JPS5911455Y2 - Mounting mechanism of electronic components to heat sink - Google Patents

Mounting mechanism of electronic components to heat sink

Info

Publication number
JPS5911455Y2
JPS5911455Y2 JP13107379U JP13107379U JPS5911455Y2 JP S5911455 Y2 JPS5911455 Y2 JP S5911455Y2 JP 13107379 U JP13107379 U JP 13107379U JP 13107379 U JP13107379 U JP 13107379U JP S5911455 Y2 JPS5911455 Y2 JP S5911455Y2
Authority
JP
Japan
Prior art keywords
electronic component
heat sink
groove
spring member
mounting mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13107379U
Other languages
Japanese (ja)
Other versions
JPS5649149U (en
Inventor
日出男 鹿山
Original Assignee
パイオニア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to JP13107379U priority Critical patent/JPS5911455Y2/en
Publication of JPS5649149U publication Critical patent/JPS5649149U/ja
Application granted granted Critical
Publication of JPS5911455Y2 publication Critical patent/JPS5911455Y2/en
Expired legal-status Critical Current

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Description

【考案の詳細な説明】 本考案はヒートシンクに対する電子部品、例えばパワー
トランジスタ、集積回路等の取付機構に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mounting mechanism for electronic components, such as power transistors, integrated circuits, etc., to a heat sink.

従来、この種電子部品の取付機構は、第1図で示すよう
に、基板Aに実装された電子部品Bには取付孔Cが形或
されており、この取付孔Cに挿入したネジDをヒートシ
ンクEの雌ネジFに螺回することによって電子部品Bを
ヒートシンクEに固定するようにしたのがほとんどであ
った。
Conventionally, in the mounting mechanism for this type of electronic component, as shown in FIG. In most cases, the electronic component B was fixed to the heat sink E by screwing it into the female screw F of the heat sink E.

しかし、この取付機構では、電子部品Bに取付孔Cが必
要となり、この取付孔Cによって電子部品Bの制約され
る部分が生ずるし、ヒートシンクEには雌ネジFの加工
を必要とする。
However, in this mounting mechanism, the electronic component B requires a mounting hole C, and the mounting hole C creates a portion where the electronic component B is restricted, and the heat sink E requires the machining of the female screw F.

又、電子部品BをヒートシンクEにネジDで締着するこ
とは、位置決めが必要となり、電子部品Bに負荷応力を
与える可能性が大きく、取付け時間も長くか・る等の欠
点があった。
Furthermore, fastening the electronic component B to the heat sink E with the screw D requires positioning, which increases the possibility of applying load stress to the electronic component B, and has drawbacks such as requiring a long installation time.

そこで、本考案はヒートシンクに所定巾の溝を形或し、
この溝内に電子部品とバネ部材とを並列に挿入して、該
バネ部材の弾発力によって電子部品の溝の一側面に押接
するように構威して、上記従来例の欠点を解決しようと
するものである。
Therefore, the present invention forms a groove of a predetermined width in the heat sink,
The electronic component and the spring member are inserted in parallel into this groove, and the resilient force of the spring member is used to push the electronic component against one side of the groove, thereby solving the drawbacks of the conventional example. That is.

以下、本考案を実施例の図面に基づいて詳記すると、第
2図と第3図は本考案の異種実施例を示す側面図にして
、図中、1は絶縁基板、2は該基板1に実装されたパワ
ートランジスタ、集積回路等の電子部品で、2aは放熱
面、2bはモールド側を示してある。
Hereinafter, the present invention will be described in detail based on the drawings of the embodiments. FIGS. 2 and 3 are side views showing different embodiments of the present invention, in which 1 is an insulating substrate, and 2 is the substrate 1. Electronic components such as power transistors and integrated circuits are mounted on the substrate, and 2a is the heat dissipation surface and 2b is the mold side.

3はバネ部材で、該バネ部材3はU字形状に折曲して、
その固定側3aと自由側3bとの間に常時、外方向への
弾発力を付与したものである。
3 is a spring member, and the spring member 3 is bent into a U-shape,
An outward resilient force is always applied between the fixed side 3a and the free side 3b.

そして、このバネ部材3は固定側3aが電子部品2のモ
ールド2b側と接触するよう電子部品2と並列して、そ
の基端3Cを絶縁基板1に固定してある。
The spring member 3 is arranged in parallel with the electronic component 2 so that the fixed side 3a is in contact with the mold 2b side of the electronic component 2, and its base end 3C is fixed to the insulating substrate 1.

尚、第2図で示すバネ部材3はリン青銅板により、第3
図のバネ部材3は合或樹脂板により夫々形威されている
In addition, the spring member 3 shown in FIG. 2 is made of a phosphor bronze plate.
The spring members 3 shown in the figure are each shaped by a composite resin plate.

4は銅やアルミニウム等によるヒートシンクで、該ヒー
トシンク4には所定巾の溝5が形威されている。
4 is a heat sink made of copper, aluminum, etc., and a groove 5 of a predetermined width is formed in the heat sink 4.

