル | Operation panel unit with push button |
| US5746868A (en) * | 1994-07-21 | 1998-05-05 | Fujitsu Limited | Method of manufacturing multilayer circuit substrate |
| US5976393A (en) * | 1994-07-21 | 1999-11-02 | Fujitsu Limited | Method of manufacturing multilayer circuit substrate |
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