JPS5911500Y2 - Housing structure of electronic circuit unit - Google Patents
Housing structure of electronic circuit unitInfo
- Publication number
- JPS5911500Y2 JPS5911500Y2 JP12545779U JP12545779U JPS5911500Y2 JP S5911500 Y2 JPS5911500 Y2 JP S5911500Y2 JP 12545779 U JP12545779 U JP 12545779U JP 12545779 U JP12545779 U JP 12545779U JP S5911500 Y2 JPS5911500 Y2 JP S5911500Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- unit
- circuit unit
- housing structure
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【考案の詳細な説明】
本考案は機能的に独立した多数の電子回路ユニットを架
に並列して実装する筐体構造に関す。[Detailed Description of the Invention] The present invention relates to a housing structure in which a large number of functionally independent electronic circuit units are mounted in parallel on a rack.
近時、電話交換機等電子装置に於では部品並に半導体テ
゛バイス等素子の小形化あるいは電子回路の薄膜集積化
が進み架内実装密度が高まり、他方交換接続の高速処理
等の要請もあり架内消費電力が増大しつつあり、熱放散
機能の向上あるいは冷却効率の改善をはかる要がある。In recent years, in electronic equipment such as telephone exchanges, the packaging density within racks has increased due to the miniaturization of components, semiconductor devices, and other elements, and thin film integration of electronic circuits. Power consumption is increasing, and it is necessary to improve heat dissipation function or cooling efficiency.
本考案はかかる要請にもとづき電子装置の実装単位ユニ
ットに対し筐体の通風面積の拡大を意図した冷却手段に
つき提示するものである。Based on such a request, the present invention proposes a cooling means intended to expand the ventilation area of a housing for a mounting unit of an electronic device.
第１図は架据付になる装置の簡略正面図又第２図は該装
置の実装単位ユニットの要部構造を示す斜視図で、これ
により従来の要部構造を説明する。FIG. 1 is a simplified front view of an apparatus mounted on a rack, and FIG. 2 is a perspective view showing the main structure of a mounting unit of the apparatus.The conventional structure of the main parts will be explained using these figures.
図中、１は装置の架柱、２は左右面端が架柱１支持にな
る棚、３は架棚２に並列して実装される電子回路ユニッ
トでこの中には電子回路パッケージ（以下単にパッケー
ジと呼ぶ）が収納してある。In the figure, 1 is a column for the equipment, 2 is a shelf whose left and right side ends support the column 1, and 3 is an electronic circuit unit mounted in parallel on the shelf 2, which includes an electronic circuit package (hereinafter simply referred to as (called a package) is stored there.
これは架実装の単位ユニットであると共に装置の一機能
単位でもある。This is not only a unit of rack mounting but also a functional unit of the device.
下方の広巾ユニット３′は装置の電力給電ユニットであ
る。The lower wide unit 3' is the power supply unit for the device.
前記ユニット３の一般的要部構或は第２図に示されると
おり、その上又は下方の筐体上下板５と５′には多数の
通風孔６が設けてある。As shown in the general main structure of the unit 3 or as shown in FIG. 2, a large number of ventilation holes 6 are provided in the upper and lower housing plates 5 and 5' above or below the unit 3.
７はユニットの左右の筐体側板、８は該図には示されな
いが電子回路パッケージの挿入・引出しを容易ならしめ
るガイドの凹溝である。Reference numeral 7 designates left and right housing side plates of the unit, and reference numeral 8 designates grooves of a guide, which are not shown in the figure, to facilitate insertion and withdrawal of the electronic circuit package.
これらユニット３の機能は架実装装置の組立（製造）検
査および保守の各段階でその信頼性並稼動率を向上する
に軽視できないものである。The functions of these units 3 cannot be ignored in order to improve the reliability and parallel operation rate at each stage of assembly (manufacturing) inspection and maintenance of the mounting equipment.
通風孔６により層流空気が生或され前記パッケージの冷
却がなされる。A laminar flow of air is generated by the ventilation holes 6 to cool the package.
第１図の架構造においてパネル前面並に後面は通常密閉
して架中央面から空気流入がない様考慮されいわば架全
体をして煙突効果が生成されやすい構造とする。In the frame structure shown in FIG. 1, the front and rear surfaces of the panels are usually sealed to prevent air from flowing in from the center of the frame, so that the entire frame is structured to easily create a chimney effect.
しかし図示にはないが必要に応じ架の上部又は下部に強
制冷却用ファンを設けることもある。However, although not shown in the drawings, a forced cooling fan may be provided at the top or bottom of the rack if necessary.
しかしながら従来のユニットの筐体構造では自然・強制
何れの冷却法でも通風抵抗が大きく、そのため十分な冷
却効果かえられない欠点があった。However, the conventional housing structure of the unit has a drawback that ventilation resistance is large in both natural and forced cooling methods, making it impossible to obtain a sufficient cooling effect.
本考案の目的は該欠点を除去するにある。The purpose of the invention is to eliminate this drawback.
その特徴とするところは前記ユニット筐体の上下側板が
パッケージ取付位置に対応して凹形ガイド溝形或になる
金網と該金網面積に合わせて広い開口窓を有する支え板
とで構或された電子回路ユニットの筐体構造である。The feature is that the upper and lower side plates of the unit housing are constructed of a wire mesh that has a concave guide groove shape corresponding to the package mounting position, and a support plate that has a wide opening window to match the area of the wire mesh. This is the housing structure of the electronic circuit unit.
以下本考案のユニット体につき第３図と第４図に従って
説明する。The unit body of the present invention will be explained below with reference to FIGS. 3 and 4.