こ・で、溝5の巾は、前記の並列した電子部品2とバネ
部材3の合計巾、即ち、電子部品2の放熱面2aとバネ
部材3の自由側3bとの間隔より、少し狭く形或するこ
とが必要である。
In this case, the width of the groove 5 is slightly narrower than the total width of the electronic component 2 and the spring member 3 that are arranged in parallel, that is, the distance between the heat dissipation surface 2a of the electronic component 2 and the free side 3b of the spring member 3. It is necessary to do something.

そこで、電子部品2をヒートシンク4に取り付けるには
、並列状態に存る電子部品2とバネ部材3とを、上方よ
り溝5内に挿入すれば、バネ部材3の自由側3bが固定
側3aに変位するので、容易に挿入され、所定の挿入位
置においては、自由側3bの外方向への弾発力によって
、電子部品2の放熱面2aは、溝5の一側面に密着状態
で押圧される。
Therefore, in order to attach the electronic component 2 to the heat sink 4, the electronic component 2 and the spring member 3, which are in a parallel state, are inserted into the groove 5 from above, so that the free side 3b of the spring member 3 is connected to the fixed side 3a. Since the electronic component 2 is displaced, it is easily inserted, and at the predetermined insertion position, the heat dissipation surface 2a of the electronic component 2 is pressed tightly against one side of the groove 5 by the outward elastic force of the free side 3b. .

又、電子部品2を溝5から離脱するには、上記の逆操作
を行なえばよい。
Furthermore, in order to remove the electronic component 2 from the groove 5, the above-mentioned operation may be reversed.

本考案は叙上のように、ヒートシンク4に所定巾の溝5
を形威し、この溝5内に電子部品2とバネ部材3とを並
列に挿入して、バネ部材3の弾発力によって電子部品3
を溝5の一側面に押接するようにしたので、ヒートシン
ク4に対する電子部品3の取付けが簡単、迅速に行なえ
、作業性が著しく向上する。
As mentioned above, the present invention has grooves 5 of a predetermined width in the heat sink 4.
The electronic component 2 and the spring member 3 are inserted in parallel into the groove 5, and the elastic force of the spring member 3 causes the electronic component 3 to
Since the electronic component 3 is pressed against one side of the groove 5, the electronic component 3 can be easily and quickly attached to the heat sink 4, and work efficiency is significantly improved.

又、電子部品3に対して無理な応力も加わらず、しかも
位置決めも必要ない。
Moreover, no unreasonable stress is applied to the electronic component 3, and no positioning is required.

更に、電子部品3にはネジ穴等の加工が不要となるので
、それだけ制約部分が無くなるし、電子部品2はバネ部
材3によって強固に溝5の一側面に押接されるので、押
接面の熱伝導性は、従来のネジ締めのものと比較して遜
色がない。
Furthermore, since the electronic component 3 does not require machining of screw holes, etc., there are no restricted parts, and since the electronic component 2 is firmly pressed against one side of the groove 5 by the spring member 3, the pressing surface is The thermal conductivity of this product is comparable to that of conventional screw-tight products.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来例の電子部品取付機構を示す一部切断の側
面図、第2図と第3図は夫々本考案に係る電子部品の取
付機構を示す異種実施例の一部を切断した側面図である
。 2・・・・・・電子部品、3・・・・・・バネ部材、4
・・・・・・ヒートシンク、5・・・・・・溝。
FIG. 1 is a partially cut-away side view showing a conventional electronic component mounting mechanism, and FIGS. 2 and 3 are partially cut-away side views of different embodiments showing the electronic component mounting mechanism according to the present invention, respectively. It is a diagram. 2...Electronic component, 3...Spring member, 4
...Heat sink, 5...Groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ヒートシンクに所定巾の溝を形或し、この溝内に電子部
品とバネ部材とを並列に挿入して、該バネ部材の弾発力
によって電子部品を溝の一側面に押接するようにしたヒ
ートシンクに対する電子部品の取付機構。
A heat sink in which a groove of a predetermined width is formed in the heat sink, an electronic component and a spring member are inserted in parallel into the groove, and the electronic component is pressed against one side of the groove by the elastic force of the spring member. Mounting mechanism for electronic components.
JP13107379U 1979-09-20 1979-09-20 Mounting mechanism of electronic components to heat sink Expired JPS5911455Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13107379U JPS5911455Y2 (en) 1979-09-20 1979-09-20 Mounting mechanism of electronic components to heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13107379U JPS5911455Y2 (en) 1979-09-20 1979-09-20 Mounting mechanism of electronic components to heat sink

Publications (2)

Publication Number Publication Date
JPS5649149U JPS5649149U (en) 1981-05-01
JPS5911455Y2 true JPS5911455Y2 (en) 1984-04-09

Family

ID=29362749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13107379U Expired JPS5911455Y2 (en) 1979-09-20 1979-09-20 Mounting mechanism of electronic components to heat sink

Country Status (1)

Country Link
JP (1) JPS5911455Y2 (en)

Also Published As

Publication number Publication date
JPS5649149U (en) 1981-05-01

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