第３図はパッケージ取付になる凹形溝が形或された金網
９と、該金網を固定する広い開口窓を有する支え板１０
とを示す分解斜視図である。Figure 3 shows a wire mesh 9 with a concave groove for mounting the package, and a support plate 10 with a wide opening window for fixing the wire mesh.
FIG.
金網９は適宜網目のものをプレス等の手段でパッケージ
取付用（第４図の１５参照）凹形ガイド溝１３を形威さ
せる。The wire mesh 9 has a suitable mesh shape, and a concave guide groove 13 for mounting the package (see 15 in FIG. 4) is formed by pressing or other means.
支え板１０は適宜強度の金属板からなりこれは広い開口
窓６をプレス等により打抜きし、又該板１０の前縁１２
に設ける凹部溝１１も併せ形或する。The support plate 10 is made of a metal plate having an appropriate strength, and a wide opening window 6 is punched out by a press or the like, and the front edge 12 of the plate 10 is
The recess groove 11 provided in the groove is also of a combined shape.
該前縁部１２はそのあと直角曲げをなす。The leading edge 12 then makes a right angle bend.
前記形或の金網９と支え板１０とはパッケージ取付並に
凹形ガイド溝１３と１１とを合わせて溶接して本考案に
なるユニット筐体の上又は下方の側板が完戒する。The metal mesh 9 and the support plate 10 having the above shape are welded together with the concave guide grooves 13 and 11 at the same time as the package installation, so that the upper or lower side plate of the unit housing of the present invention is completed.
尚図示開口窓６の形状等は一例に過ぎず、該単位ユニッ
トが比較的軽量のパッケージ収納になるときは図示補補
コラム１４は除かれ、同時に通風効果を高めさせるに好
都合である。The shape of the opening window 6 shown in the figure is merely an example, and when the unit is to be housed in a relatively lightweight package, the supplementary column 14 shown in the figure can be removed, which is convenient for enhancing the ventilation effect at the same time.
第４図は前記本考案構或になるユニット筐体の組立斜視
図である。FIG. 4 is an assembled perspective view of the unit housing having the structure of the present invention.
尚１５は該ユニットに収納されるプリント板回路パッケ
ージの取付状態を示す。Note that 15 shows the attached state of the printed circuit board package housed in the unit.
以上の具体例図から明らかな様に該電子回路ユニットの
筐体構造によればパッケージの実装機能を低下させるこ
となくユニットの通風面積率（通風用窓部面積／筐体の
上又は下側板の面積）が従来に比し高くとられ、これに
伴なう通風抵抗が減少することから、冷却方式が自然あ
るいは強制何れであることを問わず顕著な熱放散効果が
期待できる。As is clear from the above specific example diagram, the casing structure of the electronic circuit unit allows the unit to maintain its ventilation area ratio (ventilation window area/top or bottom plate of the casing) without reducing the package mounting function. Since the area (area) is higher than that of the conventional method and the associated ventilation resistance is reduced, a remarkable heat dissipation effect can be expected regardless of whether the cooling method is natural or forced.
かかる点から本考案のユニット体は、将来の技術開発動
向特に装置の消費電力が増大に対処して有効な構戊であ
り、その実用的効果大なるものがある。From this point of view, the unit body of the present invention has a structure that is effective in dealing with future technological development trends, especially the increase in power consumption of devices, and has great practical effects.
第１図は電子装置据付のパネルの簡略正面図、第２図ユ
ニット構造を示す斜視図、第３図と第４図は本考案のユ
ニット筐体構造を示す斜視図である。
図中 ３・・・・・・ユニット、６・・・・・・冷却用
通風路又は開口窓、９・・・・・・本考案に係わる金網
、１０・・・・・・支え板、１１と１３・・・・・・パ
ッケージ取付ガイド溝、１５・・・・・・パッケージ。FIG. 1 is a simplified front view of a panel on which an electronic device is installed, FIG. 2 is a perspective view showing the unit structure, and FIGS. 3 and 4 are perspective views showing the unit housing structure of the present invention. In the figure: 3...Unit, 6...Cooling ventilation path or opening window, 9...Wire mesh related to the present invention, 10...Support plate, 11 and 13...Package installation guide groove, 15...Package.
Claims (1)
子回路ユニットの筐体構造において、前記ユニット筐体
の上下側板が電子回路パッケージ取付位置に対応して凹
形ガイド溝形戊になる金網と該金網面積に合わせて広い
開口窓を有する支え板とで構或されてなることを特徴と
する電子回路ユニットの筐体構造。In the housing structure of an electronic circuit unit in which a plurality of electronic circuit units are arranged in parallel and displayed on a shelf, the upper and lower side plates of the unit housing have concave guide grooves corresponding to the mounting positions of the electronic circuit packages. A casing structure for an electronic circuit unit, comprising a wire mesh and a supporting plate having a wide opening window corresponding to the area of the wire mesh.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12545779U JPS5911500Y2 (en) | 1979-09-11 | 1979-09-11 | Housing structure of electronic circuit unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12545779U JPS5911500Y2 (en) | 1979-09-11 | 1979-09-11 | Housing structure of electronic circuit unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5643200U JPS5643200U (en) | 1981-04-20 |
| JPS5911500Y2 true JPS5911500Y2 (en) | 1984-04-09 |
Family
ID=29357346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12545779U Expired JPS5911500Y2 (en) | 1979-09-11 | 1979-09-11 | Housing structure of electronic circuit unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5911500Y2 (en) |
-
1979
- 1979-09-11 JP JP12545779U patent/JPS5911500Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5643200U (en) | 1981-04-20 |
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